TW464578B - Control of median crack depth in laser scoring - Google Patents

Control of median crack depth in laser scoring Download PDF

Info

Publication number
TW464578B
TW464578B TW089104530A TW89104530A TW464578B TW 464578 B TW464578 B TW 464578B TW 089104530 A TW089104530 A TW 089104530A TW 89104530 A TW89104530 A TW 89104530A TW 464578 B TW464578 B TW 464578B
Authority
TW
Taiwan
Prior art keywords
glass
laser
patent application
scope
light beam
Prior art date
Application number
TW089104530A
Other languages
Chinese (zh)
Inventor
Roger Alphee Allaire
James William Browne
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Application granted granted Critical
Publication of TW464578B publication Critical patent/TW464578B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • B23K26/0738Shaping the laser spot into a linear shape
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073Shaping the laser spot
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Toxicology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

A glass sheet is separated by propagating a crack in the glass sheet. By moving a laser beam across the surface of the glass sheet along a desired line of separation and then streaming coolant at the glass sheet at a predetermined distance behind the laser beam. By altering the profile of a laser beam used to score glass, and by changing the distance between the spot where the laser beam impinges on the glass and the spot struck by the stream of coolant, the penetration depth of the resultant median crack can be controlled.

Description

經濟部中央標準局®;工消费合作社印裂 46457 8 五、發明説明(z ) · 作之二氧化碳雷射以及移動速度約為500ram/秒,大部份熱 量保持於玻璃表面下小於500微米之區域内。此雷射劃線 ' 特性允許裂縫形成,該裂缝只部份地延伸過玻璃。 在雷射共振腔内電磁場形狀決定於反射鏡曲率,放電 管間距以及開孔直徑以及能量波長。由雷射形成光束形狀 通常依據零點數目加以分類,其在通過光束斷面兩個方向 中呈現出。對於大部份用途,具有高斯能量分佈而沒有零 值之光束為優先採用的。不過對於玻璃分割處理過程,具 有一個或多個零值之非高斯模式能夠加以使用以傳送雷射 月匕里更加均勻地至玻璃表面,其產车較高效率之雷射劃線 速度。 D模式操作之雷射已說明於美國第5776220號專利中, 該專利說明在此加入作為參考。圖2顯示出本發明D模式雷 射光束能量分佈之斷面。該非高斯光束具有至少一對強度 尖學位於較低能量分佈之中央區域,本發明優先採用該光 束0 如Kondratenko之(PCT WO 93/20015)所示,雷射光束 投射於玻璃片之形狀為擴圓形的。該翻形形狀長轴及短 軸通常滿足下列關係: a=0. 2至2. Oh以及 0至 10. 〇h 其中a為短軸長度以及b為長轴長度;以及h為雷射割線之玻 璃片厚度。依據tadratenk。專利,針大纽此時,將影 響切割處理過程之精確度。因而厚度為之玻璃基板( (請先1¾]讀背面之注意事項再填寫本頁) λ'4 ,1Τ 46457 8 Λ7 B7 五、發明説明 -Λ:ί 央 局 "vr 印 -7.'! 液晶顯錢—般厚度),K〇i*at enk。揭示di綠長度並不 超過7mni。 、為了升v成憜圓形光束,由|)模式所產生之雷射光東分佈 通常利用兩個橢圓形透鏡轉變以形成橢圓形形狀之光束。 _形光束使用來直接地照射玻璃表面。使用該技術,利 用280瓦光束中間裂縫深度通常在115至118微米範圍内,利 用330瓦光束則為12〇至125微米。 這些雷射劃線技術藉由形成不含顆粒之中間裂縫產生 良好品質之分割邊緣◊處理過程重現性以及所形成品質使 得雷射劃線可使⑽f造液晶以及其他平錢示器基板, 其邊緣分裂品質為高度需要的。除此幾乎任何需要在成形 玻璃片之應用例如為製造汽車窗戶,化粧品鏡子,或社區窗 戶能夠有益地使用雷射劃線。 不過,在一些應用中在劃線後但是在分割處理過程前 需要處理玻璃零件,劃線玻璃處理會使零件過早地分裂。 一項防止該問題之方法在於形成較淺中間裂縫,其較不容 易產生意外之分裂。不過,先前所揭示劃線方法並不會使 :該中間裂縫作細微控制,亦不會產生均勻的劃線深度而不 受雷射光束能量變化或冷卻水流位置之影響。 因而,存在一種方法以控制中間裂缝深度之需求,該裂 縫由劃線技術形成° 發明大要: 因而本發明目標在於提供一種控制中間裂缝穿透深度 之方法及裝置,該裂縫藉由雷射劃線法形成於玻璃片上。 说張尺度適用中囹囹家樣準(匚\5)/\4規格(2丨0;< 297公及 4 , (請先閱請"而之注""項再填寫本頁)Central Standards Bureau of the Ministry of Economic Affairs®; Industrial and Consumer Cooperative Coupling 46457 8 V. Description of the Invention (z) · The carbon dioxide laser and the moving speed are about 500 ram / second, and most of the heat is kept in the area below the glass surface of less than 500 microns. Inside. This laser scribing 'property allows cracks to form which only partially extend through the glass. The shape of the electromagnetic field in the laser cavity depends on the curvature of the mirror, the distance between the discharge tube, the diameter of the opening, and the energy wavelength. The shape of the beam formed by the laser is usually classified according to the number of zeros, which appears in both directions through the beam