TW464578B - Control of median crack depth in laser scoring - Google Patents
Control of median crack depth in laser scoring Download PDFInfo
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- TW464578B TW464578B TW089104530A TW89104530A TW464578B TW 464578 B TW464578 B TW 464578B TW 089104530 A TW089104530 A TW 089104530A TW 89104530 A TW89104530 A TW 89104530A TW 464578 B TW464578 B TW 464578B
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- Prior art keywords
- glass
- laser
- patent application
- scope
- light beam
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Links
- 239000011521 glass Substances 0.000 claims abstract description 62
- 239000002826 coolant Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 30
- 239000008186 active pharmaceutical agent Substances 0.000 claims 2
- 240000008564 Boehmeria nivea Species 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 210000004907 gland Anatomy 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 3
- 230000001902 propagating effect Effects 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 12
- 238000009826 distribution Methods 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 229910002092 carbon dioxide Inorganic materials 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 240000007154 Coffea arabica Species 0.000 description 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 241001125929 Trisopterus luscus Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 235000016213 coffee Nutrition 0.000 description 1
- 235000013353 coffee beverage Nutrition 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 238000010330 laser marking Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Toxicology (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
經濟部中央標準局®;工消费合作社印裂 46457 8 五、發明説明(z ) · 作之二氧化碳雷射以及移動速度約為500ram/秒,大部份熱 量保持於玻璃表面下小於500微米之區域内。此雷射劃線 ' 特性允許裂縫形成,該裂缝只部份地延伸過玻璃。 在雷射共振腔内電磁場形狀決定於反射鏡曲率,放電 管間距以及開孔直徑以及能量波長。由雷射形成光束形狀 通常依據零點數目加以分類,其在通過光束斷面兩個方向 中呈現出。對於大部份用途,具有高斯能量分佈而沒有零 值之光束為優先採用的。不過對於玻璃分割處理過程,具 有一個或多個零值之非高斯模式能夠加以使用以傳送雷射 月匕里更加均勻地至玻璃表面,其產车較高效率之雷射劃線 速度。 D模式操作之雷射已說明於美國第5776220號專利中, 該專利說明在此加入作為參考。圖2顯示出本發明D模式雷 射光束能量分佈之斷面。該非高斯光束具有至少一對強度 尖學位於較低能量分佈之中央區域,本發明優先採用該光 束0 如Kondratenko之(PCT WO 93/20015)所示,雷射光束 投射於玻璃片之形狀為擴圓形的。該翻形形狀長轴及短 軸通常滿足下列關係: a=0. 2至2. Oh以及 0至 10. 〇h 其中a為短軸長度以及b為長轴長度;以及h為雷射割線之玻 璃片厚度。依據tadratenk。專利,針大纽此時,將影 響切割處理過程之精確度。因而厚度為之玻璃基板( (請先1¾]讀背面之注意事項再填寫本頁) λ'4 ,1Τ 46457 8 Λ7 B7 五、發明説明 -Λ:ί 央 局 "vr 印 -7.'! 液晶顯錢—般厚度),K〇i*at enk。揭示di綠長度並不 超過7mni。 、為了升v成憜圓形光束,由|)模式所產生之雷射光東分佈 通常利用兩個橢圓形透鏡轉變以形成橢圓形形狀之光束。 _形光束使用來直接地照射玻璃表面。使用該技術,利 用280瓦光束中間裂縫深度通常在115至118微米範圍内,利 用330瓦光束則為12〇至125微米。 這些雷射劃線技術藉由形成不含顆粒之中間裂縫產生 良好品質之分割邊緣◊處理過程重現性以及所形成品質使 得雷射劃線可使⑽f造液晶以及其他平錢示器基板, 其邊緣分裂品質為高度需要的。除此幾乎任何需要在成形 玻璃片之應用例如為製造汽車窗戶,化粧品鏡子,或社區窗 戶能夠有益地使用雷射劃線。 不過,在一些應用中在劃線後但是在分割處理過程前 需要處理玻璃零件,劃線玻璃處理會使零件過早地分裂。 一項防止該問題之方法在於形成較淺中間裂縫,其較不容 易產生意外之分裂。不過,先前所揭示劃線方法並不會使 :該中間裂縫作細微控制,亦不會產生均勻的劃線深度而不 受雷射光束能量變化或冷卻水流位置之影響。 因而,存在一種方法以控制中間裂缝深度之需求,該裂 縫由劃線技術形成° 發明大要: 因而本發明目標在於提供一種控制中間裂缝穿透深度 之方法及裝置,該裂縫藉由雷射劃線法形成於玻璃片上。 说張尺度適用中囹囹家樣準(匚\5)/\4規格(2丨0;< 297公及 4 , (請先閱請"而之注""項再填寫本頁)Central Standards Bureau of the Ministry of Economic Affairs®; Industrial and Consumer Cooperative Coupling 46457 8 V. Description of the Invention (z) · The carbon dioxide laser and the moving speed are about 500 ram / second, and most of the heat is kept in the area below the glass surface of less than 500 microns. Inside. This laser scribing 'property allows cracks to form which only partially extend through the glass. The shape of the electromagnetic field in the laser cavity depends on the curvature of the mirror, the distance between the discharge tube, the diameter of the opening, and the energy wavelength. The shape of the