JP2012163227A - ヒートパイプおよび電子部品 - Google Patents
ヒートパイプおよび電子部品 Download PDFInfo
- Publication number
- JP2012163227A JP2012163227A JP2011022054A JP2011022054A JP2012163227A JP 2012163227 A JP2012163227 A JP 2012163227A JP 2011022054 A JP2011022054 A JP 2011022054A JP 2011022054 A JP2011022054 A JP 2011022054A JP 2012163227 A JP2012163227 A JP 2012163227A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- electronic component
- reactor
- reactor core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/10—Liquid cooling
- H01F27/18—Liquid cooling by evaporating liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】ヒートパイプ20は、平板を積層して構成される積層体21であって、その内部に細管が形成される積層体21と、前記細管に封入され、熱を輸送する作動液と、を備えている。前記積層体21は、その表面に絶縁膜28が形成された金属平板26を積層して構成されており、絶縁材料からなる絶縁層と、金属材料からなる金属層と、が交互に積層されている。
【選択図】図2
Description
Claims (6)
- 平板を積層して構成される積層体であって、その内部に細管が形成される積層体と、
前記細管に封入され、熱を輸送する作動液と、
を備え、
前記積層体は、絶縁材料からなる絶縁層と、金属材料からなる金属層と、が交互に積層されている、
ことを特徴とするヒートパイプ。 - 請求項1に記載のヒートパイプであって、
前記積層体は、予め溝や孔が形成されるとともに、その表面に絶縁膜が形成された金属平板を積層して構成される、ことを特徴とするヒートパイプ。 - 請求項1または2に記載のヒートパイプと、
前記ヒートパイプの外周囲に、巻回されたコイルと、
を備えた電子部品。 - 請求項3に記載の電子部品であって、さらに、
前記コイルが巻回されるコア材を備え、
前記ヒートパイプのうち、熱を受け取る発熱部が前記コア材の内部に挿入され、受けた熱を外部に放出する放熱部が前記コア材の外側に突出している、
ことを特徴とする電子部品。 - 請求項4に記載の電子部品であって、
前記ヒートパイプの放熱部の外表面には、熱を外部に放出する冷却部材が設置されている、ことを特徴とする電子部品。 - 請求項3から5のいずれか1項に記載の電子部品であって、
前記コイルおよびコア材は、リアクトルコイルおよびリアクトルコアである、ことを特徴とする電子部品。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022054A JP5553040B2 (ja) | 2011-02-03 | 2011-02-03 | 電子部品 |
PCT/IB2012/000166 WO2012104714A1 (en) | 2011-02-03 | 2012-02-01 | Heat pipe and electronic component having the heat pipe |
US13/982,543 US20130308272A1 (en) | 2011-02-03 | 2012-02-01 | Heat pipe and electronic component having the heat pipe |
EP12708924.1A EP2671235A1 (en) | 2011-02-03 | 2012-02-01 | Heat pipe and electronic component having the heat pipe |
CN2012800072121A CN103348422A (zh) | 2011-02-03 | 2012-02-01 | 热管和具有热管的电子部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011022054A JP5553040B2 (ja) | 2011-02-03 | 2011-02-03 | 電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012163227A true JP2012163227A (ja) | 2012-08-30 |
JP5553040B2 JP5553040B2 (ja) | 2014-07-16 |
Family
ID=45833476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011022054A Active JP5553040B2 (ja) | 2011-02-03 | 2011-02-03 | 電子部品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130308272A1 (ja) |
EP (1) | EP2671235A1 (ja) |
JP (1) | JP5553040B2 (ja) |
CN (1) | CN103348422A (ja) |
WO (1) | WO2012104714A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012256763A (ja) * | 2011-06-09 | 2012-12-27 | Tokuden Co Ltd | 静止誘導機器、金属管誘導加熱装置及びインボリュート鉄心冷却構造 |
