JP2012216487A - 高温超伝導線材 - Google Patents
高温超伝導線材 Download PDFInfo
- Publication number
- JP2012216487A JP2012216487A JP2011184603A JP2011184603A JP2012216487A JP 2012216487 A JP2012216487 A JP 2012216487A JP 2011184603 A JP2011184603 A JP 2011184603A JP 2011184603 A JP2011184603 A JP 2011184603A JP 2012216487 A JP2012216487 A JP 2012216487A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temperature superconducting
- superconducting wire
- buffer layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000010935 stainless steel Substances 0.000 claims abstract description 23
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 23
- 239000013078 crystal Substances 0.000 claims abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 10
- 239000010703 silicon Substances 0.000 claims abstract description 10
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 8
- 239000011733 molybdenum Substances 0.000 claims abstract description 8
- 239000000463 material Substances 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 7
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 4
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 4
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 4
- 229910052689 Holmium Inorganic materials 0.000 claims abstract description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 4
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 4
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 75
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical group O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims description 7
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 5
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 4
- 241000954177 Bangana ariza Species 0.000 claims description 3
- HBAGRTDVSXKKDO-UHFFFAOYSA-N dioxido(dioxo)manganese lanthanum(3+) Chemical compound [La+3].[La+3].[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O HBAGRTDVSXKKDO-UHFFFAOYSA-N 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 53
- 229910000856 hastalloy Inorganic materials 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 12
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 239000002887 superconductor Substances 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- CAJPVKIHAHESPE-UHFFFAOYSA-N barium;gadolinium;oxocopper Chemical compound [Ba].[Gd].[Cu]=O CAJPVKIHAHESPE-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 101100137815 Arabidopsis thaliana PRP8A gene Proteins 0.000 description 1
- 229910017060 Fe Cr Inorganic materials 0.000 description 1
- 229910002544 Fe-Cr Inorganic materials 0.000 description 1
- -1 Fe—Cr compound Chemical class 0.000 description 1
- 101000920618 Homo sapiens Transcription and mRNA export factor ENY2 Proteins 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 101150085660 SUS2 gene Proteins 0.000 description 1
- 102100031954 Transcription and mRNA export factor ENY2 Human genes 0.000 description 1
- LGVUVWSTEGWVKM-UHFFFAOYSA-N [Cu]=O.[Ba].[Sm] Chemical compound [Cu]=O.[Ba].[Sm] LGVUVWSTEGWVKM-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- UPHIPHFJVNKLMR-UHFFFAOYSA-N chromium iron Chemical class [Cr].[Fe] UPHIPHFJVNKLMR-UHFFFAOYSA-N 0.000 description 1
- 238000010549 co-Evaporation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001017 electron-beam sputter deposition Methods 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007735 ion beam assisted deposition Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming superconductor layers
- H10N60/0576—Processes for depositing or forming superconductor layers characterised by the substrate
- H10N60/0632—Intermediate layers, e.g. for growth control
Abstract
【解決手段】本発明の高温超伝導線材は、基板と、基板上に形成されたバッファ層と、バッファ層上に形成された高温超伝導層とを含んでなる高温超伝導線材において、前記基板は、SUS310s、またはシリコン(Si)が0.01%〜1%、モリブデン(Mo)が1%〜5%で含有されるステンレス鋼からなり、該基板を成す金属結晶粒は12μm以下の平均粒径を有し、前記高温超伝導層はReBCO(ReBa2Cu3O7、Re=Nd、Sm、Eu、Gd、Dy、Ho、Y)系高温超伝導物質を使用する。
【選択図】図5
Description
以下、本発明の実施例について説明する。
Claims (3)
- 基板と、基板上に形成されたバッファ層と、バッファ層上に形成された高温超伝導層とを含んでなる高温超伝導線材において、
前記基板は、SUS310s、またはシリコン(Si)が0.01%〜1%、モリブデン(Mo)が1%〜5%で含有されるステンレス鋼からなり、該基板を成す金属結晶粒は12μm以下の平均粒径を有し、前記高温超伝導層はReBCO(ReBa2Cu3O7、Re=Nd、Sm、Eu、Gd、Dy、Ho、Y)系高温超伝導物質を使用することを特徴とする高温超伝導線材。 - 前記バッファ層が酸化イットリウム(Y2O3)/マグネシア(MgO)/マンガン酸ランタン(LaMnO3)であることを特徴とする請求項1に記載の高温超伝導線材。