beam formed by the laser is usually classified according to the number of zeros, which appears in both directions through the beam section. For most applications, beams with a Gaussian energy distribution without zero are preferred. However, for the glass splitting process, a non-Gaussian mode with one or more zero values can be used to transmit the laser moon dagger more evenly to the glass surface, and its production vehicle has a higher efficiency laser scribe speed. Lasers for D-mode operation have been described in US Patent No. 5,776,220, which is incorporated herein by reference. Fig. 2 shows a cross section of the energy distribution of a laser beam of the D mode according to the present invention. The non-Gaussian beam has at least a pair of intensity peaks located in the central region of the lower energy distribution. The present invention preferentially uses the beam. As shown by Kondratenko (PCT WO 93/20015), the shape of the laser beam projected on the glass sheet is expanded. round. The major and minor axes of the flip shape generally satisfy the following relationships: a = 0. 2 to 2. Oh and 0 to 10. 0 h where a is the length of the short axis and b is the length of the long axis; and h is the length of the laser secant Glass sheet thickness. According to tadratenk. The patent, needle big button at this time, will affect the accuracy of the cutting process. Therefore the thickness of the glass substrate ((please read 1¾), read the precautions on the back, and then fill in this page) λ'4, 1Τ 46457 8 Λ7 B7 V. Description of the invention-Λ: ί 局 局 " vr 印 -7. '! LCD display money-the same thickness), Koi * at enk. It is revealed that the length of di green does not exceed 7mni. In order to increase v into a 憜 -shaped circular beam, the eastern distribution of laser light generated by |) mode is usually transformed by using two oval lenses to form an oval-shaped beam. The _-shaped beam is used to directly illuminate the glass surface. Using this technique, the depth of the crack in the middle of a beam of 280 watts is usually in the range of 115 to 118 microns, and it is 120 to 125 microns with a 330 watt beam. These laser scribing technologies produce good-quality divided edges by forming intermediate cracks that do not contain particles. The reproducibility of the process and the quality of the formed laser scribing technology can make LCD and other flat display substrates. Edge split quality is highly needed. In addition, almost any application that requires shaping glass sheets, such as manufacturing automotive windows, cosmetic mirrors, or community windows, can beneficially use laser scribing. However, in some applications, glass parts need to be processed after scribing but before the singulation process. Scribing glass processing can cause the part to split prematurely. One way to prevent this problem is to form shallow intermediate cracks that are less likely to cause accidental splits. However, the previously disclosed scribing method does not allow: the intermediate crack is finely controlled, nor does it produce a uniform scribing depth without being affected by changes in the laser beam energy or the location of the cooling water flow. Therefore, there is a need for a method to control the depth of the intermediate crack, which is formed by a scribing technique. The invention is important: Therefore, the object of the present invention is to provide a method and a device for controlling the penetration depth of the intermediate crack. The wire method is formed on a glass sheet. It is said that the Zhang scale is applicable to the standard of the Chinese family (匚 \ 5) / \ 4 specifications (2 丨 0; < 297 and 4), (please read the "" and note " " before filling out this page)
