JP2012207263A - 蒸着方法および蒸着装置 - Google Patents

蒸着方法および蒸着装置 Download PDF

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Publication number
JP2012207263A
JP2012207263A JP2011073410A JP2011073410A JP2012207263A JP 2012207263 A JP2012207263 A JP 2012207263A JP 2011073410 A JP2011073410 A JP 2011073410A JP 2011073410 A JP2011073410 A JP 2011073410A JP 2012207263 A JP2012207263 A JP 2012207263A
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JP
Japan
Prior art keywords
vapor deposition
gas
crucible
nozzle
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011073410A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyasu Matsuura
宏育 松浦
Hideaki Minekawa
英明 峰川
Masatoshi Muneto
正利 宗藤
Noboru Kato
昇 加藤
Tatsuya Miyake
竜也 三宅
Kenichi Yamamoto
健一 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2011073410A priority Critical patent/JP2012207263A/ja
Priority to KR1020120012968A priority patent/KR101363147B1/ko
Priority to CN2012100343958A priority patent/CN102732838A/zh
Priority to TW101106005A priority patent/TW201239122A/zh
Publication of JP2012207263A publication Critical patent/JP2012207263A/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/228—Gas flow assisted PVD deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011073410A 2011-03-29 2011-03-29 蒸着方法および蒸着装置 Pending JP2012207263A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011073410A JP2012207263A (ja) 2011-03-29 2011-03-29 蒸着方法および蒸着装置
KR1020120012968A KR101363147B1 (ko) 2011-03-29 2012-02-08 증착 방법 및 증착 장치
CN2012100343958A CN102732838A (zh) 2011-03-29 2012-02-15 蒸镀方法及蒸镀装置
TW101106005A TW201239122A (en) 2011-03-29 2012-02-23 Vapor deposition method and vapor deposition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011073410A JP2012207263A (ja) 2011-03-29 2011-03-29 蒸着方法および蒸着装置

Publications (1)

Publication Number Publication Date
JP2012207263A true JP2012207263A (ja) 2012-10-25

Family

ID=46989127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011073410A Pending JP2012207263A (ja) 2011-03-29 2011-03-29 蒸着方法および蒸着装置

Country Status (4)

Country Link
JP (1) JP2012207263A (zh)
KR (1) KR101363147B1 (zh)
CN (1) CN102732838A (zh)
TW (1) TW201239122A (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014105375A (ja) * 2012-11-29 2014-06-09 Optorun Co Ltd 真空蒸着源及びそれを用いた真空蒸着方法
KR101784202B1 (ko) 2011-12-22 2017-10-12 주식회사 원익아이피에스 콜드립을 구비하는 증발원
CN108660420A (zh) * 2018-07-25 2018-10-16 华夏易能（广东）新能源科技有限公司 真空蒸镀设备及蒸发源装置
WO2018199184A1 (ja) * 2017-04-26 2018-11-01 株式会社アルバック 蒸発源及び成膜装置
JP2020143315A (ja) * 2019-03-05 2020-09-10 日本エア・リキード合同会社 固体材料容器
WO2021107224A1 (ko) * 2019-11-29 2021-06-03 엘지전자 주식회사 증착 장치

