CN102119452A - 包含含氟聚合物的发光二极管外壳 - Google Patents

包含含氟聚合物的发光二极管外壳 Download PDF

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Publication number
CN102119452A
CN102119452A CN2009801313104A CN200980131310A CN102119452A CN 102119452 A CN102119452 A CN 102119452A CN 2009801313104 A CN2009801313104 A CN 2009801313104A CN 200980131310 A CN200980131310 A CN 200980131310A CN 102119452 A CN102119452 A CN 102119452A
Authority
CN
China
Prior art keywords
light
fluoropolymer
emitting diodes
pipe shell
diodes pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801313104A
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English (en)
Chinese (zh)
Inventor
J·拉希贾尼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102119452A publication Critical patent/CN102119452A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
CN2009801313104A 2008-08-11 2009-08-07 包含含氟聚合物的发光二极管外壳 Pending CN102119452A (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US8781508P 2008-08-11 2008-08-11
US61/087815 2008-08-11
US12065808P 2008-12-08 2008-12-08
US61/120658 2008-12-08
US16177809P 2009-03-20 2009-03-20
US61/161778 2009-03-20
PCT/US2009/053089 WO2010019459A2 (en) 2008-08-11 2009-08-07 Light-emitting diode housing comprising fluoropolymer

Publications (1)

Publication Number Publication Date
CN102119452A true CN102119452A (zh) 2011-07-06

Family

ID=41652066

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801313104A Pending CN102119452A (zh) 2008-08-11 2009-08-07 包含含氟聚合物的发光二极管外壳

Country Status (7)

Country Link
US (2) US20100032702A1 (https=)
EP (1) EP2311105A2 (https=)
JP (1) JP2011530834A (https=)
KR (1) KR20110044894A (https=)
CN (1) CN102119452A (https=)
TW (1) TW201013996A (https=)
WO (1) WO2010019459A2 (https=)

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CN104379656A (zh) * 2012-01-27 2015-02-25 3M创新有限公司 具有微球体和纤维的聚四氟乙烯复合物
CN104556977A (zh) * 2014-12-16 2015-04-29 广东华辉煌光电科技有限公司 一种led陶瓷封装材料
CN108231973A (zh) * 2017-12-08 2018-06-29 开发晶照明（厦门）有限公司 封装支架
CN112119510A (zh) * 2018-03-15 2020-12-22 索尔维特殊聚合物意大利有限公司 用于发光装置的部件的氟聚合物组合物

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DE102009058421A1 (de) * 2009-12-16 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil
TWI509838B (zh) * 2010-04-14 2015-11-21 黃邦明 具氟化聚合物之表面塗層的發光二極體外殼及其發光二極體結構
CN102222751A (zh) * 2010-04-15 2011-10-19 黄邦明 用以承载发光二极管晶片的外壳及其发光二极管结构
US8340941B2 (en) * 2010-06-04 2012-12-25 Tyco Electronics Corporation Temperature measurement system for a light emitting diode (LED) assembly
ITMI20101250A1 (it) * 2010-07-07 2012-01-08 Getters Spa Miglioramenti per fosfori
US8723201B2 (en) 2010-08-20 2014-05-13 Invenlux Corporation Light-emitting devices with substrate coated with optically denser material
DE102010051959A1 (de) 2010-11-19 2012-05-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement
WO2012119750A1 (de) * 2011-03-07 2012-09-13 Schott Ag Glassystem zum hermetischen verbund von cu bauteilen sowie gehäuse für elektronische bauteile
US9453119B2 (en) 2011-04-14 2016-09-27 Ticona Llc Polymer composition for producing articles with light reflective properties
US9284448B2 (en) 2011-04-14 2016-03-15 Ticona Llc Molded reflectors for light-emitting diode assemblies
US9062198B2 (en) * 2011-04-14 2015-06-23 Ticona Llc Reflectors for light-emitting diode assemblies containing a white pigment
US8480254B2 (en) * 2011-04-14 2013-07-09 Ticona, Llc Molded reflective structures for light-emitting diodes
JP2012244058A (ja) * 2011-05-23 2012-12-10 Du Pont Mitsui Fluorochem Co Ltd 発光ダイオード用リフレクター及びハウジング
TWI474967B (zh) * 2011-07-14 2015-03-01 Getters Spa 有關磷光體之改良
WO2013025832A1 (en) 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
WO2013101277A1 (en) 2011-12-30 2013-07-04 Ticona Llc Reflector for light-emitting devices
JP2016504459A (ja) 2012-12-18 2016-02-12 ティコナ・エルエルシー 発光ダイオードアセンブリ用の成形反射体
US20150009674A1 (en) * 2013-07-03 2015-01-08 GE Lighting Solutions, LLC Structures subjected to thermal energy and thermal management methods therefor
US10423249B2 (en) * 2014-12-29 2019-09-24 Lenovo (Beijing) Co., Ltd. Information processing method and electronic device
TWM509438U (zh) * 2015-04-24 2015-09-21 Unity Opto Technology Co Ltd 發光二極體支架
JP6033361B2 (ja) * 2015-05-07 2016-11-30 三井・デュポンフロロケミカル株式会社 成形品
WO2017148905A1 (en) 2016-03-04 2017-09-08 Solvay Specialty Polymers Italy S.P.A. Fluoropolymer composition for components of light emitting apparatuses
CN106768463B (zh) * 2016-12-21 2019-08-09 广东工业大学 一种基于相变材料的发光二极管温度报警器
CN116583131A (zh) 2017-04-26 2023-08-11 Oti照明公司 用于图案化表面上覆层的方法和包括图案化覆层的装置
JP7576337B2 (ja) 2019-05-08 2024-11-01 オーティーアイ ルミオニクス インコーポレーテッド 核生成抑制コーティングを形成するための材料およびそれを組み込んだデバイス
CN113811429A (zh) * 2019-05-16 2021-12-17 住友化学株式会社 电子部件的制造方法和电子部件
WO2022123431A1 (en) 2020-12-07 2022-06-16 Oti Lumionics Inc. Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating
GB2622828A (en) * 2022-09-29 2024-04-03 Fotolec Tech Limited A Diffusion Coating for a Lighting Unit