section. For most applications, beams with a Gaussian energy distribution without zero are preferred. However, for the glass splitting process, a non-Gaussian mode with one or more zero values can be used to transmit the laser moon dagger more evenly to the glass surface, and its production vehicle has a higher efficiency laser scribe speed. Lasers for D-mode operation have been described in US Patent No. 5,776,220, which is incorporated herein by reference. Fig. 2 shows a cross section of the energy distribution of a laser beam of the D mode according to the present invention. The non-Gaussian beam has at least a pair of intensity peaks located in the central region of the lower energy distribution. The present invention preferentially uses the beam. As shown by Kondratenko (PCT WO 93/20015), the shape of the laser beam projected on the glass sheet is expanded. round. The major and minor axes of the flip shape generally satisfy the following relationships: a = 0. 2 to 2. Oh and 0 to 10. 0 h where a is the length of the short axis and b is the length of the long axis; and h is the length of the laser secant Glass sheet thickness. According to tadratenk. The patent, needle big button at this time, will affect the accuracy of the cutting process. Therefore the thickness of the glass substrate ((please read 1¾), read the precautions on the back, and then fill in this page) λ'4, 1Τ 46457 8 Λ7 B7 V. Description of the invention-Λ: ί 局 局 " vr 印 -7. '! LCD display money-the same thickness), Koi * at enk. It is revealed that the length of di green does not exceed 7mni. In order to increase v into a 憜 -shaped circular beam, the eastern distribution of laser light generated by |) mode is usually transformed by using two oval lenses to form an oval-shaped beam. The _-shaped beam is used to directly illuminate the glass surface. Using this technique, the depth of the crack in the middle of a beam of 280 watts is usually in the range of 115 to 118 microns, and it is 120 to 125 microns with a 330 watt beam. These laser scribing technologies produce good-quality divided edges by forming intermediate cracks that do not contain particles. The reproducibility of the process and the quality of the formed laser scribing technology can make LCD and other flat display substrates. Edge split quality is highly needed. In addition, almost any application that requires shaping glass sheets, such as manufacturing automotive windows, cosmetic mirrors, or community windows, can beneficially use laser scribing. However, in some applications, glass parts need to be processed after scribing but before the singulation process. Scribing glass processing can cause the part to split prematurely. One way to prevent this problem is to form shallow intermediate cracks that are less likely to cause accidental splits. However, the previously disclosed scribing method does not allow: the intermediate crack is finely controlled, nor does it produce a uniform scribing depth without being affected by changes in the laser beam energy or the location of the cooling water flow. Therefore, there is a need for a method to control the depth of the intermediate crack, which is formed by a scribing technique. The invention is important: Therefore, the object of the present invention is to provide a method and a device for controlling the penetration depth of the intermediate crack. The wire method is formed on a glass sheet. It is said that the Zhang scale is applicable to the standard of the Chinese family (匚 \ 5) / \ 4 specifications (2 丨 0; < 297 and 4), (please read the "" and note " " before filling out this page)