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI477625B (zh) * 2012-12-26 2015-03-21 Au Optronics Corp 蒸鍍裝置
KR101413610B1 (ko) * 2013-01-31 2014-07-08 부산대학교 산학협력단 대면적 균일 박막 형성용 진공 증발원
WO2014174803A1 (ja) * 2013-04-22 2014-10-30 パナソニック株式会社 Ｅｌ表示装置の製造方法
KR20150004646A (ko) * 2013-07-03 2015-01-13 삼성디스플레이 주식회사 증착원
CN104294217A (zh) * 2013-07-18 2015-01-21 上海和辉光电有限公司 蒸发源装置
TWI473894B (zh) * 2013-09-11 2015-02-21 Au Optronics Corp 蒸鍍設備
CN103668083B (zh) * 2013-12-13 2016-10-19 京东方科技集团股份有限公司 冷却装置以及真空蒸镀设备
CN103695847B (zh) * 2013-12-24 2016-03-16 京东方科技集团股份有限公司 坩埚及其蒸镀方法
KR102222876B1 (ko) * 2014-01-10 2021-03-04 주식회사 선익시스템 증착장치용 증발원
JP6584067B2 (ja) * 2014-05-30 2019-10-02 日立造船株式会社 真空蒸着装置
CN104746017B (zh) * 2015-04-13 2017-08-25 清华大学 电极蒸镀装置
SG10201510101XA (en) * 2015-12-09 2017-07-28 Au Optronics Corp Evaporation apparatus and evaporation method
CN105762278B (zh) * 2016-03-04 2018-05-01 苏州大学 一种真空蒸镀装置及利用其制备有机电致发光器件的方法
TWI586823B (zh) * 2016-11-25 2017-06-11 Nat Chung-Shan Inst Of Science And Tech Apparatus and method for quantifying the amount of solid matter deposited
JP6468540B2 (ja) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 基板搬送機構、基板載置機構、成膜装置及びそれらの方法
CN109402592B (zh) * 2017-08-18 2020-06-26 Tcl科技集团股份有限公司 器件侧面蒸镀装置及器件侧面蒸镀方法
JP6576009B2 (ja) * 2017-08-28 2019-09-18 キヤノントッキ株式会社 蒸発源容器及び蒸発源装置
CN107779824A (zh) * 2017-12-07 2018-03-09 合肥鑫晟光电科技有限公司 蒸发源、蒸镀装置以及有机电致发光显示器的生产设备
JP6595568B2 (ja) * 2017-12-12 2019-10-23 キヤノントッキ株式会社 蒸発源装置及び蒸着装置
CN109290740B (zh) * 2018-10-18 2021-03-02 重庆文理学院 一种在加热处理过程中控制柱塞热变形的工艺方法
CN110344002B (zh) * 2019-06-11 2022-03-22 惠科股份有限公司 一种蒸镀装置和蒸镀方法
FR3102189B1 (fr) * 2019-10-17 2022-08-05 Riber Cellule d’évaporation pour chambre d’évaporation sous vide et procédé d’évaporation associé
CN110724911B (zh) * 2019-11-06 2021-11-02 深圳市华星光电半导体显示技术有限公司 蒸镀坩埚、蒸镀系统及蒸镀oled的方法
JP6959680B1 (ja) * 2020-11-13 2021-11-05 株式会社シンクロン 成膜装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0525613A (ja) * 1991-07-23 1993-02-02 Shibaura Eng Works Co Ltd 均熱部材の冷却方法
JP2008115416A (ja) * 2006-11-02 2008-05-22 Canon Inc 真空蒸着源および真空蒸着装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212731A (ja) * 1999-01-25 2000-08-02 Victor Co Of Japan Ltd 蒸着装置
JP3485104B2 (ja) * 2001-04-24 2004-01-13 日新電機株式会社 イオン源用オーブン
JP4342868B2 (ja) 2003-08-11 2009-10-14 株式会社アルバック 成膜装置
KR100761079B1 (ko) * 2005-01-31 2007-09-21 삼성에스디아이 주식회사 냉각수단을 갖는 증발원 및 이를 이용한 증착 장치
KR100671673B1 (ko) * 2005-03-09 2007-01-19 삼성에스디아이 주식회사 다중 진공증착장치 및 제어방법
KR100887703B1 (ko) * 2007-05-18 2009-03-11 아이시스(주) 일체형 애노드를 구비한 이온 플레이팅 장치

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0525613A (ja) * 1991-07-23 1993-02-02 Shibaura Eng Works Co Ltd 均熱部材の冷却方法
JP2008115416A (ja) * 2006-11-02 2008-05-22 Canon Inc 真空蒸着源および真空蒸着装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101784202B1 (ko) 2011-12-22 2017-10-12 주식회사 원익아이피에스 콜드립을 구비하는 증발원
JP2014105375A (ja) * 2012-11-29 2014-06-09 Optorun Co Ltd 真空蒸着源及びそれを用いた真空蒸着方法
WO2018199184A1 (ja) * 2017-04-26 2018-11-01 株式会社アルバック 蒸発源及び成膜装置
JPWO2018199184A1 (ja) * 2017-04-26 2019-06-27 株式会社アルバック 蒸発源及び成膜装置
CN108660420A (zh) * 2018-07-25 2018-10-16 华夏易能（广东）新能源科技有限公司 真空蒸镀设备及蒸发源装置
WO2020019538A1 (zh) * 2018-07-25 2020-01-30 华夏易能（广东）新能源科技有限公司 真空蒸镀设备及蒸发源装置
JP2020143315A (ja) * 2019-03-05 2020-09-10 日本エア・リキード合同会社 固体材料容器
WO2021107224A1 (ko) * 2019-11-29 2021-06-03 엘지전자 주식회사 증착 장치

Also Published As

Publication number Publication date
KR20120111987A (ko) 2012-10-11
KR101363147B1 (ko) 2014-02-13
CN102732838A (zh) 2012-10-17
TW201239122A (en) 2012-10-01

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