JP2015102269A (ja) * | 2013-11-22 | 2015-06-04 | 富士通株式会社 | ヒートパイプ、ヒートパイプ製造方法及び電子機器 |
JP2015207612A (ja) * | 2014-04-18 | 2015-11-19 | 新電元工業株式会社 | 磁性部品 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI582924B (zh) * | 2016-02-02 | 2017-05-11 | 宏碁股份有限公司 | 散熱模組與電子裝置 |
IT201700094491A1 (it) * | 2017-08-18 | 2019-02-18 | General Electric Technology Gmbh | Reattore. |
JP6951267B2 (ja) * | 2018-01-22 | 2021-10-20 | 新光電気工業株式会社 | ヒートパイプ及びその製造方法 |
JP7028659B2 (ja) * | 2018-01-30 | 2022-03-02 | 新光電気工業株式会社 | ループ型ヒートパイプ、ループ型ヒートパイプの製造方法 |
JP6920231B2 (ja) * | 2018-02-06 | 2021-08-18 | 新光電気工業株式会社 | ループ型ヒートパイプ |
US11043876B2 (en) | 2018-05-11 | 2021-06-22 | General Electric Company | Electric motor having conformal heat pipe assemblies |
US11122715B2 (en) | 2018-05-11 | 2021-09-14 | General Electric Company | Conformal heat pipe assemblies |
JP7027253B2 (ja) * | 2018-05-30 | 2022-03-01 | 新光電気工業株式会社 | ループ型ヒートパイプ及びその製造方法 |
CN109520345B (zh) * | 2018-11-08 | 2020-09-25 | 大连理工大学 | 一种三明治结构硅玻璃微热管的键合工艺 |
TWI819214B (zh) * | 2020-04-17 | 2023-10-21 | 李克勤 | 層疊式薄型散熱裝置及其製造方法 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01101153U (ja) * | 1987-12-26 | 1989-07-07 | ||
JPH0496648A (ja) * | 1990-08-08 | 1992-03-30 | Hino Motors Ltd | 電気制動装置の冷却装置 |
JPH07122402A (ja) * | 1993-10-28 | 1995-05-12 | Akutoronikusu Kk | ループ型細管ヒートパイプ冷却式巻線抵抗器 |
JPH10261534A (ja) * | 1997-03-21 | 1998-09-29 | Sumitomo Wiring Syst Ltd | 電気自動車用充電システム |
JP2000138485A (ja) * | 1998-10-29 | 2000-05-16 | Sony Corp | ヒートパイプ内蔵プリント配線基板 |
JP2003507994A (ja) * | 1999-08-16 | 2003-02-25 | アメリカン スーパーコンダクター コーポレイション | 電気モータの水冷ステータ巻線 |
JP2009212384A (ja) * | 2008-03-05 | 2009-09-17 | Sumitomo Electric Ind Ltd | リアクトル及びリアクトルの取付構造 |
JP2010119297A (ja) * | 2010-03-04 | 2010-05-27 | Mitsubishi Electric Corp | 電動機及び電動機の製造方法及び密閉型圧縮機及び冷凍空調装置 |
JP2010156533A (ja) * | 2008-12-01 | 2010-07-15 | Suri-Ai:Kk | ループ式ヒートパイプ |
JP2010288424A (ja) * | 2009-06-15 | 2010-12-24 | Denso Corp | 回転電機の固定子及び回転電機 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US4372377A (en) * | 1981-03-16 | 1983-02-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Heat pipes containing alkali metal working fluid |
US5697428A (en) * | 1993-08-24 | 1997-12-16 | Actronics Kabushiki Kaisha | Tunnel-plate type heat pipe |
US6843308B1 (en) * | 2000-12-01 | 2005-01-18 | Atmostat Etudes Et Recherches | Heat exchanger device using a two-phase active fluid, and a method of manufacturing such a device |
US20020135979A1 (en) * | 2001-03-20 | 2002-09-26 | Motorola, Inc | Two-phase cooling module and method of making the same |