- 前記バッファ層がアルミナ(Al2O3)/酸化イットリウム(Y2O3)/マグネシア(MgO)/セリア(CeO2)であることを特徴とする請求項1に記載の高温超伝導線材。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110029468A KR20120111137A (ko) | 2011-03-31 | 2011-03-31 | 고온 초전도 선재 |
KR10-2011-0029468 | 2011-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012216487A true JP2012216487A (ja) | 2012-11-08 |
JP5492159B2 JP5492159B2 (ja) | 2014-05-14 |
Family
ID=45562079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011184603A Active JP5492159B2 (ja) | 2011-03-31 | 2011-08-26 | 高温超伝導線材 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8633137B2 (ja) |
EP (1) | EP2506324B1 (ja) |
JP (1) | JP5492159B2 (ja) |
KR (1) | KR20120111137A (ja) |
ES (1) | ES2537443T3 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11309480B2 (en) | 2015-05-11 | 2022-04-19 | University Of Houston System | Ultra-thin film superconducting tapes |
EP3282493B1 (de) * | 2016-08-10 | 2020-03-11 | Theva Dünnschichttechnik GmbH | Hochtemperatur-supraleiter-bandleiter mit edelstahl-substrat |
CN108963067B (zh) * | 2018-07-27 | 2022-04-29 | 武汉工程大学 | 一种ReBa2Cu3O7-x超导薄膜上制备钉扎层的方法 |
CN113013318B (zh) * | 2021-03-09 | 2023-07-11 | 傲普(上海)新能源有限公司 | 一种储能用高温超导材料性能提高方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH087674A (ja) * | 1994-06-20 | 1996-01-12 | Hitachi Chem Co Ltd | 酸化物超電導複合体の製造法 |
US6106615A (en) * | 1997-09-19 | 2000-08-22 | Goyal; Amit | Method of forming biaxially textured alloy substrates and devices thereon |
JP2001110255A (ja) * | 1999-10-07 | 2001-04-20 | Furukawa Electric Co Ltd:The | 高強度配向多結晶金属基板および酸化物超電導線材 |
JP2001266666A (ja) * | 2000-02-01 | 2001-09-28 | Zentrum Fuer Funktionswerkstoffe Gemeinnuetzige Gmbh | 超伝導要素 |
US20030036483A1 (en) * | 2000-12-06 | 2003-02-20 | Arendt Paul N. | High temperature superconducting thick films |
JP2007200870A (ja) * | 2006-01-26 | 2007-08-09 | Ls Cable Ltd | 超伝導ケーブル用基板の製造方法 |
JP2007200831A (ja) * | 2005-12-26 | 2007-08-09 | Furukawa Electric Co Ltd:The | 超電導体用基材およびその製造方法 |
WO2008023782A1 (fr) * | 2006-08-25 | 2008-02-28 | Nihon Microcoating Co., Ltd. | Procédé pour polir un substrat en bande pour un oxyde supraconducteur et oxyde supraconducteur et substrat pour un oxyde supraconducteur |
JP2008200775A (ja) * | 2007-02-16 | 2008-09-04 | Nihon Micro Coating Co Ltd | 超電導体用テープ基材の製造方法及びテープ基材 |
JP2010086796A (ja) * | 2008-09-30 | 2010-04-15 | Fujikura Ltd | 多結晶薄膜とその製造方法及び酸化物超電導導体 |
WO2010055651A1 (ja) * | 2008-11-12 | 2010-05-20 | 東洋鋼鈑株式会社 | 酸化物超電導線材用金属積層基板の製造方法及び該基板を用いた酸化物超電導線材 |
JP2010123475A (ja) * | 2008-11-21 | 2010-06-03 | International Superconductivity Technology Center | 超電導膜成膜用基板、超電導線材及びそれらの製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU610260B2 (en) | 1987-10-16 | 1991-05-16 | Furukawa Electric Co. Ltd., The | Oxide superconductor shaped body and method of manufacturing the same |
US5019555A (en) * | 1988-08-10 | 1991-05-28 | General Atomics | High purity superconducting compositions and methods for their fabrication |
JP3383799B2 (ja) * | 1993-09-02 | 2003-03-04 | 独立行政法人物質・材料研究機構 | 超電導複合体及びその製造法 |
WO1997005669A1 (en) * | 1995-07-26 | 1997-02-13 | Illinois Superconductor Corporation | Method for producing highly textured yttrium barium cuprate for use in waveguides and transmission lines |
US7879763B2 (en) * | 2006-11-10 | 2011-02-01 | Superpower, Inc. | Superconducting article and method of making |
US8195260B2 (en) * | 2008-07-23 | 2012-06-05 | American Superconductor Corporation | Two-sided splice for high temperature superconductor laminated wires |
-
2011
- 2011-03-31 KR KR1020110029468A patent/KR20120111137A/ko not_active Application Discontinuation
- 2011-08-26 JP JP2011184603A patent/JP5492159B2/ja active Active
- 2011-09-07 US US13/226,678 patent/US8633137B2/en active Active
- 2011-09-28 ES ES11183039.4T patent/ES2537443T3/es active Active
- 2011-09-28 EP EP20110183039 patent/EP2506324B1/en active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH087674A (ja) * | 1994-06-20 | 1996-01-12 | Hitachi Chem Co Ltd | 酸化物超電導複合体の製造法 |
US6106615A (en) * | 1997-09-19 | 2000-08-22 | Goyal; Amit | Method of forming biaxially textured alloy substrates and devices thereon |
