JP2011525207A5 - - Google Patents
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- Publication number
- JP2011525207A5 JP2011525207A5 JP2011514739A JP2011514739A JP2011525207A5 JP 2011525207 A5 JP2011525207 A5 JP 2011525207A5 JP 2011514739 A JP2011514739 A JP 2011514739A JP 2011514739 A JP2011514739 A JP 2011514739A JP 2011525207 A5 JP2011525207 A5 JP 2011525207A5
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- curable composition
- modified nanoparticles
- nanoparticles
- nanodomains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002105 nanoparticle Substances 0.000 claims 8
- 229920001400 block copolymer Polymers 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 230000005540 biological transmission Effects 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011258 core-shell material Substances 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 239000012756 surface treatment agent Substances 0.000 claims 1
Claims (6)
- 少なくとも1つの硬化性樹脂と、透過電子顕微鏡により測定して50〜500nmの主要粒径を有する表面修飾ナノ粒子と、透過電子顕微鏡により測定して10〜500nmの平均寸法を有するゴムナノドメインと、を含み、前記表面修飾ナノ粒子が実質的に球状のシリカコアの表面に結合した有機表面処理剤を含む硬化性組成物。
- 前記表面修飾ナノ粒子が、100〜250ナノメートルの平均粒径を有する、請求項1に記載の硬化性組成物。
- 前記ゴムナノドメインが、コア−シェルゴムナノ粒子を含む、請求項1又は2に記載の硬化性組成物。
- 前記ゴムナノドメインが、自己集合性ブロックコポリマーを含み、任意に該自己集合性ブロックコポリマーが、三元ブロックコポリマーを含む、請求項1又は2に記載の硬化性組成物。
- 前記硬化性組成物が、硬化性樹脂、表面修飾ナノ粒子、及びコアシェルゴムナノ粒子の総重量に基づき、20重量%〜50重量%の表面修飾ナノ粒子を含む、請求項3に記載の硬化性組成物。
- 前記硬化性組成物が、硬化性樹脂、表面修飾ナノ粒子、及びゴムナノドメインの総重量に基づき、0.5重量%〜10重量%のゴムナノドメインを含む、請求項5に記載の硬化性組成物。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6179508P | 2008-06-16 | 2008-06-16 | |
US61/061,795 | 2008-06-16 | ||
PCT/US2009/047465 WO2010005710A1 (en) | 2008-06-16 | 2009-06-16 | Toughened curable compositions |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014151818A Division JP2014218675A (ja) | 2008-06-16 | 2014-07-25 | 強化硬化性組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011525207A JP2011525207A (ja) | 2011-09-15 |
JP2011525207A5 true JP2011525207A5 (ja) | 2012-07-05 |
Family
ID=41182192
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011514739A Withdrawn JP2011525207A (ja) | 2008-06-16 | 2009-06-16 | 強化硬化性組成物 |
JP2014151818A Withdrawn JP2014218675A (ja) | 2008-06-16 | 2014-07-25 | 強化硬化性組成物 |
JP2016154703A Expired - Fee Related JP6437966B2 (ja) | 2008-06-16 | 2016-08-05 | 強化硬化性組成物 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014151818A Withdrawn JP2014218675A (ja) | 2008-06-16 | 2014-07-25 | 強化硬化性組成物 |
JP2016154703A Expired - Fee Related JP6437966B2 (ja) | 2008-06-16 | 2016-08-05 | 強化硬化性組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110097212A1 (ja) |
EP (1) | EP2294119B1 (ja) |
JP (3) | JP2011525207A (ja) |
KR (1) | KR20110039257A (ja) |
CN (1) | CN102112536B (ja) |
ES (1) | ES2690653T3 (ja) |
WO (1) | WO2010005710A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8309633B2 (en) * | 2008-07-17 | 2012-11-13 | Henkel Ireland Ltd. | Low temperature, cationically curable compositions with improved cure speed and toughness |
