JP2012102336A - 共役ポリマー層を成膜するための組成物 - Google Patents
共役ポリマー層を成膜するための組成物 Download PDFInfo
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- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 claims abstract description 8
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- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
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- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
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- 229920002959 polymer blend Polymers 0.000 description 1
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- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
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- 150000003577 thiophenes Chemical class 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/115—Polyfluorene; Derivatives thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
Abstract
【解決手段】発光デバイスの製造にあたってポリマー層を成膜するための組成物であって、組成物は溶媒に溶解した共役ポリマーを含有し、溶媒はジアルキルまたはトリアルキル置換の芳香族炭化水素を含有し、前記アルキル置換基のうち少なくとも2つは互いにオルト位にある組成物。共役ポリマーは発光ポリマーなど、溶媒は1,2−ジメチルベンゼン、1,2,3−トリメチルベンゼンなどが好ましい。
【選択図】なし
Description
最初に例示される組成物は、1%w/vのトリブレンド[このトリブレンドは、おおよそ、14wt%の三元ポリマー[この三元ポリマーは、フルオレン(F8)単位(図3a図示)、ベンゾチアジアゾール(BT)単位(図3b図示)およびトリアリーレン単位(図3c図示)を含む]、56wt%のF8BT(図3d図示)および30wt%のTFB(図3e図示)を含む]を、1,2,4−トリメチルベンゼンに溶解したものである。得られた組成物は、20℃で3.8cpsの粘度および20℃で28mN/mの表面張力を有していた。
第2の実施例では、組成物は、1%w/vの実施例1で述べたトリブレンドを、20vlo%の1,2,4−トリメチルベンゼンと80vlo%のキシレンとの溶媒混合物に溶解したものからなる。この組成物は、20℃で2.9cpsの溶液粘度および20℃で28mN/mの表面張力を有していた。
第3の実施例では、組成物は、1%w/vの実施例1で述べたトリブレンドを、50vlo%の1,2,4−トリメチルベンゼンと50vlo%のキシレンとの溶媒混合物に溶解したものからなる。この組成物は、20℃で2.82cpsの溶液粘度および20℃で28mN/mの表面張力を有していた。トリメチルベンゼンの追加により、組成物の安定性がかなり向上することがわかった。
Claims (16)
- 発光デバイスの製造にあたってポリマー層を成膜するための組成物であって、前記組成物は溶媒に溶解した共役ポリマーを含有し、前記溶媒はジアルキルまたはトリアルキル置換の芳香族炭化水素を含有し、前記アルキル置換基のうち少なくとも2つは互いにオルト位にあることを特徴とする組成物。
- 前記溶媒はジアルキルまたはトリアルキル置換ベンゼンを含有し、前記アルキル置換基のうち少なくとも2つは互いにオルト位にある請求項1に記載の組成物。
- 各々のアルキル置換基は独立にC1−C6アルキル基である請求項1または2に記載の組成物。
- 各々のアルキル置換基はメチル基である請求項3に記載の組成物。
- 前記溶媒は1,2−ジメチルベンゼンを含有する請求項4に記載の組成物。
- 前記溶媒は1,2,3−トリメチルベンゼンを含有する請求項4に記載の組成物。
- 発光デバイスの製造にあたってポリマー層を成膜するための組成物であって、前記組成物は溶媒に溶解した共役ポリマーを含有し、前記溶媒はトリアルキルベンゼンを含有することを特徴とする組成物。
- 前記溶媒はキシレンをも含有することを特徴とする請求項7の組成物。
- 前記溶媒は20〜100重量%のトリアルキルベンゼンと80重量%以下のキシレンを含有する請求項8記載の組成物。
- 前記共役ポリマーは発光ポリマーである前記請求項のいずれかに記載の組成物。
- 前記ポリマーはフルオレン系ポリマーを含有する前記請求項のいずれかに記載の組成物。
- 前記ポリマーはフルオレンおよびトリアリールアミンの単位を含むポリマーを含有する前記請求項のいずれかに記載の組成物。
- 前記ポリマーはフルオレン系ポリマーとフルオレンおよびトリアリールアミンの単位を含むポリマーとのブレンドを含有する前記請求項のいずれかに記載の組成物。
- 前記請求項のいずれかに記載の溶液処理可能な組成物を、複数の細長い穴を通して基板上に供給することによって、ポリマー層を成膜する方法。
- 前記請求項のいずれかに記載の組成物を、インクジェット印刷法によって基板上に成膜する工程を有する、基板上にポリマー層を形成する方法。
- ポリマー層を成膜するインクジェット法における、前記請求項のいずれかに記載の組成物の使用方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBPCT/GB00/03349 | 2000-08-30 | ||
PCT/GB2000/003349 WO2001016251A1 (en) | 1999-08-31 | 2000-08-30 | A formulation for depositing a light-emitting polymer layer |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2002524016A Division JP4989012B2 (ja) | 2000-08-30 | 2001-02-28 | 共役ポリマー層を成膜するための組成物 |
Publications (2)
Publication Number | Publication Date |
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JP2012102336A true JP2012102336A (ja) | 2012-05-31 |
JP2012102336A5 JP2012102336A5 (ja) | 2013-02-07 |
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JP2002524016A Expired - Lifetime JP4989012B2 (ja) | 2000-08-30 | 2001-02-28 | 共役ポリマー層を成膜するための組成物 |
JP2012000537A Pending JP2012102336A (ja) | 2000-08-30 | 2012-01-05 | 共役ポリマー層を成膜するための組成物 |
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JP2002524016A Expired - Lifetime JP4989012B2 (ja) | 2000-08-30 | 2001-02-28 | 共役ポリマー層を成膜するための組成物 |
Country Status (7)
Country | Link |
---|---|
US (3) | US7023012B2 (ja) |
EP (1) | EP1313822B1 (ja) |
JP (2) | JP4989012B2 (ja) |
AT (1) | ATE282077T1 (ja) |
AU (1) | AU2001235796A1 (ja) |
DE (1) | DE60107093T2 (ja) |
WO (1) | WO2002018513A1 (ja) |
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Also Published As
Publication number | Publication date |
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US20060131572A1 (en) | 2006-06-22 |
US7023012B2 (en) | 2006-04-04 |
EP1313822B1 (en) | 2004-11-10 |
JP4989012B2 (ja) | 2012-08-01 |
WO2002018513A1 (en) | 2002-03-07 |
JP2004507606A (ja) | 2004-03-11 |
AU2001235796A1 (en) | 2002-03-13 |
US7687287B2 (en) | 2010-03-30 |
DE60107093D1 (de) | 2004-12-16 |
DE60107093T2 (de) | 2005-03-31 |
US8232548B2 (en) | 2012-07-31 |
ATE282077T1 (de) | 2004-11-15 |
US20040041155A1 (en) | 2004-03-04 |
EP1313822A1 (en) | 2003-05-28 |
US20100155667A1 (en) | 2010-06-24 |
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