JP2012253587A - 圧電デバイス及び圧電デバイスの製造方法 - Google Patents

圧電デバイス及び圧電デバイスの製造方法 Download PDF

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Publication number
JP2012253587A
JP2012253587A JP2011124837A JP2011124837A JP2012253587A JP 2012253587 A JP2012253587 A JP 2012253587A JP 2011124837 A JP2011124837 A JP 2011124837A JP 2011124837 A JP2011124837 A JP 2011124837A JP 2012253587 A JP2012253587 A JP 2012253587A
Authority
JP
Japan
Prior art keywords
plate
sealing material
piezoelectric
wafer
piezoelectric device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011124837A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012253587A5 (enExample
Inventor
Ryoichi Ichikawa
了一 市川
Yoshiaki Amano
芳明 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2011124837A priority Critical patent/JP2012253587A/ja
Priority to CN2012101719836A priority patent/CN102811028A/zh
Priority to TW101119448A priority patent/TW201251318A/zh
Priority to US13/485,922 priority patent/US20120306320A1/en
Publication of JP2012253587A publication Critical patent/JP2012253587A/ja
Publication of JP2012253587A5 publication Critical patent/JP2012253587A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • User Interface Of Digital Computer (AREA)
JP2011124837A 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法 Pending JP2012253587A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011124837A JP2012253587A (ja) 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法
CN2012101719836A CN102811028A (zh) 2011-06-03 2012-05-29 压电元件以及压电元件的制造方法
TW101119448A TW201251318A (en) 2011-06-03 2012-05-31 Piezoelectric device and fabricating method of the piezoelectric device
US13/485,922 US20120306320A1 (en) 2011-06-03 2012-06-01 Piezoelectric device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011124837A JP2012253587A (ja) 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法

Publications (2)

Publication Number Publication Date
JP2012253587A true JP2012253587A (ja) 2012-12-20
JP2012253587A5 JP2012253587A5 (enExample) 2014-06-19

Family

ID=47234630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011124837A Pending JP2012253587A (ja) 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法

Country Status (4)

Country Link
US (1) US20120306320A1 (enExample)
JP (1) JP2012253587A (enExample)
CN (1) CN102811028A (enExample)
TW (1) TW201251318A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP7013767B2 (ja) * 2017-09-25 2022-02-01 Tdk株式会社 振動ユニット
CN111615755B (zh) * 2018-12-25 2023-06-16 株式会社村田制作所 振动结构体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2822846B2 (ja) * 1992-10-29 1998-11-11 関西日本電気株式会社 ガラス−セラミック複合体を用いた水晶振動子用フラットパッケージおよびこれを用いた水晶振動子
JP2005210185A (ja) * 2004-01-20 2005-08-04 Seiko Epson Corp 圧電振動片および圧電デバイスの製造方法
JP4843424B2 (ja) * 2006-09-05 2011-12-21 日本電波工業株式会社 水晶振動子用のガラス封止カバー及びこれを用いた水晶振動子の製造方法
JP5216290B2 (ja) * 2007-09-27 2013-06-19 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法

Also Published As

Publication number Publication date
US20120306320A1 (en) 2012-12-06
TW201251318A (en) 2012-12-16
CN102811028A (zh) 2012-12-05

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