JP4350606B2 (ja) | 2004-07-23 | 2009-10-21 | シャープ株式会社 | プリント配線板の製造方法 |
JP4645415B2 (ja) | 2005-11-02 | 2011-03-09 | トヨタ自動車株式会社 | 車両の駆動装置 |
JP2007147226A (ja) * | 2005-11-30 | 2007-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルヒートパイプおよびその製造方法 |
CN200994225Y (zh) * | 2006-12-29 | 2007-12-19 | 帛汉股份有限公司 | 电路基板结构 |
US7438449B2 (en) * | 2007-01-10 | 2008-10-21 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Light emitting diode module having a latching component and a heat-dissipating device |
TWM348267U (en) * | 2008-07-25 | 2009-01-01 | Micro Star Int Co Ltd | Heat conducting pipe and heat dissipation system using the same |
CN201681694U (zh) * | 2009-12-30 | 2010-12-22 | 株洲时代散热技术有限公司 | 一种电抗器散热装置 |
-
2011
- 2011-02-03 JP JP2011022054A patent/JP5553040B2/ja active Active
-
2012
- 2012-02-01 CN CN2012800072121A patent/CN103348422A/zh active Pending
- 2012-02-01 US US13/982,543 patent/US20130308272A1/en not_active Abandoned
- 2012-02-01 EP EP12708924.1A patent/EP2671235A1/en not_active Withdrawn
- 2012-02-01 WO PCT/IB2012/000166 patent/WO2012104714A1/en active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01101153U (ja) * | 1987-12-26 | 1989-07-07 | ||
JPH0496648A (ja) * | 1990-08-08 | 1992-03-30 | Hino Motors Ltd | 電気制動装置の冷却装置 |
JPH07122402A (ja) * | 1993-10-28 | 1995-05-12 | Akutoronikusu Kk | ループ型細管ヒートパイプ冷却式巻線抵抗器 |
JPH10261534A (ja) * | 1997-03-21 | 1998-09-29 | Sumitomo Wiring Syst Ltd | 電気自動車用充電システム |
JP2000138485A (ja) * | 1998-10-29 | 2000-05-16 | Sony Corp | ヒートパイプ内蔵プリント配線基板 |
JP2003507994A (ja) * | 1999-08-16 | 2003-02-25 | アメリカン スーパーコンダクター コーポレイション | 電気モータの水冷ステータ巻線 |
JP2009212384A (ja) * | 2008-03-05 | 2009-09-17 | Sumitomo Electric Ind Ltd | リアクトル及びリアクトルの取付構造 |
JP2010156533A (ja) * | 2008-12-01 | 2010-07-15 | Suri-Ai:Kk | ループ式ヒートパイプ |
JP2010288424A (ja) * | 2009-06-15 | 2010-12-24 | Denso Corp | 回転電機の固定子及び回転電機 |
JP2010119297A (ja) * | 2010-03-04 | 2010-05-27 | Mitsubishi Electric Corp | 電動機及び電動機の製造方法及び密閉型圧縮機及び冷凍空調装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012256763A (ja) * | 2011-06-09 | 2012-12-27 | Tokuden Co Ltd | 静止誘導機器、金属管誘導加熱装置及びインボリュート鉄心冷却構造 |
JP2015102269A (ja) * | 2013-11-22 | 2015-06-04 | 富士通株式会社 | ヒートパイプ、ヒートパイプ製造方法及び電子機器 |
JP2015207612A (ja) * | 2014-04-18 | 2015-11-19 | 新電元工業株式会社 | 磁性部品 |
Also Published As
Publication number | Publication date |
---|---|
JP5553040B2 (ja) | 2014-07-16 |
US20130308272A1 (en) | 2013-11-21 |
EP2671235A1 (en) | 2013-12-11 |
CN103348422A (zh) | 2013-10-09 |
WO2012104714A1 (en) | 2012-08-09 |
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