464578 A7464578 A7

B7 依據本發明方法,破璃片係利用雷射光束點加熱,其沿 著玻璃料面移動以形成悄裂縫。雷射_傳送通過一 個或多個透鏡以形成橢_光束。不透明糾使用來封閉 橢圓形光束於麵形光束絲—喊㈣處轉成經截取 橢圓形光束,其沿著玻璃片移動對玻璃表面加熱。冷卻劑 流體由冷卻噴嘴投向加熱_上„點。在冷卻點與移域 取摘圓形光相之冷卻距射加以控.藉崎冷卻距離 力以變化,可控制巾間裂缝穿透深度,其解決該形式雷射劃 線以及玻璃分裂系統控制之需求。 巧明這些以及其他方面將由下列詳細說明變為清 附圖簡單說明: 走 第一圖(圖1)顯示出本發明麵玻則舰處理過程^ 第=圖(圖2)顯示出標準D模式雷射光束之能量分佈。 ..第三甲,乙及關⑽a,b及〇顯示出本發明f射光束 第四圖 光東能量。 第五圖 裂縫珠度。 (圖4)顯示出本發明分佈於_,取擴圓形 (圖5)顯示出本㈣職於玻絲質中之中間 附圖元件數字符號說明: 玻璃片ίο;玻璃表φ il;裂縫啟始點12 1_邊緣18;裂縫20;噴束22;冷卻劑24, 光束32;透鏡34;光束36;形狀38;遮覃4〇。田、 優先實施例詳細說明: •泛迕尺及通用中园园家標华 CNS ) Λ4^格(2;qx 297公片 7 4578 Λ7 B7 4B7 According to the method of the present invention, the glass-breaking sheet is heated by a laser beam spot, which moves along the frit surface to form a quiet crack. The laser is transmitted through one or more lenses to form an elliptical beam. Opaque correction is used to close the elliptical beam at the surface of the beam-the ellipses are turned into intercepted elliptical beams, which move along the glass sheet to heat the glass surface. The coolant fluid is thrown by the cooling nozzle to the heating point. The cooling distance of the circular light phase is taken at the cooling point and the moving area to control. The cooling distance can be changed by using the cooling distance to control the penetration depth of the crack between the towels. Solve the needs of laser scribing and glass splitting system control in this form. It will be clear that these and other aspects will be changed from the following detailed description to the simple description of the drawings: The first figure (Figure 1) shows the surface treatment of the present invention Process ^ Figure = (Figure 2) shows the energy distribution of the standard D-mode laser beam .. The third A, B and Guan a, b and 0 show the light east energy of the fourth figure of the f-beam of the present invention. The figure 5 shows the sphericity of the crack. (Figure 4) shows that the present invention is distributed in _, and the round shape (Figure 5) shows that the intermediate drawing elements that work in glassy matter are described by the numerical symbol of the glass: glass piece; glass Table φ il; crack initiation point 12 1_edge 18; crack 20; spray beam 22; coolant 24, beam 32; lens 34; beam 36; shape 38; shade Qin 40. The preferred embodiment is explained in detail: • Pan-square ruler and general Chinese garden garden standard Chinese CNS) Λ4 ^ grid (2; qx 297 male film 7 4578 Λ7 B7 4