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DE2800726A1 (de) * 1977-01-20 1978-07-27 Philips Nv Vorrichtung zur wiedergabe alphanumerischer zeichen
CN1579024A (zh) * 2001-10-31 2005-02-09 奥斯兰姆奥普托半导体有限责任公司 光电元件
US20050136200A1 (en) * 2003-12-19 2005-06-23 Durell Christopher N. Diffuse high reflectance film
CN1713468A (zh) * 2004-06-24 2005-12-28 安捷伦科技有限公司 用于晶片级光电封装的封盖
WO2008023605A1 (en) * 2006-08-23 2008-02-28 Mitsui Chemicals, Inc. Light-reflecting body and light source comprising the same
US20080057333A1 (en) * 2006-08-30 2008-03-06 Polytronics Technology Corporation Heat dissipation substrate for electronic device

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US7497581B2 (en) * 2004-03-30 2009-03-03 Goldeneye, Inc. Light recycling illumination systems with wavelength conversion
US20060134440A1 (en) * 2004-10-27 2006-06-22 Crivello James V Silicone encapsulants for light emitting diodes
DE112006000694B4 (de) * 2005-03-24 2013-10-17 Kyocera Corp. Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
JP2006330488A (ja) * 2005-05-27 2006-12-07 Asahi Glass Co Ltd 液晶表示装置
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US7678701B2 (en) * 2006-07-31 2010-03-16 Eastman Kodak Company Flexible substrate with electronic devices formed thereon
KR100935869B1 (ko) * 2008-04-17 2010-01-07 삼성전기주식회사 열가소성 수지 기판을 이용한 백라이트 유닛

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2800726A1 (de) * 1977-01-20 1978-07-27 Philips Nv Vorrichtung zur wiedergabe alphanumerischer zeichen
CN1579024A (zh) * 2001-10-31 2005-02-09 奥斯兰姆奥普托半导体有限责任公司 光电元件
US20050136200A1 (en) * 2003-12-19 2005-06-23 Durell Christopher N. Diffuse high reflectance film
CN1713468A (zh) * 2004-06-24 2005-12-28 安捷伦科技有限公司 用于晶片级光电封装的封盖
WO2008023605A1 (en) * 2006-08-23 2008-02-28 Mitsui Chemicals, Inc. Light-reflecting body and light source comprising the same
US20080057333A1 (en) * 2006-08-30 2008-03-06 Polytronics Technology Corporation Heat dissipation substrate for electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104379656A (zh) * 2012-01-27 2015-02-25 3M创新有限公司 具有微球体和纤维的聚四氟乙烯复合物
CN104379656B (zh) * 2012-01-27 2016-11-09 3M创新有限公司 具有微球体和纤维的聚四氟乙烯复合物
US9605134B2 (en) 2012-01-27 2017-03-28 3M Innovative Properties Company Polytetrafluoroethene compound with microspheres and fibers
CN104556977A (zh) * 2014-12-16 2015-04-29 广东华辉煌光电科技有限公司 一种led陶瓷封装材料
CN108231973A (zh) * 2017-12-08 2018-06-29 开发晶照明（厦门）有限公司 封装支架
CN108231973B (zh) * 2017-12-08 2019-08-27 开发晶照明（厦门）有限公司 封装支架
US10892389B2 (en) 2017-12-08 2021-01-12 Kaistar Lighting (Xiamen) Co., Ltd. Packaging leadframe and packaging structure
CN112119510A (zh) * 2018-03-15 2020-12-22 索尔维特殊聚合物意大利有限公司 用于发光装置的部件的氟聚合物组合物

Also Published As

Publication number Publication date
TW201013996A (en) 2010-04-01
EP2311105A2 (en) 2011-04-20
JP2011530834A (ja) 2011-12-22
KR20110044894A (ko) 2011-05-02
US20130026526A1 (en) 2013-01-31
US20100032702A1 (en) 2010-02-11
WO2010019459A3 (en) 2010-04-22
WO2010019459A2 (en) 2010-02-18

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Application publication date: 20110706