464578 A7464578 A7
B7 依據本發明方法,破璃片係利用雷射光束點加熱,其沿 著玻璃料面移動以形成悄裂縫。雷射_傳送通過一 個或多個透鏡以形成橢_光束。不透明糾使用來封閉 橢圓形光束於麵形光束絲—喊㈣處轉成經截取 橢圓形光束,其沿著玻璃片移動對玻璃表面加熱。冷卻劑 流體由冷卻噴嘴投向加熱_上„點。在冷卻點與移域 取摘圓形光相之冷卻距射加以控.藉崎冷卻距離 力以變化,可控制巾間裂缝穿透深度,其解決該形式雷射劃 線以及玻璃分裂系統控制之需求。 巧明這些以及其他方面將由下列詳細說明變為清 附圖簡單說明: 走 第一圖(圖1)顯示出本發明麵玻則舰處理過程^ 第=圖(圖2)顯示出標準D模式雷射光束之能量分佈。 ..第三甲,乙及關⑽a,b及〇顯示出本發明f射光束 第四圖 光東能量。 第五圖 裂縫珠度。 (圖4)顯示出本發明分佈於_,取擴圓形 (圖5)顯示出本㈣職於玻絲質中之中間 附圖元件數字符號說明: 玻璃片ίο;玻璃表φ il;裂縫啟始點12 1_邊緣18;裂縫20;噴束22;冷卻劑24, 光束32;透鏡34;光束36;形狀38;遮覃4〇。田、 優先實施例詳細說明: •泛迕尺及通用中园园家標华 CNS ) Λ4^格(2;qx 297公片 7 4578 Λ7 B7 4B7 According to the method of the present invention, the glass-breaking sheet is heated by a laser beam spot, which moves along the frit surface to form a quiet crack. The laser is transmitted through one or more lenses to form an elliptical beam. Opaque correction is used to close the elliptical beam at the surface of the beam-the ellipses are turned into intercepted elliptical beams, which move along the glass sheet to heat the glass surface. The coolant fluid is thrown by the cooling nozzle to the heating point. The cooling distance of the circular light phase is taken at the cooling point and the moving area to control. The cooling distance can be changed by using the cooling distance to control the penetration depth of the crack between the towels. Solve the needs of laser scribing and glass splitting system control in this form. It will be clear that these and other aspects will be changed from the following detailed description to the simple description of the drawings: The first figure (Figure 1) shows the surface treatment of the present invention Process ^ Figure = (Figure 2) shows the energy distribution of the standard D-mode laser beam .. The third A, B and Guan a, b and 0 show the light east energy of the fourth figure of the f-beam of the present invention. The figure 5 shows the sphericity of the crack. (Figure 4) shows that the present invention is distributed in _, and the round shape (Figure 5) shows that the intermediate drawing elements that work in glassy matter are described by the numerical symbol of the glass: glass piece; glass Table φ il; crack initiation point 12 1_edge 18; crack 20; spray beam 22; coolant 24, beam 32; lens 34; beam 36; shape 38; shade Qin 40. The preferred embodiment is explained in detail: • Pan-square ruler and general Chinese garden garden standard Chinese CNS) Λ4 ^ grid (2; qx 297 male film 7 4578 Λ7 B7 4
對附圖實施例所_示範例詳細加以說明。下 列la 料範例性質以及並不會 構造產生限制c klt- 本各明係關於使用雷射法沿著所需要分裂線分裂破璃 片之Μ。#_示本發财齡料'統,玻璃上側 具有主要表抓。玻則财先沿著玻璃㈣邊緣產生刻 痕或劃線以形成裂缝啟始點12於玻.10 —邊。該裂縫啟 始點12再H由銷f要分聽之路做射光糾 通過玻璃片1G以形成裂缝2Q。雷射光束點16藉域用雷射 例如為C〇2雷射以形成第一光束32。以以莫式操作c〇2雷射 將產生光束,其能量分佈圖如圖2所示。第一光束32能夠藉 由一個或多個透鏡34例如為一對圓柱形透鏡轉變而形成第 二光束36,其具有橢圓形形狀38。 第二光束藉由一個或多個不透明遮罩40戴取以形成第 三光束16。任何能夠吸收以及消散雪射光束能量之材料能 夠使用來形成不透明遮罩40。碳遮罩呈現出高導熱性以及 在該方面用途為有效的,雖然其較低之氧化溫度在製造環 境中將限制碳遮罩之壽命。形成不透明遮罩40之另外一種 變化包括任何高溫陶瓷材料。不透明遮罩40實際上應該相 當大足以消散所產生熱量而不會影響其他裝置。一般遮罩 為4英吋方形以及厚度為四分之一英吋。第三光束37具有 經截取橢圓形形狀以及沿著所需要分裂線對玻璃片局部區 域加熱。 加熱點玻璃具有預先決定之溫度梯度以及分佈,其決 , ,___________—" "T" 以用中囷遏家標华(CNS > M«L格(210X29"?公& 7464578 Λ7 部 央 標 >1 •V» 印 發明説明(台) - 定於光束形狀,能量以及照射時間°其次,玻璃利用流體冷 卻劑24經由喷束22進行淬冷,其優先地利用水。當操作在 正確熱平衡範圍内(考慮光東分佈,光束能量,處理速度,水 體積以及水流喷嘴與光束間之距離,如圖中標示為c),玻璃 表面快速冷卻產生之張應力,其足以由形成啟始缺陷12產 生中間裂縫以及使裂縫以處理速度傳播通過玻璃表面α 如圖3a所示,第二光束產生橢圓形之形狀,其短軸為3 以及長軸為b。依據本發明,圖3a橢圓形光束在離長軸一端 一段距離加以截取如圖3b所示或在兩端處截取如圖3C所示 。橢圓形光束36在截取前長軸有效地大於20麵,較優先地 大於30_,以及最優先地為4(M2(km或更大。遮罩4〇可優 先地裝置以沿著長軸量測時遮蔽20至40¾第二光束36 ^雷 射光束點16截取中心軸對準於通過玻璃片1 〇所需要分裂線 之運行方向m。 對於薄玻璃片(1· 1刪或更薄),我們發現雷射光束點長 軸最佳長度與所需要運行速度相關,其中長軸優先地至少 為10%所需要之雷射劃線每秒鐘速度。因而對於〇. 7mm厚度 破璃所需要5 0 0mm雷射劃線速率,雷射長軸優先地至少為5 〇 mm長。 