CN102811028A - 压电元件以及压电元件的制造方法 - Google Patents

压电元件以及压电元件的制造方法 Download PDF

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Publication number
CN102811028A
CN102811028A CN2012101719836A CN201210171983A CN102811028A CN 102811028 A CN102811028 A CN 102811028A CN 2012101719836 A CN2012101719836 A CN 2012101719836A CN 201210171983 A CN201210171983 A CN 201210171983A CN 102811028 A CN102811028 A CN 102811028A
Authority
CN
China
Prior art keywords
plate
sealing material
piezoelectric element
wafer
piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101719836A
Other languages
English (en)
Chinese (zh)
Inventor
市川了一
天野芳明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Publication of CN102811028A publication Critical patent/CN102811028A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • User Interface Of Digital Computer (AREA)
CN2012101719836A 2011-06-03 2012-05-29 压电元件以及压电元件的制造方法 Pending CN102811028A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-124837 2011-06-03
JP2011124837A JP2012253587A (ja) 2011-06-03 2011-06-03 圧電デバイス及び圧電デバイスの製造方法

Publications (1)

Publication Number Publication Date
CN102811028A true CN102811028A (zh) 2012-12-05

Family

ID=47234630

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101719836A Pending CN102811028A (zh) 2011-06-03 2012-05-29 压电元件以及压电元件的制造方法

Country Status (4)

Country Link
US (1) US20120306320A1 (enExample)
JP (1) JP2012253587A (enExample)
CN (1) CN102811028A (enExample)
TW (1) TW201251318A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111033775A (zh) * 2017-09-25 2020-04-17 Tdk株式会社 振动组件

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012217155A (ja) * 2011-03-30 2012-11-08 Nippon Dempa Kogyo Co Ltd 圧電デバイス及び圧電デバイスの製造方法
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
WO2020137265A1 (ja) * 2018-12-25 2020-07-02 株式会社村田製作所 振動構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5525855A (en) * 1992-10-29 1996-06-11 Nec Corporation Flat packaged piezoelectric device using a glass-ceramic composite material comprising forsterite as ceramics
JP2005210185A (ja) * 2004-01-20 2005-08-04 Seiko Epson Corp 圧電振動片および圧電デバイスの製造方法
JP2008066885A (ja) * 2006-09-05 2008-03-21 Nippon Dempa Kogyo Co Ltd 水晶振動子用のガラス封止カバー及びこれを用いた表面実装用の水晶振動子
CN101399527A (zh) * 2007-09-27 2009-04-01 日本电波工业株式会社 压电装置及压电装置的制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5525855A (en) * 1992-10-29 1996-06-11 Nec Corporation Flat packaged piezoelectric device using a glass-ceramic composite material comprising forsterite as ceramics
JP2005210185A (ja) * 2004-01-20 2005-08-04 Seiko Epson Corp 圧電振動片および圧電デバイスの製造方法
JP2008066885A (ja) * 2006-09-05 2008-03-21 Nippon Dempa Kogyo Co Ltd 水晶振動子用のガラス封止カバー及びこれを用いた表面実装用の水晶振動子
CN101399527A (zh) * 2007-09-27 2009-04-01 日本电波工业株式会社 压电装置及压电装置的制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111033775A (zh) * 2017-09-25 2020-04-17 Tdk株式会社 振动组件

Also Published As

Publication number Publication date
TW201251318A (en) 2012-12-16
JP2012253587A (ja) 2012-12-20
US20120306320A1 (en) 2012-12-06

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121205