JP2012032410A - 温度センサ・アセンブリ及びその製造方法 - Google Patents
温度センサ・アセンブリ及びその製造方法 Download PDFInfo
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- JP2012032410A JP2012032410A JP2011248271A JP2011248271A JP2012032410A JP 2012032410 A JP2012032410 A JP 2012032410A JP 2011248271 A JP2011248271 A JP 2011248271A JP 2011248271 A JP2011248271 A JP 2011248271A JP 2012032410 A JP2012032410 A JP 2012032410A
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- Prior art keywords
- temperature
- probe
- temperature sensor
- assembly
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
- G01K7/023—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples provided with specially adapted connectors
Abstract
【解決手段】本発明によれば、温度プローブ、実装コネクタ、ワイヤ・セット、遷移構成要素、ハウジング及び回路を有する温度センサ・アセンブリ、及びその製造方法が提供される。温度プローブは、プローブ本体、温度センサ、及び少なくとも1つの導体を含み、少なくとも1つの導体は、この少なくとも1つの導体に及ぶ温度を示す温度信号を提供するように構成される。回路はハウジングに封入され、温度プローブから温度信号を受け取り、受け取った温度信号に応答して温度特性を生成するように構成される。
【選択図】図1
Description
12 温度プローブ
14 先端キャップ
16 無機絶縁(MI)ケーブル
18 実装コネクタ
20 シール・リング又はカラー
22 遷移構成要素
23 グロメット
26 リード・ワイヤ
27 遷移体
28 ハウジング
30 出力部
32 第1の端部
34 第2の端部
36 入力部
50 温度センサ・アセンブリ
52 第1のセンサ・プローブ
53 第2のセンサ・プローブ
54 リード・ワイヤ
55 リード
56 ハウジング
58 リード・カバー
60 先端キャップ
62 アダプタ回路アセンブリ
66 回路基板
68 回路の構成要素
70 コネクタ
72 ハウジング・ベース
73 空洞
74 カバー
80 ケーブル
82 実装コネクタ
84 カラー
86 遷移構成要素
87 遷移体
88 グロメット
90 導体
92 コネクタ
93 先端ディスク
94 チューブ
96 絶縁体
Claims (5)
- 第1の温度センサ、及び前記第1の温度センサに結合され、第1の温度を示す第1の温度信号を提供するように構成された1対の第1の導体を有する第1の温度センサ・プローブと、
第2の温度センサ、及び前記第2の温度センサに結合され、第2の温度を示す第2の温度信号を提供するように構成された1対の第2の導体を有する第2の温度センサ・プローブと、
前記1対の第1の導体及び前記1対の第2の導体に直接固定結合されたアダプタ回路アセンブリであって、該アダプタ回路アセンブリは、前記第1の温度信号を受け取るように構成された第1の入力部、及び前記第2の温度信号を受け取るように構成された第2の入力部を有し、また該アダプタ回路アセンブリは、該アダプタ回路アセンブリの外部にある温度測定システムに結合するための出力部を有し、該出力部は、第1の温度特性及び第2の温度特性を提供するように構成され、また前記アダプタ回路アセンブリは、前記第1の温度信号を受け取り、該第1の温度信号に応答して前記第1の温度特性を生成するように構成された回路を有し、該回路は、前記第2の温度信号を受け取り、該第2の温度信号に応答して前記第2の温度特性を生成するようにさらに構成されているアダプタ回路アセンブリと
を有する温度センサ・アセンブリ。 - 前記第1の温度センサ・プローブが1対の第1のワイヤを有する第1のワイヤ・セットを含み、該第1のワイヤのそれぞれが、前記1対の第1の導体のうちの1つの第1の導体に結合されて第1の結合部を形成し、前記第1の温度センサ・プローブが、前記第1の温度センサ・プローブの端部に結合される第1の接続構成要素であって、2つのチャンネルを備えた第1のグロメットを有する第1の接続構成要素をさらに含み、前記チャンネルのそれぞれが前記第1の導体の1つ及び前記第1のワイヤの1つを受け入れ、前記第1のグロメットが前記第1の結合部を取り囲み、また前記第2の温度センサ・プローブが1対の第2のワイヤを有する第2のワイヤ・セットを含み、該第2のワイヤのそれぞれが、前記1対の第2の導体のうちの1つの第2の導体に結合されて第2の結合部を形成し、前記第2の温度センサ・プローブが、前記第2の温度センサ・プローブの端部に結合される第2の接続構成要素であって、2つのチャンネルを備えた第2のグロメットを有する第2の接続構成要素をさらに含み、前記チャンネルのそれぞれが前記第2の導体の1つ及び前記第2のワイヤの1つを受け入れ、前記第2のグロメットが前記第2の結合部を取り囲んでいる請求項1に記載の温度センサ・アセンブリ。
- 前記第1のセンサ・プローブが、前記第1の温度センサ・プローブの外部に取り付けられた第1のカラーと、前記第1の温度センサ・プローブに回転可能に結合され、前記第1のカラーと係合して前記第1の温度プローブを実装アセンブリに固定するように構成された第1のコネクタとを含み、前記第2のセンサ・プローブが、前記第2の温度センサ・プローブの外部に取り付けられた第2のカラーと、前記第2の温度センサ・プローブに回転可能に結合され、前記第2のカラーと係合して前記第2の温度プローブを実装アセンブリに固定するように構成された第2のコネクタとを含む請求項1に記載の温度センサ・アセンブリ。
- 前記第1のプローブを前記アダプタ回路アセンブリに直接接続するための第1のリード、及び前記第2のプローブを前記アダプタ回路アセンブリに直接接続するための第2のリードをさらに有し、前記アダプタ回路アセンブリは、前記第1及び第2のリードを固定保持するための一体化された部分を有するハウジングをさらに含む請求項1に記載の温度センサ・アセンブリ。
- 前記ハウジングが単体ハウジングであり、前記ハウジングが前記第1及び第2のリードのまわりに成形される請求項1に記載の温度センサ・アセンブリ。
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US11/767,362 | 2007-06-22 | ||
US11/767,362 US7665890B2 (en) | 2006-06-22 | 2007-06-22 | Temperature sensor assembly and method of manufacturing thereof |
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JP2010513323A Division JP2010530540A (ja) | 2007-06-22 | 2008-06-06 | 温度センサ・アセンブリ及びその製造方法 |
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JP2012032410A true JP2012032410A (ja) | 2012-02-16 |
JP5779481B2 JP5779481B2 (ja) | 2015-09-16 |
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JP2010513323A Pending JP2010530540A (ja) | 2007-06-22 | 2008-06-06 | 温度センサ・アセンブリ及びその製造方法 |
JP2011248271A Active JP5779481B2 (ja) | 2007-06-22 | 2011-11-14 | 温度センサ・アセンブリ及びその製造方法 |
JP2015043597A Active JP6189887B2 (ja) | 2007-06-22 | 2015-03-05 | 温度センサ・アセンブリ及びその製造方法 |
JP2015001643U Expired - Lifetime JP3198066U (ja) | 2007-06-22 | 2015-04-03 | 温度センサ・アセンブリ |
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JP2015043597A Active JP6189887B2 (ja) | 2007-06-22 | 2015-03-05 | 温度センサ・アセンブリ及びその製造方法 |
JP2015001643U Expired - Lifetime JP3198066U (ja) | 2007-06-22 | 2015-04-03 | 温度センサ・アセンブリ |
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US (1) | US7665890B2 (ja) |
EP (2) | EP2162711B1 (ja) |
JP (4) | JP2010530540A (ja) |
AT (1) | AT12799U1 (ja) |
DE (1) | DE202008018148U1 (ja) |
ES (1) | ES2657974T3 (ja) |
WO (1) | WO2009002682A1 (ja) |
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- 2008-06-06 AT ATGM252/2011U patent/AT12799U1/de not_active IP Right Cessation
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Also Published As
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EP2162711B1 (en) | 2014-07-16 |
US20080025372A1 (en) | 2008-01-31 |
JP5779481B2 (ja) | 2015-09-16 |
JP2015129767A (ja) | 2015-07-16 |
EP2162711A1 (en) | 2010-03-17 |
EP2778638A2 (en) | 2014-09-17 |
AT12799U1 (de) | 2012-11-15 |
JP2010530540A (ja) | 2010-09-09 |
JP3198066U (ja) | 2015-06-11 |
US7665890B2 (en) | 2010-02-23 |
JP6189887B2 (ja) | 2017-08-30 |
ES2657974T3 (es) | 2018-03-07 |
EP2778638B1 (en) | 2017-11-29 |
EP2778638A3 (en) | 2014-12-10 |
WO2009002682A1 (en) | 2008-12-31 |
DE202008018148U1 (de) | 2011-12-14 |
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