JP2012161068A - 骨伝導機能つき通信端末機 - Google Patents

骨伝導機能つき通信端末機 Download PDF

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Publication number
JP2012161068A
JP2012161068A JP2011232738A JP2011232738A JP2012161068A JP 2012161068 A JP2012161068 A JP 2012161068A JP 2011232738 A JP2011232738 A JP 2011232738A JP 2011232738 A JP2011232738 A JP 2011232738A JP 2012161068 A JP2012161068 A JP 2012161068A
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JP
Japan
Prior art keywords
communication terminal
bone conduction
vibration
assembled
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011232738A
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English (en)
Japanese (ja)
Inventor
Sang-Chol Yi
サンチョル，イ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vonia Corp
Original Assignee
Vonia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vonia Corp filed Critical Vonia Corp
Publication of JP2012161068A publication Critical patent/JP2012161068A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R11/00—Transducers of moving-armature or moving-core type
    • H04R11/06—Telephone receivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops
JP2011232738A 2011-02-01 2011-10-24 骨伝導機能つき通信端末機 Pending JP2012161068A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0010278 2011-02-01
KR1020110010278A KR101068254B1 (ko) 2011-02-01 2011-02-01 골전도 기능을 갖는 통신단말기

Publications (1)

Publication Number Publication Date
JP2012161068A true JP2012161068A (ja) 2012-08-23

Family

ID=44957979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011232738A Pending JP2012161068A (ja) 2011-02-01 2011-10-24 骨伝導機能つき通信端末機

Country Status (4)

Country Link
US (1) US9226075B2 (ko)
JP (1) JP2012161068A (ko)
KR (1) KR101068254B1 (ko)
WO (1) WO2012105735A1 (ko)

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US20120082324A1 (en) * 2009-06-10 2012-04-05 Seong Sik Choi Vibration earphone