中間裂縫20只部份以深度d延伸於玻璃片1〇表面u下 使得中間裂縫20形成為刻痕線。裂缝深度,形狀以及方向 由熱彈性應力分佈決定,其依次地主要決定於下列數項因 京:光束點之能量密度,尺寸以及形狀;光束點通過基板材 料相對位移之速率;熱物理特性,供應至加熱區域之冷卻劑 (請先閱讀背而之注意羋項再填艿本页) L·r 丁 、15»1 A7 .464578 五、發明説明(了) ... 供應條件以及品質;以及將分裂材料熱物理以及機械特性, 其厚度,以及表面狀態。 為了控制中間裂鏠深度,本發明使用截取橢圓形光東 16對玻璃i〇加熱。因而具有該特別形狀光束之特定品質, 中間裂縫深度d隨著冷钟流體投射點相對於雷射光束移動 而改變。圖1描繪出雷射光朿點16尾端邊緣與流體冷卻劑 24才X射至玻璃點1〇點之間冷卻距離c。藉由冷卻玻璃於 更罪近雷射照射一點處以改變冷卻距離。所產生中間裂絲 較淺與使用冷卻距離c為較大冷卻點所形成中間裂縫比較 為較淺。 例如,由雷射30以及圓柱形透鏡34所形成之橢圓形光 東。光束短軸為1_ 5腿以及長軸為90mm。本發明不透明遮 罩40放置於透鏡34與玻璃1 〇之間^使得在長軸邊緣18區域 被封閉如同投射於玻璃上載取橢圓形雷射光束點16。由於 —部份如圖4所顯示雷射光束能量由不透明遮罩所截取,在 玻璃表面10產生之切割能量相當於未遮蔽光束能量,其需 要操作雷射30為較高設定功率。 如圖5曲線圖所示,使用遮蔽光束對玻璃加熱,所產生 中間裂縫之深度顯著地隨著冷卻距離變化而改變^例如, 當嗔嘴位於投射於玻璃上經遮蔽光束點後5_時,使用32〇 瓦經遮蔽光束將產生約1〇〇微米中間裂縫深度。藉由調整 嘴嘴以產生12咖1冷卻距離,中間裂縫深度增加至約為11〇微 不0 最後將玻璃片10分裂為較小玻璃片再藉由施加彎曲力 ( CNS ) ,,4¾¾ ( 2!0Χ^ΪΤ Φ 464578 五、發明説明(γ) 矩於裂缝底下而達成。該彎曲能夠藉由使用傳統彎折裝置 (並未顯示出)使用一些較為傳統機器性表面劃線方法之分 裂破璃處理過程而達成。 使用作為玻璃分裂操作之雷射光束3 0應該能夠對被切 破璃表面加熱。因而雷射光線優先地為較玻璃之吸收波長 為短之波長。為了達成該情況,照射光線優先地在紅外線 範圍内,其波長大於2微米,例如使用波長在9-11微米範圍 之C〇2雷射;或波長在5-6微米之C0雷射,或波長在2. 6-3. 0 微米之HF雷射,或波長約2_ 9微米之YAG雷射。當目前試驗 主要使用C02雷射,其功率在150-300瓦範圍内,我們相信可 成功地使用較高功率之雷射。 雖然本發明已針對列舉目的詳細加以說明,人們了解 该詳細說明只作為該目的,以及熟知此技術者能夠由其中 作出許多變化,但是並不會脫離下列申請專利範圍界定出 之本發明精神及範圍。人們了解本發明上述所說明優先實 施例能夠容易地加以使用,作改變以及變化,但是其均含蓋 於下列申請專利範圍内。 除此,雖然一些相關元件已加以提及,其能夠替代針對 優先實施例戶斤說明及列舉之元件,此並不毫無遺漏地指出 所有可能相關情況,亦非限制申請專利範圍界定出本發明 為特定相關情況或其組合情況。熟知此技術者了解將存在 其他目别已知的或將發屐出之相關元件,其能夠加以使用 其本發明範圍内。 厶沽疚尺度適用中固S家標羋(CNS ) Λ4規格 2iO'X 297公) (!'The embodiments of the drawings will be described in detail. The following examples of material properties and the structure does not produce restrictions c klt- Ben Gongming is about the use of laser method to split the glass chip along the required split line. #_ 示 本 发财 年 料 '制, the top side of the glass has the main watch. Bo Zecai first made a score or scribe along the edge of the glass to form a crack initiation point 12 on the edge of the glass. The crack initiation point 12 is further corrected by the pin f to pass the light through the glass sheet 1G to form a crack 2Q. The laser beam spot 16 uses a laser, such as a CO2 laser, to form a first beam 32. Operating the C02 laser in a Moh mode will generate a light beam, and its energy distribution is shown in Figure 2. The first light beam 32 can be transformed by one or more lenses 34, such as a pair of cylindrical lenses, to form a second light beam 36, which has an oval shape 38. The second light beam is worn by one or more opaque masks 40 to form a third light beam 16. Any material capable of absorbing and dissipating the energy of the snow beam can be used to form the opaque mask 40. The carbon mask exhibits high thermal conductivity and is effective in this respect, although its lower oxidation temperature will limit the life of the carbon mask in the manufacturing environment. Another variation to form the opaque mask 40 includes any high temperature ceramic material. The opaque mask 40 should actually be sufficiently large to dissipate the heat generated without affecting other devices. Typical masks are 4 inches square and a quarter inch thick. The third light beam 37 has a truncated elliptical shape and heats a local area of the glass sheet along a desired split line. The heating point glass has a predetermined temperature gradient and distribution. It is determined that, ___________— " " T " In order to curb the house mark China (CNS > M «L Grid (210X29 "? 