JP2011526725A - 固体光源のための支持モジュール、このようなモジュールを有する照明装置、及びこのような照明装置を製造するための方法 - Google Patents
固体光源のための支持モジュール、このようなモジュールを有する照明装置、及びこのような照明装置を製造するための方法 Download PDFInfo
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- JP2011526725A JP2011526725A JP2011515699A JP2011515699A JP2011526725A JP 2011526725 A JP2011526725 A JP 2011526725A JP 2011515699 A JP2011515699 A JP 2011515699A JP 2011515699 A JP2011515699 A JP 2011515699A JP 2011526725 A JP2011526725 A JP 2011526725A
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- light source
- contact pin
- support module
- solid state
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- 239000007787 solid Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000005476 soldering Methods 0.000 claims abstract description 21
- 238000002955 isolation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 7
- 238000013037 co-molding Methods 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 238000010292 electrical insulation Methods 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09836—Oblique hole, via or bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (9)
- 1つの面に少なくとも1つの電気接点パッドを持つ固体光源のための支持モジュールであり、
貫通穴を備える導電層であって、前記導電層が、受取面を持ち、前記受取面が、前記電気接点パッドが、前記受取面に面し、前記貫通穴と位置合わせされている状態で、前記固体光源を受けるよう適合される導電層と、
前記導電層の、前記受取面に対する裏側に配設される電気絶縁素子と、
前記電気絶縁素子を通って延在する少なくとも1つの接点ピンであって、前記貫通穴を通って突出し、前記導電層の前記受取面によって受けられる固体光源の前記電気接点パッドと接触させられるよう適合される1つの端部を持つ少なくとも1つの接点ピンとを有する支持モジュールであって、
前記電気絶縁素子が、前記接点ピンの前記端部、及び前記導電層の前記受取面によって受けられる固体光源の前記電気接点パッドへのアクセスを可能にするチャネルを有することを特徴とする支持モジュール。 - 前記導電層に接続され、前記導電層と一緒にカップ状のソケットを形成する円筒形素子を更に有する請求項1に記載の支持モジュール。
- 前記絶縁素子が、インサート成形又は共成形によって前記カップ状のソケット内で形成される請求項2に記載の支持モジュール。
- 前記絶縁素子が、前記接点ピンを機械的に固定するよう適合される請求項1乃至3のいずれか一項に記載の支持モジュール。
- 請求項1乃至4のいずれか一項に記載の支持モジュールと、前記電気接点パッドが前記接点ピンの前記端部に電気的に接続されるように前記導電層の前記受取面上に配設される固体光源とを有する照明装置。
- 請求項5に記載の照明装置を有する照明器具。
- 固体照明装置を製造するための方法であって、
支持モジュールを設けるステップであって、前記支持モジュールが、
貫通穴及び受取面を持つ導電層、
前記導電層の、前記受取面に対する裏側に配設される電気絶縁素子、
前記電気絶縁素子を通って延在する少なくとも1つの接点ピンであって、前記貫通穴を通って突出する1つの端部を持つ少なくとも1つの接点ピン、並びに
前記電気絶縁素子を通るチャネルであって、前記接点ピンの前記端部へのアクセスを可能にするチャネルを含むステップと、
前記導電層の前記受取面上に、固体光源を、前記固体光源の電気接点パッドが、前記受取面に面し、前記貫通穴と位置合わせされるように、配設するステップと、
道具で、前記チャネルを通して、前記接点ピンの前記端部、及び前記電気接点パッドにアクセスするステップと、
前記道具を用いて、前記接点ピンの前記端部を前記電気接点パッドに電気的に接続するステップとを有する方法。 - 前記接点ピンの前記端部が、はんだ付けによって、前記電気接点パッドに電気的に接続される請求項7に記載の方法。
- 前記方法が、前記チャネルに封止材料を充填するステップを更に有する請求項7又は8に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08159568 | 2008-07-03 | ||
EP08159568.8 | 2008-07-03 | ||
PCT/IB2009/052687 WO2010001300A1 (en) | 2008-07-03 | 2009-06-23 | A support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011526725A true JP2011526725A (ja) | 2011-10-13 |
JP5503646B2 JP5503646B2 (ja) | 2014-05-28 |
Family