BRPI1014911A2 (pt) | 2009-05-26 | 2016-07-26 | 3M Innovative Proferties Company | processo para fabricação de resinas carregadas |
CN102741338B (zh) | 2010-02-11 | 2015-04-15 | 3M创新有限公司 | 包括分散的多峰表面改性纳米粒子的树脂体系 |
WO2011133518A1 (en) | 2010-04-20 | 2011-10-27 | 3M Innovative Properties Company | Pressure sensitive adhesives containing polymeric surface-modified nanoparticles |
JP6026095B2 (ja) * | 2011-10-31 | 2016-11-16 | 太陽インキ製造株式会社 | 熱硬化性樹脂組成物及びその硬化物、並びにそれを用いたプリント配線板 |
EP3033379B1 (en) | 2013-08-13 | 2020-12-02 | 3M Innovative Properties Company | Nanocomposites containing silica nanoparticles and dispersant, composites, articles, and methods of making same |
WO2015102911A1 (en) * | 2013-12-30 | 2015-07-09 | Dow Global Technologies Llc | Toughening agents for epoxy systems |
CN103899571A (zh) * | 2014-03-17 | 2014-07-02 | 安徽华瑞塑业有限公司 | 独立式轴流泵叶片 |
DE102014213327A1 (de) * | 2014-07-09 | 2016-01-14 | MTU Aero Engines AG | Anti-fouling-Schicht für Verdichterschaufeln |
AU2015362688B2 (en) * | 2014-12-18 | 2021-01-21 | Cytec Industries Inc. | Modified resin systems suitable for liquid resin infusion |
US10280345B2 (en) | 2015-02-27 | 2019-05-07 | 3M Innovative Properties Company | Two-part structural adhesive |
KR102350152B1 (ko) * | 2016-04-19 | 2022-01-11 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 프리프레그, 금속 클래드 적층판 및 프린트 배선판 |
TW202216888A (zh) * | 2016-05-13 | 2022-05-01 | 日商日立化成股份有限公司 | 樹脂組成物、預浸體、附有樹脂之金屬箔、積層板、印刷線路板、及樹脂組成物的製造方法 |
JP2019533746A (ja) | 2016-11-07 | 2019-11-21 | スリーエム イノベイティブ プロパティズ カンパニー | 表面結合した疎水性修飾アルキル基を含むナノ粒子を含む硬化性樹脂 |
WO2019000375A1 (en) * | 2017-06-30 | 2019-01-03 | Henkel Ag & Co. Kgaa | INORGANIC NANOPARTICLES WITH MODIFIED SURFACE AND USE THEREOF |
CN107501867A (zh) * | 2017-09-21 | 2017-12-22 | 上海稳优实业有限公司 | 固态颗粒增强环氧树脂及其制备方法 |
CN109517344B (zh) * | 2018-12-29 | 2021-03-16 | 江苏恒神股份有限公司 | 一种高模量高韧性环氧树脂 |
CN113278395B (zh) * | 2021-04-12 | 2022-03-18 | 广东博汇新材料科技股份有限公司 | 一种预定型喷胶组合物及其制备方法 |
CN115157809B (zh) * | 2022-06-09 | 2023-04-07 | 科顺防水科技股份有限公司 | 一种预铺防水卷材及其制备方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4684678A (en) * | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
JP2717229B2 (ja) * | 1988-06-21 | 1998-02-18 | 旭化成工業株式会社 | 樹脂補強用ゴム粒子及び補強樹脂組成物 |
US5290857A (en) * | 1991-09-04 | 1994-03-01 | Nippon Zeon Co., Ltd. | Epoxy resin adhesive composition |
JP2652093B2 (ja) * | 1991-09-12 | 1997-09-10 | 富士写真フイルム株式会社 | 感光性組成物 |
JP3655646B2 (ja) * | 1993-05-24 | 2005-06-02 | 日産自動車株式会社 | エポキシ樹脂用接着補強剤及び該補強剤を含有する自動車用エポキシ樹脂系構造接着性組成物 |
US5648407A (en) * | 1995-05-16 | 1997-07-15 | Minnesota Mining And Manufacturing Company | Curable resin sols and fiber-reinforced composites derived therefrom |
JP4319332B2 (ja) * | 2000-06-29 | 2009-08-26 | 株式会社東芝 | 電気絶縁材料およびその製造方法 |