公 & 7464578 Λ7) Central standard> 1 V »Printed description of the invention (set)-Determined by the beam shape, energy and irradiation time ° Second, the glass is quenched by the fluid coolant 24 via the spray beam 22, which preferentially uses water. When operating in Within the correct thermal equilibrium range (considering the distribution of light east, beam energy, processing speed, water volume, and the distance between the water flow nozzle and the beam, as shown in the figure as c), the tensile stress caused by rapid cooling of the glass surface is sufficient to start from the formation Defect 12 generates intermediate cracks and causes cracks to propagate through the glass surface at a processing speed. As shown in FIG. 3a, the second beam produces an elliptical shape with a short axis of 3 and a long axis of b. According to the present invention, FIG. 3a is oval The light beam is intercepted at a distance from one end of the long axis as shown in FIG. 3b or at both ends as shown in FIG. 3C. The elliptical beam 36 is effectively longer than 20 faces, and more preferably greater than 30 before interception. _, And the highest priority is 4 (M2 (km or more.) The mask 40 can be preferentially installed to cover 20 to 40 when measuring along the long axis. The second beam 36 ^ laser beam point 16 intercepts the central axis pair The direction of travel of the split line required to pass through the glass sheet 10 is m. For thin glass sheets (1.1 or less), we find that the optimal length of the long axis of the laser beam point is related to the required running speed, of which the long The axis is preferentially at least 10% of the required laser marking speed per second. Therefore, for a laser scribe rate of 500mm for a 0.7mm thickness breaking glass, the long axis of the laser is preferentially at least 50mm long. The middle crack 20 only partially extends below the surface 10 of the glass sheet 10 with a depth d so that the middle crack 20 is formed as a score line. The depth, shape and direction of the crack are determined by the thermoelastic stress distribution, which in turn is mainly determined by the following numbers Xiang Yinjing: the energy density, size, and shape of the beam spot; the relative displacement rate of the beam spot through the substrate material; the thermophysical properties, the coolant supplied to the heating area (please read the note on the back first and then fill out this page) ) L. Ding, 15 »1 A7 .464578 Explanation of the invention (supply) ... the supply conditions and quality; and the thermophysical and mechanical properties of the split material, its thickness, and surface state. In order to control the depth of the intermediate crack, the present invention uses intercepted elliptical light east 16 pairs of glass i 〇Heating. Therefore, it has the specific quality of this special shape light beam. The depth of the intermediate crack d changes as the projection point of the cold bell fluid moves relative to the laser beam. Figure 1 depicts the trailing edge of the laser light beam point 16 and the fluid coolant 24 Only X fires to the cooling distance c between the glass point 10. The cooling distance is changed by cooling the glass at a point closer to the laser. The intermediate cracks produced are shallower than the intermediate cracks formed using a larger cooling distance c. For example, an elliptical light beam formed by a laser 30 and a cylindrical lens 34. The short axis of the beam is 1-5 legs and the long axis is 90mm. The opaque mask 40 of the present invention is placed between the lens 34 and the glass 10 so that the region of the long axis edge 18 is closed as if projected on the glass to take the elliptical laser beam spot 16. Since-part of the laser beam energy is intercepted by the opaque mask as shown in Figure 4, the cutting energy generated on the glass surface 10 is equivalent to the unshielded beam energy, which requires the laser 30 to be operated at a higher set power. As shown in the graph of FIG. 5, when the glass is heated by using a shielded beam, the depth of the intermediate cracks significantly changes with the cooling distance ^ For example, when the pout is located 5_ Using a shielded beam of 32 watts will produce an intermediate crack depth of about 100 microns. By adjusting the mouth to produce a cooling distance of 12 coffees, the depth of the middle crack was increased to about 11 micron 0. Finally, the glass sheet 10 was split into smaller glass sheets, and then by applying a bending force (CNS), 4¾¾ (2 ! 0Χ ^ ΪΤ Φ 464578 Fifth, the description of the invention (γ) The moment is achieved under the crack. The bending can be broken by using the traditional bending device (not shown) using some of the more traditional mechanical surface scribing methods. Achieved by the processing process. The laser beam 30 used as the glass splitting operation should be able to heat the surface of the cut glass. Therefore, the laser light is preferentially shorter than the absorption wavelength of the glass. In order to achieve this, the light is irradiated 6-3. Preferably in the infrared range, its wavelength is greater than 2 microns, such as the use of a CO2 laser with a wavelength in the range of 9-11 microns; or a CO laser with a wavelength of 5-6 microns, or a wavelength of 2. 6-3. 0 micron HF laser, or YAG laser with a wavelength of about 2-9 micron. When the current test mainly uses a C02 laser with a power in the range of 150-300 watts, we believe that it can successfully use a higher power laser. Although the invention has been The purpose is to explain in detail, people understand that the detailed description is only for that purpose, and those skilled in the art can make many changes from it, but it will not depart from the spirit and scope of the invention defined by the scope of the following patent applications. People understand the invention The above-mentioned preferred embodiments can be easily used, changed and changed, but they are all included in the scope of the following patent applications. In addition, although some related elements have been mentioned, they can substitute for the preferred embodiments. The description and enumeration of the elements does not exhaustively point out all possible related situations, nor does it limit the scope of the patent application to define the invention as a specific related situation or a combination thereof. Those skilled in the art understand that there will be other items known The related components that are or will be released can be used within the scope of the present invention. 厶 Guild scale is applicable to the Chinese solid standard SCNCN (CNS) Λ4 specification 2iO'X 297 male) (! '
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US09/264,938 US6327875B1 (en) | 1999-03-09 | 1999-03-09 | Control of median crack depth in laser scoring |
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CN109311726A (en) * | 2016-06-03 | 2019-02-05 | 康宁股份有限公司 | The mechanical device and method for causing stress when management separation flexible glass band on crack tip |
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TWI821250B (en) * | 2018-03-06 | 2023-11-11 | 美商康寧公司 | Apparatus and method for controlling substrate thickness |
Also Published As
Publication number | Publication date |
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JP2011246349A (en) | 2011-12-08 |
JP5525491B2 (en) | 2014-06-18 |
KR100604765B1 (en) | 2006-07-26 |
KR20010014540A (en) | 2001-02-26 |
JP2000281371A (en) | 2000-10-10 |
US6327875B1 (en) | 2001-12-11 |
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