ID=41226385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011515699A Expired - Fee Related JP5503646B2 (ja) | 2008-07-03 | 2009-06-23 | 固体光源のための支持モジュール、このようなモジュールを有する照明装置、及びこのような照明装置を製造するための方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8373194B2 (ja) |
EP (1) | EP2298048B1 (ja) |
JP (1) | JP5503646B2 (ja) |
KR (1) | KR20110042175A (ja) |
CN (1) | CN102084730B (ja) |
RU (1) | RU2011103797A (ja) |
TW (1) | TW201010142A (ja) |
WO (1) | WO2010001300A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI492687B (zh) * | 2011-01-17 | 2015-07-11 | Hon Hai Prec Ind Co Ltd | 發光二極體燈條及其製造方法 |
RU2474985C1 (ru) * | 2011-07-27 | 2013-02-10 | Открытое акционерное общество "Федеральный научно-производственный центр Нижегородский научно-исследовательский институт радиотехники" | Способ изготовления многослойных печатных плат |
US10763193B2 (en) | 2018-10-30 | 2020-09-01 | Hamilton Sundstrand Corporation | Power control modules |
TWI693119B (zh) * | 2019-03-06 | 2020-05-11 | 台灣愛司帝科技股份有限公司 | 應用於固接led的雷射加熱裝置 |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61137376A (ja) * | 1984-12-07 | 1986-06-25 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | 発光素子マトリツクス及びその製造方法 |
JPH04326783A (ja) * | 1991-04-26 | 1992-11-16 | Rohm Co Ltd | 半導体レーザ装置用ステムの製造方法 |
JPH05226698A (ja) * | 1992-02-14 | 1993-09-03 | Sharp Corp | 発光素子 |
JPH07281619A (ja) * | 1994-04-04 | 1995-10-27 | Rohm Co Ltd | Ledランプ、およびその基板への取付け構造 |
JPH10275512A (ja) * | 1997-03-31 | 1998-10-13 | Denso Corp | ソケット付き発光体 |
JP2002299695A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | Led光源器具 |
JP2002304903A (ja) * | 2001-04-04 | 2002-10-18 | Matsushita Electric Works Ltd | 照明器具 |
JP2003297110A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Works Ltd | 口金型蛍光灯装置 |
JP2004297065A (ja) * | 2003-03-27 | 2004-10-21 | Valeo Vision | パワー発光ダイオードを放熱要素、すなわちラジエータに固定する方法、およびかかるダイオードを含む信号デバイス |
JP2005116182A (ja) * | 2003-10-02 | 2005-04-28 | Rabo Sufia Kk | 広角局部照明装置 |
JP2007035547A (ja) * | 2005-07-29 | 2007-02-08 | Koito Mfg Co Ltd | 車両用前照灯 |
WO2007078103A1 (en) * | 2006-01-06 | 2007-07-12 | Lg Innotek Co., Ltd | Led package, method of fabricating the same, and backlight unit having the same |
JP2008503057A (ja) * | 2004-06-15 | 2008-01-31 | ヘンケル コーポレイション | 高出力ledの電気光学組立体 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9368428B2 (en) * | 2004-06-30 | 2016-06-14 | Cree, Inc. | Dielectric wafer level bonding with conductive feed-throughs for electrical connection and thermal management |
DE102005006280B4 (de) * | 2005-02-10 | 2006-11-16 | Infineon Technologies Ag | Halbleiterbauteil mit einem Durchkontakt durch eine Gehäusemasse und Verfahren zur Herstellung desselben |
US7952112B2 (en) | 2005-04-29 | 2011-05-31 | Philips Lumileds Lighting Company Llc | RGB thermal isolation substrate |
DE202006018985U1 (de) | 2006-12-15 | 2007-03-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Lampe mit einem Sockel und mindestens einem lichtemittierenden Halbleiterbauelement |
TWI356486B (en) * | 2007-09-07 | 2012-01-11 | Young Lighting Technology | Led light source module and manufacturing method t |
-
2009
- 2009-06-23 US US13/000,042 patent/US8373194B2/en not_active Expired - Fee Related
- 2009-06-23 CN CN2009801257180A patent/CN102084730B/zh not_active Expired - Fee Related
- 2009-06-23 EP EP09772960.2A patent/EP2298048B1/en not_active Not-in-force
- 2009-06-23 KR KR1020117002729A patent/KR20110042175A/ko not_active Application Discontinuation
- 2009-06-23 RU RU2011103797/07A patent/RU2011103797A/ru not_active Application Discontinuation
- 2009-06-23 WO PCT/IB2009/052687 patent/WO2010001300A1/en active Application Filing
- 2009-06-23 JP JP2011515699A patent/JP5503646B2/ja not_active Expired - Fee Related
- 2009-07-01 TW TW098122309A patent/TW201010142A/zh unknown
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61137376A (ja) * | 1984-12-07 | 1986-06-25 | エヌ・ベー・フイリツプス・フルーイランペンフアブリケン | 発光素子マトリツクス及びその製造方法 |
JPH04326783A (ja) * | 1991-04-26 | 1992-11-16 | Rohm Co Ltd | 半導体レーザ装置用ステムの製造方法 |
JPH05226698A (ja) * | 1992-02-14 | 1993-09-03 | Sharp Corp | 発光素子 |
JPH07281619A (ja) * | 1994-04-04 | 1995-10-27 | Rohm Co Ltd | Ledランプ、およびその基板への取付け構造 |
JPH10275512A (ja) * | 1997-03-31 | 1998-10-13 | Denso Corp | ソケット付き発光体 |
JP2002299695A (ja) * | 2001-03-29 | 2002-10-11 | Mitsubishi Electric Lighting Corp | Led光源器具 |
JP2002304903A (ja) * | 2001-04-04 | 2002-10-18 | Matsushita Electric Works Ltd | 照明器具 |
JP2003297110A (ja) * | 2002-04-03 | 2003-10-17 | Matsushita Electric Works Ltd | 口金型蛍光灯装置 |
JP2004297065A (ja) * | 2003-03-27 | 2004-10-21 | Valeo Vision | パワー発光ダイオードを放熱要素、すなわちラジエータに固定する方法、およびかかるダイオードを含む信号デバイス |
JP2005116182A (ja) * | 2003-10-02 | 2005-04-28 | Rabo Sufia Kk | 広角局部照明装置 |
JP2008503057A (ja) * | 2004-06-15 | 2008-01-31 | ヘンケル コーポレイション | 高出力ledの電気光学組立体 |
JP2007035547A (ja) * | 2005-07-29 | 2007-02-08 | Koito Mfg Co Ltd | 車両用前照灯 |
WO2007078103A1 (en) * | 2006-01-06 | 2007-07-12 | Lg Innotek Co., Ltd | Led package, method of fabricating the same, and backlight unit having the same |
Also Published As
Publication number | Publication date |
---|---|
KR20110042175A (ko) | 2011-04-25 |
RU2011103797A (ru) | 2012-08-10 |
CN102084730A (zh) | 2011-06-01 |
US20110101411A1 (en) | 2011-05-05 |
EP2298048A1 (en) | 2011-03-23 |
TW201010142A (en) | 2010-03-01 |
US8373194B2 (en) | 2013-02-12 |
JP5503646B2 (ja) | 2014-05-28 |
WO2010001300A1 (en) | 2010-01-07 |
EP2298048B1 (en) | 2014-03-19 |
CN102084730B (zh) | 2013-06-05 |
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