US6800371B2 (en) * | 2001-03-07 | 2004-10-05 | 3M Innovative Properties Company | Adhesives and adhesive compositions containing thioether groups |
JP2003012320A (ja) * | 2001-06-28 | 2003-01-15 | Catalysts & Chem Ind Co Ltd | シリカ系無機化合物オルガノゾル |
US20030111519A1 (en) * | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US6893736B2 (en) * | 2001-11-19 | 2005-05-17 | Henkel Corporation | Thermosetting resin compositions useful as underfill sealants |
JP2005527113A (ja) * | 2002-05-23 | 2005-09-08 | スリーエム イノベイティブ プロパティズ カンパニー | ナノ粒子充填アンダーフィル |
JP2004083651A (ja) * | 2002-08-23 | 2004-03-18 | Toray Ind Inc | 吸湿性ポリエステル組成物およびポリエステル繊維 |
US6811823B2 (en) * | 2002-09-13 | 2004-11-02 | Dow Corning Corporation | Hydrophobing silica with organosilicon compounds and blends thereof |
US7056978B2 (en) * | 2002-11-06 | 2006-06-06 | National Starch And Chemical Investment Holding Corporation | Toughened epoxy-anhydride no-flow underfill encapsulant |
US20050048291A1 (en) * | 2003-08-14 | 2005-03-03 | General Electric Company | Nano-filled composite materials with exceptionally high glass transition temperature |
EP1457509B1 (de) * | 2003-03-11 | 2006-06-28 | hanse chemie AG | Polymere Epoxidharz-Zusammensetzung |
DE50304047D1 (de) * | 2003-03-11 | 2006-08-10 | Hanse Chemie Ag | Polymere Epoxidharz-Zusammensetzung |
JP4066870B2 (ja) * | 2003-04-10 | 2008-03-26 | Jsr株式会社 | 液状硬化性組成物、硬化膜及び帯電防止用積層体 |
US7666938B2 (en) * | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
US20060199301A1 (en) * | 2005-03-07 | 2006-09-07 | Basheer Rafil A | Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from |
ATE534703T1 (de) * | 2005-08-24 | 2011-12-15 | Henkel Kgaa | Epoxidzusammensetzungen mit verbesserter schlagzähigkeit |
JP4983228B2 (ja) * | 2005-11-29 | 2012-07-25 | 味の素株式会社 | 多層プリント配線板の絶縁層用樹脂組成物 |
TWI410442B (zh) * | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
JP2008031193A (ja) * | 2006-07-26 | 2008-02-14 | Toray Ind Inc | エポキシ樹脂組成物、プリプレグ、繊維強化複合材料 |
JP4905668B2 (ja) * | 2006-09-15 | 2012-03-28 | 信越化学工業株式会社 | 半導体封止用液状エポキシ樹脂組成物及び半導体装置 |
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2009
- 2009-06-16 EP EP09789826.6A patent/EP2294119B1/en active Active
- 2009-06-16 KR KR1020117000672A patent/KR20110039257A/ko active Search and Examination
- 2009-06-16 CN CN200980129889.0A patent/CN102112536B/zh active Active
- 2009-06-16 US US12/997,939 patent/US20110097212A1/en not_active Abandoned
- 2009-06-16 JP JP2011514739A patent/JP2011525207A/ja not_active Withdrawn
- 2009-06-16 WO PCT/US2009/047465 patent/WO2010005710A1/en active Application Filing
- 2009-06-16 ES ES09789826.6T patent/ES2690653T3/es active Active
-
2014
- 2014-07-25 JP JP2014151818A patent/JP2014218675A/ja not_active Withdrawn
-
2016
- 2016-08-05 JP JP2016154703A patent/JP6437966B2/ja not_active Expired - Fee Related
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