JP2012039022A5 - - Google Patents
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- Publication number
- JP2012039022A5 JP2012039022A5 JP2010179978A JP2010179978A JP2012039022A5 JP 2012039022 A5 JP2012039022 A5 JP 2012039022A5 JP 2010179978 A JP2010179978 A JP 2010179978A JP 2010179978 A JP2010179978 A JP 2010179978A JP 2012039022 A5 JP2012039022 A5 JP 2012039022A5
- Authority
- JP
- Japan
- Prior art keywords
- lid
- cavity
- base substrate
- peripheral wall
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000002093 peripheral effect Effects 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010179978A JP5629926B2 (ja) | 2010-08-11 | 2010-08-11 | 半導体パッケージおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010179978A JP5629926B2 (ja) | 2010-08-11 | 2010-08-11 | 半導体パッケージおよびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012039022A JP2012039022A (ja) | 2012-02-23 |
| JP2012039022A5 true JP2012039022A5 (enExample) | 2013-08-08 |
| JP5629926B2 JP5629926B2 (ja) | 2014-11-26 |
Family
ID=45850656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010179978A Active JP5629926B2 (ja) | 2010-08-11 | 2010-08-11 | 半導体パッケージおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5629926B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5979994B2 (ja) | 2012-06-12 | 2016-08-31 | 新光電気工業株式会社 | 電子装置 |
| JP6155617B2 (ja) * | 2012-12-13 | 2017-07-05 | セイコーエプソン株式会社 | 電子デバイス、電子機器および移動体 |
| CN114361122B (zh) * | 2021-08-11 | 2025-03-11 | 华为技术有限公司 | 功率模块的封装结构及封装方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010178113A (ja) * | 2009-01-30 | 2010-08-12 | Kyocera Kinseki Corp | 圧電デバイス |
-
2010
- 2010-08-11 JP JP2010179978A patent/JP5629926B2/ja active Active
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