JP2011522769A5 - - Google Patents

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Publication number
JP2011522769A5
JP2011522769A5 JP2011511598A JP2011511598A JP2011522769A5 JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5 JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011511598 A JP2011511598 A JP 2011511598A JP 2011522769 A5 JP2011522769 A5 JP 2011522769A5
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JP
Japan
Prior art keywords
laser beam
laser
optical head
focus
waist
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JP2011511598A
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English (en)
Japanese (ja)
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JP5563562B2 (ja
JP2011522769A (ja
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Priority claimed from US12/220,948 external-priority patent/US8053704B2/en
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Publication of JP2011522769A publication Critical patent/JP2011522769A/ja
Publication of JP2011522769A5 publication Critical patent/JP2011522769A5/ja
Application granted granted Critical
Publication of JP5563562B2 publication Critical patent/JP5563562B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011511598A 2008-05-27 2009-05-14 非平坦材料の罫書き Expired - Fee Related JP5563562B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12894908P 2008-05-27 2008-05-27
US61/128,949 2008-05-27
US12/220,948 US8053704B2 (en) 2008-05-27 2008-07-30 Scoring of non-flat materials
US12/220,948 2008-07-30
PCT/US2009/002988 WO2009151527A2 (en) 2008-05-27 2009-05-14 Scoring of non-flat materials

Publications (3)

Publication Number Publication Date
JP2011522769A JP2011522769A (ja) 2011-08-04
JP2011522769A5 true JP2011522769A5 (cg-RX-API-DMAC10.html) 2012-06-07
JP5563562B2 JP5563562B2 (ja) 2014-07-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511598A Expired - Fee Related JP5563562B2 (ja) 2008-05-27 2009-05-14 非平坦材料の罫書き

Country Status (6)

Country Link
US (1) US8053704B2 (cg-RX-API-DMAC10.html)
JP (1) JP5563562B2 (cg-RX-API-DMAC10.html)
KR (1) KR101428141B1 (cg-RX-API-DMAC10.html)
CN (1) CN102046545B (cg-RX-API-DMAC10.html)
TW (1) TWI404683B (cg-RX-API-DMAC10.html)
WO (1) WO2009151527A2 (cg-RX-API-DMAC10.html)

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US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
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US10144668B2 (en) * 2014-08-20 2018-12-04 Corning Incorporated Method and apparatus for yielding high edge strength in cutting of flexible thin glass
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WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
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KR102499697B1 (ko) 2015-07-10 2023-02-14 코닝 인코포레이티드 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품
US10759690B2 (en) * 2015-08-10 2020-09-01 Saint-Gobain Glass France Method for cutting a thin glass layer
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JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN109791303A (zh) * 2016-07-15 2019-05-21 特拉迪欧德公司 利用可变光束形状的激光的材料加工
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3848333B1 (en) 2016-10-24 2025-12-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
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