JP2012054573A - 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置 - Google Patents
多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置 Download PDFInfo
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- JP2012054573A JP2012054573A JP2011223615A JP2011223615A JP2012054573A JP 2012054573 A JP2012054573 A JP 2012054573A JP 2011223615 A JP2011223615 A JP 2011223615A JP 2011223615 A JP2011223615 A JP 2011223615A JP 2012054573 A JP2012054573 A JP 2012054573A
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- multilayer printed
- printed wiring
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- insulating resin
- resin
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- 239000012286 potassium permanganate Substances 0.000 description 1
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- 230000009257 reactivity Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
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- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
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| JP2013091160A Division JP2013141044A (ja) | 2013-04-24 | 2013-04-24 | 多層プリント配線板用絶縁樹脂組成物、基材付き絶縁シート、多層プリント配線板及び半導体装置 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014001380A (ja) * | 2012-05-24 | 2014-01-09 | Mitsubishi Chemicals Corp | エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 |
| WO2016047682A1 (ja) * | 2014-09-25 | 2016-03-31 | 積水化学工業株式会社 | 樹脂フィルム及び積層フィルム |
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