JP2001110255A (ja) * | 1999-10-07 | 2001-04-20 | Furukawa Electric Co Ltd:The | 高強度配向多結晶金属基板および酸化物超電導線材 |
JP2001266666A (ja) * | 2000-02-01 | 2001-09-28 | Zentrum Fuer Funktionswerkstoffe Gemeinnuetzige Gmbh | 超伝導要素 |
US20030036483A1 (en) * | 2000-12-06 | 2003-02-20 | Arendt Paul N. | High temperature superconducting thick films |
US20030144150A1 (en) * | 2000-12-06 | 2003-07-31 | Arendt Paul N. | Substrate structure for growth of highly oriented and/or epitaxial layers thereon |
JP2007200831A (ja) * | 2005-12-26 | 2007-08-09 | Furukawa Electric Co Ltd:The | 超電導体用基材およびその製造方法 |
JP2007200870A (ja) * | 2006-01-26 | 2007-08-09 | Ls Cable Ltd | 超伝導ケーブル用基板の製造方法 |
WO2008023782A1 (fr) * | 2006-08-25 | 2008-02-28 | Nihon Microcoating Co., Ltd. | Procédé pour polir un substrat en bande pour un oxyde supraconducteur et oxyde supraconducteur et substrat pour un oxyde supraconducteur |
JP2008200775A (ja) * | 2007-02-16 | 2008-09-04 | Nihon Micro Coating Co Ltd | 超電導体用テープ基材の製造方法及びテープ基材 |
JP2010086796A (ja) * | 2008-09-30 | 2010-04-15 | Fujikura Ltd | 多結晶薄膜とその製造方法及び酸化物超電導導体 |
WO2010055651A1 (ja) * | 2008-11-12 | 2010-05-20 | 東洋鋼鈑株式会社 | 酸化物超電導線材用金属積層基板の製造方法及び該基板を用いた酸化物超電導線材 |
JP2010123475A (ja) * | 2008-11-21 | 2010-06-03 | International Superconductivity Technology Center | 超電導膜成膜用基板、超電導線材及びそれらの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2506324A3 (en) | 2014-01-15 |
ES2537443T3 (es) | 2015-06-08 |
JP5492159B2 (ja) | 2014-05-14 |
EP2506324B1 (en) | 2015-04-22 |
US20120252680A1 (en) | 2012-10-04 |
KR20120111137A (ko) | 2012-10-10 |
US8633137B2 (en) | 2014-01-21 |
EP2506324A2 (en) | 2012-10-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7879161B2 (en) | Strong, non-magnetic, cube textured alloy substrates | |
JP5492159B2 (ja) | 高温超伝導線材 | |
Varanasi et al. | Biaxially textured copper and copper–iron alloy substrates for use in YBa2Cu3O7− x coated conductors | |
JP4316070B2 (ja) | 高強度配向多結晶金属基板および酸化物超電導線材 | |
WO2016068046A1 (ja) | 超電導線材用基板及びその製造方法、並びに超電導線材 | |
Bhattacharjee et al. | Nickel base substrate tapes for coated superconductor applications | |
JP5330725B2 (ja) | 超電導線材用基板およびその製造方法 | |
JP5693398B2 (ja) | 酸化物超電導導体とその製造方法 | |
JP2008066168A (ja) | MgB2超伝導線材及びその製造法 | |
JP2015050147A (ja) | 超電導線材用基板及びその製造方法、並びに超電導線材 | |
Gao et al. | Characterization and properties of an advanced composite substrate for YBCO-coated conductors | |
RU2624564C2 (ru) | Способ изготовления биаксиально текстурированной подложки из тройного сплава на медно-никелевой основе | |
Suo et al. | Technique for developing highly strengthened and biaxially textured composite substrates for coated superconductor tapes | |
JP5950826B2 (ja) | 超電導線材及び超電導線材の製造方法 | |
EP2905362B1 (en) | Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire | |
JP5939995B2 (ja) | 超電導線材及び超電導線材の製造方法 | |
CN103824647B (zh) | 前体的制造方法、超导线材的制造方法、前体和超导线材 | |
RU2451766C1 (ru) | Способ изготовления биаксиально текстурированной подложки из бинарного сплава на основе никеля для эпитаксиального нанесения на нее буферного и высокотемпературного сверхпроводящего слоев для ленточных сверхпроводников | |
JP5323444B2 (ja) | 酸化物超電導線材用複合基板、その製造方法、及び超電導線材 | |
JP2012018829A (ja) | 超電導線材およびその製造方法 | |
Suo et al. | A novel approach using powder metallurgy for strengthened RABiTS composite substrates for coated superconductors | |
Zhao et al. | Sparking plasma sintering method for developing cube textured Ni7W/Ni12W/Ni7W multi-layer substrates used for coated conductors | |
Bhattacharjee et al. | Processing and characterization of Ni base coated superconductor substrate tapes with layered architecture | |
Song et al. | Magnetic Properties of $[\hbox {Ni} _ {97 {\rm at.}\%} $-W $ _ {3 {\rm at.}\%}] _ {{100}-{x}} $-Cu $ _x $ Textured Substrates for Coated Conductors | |
CN115410785A (zh) | 一种用于钐钴永磁材料表面防护的镀层及钐钴永磁材料表面的防护方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130418 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130719 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140204 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140228 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5492159 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |