JP2011530834A - フルオロポリマーを含む発光ダイオード筺体 - Google Patents
フルオロポリマーを含む発光ダイオード筺体 Download PDFInfo
- Publication number
- JP2011530834A JP2011530834A JP2011523054A JP2011523054A JP2011530834A JP 2011530834 A JP2011530834 A JP 2011530834A JP 2011523054 A JP2011523054 A JP 2011523054A JP 2011523054 A JP2011523054 A JP 2011523054A JP 2011530834 A JP2011530834 A JP 2011530834A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- fluoropolymer
- emitting diode
- housing
- diode housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US8781508P | 2008-08-11 | 2008-08-11 | |
| US61/087,815 | 2008-08-11 | ||
| US12065808P | 2008-12-08 | 2008-12-08 | |
| US61/120,658 | 2008-12-08 | ||
| US16177809P | 2009-03-20 | 2009-03-20 | |
| US61/161,778 | 2009-03-20 | ||
| PCT/US2009/053089 WO2010019459A2 (en) | 2008-08-11 | 2009-08-07 | Light-emitting diode housing comprising fluoropolymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011530834A true JP2011530834A (ja) | 2011-12-22 |
| JP2011530834A5 JP2011530834A5 (https=) | 2012-08-23 |
Family
ID=41652066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011523054A Pending JP2011530834A (ja) | 2008-08-11 | 2009-08-07 | フルオロポリマーを含む発光ダイオード筺体 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20100032702A1 (https=) |
| EP (1) | EP2311105A2 (https=) |
| JP (1) | JP2011530834A (https=) |
| KR (1) | KR20110044894A (https=) |
| CN (1) | CN102119452A (https=) |
| TW (1) | TW201013996A (https=) |
| WO (1) | WO2010019459A2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020230716A1 (ja) * | 2019-05-16 | 2020-11-19 | 住友化学株式会社 | 電子部品の製造方法および電子部品 |
| JP2021518447A (ja) * | 2018-03-15 | 2021-08-02 | ソルベイ スペシャルティ ポリマーズ イタリー エス.ピー.エー. | 発光装置の構成部品のためのフルオロポリマー組成物 |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102009058421A1 (de) * | 2009-12-16 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
| TWI509838B (zh) * | 2010-04-14 | 2015-11-21 | 黃邦明 | 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構 |
| CN102222751A (zh) * | 2010-04-15 | 2011-10-19 | 黄邦明 | 用以承载发光二极管晶片的外壳及其发光二极管结构 |
| US8340941B2 (en) * | 2010-06-04 | 2012-12-25 | Tyco Electronics Corporation | Temperature measurement system for a light emitting diode (LED) assembly |
| ITMI20101250A1 (it) * | 2010-07-07 | 2012-01-08 | Getters Spa | Miglioramenti per fosfori |
| US8723201B2 (en) | 2010-08-20 | 2014-05-13 | Invenlux Corporation | Light-emitting devices with substrate coated with optically denser material |
| DE102010051959A1 (de) | 2010-11-19 | 2012-05-24 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| WO2012119750A1 (de) * | 2011-03-07 | 2012-09-13 | Schott Ag | Glassystem zum hermetischen verbund von cu bauteilen sowie gehäuse für elektronische bauteile |
| US9453119B2 (en) | 2011-04-14 | 2016-09-27 | Ticona Llc | Polymer composition for producing articles with light reflective properties |
| US9284448B2 (en) | 2011-04-14 | 2016-03-15 | Ticona Llc | Molded reflectors for light-emitting diode assemblies |
| US9062198B2 (en) * | 2011-04-14 | 2015-06-23 | Ticona Llc | Reflectors for light-emitting diode assemblies containing a white pigment |
| US8480254B2 (en) * | 2011-04-14 | 2013-07-09 | Ticona, Llc | Molded reflective structures for light-emitting diodes |
| JP2012244058A (ja) * | 2011-05-23 | 2012-12-10 | Du Pont Mitsui Fluorochem Co Ltd | 発光ダイオード用リフレクター及びハウジング |
| TWI474967B (zh) * | 2011-07-14 | 2015-03-01 | Getters Spa | 有關磷光體之改良 |
| WO2013025832A1 (en) | 2011-08-16 | 2013-02-21 | E. I. Du Pont De Nemours And Company | Reflector for light-emitting diode and housing |
| WO2013101277A1 (en) | 2011-12-30 | 2013-07-04 | Ticona Llc | Reflector for light-emitting devices |
| EP2620471B1 (en) | 2012-01-27 | 2021-03-10 | 3M Innovative Properties Company | Polytetrafluoroethene compound with microspheres and fibers |
| JP2016504459A (ja) | 2012-12-18 | 2016-02-12 | ティコナ・エルエルシー | 発光ダイオードアセンブリ用の成形反射体 |
| US20150009674A1 (en) * | 2013-07-03 | 2015-01-08 | GE Lighting Solutions, LLC | Structures subjected to thermal energy and thermal management methods therefor |
| CN104556977A (zh) * | 2014-12-16 | 2015-04-29 | 广东华辉煌光电科技有限公司 | 一种led陶瓷封装材料 |
| US10423249B2 (en) * | 2014-12-29 | 2019-09-24 | Lenovo (Beijing) Co., Ltd. | Information processing method and electronic device |
| TWM509438U (zh) * | 2015-04-24 | 2015-09-21 | Unity Opto Technology Co Ltd | 發光二極體支架 |
| JP6033361B2 (ja) * | 2015-05-07 | 2016-11-30 | 三井・デュポンフロロケミカル株式会社 | 成形品 |
| WO2017148905A1 (en) | 2016-03-04 | 2017-09-08 | Solvay Specialty Polymers Italy S.P.A. | Fluoropolymer composition for components of light emitting apparatuses |
| CN106768463B (zh) * | 2016-12-21 | 2019-08-09 | 广东工业大学 | 一种基于相变材料的发光二极管温度报警器 |
| CN116583131A (zh) | 2017-04-26 | 2023-08-11 | Oti照明公司 | 用于图案化表面上覆层的方法和包括图案化覆层的装置 |
| CN108231973B (zh) | 2017-12-08 | 2019-08-27 | 开发晶照明(厦门)有限公司 | 封装支架 |
| JP7576337B2 (ja) | 2019-05-08 | 2024-11-01 | オーティーアイ ルミオニクス インコーポレーテッド | 核生成抑制コーティングを形成するための材料およびそれを組み込んだデバイス |
| WO2022123431A1 (en) | 2020-12-07 | 2022-06-16 | Oti Lumionics Inc. | Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating |
| GB2622828A (en) * | 2022-09-29 | 2024-04-03 | Fotolec Tech Limited | A Diffusion Coating for a Lighting Unit |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005507178A (ja) * | 2001-10-31 | 2005-03-10 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
| WO2006101174A1 (ja) * | 2005-03-24 | 2006-09-28 | Kyocera Corporation | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
| JP2006330488A (ja) * | 2005-05-27 | 2006-12-07 | Asahi Glass Co Ltd | 液晶表示装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2378324A1 (fr) * | 1977-01-20 | 1978-08-18 | Radiotechnique Compelec | Perfectionnement a la realisation de dispositifs d'affichage |
| US20050136200A1 (en) * | 2003-12-19 | 2005-06-23 | Durell Christopher N. | Diffuse high reflectance film |
| US7497581B2 (en) * | 2004-03-30 | 2009-03-03 | Goldeneye, Inc. | Light recycling illumination systems with wavelength conversion |
| US7045827B2 (en) * | 2004-06-24 | 2006-05-16 | Gallup Kendra J | Lids for wafer-scale optoelectronic packages |
| US20060134440A1 (en) * | 2004-10-27 | 2006-06-22 | Crivello James V | Silicone encapsulants for light emitting diodes |
| US20080006819A1 (en) * | 2006-06-19 | 2008-01-10 | 3M Innovative Properties Company | Moisture barrier coatings for organic light emitting diode devices |
| US7678701B2 (en) * | 2006-07-31 | 2010-03-16 | Eastman Kodak Company | Flexible substrate with electronic devices formed thereon |
| WO2008023605A1 (en) * | 2006-08-23 | 2008-02-28 | Mitsui Chemicals, Inc. | Light-reflecting body and light source comprising the same |
| TWI302372B (en) * | 2006-08-30 | 2008-10-21 | Polytronics Technology Corp | Heat dissipation substrate for electronic device |
| KR100935869B1 (ko) * | 2008-04-17 | 2010-01-07 | 삼성전기주식회사 | 열가소성 수지 기판을 이용한 백라이트 유닛 |
-
2009
- 2009-07-31 US US12/533,511 patent/US20100032702A1/en not_active Abandoned
- 2009-08-07 KR KR1020117005627A patent/KR20110044894A/ko not_active Withdrawn
- 2009-08-07 CN CN2009801313104A patent/CN102119452A/zh active Pending
- 2009-08-07 EP EP09791267A patent/EP2311105A2/en not_active Withdrawn
- 2009-08-07 WO PCT/US2009/053089 patent/WO2010019459A2/en not_active Ceased
- 2009-08-07 JP JP2011523054A patent/JP2011530834A/ja active Pending
- 2009-08-11 TW TW098126972A patent/TW201013996A/zh unknown
-
2012
- 2012-10-02 US US13/633,313 patent/US20130026526A1/en not_active Abandoned
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005507178A (ja) * | 2001-10-31 | 2005-03-10 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
| WO2006101174A1 (ja) * | 2005-03-24 | 2006-09-28 | Kyocera Corporation | 発光素子収納用パッケージおよび発光装置ならびに照明装置 |
| JP2006330488A (ja) * | 2005-05-27 | 2006-12-07 | Asahi Glass Co Ltd | 液晶表示装置 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021518447A (ja) * | 2018-03-15 | 2021-08-02 | ソルベイ スペシャルティ ポリマーズ イタリー エス.ピー.エー. | 発光装置の構成部品のためのフルオロポリマー組成物 |
| JP7301866B2 (ja) | 2018-03-15 | 2023-07-03 | ソルベイ スペシャルティ ポリマーズ イタリー エス.ピー.エー. | 発光装置の構成部品のためのフルオロポリマー組成物 |
| WO2020230716A1 (ja) * | 2019-05-16 | 2020-11-19 | 住友化学株式会社 | 電子部品の製造方法および電子部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201013996A (en) | 2010-04-01 |
| EP2311105A2 (en) | 2011-04-20 |
| KR20110044894A (ko) | 2011-05-02 |
| CN102119452A (zh) | 2011-07-06 |
| US20130026526A1 (en) | 2013-01-31 |
| US20100032702A1 (en) | 2010-02-11 |
| WO2010019459A3 (en) | 2010-04-22 |
| WO2010019459A2 (en) | 2010-02-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011530834A (ja) | フルオロポリマーを含む発光ダイオード筺体 | |
| CN102652166B (zh) | 具有光源和波长转换元件的照明设备 | |
| WO2013108814A1 (ja) | 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法 | |
| WO2014119693A1 (ja) | 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法 | |
| KR20130062989A (ko) | 냉각된 파장 컨버터를 구비한 캡슐화된 방사선 방출 컴포넌트 그리고 이와 같은 방사선 방출 컴포넌트를 제조하기 위한 방법 | |
| TWI644957B (zh) | Resin composition, reflector, lead frame with reflector, and semiconductor light emitting device | |
| JP7065381B2 (ja) | 光反射体、ベース体、発光装置及びベース体の製造方法 | |
| KR102783854B1 (ko) | 발광 장치의 구성요소용 플루오로중합체 조성물 | |
| KR102665124B1 (ko) | 발광 장치의 구성요소용 플루오로중합체 조성물 | |
| JP6155929B2 (ja) | 半導体発光装置、半導体発光装置用部品及びそれらの製造方法、並びに反射体及びその製造方法 | |
| JP2017079293A (ja) | リフレクター付き光半導体素子実装用基板、半導体発光装置、リフレクター及びリフレクター形成用樹脂組成物 | |
| WO2016017818A1 (ja) | リフレクター及び樹脂組成物 | |
| WO2014119692A1 (ja) | 電子線硬化性樹脂組成物、リフレクター用樹脂フレーム、リフレクター、半導体発光装置、及び成形体の製造方法 | |
| JP2015012032A (ja) | 表面実装型発光装置凹状樹脂体構成材料、表面実装型発光装置凹状樹脂体、及び表面実装型発光装置 | |
| JP2014189711A (ja) | 光半導体実装用基板、半導体発光装置、及び光半導体実装用基板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120704 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120704 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130911 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130924 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20131224 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140107 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20140124 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20140131 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140430 |