JP2012238640A5 - - Google Patents

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Publication number
JP2012238640A5
JP2012238640A5 JP2011105100A JP2011105100A JP2012238640A5 JP 2012238640 A5 JP2012238640 A5 JP 2012238640A5 JP 2011105100 A JP2011105100 A JP 2011105100A JP 2011105100 A JP2011105100 A JP 2011105100A JP 2012238640 A5 JP2012238640 A5 JP 2012238640A5
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JP
Japan
Prior art keywords
optical semiconductor
semiconductor element
electrode
ceramic wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011105100A
Other languages
English (en)
Japanese (ja)
Other versions
JP5756675B2 (ja
JP2012238640A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011105100A priority Critical patent/JP5756675B2/ja
Priority claimed from JP2011105100A external-priority patent/JP5756675B2/ja
Priority to US13/459,535 priority patent/US9106047B2/en
Publication of JP2012238640A publication Critical patent/JP2012238640A/ja
Publication of JP2012238640A5 publication Critical patent/JP2012238640A5/ja
Application granted granted Critical
Publication of JP5756675B2 publication Critical patent/JP5756675B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011105100A 2011-05-10 2011-05-10 光半導体素子用パッケージ及び光半導体装置 Active JP5756675B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011105100A JP5756675B2 (ja) 2011-05-10 2011-05-10 光半導体素子用パッケージ及び光半導体装置
US13/459,535 US9106047B2 (en) 2011-05-10 2012-04-30 Optical semiconductor element package and optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011105100A JP5756675B2 (ja) 2011-05-10 2011-05-10 光半導体素子用パッケージ及び光半導体装置

Publications (3)

Publication Number Publication Date
JP2012238640A JP2012238640A (ja) 2012-12-06
JP2012238640A5 true JP2012238640A5 (enExample) 2014-02-06
JP5756675B2 JP5756675B2 (ja) 2015-07-29

Family

ID=47141856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011105100A Active JP5756675B2 (ja) 2011-05-10 2011-05-10 光半導体素子用パッケージ及び光半導体装置

Country Status (2)

Country Link
US (1) US9106047B2 (enExample)
JP (1) JP5756675B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013217796A1 (de) * 2013-09-05 2015-03-05 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optoelektronische Vorrichtung und Verfahren zum Herstellen einer optoelektronischen Vorrichtung
JP2015225974A (ja) * 2014-05-28 2015-12-14 日立金属株式会社 Ｃａｎパッケージ半導体レーザ用治具
CN110226270B (zh) * 2017-01-20 2021-09-28 三菱电机株式会社 光模块
JP6988493B2 (ja) * 2018-01-11 2022-01-05 住友電気工業株式会社 光モジュール及びその製造方法
US20240292530A1 (en) 2021-06-21 2024-08-29 Kyocera Corporation Wiring board, electronic component storage package, and electronic device
CN113725303B (zh) * 2021-11-04 2022-02-11 至芯半导体(杭州)有限公司 斜面探测器件封装结构及其制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2682641B2 (ja) * 1988-06-03 1997-11-26 株式会社リコー 半導体レーザー光源装置
US6522673B1 (en) * 1999-12-22 2003-02-18 New Focus, Inc. Method and apparatus for optical transmission
US6659659B1 (en) * 2001-04-11 2003-12-09 Optical Communication Products, Inc. High-speed optical sub-assembly utilizing ceramic substrate, direct coupling and laser welding
JP2003163382A (ja) 2001-11-29 2003-06-06 Matsushita Electric Ind Co Ltd 受光素子または発光素子用パッケージ
EP1468475A2 (en) 2002-01-18 2004-10-20 Oepic, Inc. High-speed to-can optoelectronic packages
DE10341433A1 (de) * 2003-09-09 2005-03-31 Braun Gmbh Beheizbarer Infrarot-Sensor und Infrarot-Thermometer mit einem derartigen Infrarot-Sensor
US7223629B2 (en) * 2003-12-11 2007-05-29 Intel Corporation Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header
JP2010186965A (ja) 2009-02-13 2010-08-26 Toshiba Corp 半導体パッケージおよびその作製方法
US20110317965A1 (en) 2009-05-12 2011-12-29 Sumitomo Electric Industries, Ltd. Optical subassembly with optical device having ceramic package

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