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EP2763379A4 (en) * 2011-09-30 2015-08-05 Kyocera Corp PORTABLE ELECTRONIC APPARATUS
KR101332553B1 (ko) * 2011-12-20 2013-11-22 엘지전자 주식회사 이동 단말기
US11463814B2 (en) 2011-12-23 2022-10-04 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11601761B2 (en) 2011-12-23 2023-03-07 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11343626B2 (en) 2011-12-23 2022-05-24 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11665482B2 (en) 2011-12-23 2023-05-30 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11399234B2 (en) 2011-12-23 2022-07-26 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11611834B2 (en) 2011-12-23 2023-03-21 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11483661B2 (en) 2011-12-23 2022-10-25 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11575994B2 (en) * 2011-12-23 2023-02-07 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11540066B2 (en) 2011-12-23 2022-12-27 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11716575B2 (en) 2011-12-23 2023-08-01 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11641551B2 (en) 2011-12-23 2023-05-02 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11540057B2 (en) 2011-12-23 2022-12-27 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11595760B2 (en) 2011-12-23 2023-02-28 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11528562B2 (en) 2011-12-23 2022-12-13 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11641552B2 (en) 2011-12-23 2023-05-02 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US11638099B2 (en) 2011-12-23 2023-04-25 Shenzhen Shokz Co., Ltd. Bone conduction speaker and compound vibration device thereof
US20140364171A1 (en) * 2012-03-01 2014-12-11 DSP Group Method and system for improving voice communication experience in mobile communication devices
JP2013207601A (ja) 2012-03-28 2013-10-07 Kyocera Corp 電子機器
JP5855508B2 (ja) 2012-03-29 2016-02-09 京セラ株式会社 電子機器
JP5968018B2 (ja) 2012-04-10 2016-08-10 京セラ株式会社 電子機器
JP5986417B2 (ja) 2012-04-12 2016-09-06 京セラ株式会社 電子機器
JP5812926B2 (ja) 2012-04-12 2015-11-17 京セラ株式会社 電子機器
JP5973218B2 (ja) 2012-04-26 2016-08-23 京セラ株式会社 電子機器
JP5968050B2 (ja) * 2012-04-26 2016-08-10 京セラ株式会社 電子機器
JP5968061B2 (ja) 2012-05-01 2016-08-10 京セラ株式会社 電子機器
EP2882107B1 (en) * 2012-05-01 2017-07-26 Kyocera Corporation Electronic device
JP2013247625A (ja) * 2012-05-29 2013-12-09 Kyocera Corp 電子機器
JP6005476B2 (ja) * 2012-10-30 2016-10-12 シャープ株式会社 受話装置、制御プログラム、記録媒体
US11627419B2 (en) 2014-01-06 2023-04-11 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11622209B2 (en) 2014-01-06 2023-04-04 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11950055B2 (en) 2014-01-06 2024-04-02 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11375324B2 (en) * 2014-01-06 2022-06-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11363392B2 (en) * 2014-01-06 2022-06-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11582565B2 (en) 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11589171B2 (en) 2014-01-06 2023-02-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11304011B2 (en) 2014-01-06 2022-04-12 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11368800B2 (en) * 2014-01-06 2022-06-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11589172B2 (en) 2014-01-06 2023-02-21 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11617045B2 (en) 2014-01-06 2023-03-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11805375B2 (en) 2014-01-06 2023-10-31 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11706574B2 (en) 2014-01-06 2023-07-18 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11582564B2 (en) 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11582563B2 (en) 2014-01-06 2023-02-14 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US11197106B2 (en) 2014-01-06 2021-12-07 Shenzhen Voxtech Co., Ltd. Systems and methods for suppressing sound leakage
US11832060B2 (en) 2014-01-06 2023-11-28 Shenzhen Shokz Co., Ltd. Systems and methods for suppressing sound leakage
US9344782B2 (en) 2014-02-18 2016-05-17 Google Technology Holdings LLC Supplementary earpiece for moving display
JP6616059B2 (ja) 2014-02-27 2019-12-04 京セラ株式会社 機器
EP3920551A1 (en) 2015-08-13 2021-12-08 Shenzhen Voxtech Co., Ltd Systems for bone conductor speaker
US10695663B2 (en) * 2015-12-22 2020-06-30 Intel Corporation Ambient awareness in virtual reality
WO2017111447A2 (ko) * 2015-12-24 2017-06-29 주식회사 모다이노칩 이동 단말기
US10582295B1 (en) * 2016-12-20 2020-03-03 Amazon Technologies, Inc. Bone conduction speaker for head-mounted wearable device
CN106598175A (zh) * 2017-01-16 2017-04-26 北京小米移动软件有限公司 移动终端
CN108958697B (zh) * 2018-07-09 2021-08-17 Oppo广东移动通信有限公司 屏幕发声控制方法、装置以及电子装置
KR102625724B1 (ko) * 2018-10-05 2024-01-15 엘지디스플레이 주식회사 표시장치
WO2021000124A1 (zh) * 2019-06-29 2021-01-07 瑞声声学科技(深圳)有限公司 移动终端
KR102195959B1 (ko) * 2019-10-25 2020-12-29 허진숙 골전도 마이크를 구비한 골전도 헤드셋
CN110933566B (zh) * 2019-12-02 2022-03-18 歌尔股份有限公司 一种用于电子产品的振动发声装置及电子产品
CN114007161B (zh) * 2021-11-16 2024-02-13 杭州声联智能科技有限公司 骨传导振子固定件及骨传导振子固定方法

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JPS58182397A (ja) * 1982-04-19 1983-10-25 Takeshi Yoshii 電磁式骨伝導マイクロホン
JPH03266550A (ja) * 1990-03-16 1991-11-27 Fujitsu Ltd 携帯電話機
JP2003143673A (ja) * 2001-11-01 2003-05-16 Citizen Watch Co Ltd 振動機能付電子機器
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JP2008147732A (ja) * 2006-12-06 2008-06-26 Cosmo Gear Kk 骨伝導スピーカー

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JPS58182397A (ja) * 1982-04-19 1983-10-25 Takeshi Yoshii 電磁式骨伝導マイクロホン
JPH03266550A (ja) * 1990-03-16 1991-11-27 Fujitsu Ltd 携帯電話機
JP2003143673A (ja) * 2001-11-01 2003-05-16 Citizen Watch Co Ltd 振動機能付電子機器
WO2007034739A1 (ja) * 2005-09-20 2007-03-29 Temco Japan Co., Ltd. 骨伝導スピーカホルダー及びこれを用いた骨伝導スピーカユニット
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120082324A1 (en) * 2009-06-10 2012-04-05 Seong Sik Choi Vibration earphone

Also Published As

Publication number Publication date
US9226075B2 (en) 2015-12-29
KR101068254B1 (ko) 2011-09-28
WO2012105735A1 (ko) 2012-08-09
US20130308798A1 (en) 2013-11-21

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