TWI404683B - 非平坦材料之劃線 - Google Patents
非平坦材料之劃線 Download PDFInfo
- Publication number
- TWI404683B TWI404683B TW98117569A TW98117569A TWI404683B TW I404683 B TWI404683 B TW I404683B TW 98117569 A TW98117569 A TW 98117569A TW 98117569 A TW98117569 A TW 98117569A TW I404683 B TWI404683 B TW I404683B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass
- laser
- laser beam
- optical head
- stretched
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 24
- 230000003287 optical effect Effects 0.000 claims abstract description 133
- 239000005357 flat glass Substances 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims description 211
- 238000000034 method Methods 0.000 claims description 44
- 230000008859 change Effects 0.000 claims description 30
- 238000007493 shaping process Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000010339 dilation Effects 0.000 claims 1
- 230000008569 process Effects 0.000 description 26
- 238000005452 bending Methods 0.000 description 11
- 238000013461 design Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 3
- 238000005816 glass manufacturing process Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000006060 molten glass Substances 0.000 description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 description 1
- 238000003462 Bender reaction Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0215—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the ribbon being in a substantially vertical plane
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0966—Cylindrical lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12894908P | 2008-05-27 | 2008-05-27 | |
| US12/220,948 US8053704B2 (en) | 2008-05-27 | 2008-07-30 | Scoring of non-flat materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201002638A TW201002638A (en) | 2010-01-16 |
| TWI404683B true TWI404683B (zh) | 2013-08-11 |
Family
ID=41378489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98117569A TWI404683B (zh) | 2008-05-27 | 2009-05-26 | 非平坦材料之劃線 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8053704B2 (cg-RX-API-DMAC10.html) |
| JP (1) | JP5563562B2 (cg-RX-API-DMAC10.html) |
| KR (1) | KR101428141B1 (cg-RX-API-DMAC10.html) |
| CN (1) | CN102046545B (cg-RX-API-DMAC10.html) |
| TW (1) | TWI404683B (cg-RX-API-DMAC10.html) |
| WO (1) | WO2009151527A2 (cg-RX-API-DMAC10.html) |
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|---|---|---|---|---|
| JP2012521339A (ja) * | 2009-03-20 | 2012-09-13 | コーニング インコーポレイテッド | 精密レーザ罫書き |
| US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
| CN102596831B (zh) * | 2009-11-03 | 2015-01-07 | 康宁股份有限公司 | 具有非恒定速度的移动玻璃带的激光刻划 |
| US8946590B2 (en) | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
| US8720228B2 (en) * | 2010-08-31 | 2014-05-13 | Corning Incorporated | Methods of separating strengthened glass substrates |
| US8677783B2 (en) | 2011-11-28 | 2014-03-25 | Corning Incorporated | Method for low energy separation of a glass ribbon |
| US9938180B2 (en) * | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
| US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
| WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| US9212081B2 (en) * | 2012-11-21 | 2015-12-15 | Corning Incorporated | Methods of cutting a laminate strengthened glass substrate |
| WO2014085357A1 (en) | 2012-11-29 | 2014-06-05 | Corning Incorporated | Methods and apparatus for fabricating glass ribbon of varying widths |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| EP2781296B1 (de) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser |
| US9828276B2 (en) | 2013-06-26 | 2017-11-28 | Corning Incorporated | Glass ribbon breaking devices and methods of producing glass sheets |
| US11141815B2 (en) * | 2013-09-24 | 2021-10-12 | Ipg Photonics Corporation | Laser processing systems capable of dithering |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US10442719B2 (en) | 2013-12-17 | 2019-10-15 | Corning Incorporated | Edge chamfering methods |
| US9815730B2 (en) | 2013-12-17 | 2017-11-14 | Corning Incorporated | Processing 3D shaped transparent brittle substrate |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| TWI730945B (zh) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | 用於雷射處理材料的方法與設備 |
| US10611667B2 (en) | 2014-07-14 | 2020-04-07 | Corning Incorporated | Method and system for forming perforations |
| WO2016010991A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block |
| US10335902B2 (en) | 2014-07-14 | 2019-07-02 | Corning Incorporated | Method and system for arresting crack propagation |
| JP2017530867A (ja) * | 2014-07-14 | 2017-10-19 | コーニング インコーポレイテッド | 長さおよび直径の調節可能なレーザビーム焦線を用いて透明材料を加工するためのシステムおよび方法 |
| US10144668B2 (en) * | 2014-08-20 | 2018-12-04 | Corning Incorporated | Method and apparatus for yielding high edge strength in cutting of flexible thin glass |
| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
| WO2016115017A1 (en) | 2015-01-12 | 2016-07-21 | Corning Incorporated | Laser cutting of thermally tempered substrates using the multi photon absorption method |
| WO2016154284A1 (en) | 2015-03-24 | 2016-09-29 | Corning Incorporated | Laser cutting and processing of display glass compositions |
| JP2018516215A (ja) | 2015-03-27 | 2018-06-21 | コーニング インコーポレイテッド | 気体透過性窓、および、その製造方法 |
| KR102499697B1 (ko) | 2015-07-10 | 2023-02-14 | 코닝 인코포레이티드 | 유연한 기판 시트에서의 홀의 연속 제조 방법 및 이에 관한 물품 |
| US10759690B2 (en) * | 2015-08-10 | 2020-09-01 | Saint-Gobain Glass France | Method for cutting a thin glass layer |
| LT6428B (lt) | 2015-10-02 | 2017-07-25 | Uab "Altechna R&D" | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
| JP6938543B2 (ja) | 2016-05-06 | 2021-09-22 | コーニング インコーポレイテッド | 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し |
| US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| CN109791303A (zh) * | 2016-07-15 | 2019-05-21 | 特拉迪欧德公司 | 利用可变光束形状的激光的材料加工 |
| WO2018022476A1 (en) | 2016-07-29 | 2018-02-01 | Corning Incorporated | Apparatuses and methods for laser processing |
| US10522963B2 (en) | 2016-08-30 | 2019-12-31 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
| US10730783B2 (en) | 2016-09-30 | 2020-08-04 | Corning Incorporated | Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots |
| EP3848333B1 (en) | 2016-10-24 | 2025-12-03 | Corning Incorporated | Substrate processing station for laser-based machining of sheet-like glass substrates |
| US10752534B2 (en) | 2016-11-01 | 2020-08-25 | Corning Incorporated | Apparatuses and methods for laser processing laminate workpiece stacks |
| US10688599B2 (en) | 2017-02-09 | 2020-06-23 | Corning Incorporated | Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines |
| US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US10626040B2 (en) | 2017-06-15 | 2020-04-21 | Corning Incorporated | Articles capable of individual singulation |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| JP7353171B2 (ja) * | 2019-12-26 | 2023-09-29 | 株式会社ディスコ | レーザー加工装置 |
| DE102021121947B3 (de) | 2021-08-24 | 2023-01-26 | Holochrom Gmbh | Vorrichtung, System und Verfahren zur Erzeugung beweglicher räumlicher visueller Effekte mittels Laserlicht |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW460422B (en) * | 1997-04-14 | 2001-10-21 | Schott Glas | Method and apparatus for cutting through a flat workpiece made of brittle material along a predetermined cutting line |
| TW464578B (en) * | 1999-03-09 | 2001-11-21 | Corning Inc | Control of median crack depth in laser scoring |
| TW200630178A (en) * | 2001-03-29 | 2006-09-01 | Gsi Lumonics Corp | High-speed, precision, laser-based method and system |
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| JPS6384789A (ja) * | 1986-09-26 | 1988-04-15 | Semiconductor Energy Lab Co Ltd | 光加工方法 |
| JPH05102561A (ja) * | 1991-10-07 | 1993-04-23 | Matsushita Electric Ind Co Ltd | ガスレーザ発振装置 |
| RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
| US5623473A (en) * | 1994-06-30 | 1997-04-22 | Nikon Corporation | Method and apparatus for manufacturing a diffraction grating zone plate |
| US5776220A (en) | 1994-09-19 | 1998-07-07 | Corning Incorporated | Method and apparatus for breaking brittle materials |
| JP3782212B2 (ja) * | 1997-08-07 | 2006-06-07 | 株式会社アマダ | 光路長可変レーザー加工装置及び同装置のビームコリメーション方法 |
| US6211488B1 (en) | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
| DE19918936A1 (de) * | 1999-04-27 | 2000-11-02 | Schott Glas | Verfahren und Vorrichtung zur Herstellung von Einzelglasscheiben |
| DE19952331C1 (de) | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
| KR100701013B1 (ko) * | 2001-05-21 | 2007-03-29 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치 |
| WO2003015976A1 (en) * | 2001-08-10 | 2003-02-27 | Mitsuboshi Diamond Industrial Co., Ltd. | Brittle material substrate chamfering method and chamfering device |
| JP2005021964A (ja) * | 2003-07-02 | 2005-01-27 | National Institute Of Advanced Industrial & Technology | レーザーアブレーション加工方法およびその装置 |
| DE102004014277A1 (de) | 2004-03-22 | 2005-10-20 | Fraunhofer Ges Forschung | Verfahren zum laserthermischen Trennen von Flachgläsern |
| US20060021997A1 (en) | 2004-08-02 | 2006-02-02 | Ario Lin | Heat sink for gas-fueled appliance |
| JP3955587B2 (ja) * | 2004-08-20 | 2007-08-08 | 住友重機械工業株式会社 | レーザ照射装置 |
| JP2006142335A (ja) * | 2004-11-19 | 2006-06-08 | National Institute Of Advanced Industrial & Technology | レーザー加工装置 |
| JP4222296B2 (ja) * | 2004-11-22 | 2009-02-12 | 住友電気工業株式会社 | レーザ加工方法とレーザ加工装置 |
-
2008
- 2008-07-30 US US12/220,948 patent/US8053704B2/en not_active Expired - Fee Related
-
2009
- 2009-05-14 JP JP2011511598A patent/JP5563562B2/ja not_active Expired - Fee Related
- 2009-05-14 WO PCT/US2009/002988 patent/WO2009151527A2/en not_active Ceased
- 2009-05-14 CN CN200980120192.7A patent/CN102046545B/zh not_active Expired - Fee Related
- 2009-05-14 KR KR1020107029167A patent/KR101428141B1/ko not_active Expired - Fee Related
- 2009-05-26 TW TW98117569A patent/TWI404683B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW460422B (en) * | 1997-04-14 | 2001-10-21 | Schott Glas | Method and apparatus for cutting through a flat workpiece made of brittle material along a predetermined cutting line |
| TW464578B (en) * | 1999-03-09 | 2001-11-21 | Corning Inc | Control of median crack depth in laser scoring |
| TW200630178A (en) * | 2001-03-29 | 2006-09-01 | Gsi Lumonics Corp | High-speed, precision, laser-based method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009151527A3 (en) | 2010-02-25 |
| CN102046545B (zh) | 2014-04-30 |
| KR101428141B1 (ko) | 2014-08-08 |
| KR20110021956A (ko) | 2011-03-04 |
| JP5563562B2 (ja) | 2014-07-30 |
| CN102046545A (zh) | 2011-05-04 |
| US20090294419A1 (en) | 2009-12-03 |
| WO2009151527A2 (en) | 2009-12-17 |
| TW201002638A (en) | 2010-01-16 |
| JP2011522769A (ja) | 2011-08-04 |
| US8053704B2 (en) | 2011-11-08 |
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