對附圖實施例所_示範例詳細加以說明。下 列la 料範例性質以及並不會 構造產生限制c klt- 本各明係關於使用雷射法沿著所需要分裂線分裂破璃 片之Μ。#_示本發财齡料'統,玻璃上側 具有主要表抓。玻則财先沿著玻璃㈣邊緣產生刻 痕或劃線以形成裂缝啟始點12於玻.10 —邊。該裂縫啟 始點12再H由銷f要分聽之路做射光糾 通過玻璃片1G以形成裂缝2Q。雷射光束點16藉域用雷射 例如為C〇2雷射以形成第一光束32。以以莫式操作c〇2雷射 將產生光束,其能量分佈圖如圖2所示。第一光束32能夠藉 由一個或多個透鏡34例如為一對圓柱形透鏡轉變而形成第 二光束36,其具有橢圓形形狀38。 第二光束藉由一個或多個不透明遮罩40戴取以形成第 三光束16。任何能夠吸收以及消散雪射光束能量之材料能 夠使用來形成不透明遮罩40。碳遮罩呈現出高導熱性以及 在該方面用途為有效的,雖然其較低之氧化溫度在製造環 境中將限制碳遮罩之壽命。形成不透明遮罩40之另外一種 變化包括任何高溫陶瓷材料。不透明遮罩40實際上應該相 當大足以消散所產生熱量而不會影響其他裝置。一般遮罩 為4英吋方形以及厚度為四分之一英吋。第三光束37具有 經截取橢圓形形狀以及沿著所需要分裂線對玻璃片局部區 域加熱。 加熱點玻璃具有預先決定之溫度梯度以及分佈,其決 , ,___________—" "T" 以用中囷遏家標华(CNS > M«L格(210X29"?公& 7464578 Λ7 部 央 標 >1 •V» 印 發明説明(台) - 定於光束形狀,能量以及照射時間°其次,玻璃利用流體冷 卻劑24經由喷束22進行淬冷,其優先地利用水。當操作在 正確熱平衡範圍内(考慮光東分佈,光束能量,處理速度,水 體積以及水流喷嘴與光束間之距離,如圖中標示為c),玻璃 表面快速冷卻產生之張應力,其足以由形成啟始缺陷12產 生中間裂縫以及使裂縫以處理速度傳播通過玻璃表面α 如圖3a所示,第二光束產生橢圓形之形狀,其短軸為3 以及長軸為b。依據本發明,圖3a橢圓形光束在離長軸一端 一段距離加以截取如圖3b所示或在兩端處截取如圖3C所示 。橢圓形光束36在截取前長軸有效地大於20麵,較優先地 大於30_,以及最優先地為4(M2(km或更大。遮罩4〇可優 先地裝置以沿著長軸量測時遮蔽20至40¾第二光束36 ^雷 射光束點16截取中心軸對準於通過玻璃片1 〇所需要分裂線 之運行方向m。 對於薄玻璃片(1· 1刪或更薄),我們發現雷射光束點長 軸最佳長度與所需要運行速度相關,其中長軸優先地至少 為10%所需要之雷射劃線每秒鐘速度。因而對於〇. 7mm厚度 破璃所需要5 0 0mm雷射劃線速率,雷射長軸優先地至少為5 〇 mm長。 中間裂縫20只部份以深度d延伸於玻璃片1〇表面u下 使得中間裂縫20形成為刻痕線。裂缝深度,形狀以及方向 由熱彈性應力分佈決定,其依次地主要決定於下列數項因 京:光束點之能量密度,尺寸以及形狀;光束點通過基板材 料相對位移之速率;熱物理特性,供應至加熱區域之冷卻劑 (請先閱讀背而之注意羋項再填艿本页) L·r 丁 、15»1 A7 .464578 五、發明説明(了) ... 供應條件以及品質;以及將分裂材料熱物理以及機械特性, 其厚度,以及表面狀態。 為了控制中間裂鏠深度,本發明使用截取橢圓形光東 16對玻璃i〇加熱。因而具有該特別形狀光束之特定品質, 中間裂縫深度d隨著冷钟流體投射點相對於雷射光束移動 而改變。圖1描繪出雷射光朿點16尾端邊緣與流體冷卻劑 24才X射至玻璃點1〇點之間冷卻距離c。藉由冷卻玻璃於 更罪近雷射照射一點處以改變冷卻距離。所產生中間裂絲 較淺與使用冷卻距離c為較大冷卻點所形成中間裂縫比較 為較淺。 例如,由雷射30以及圓柱形透鏡34所形成之橢圓形光 東。光束短軸為1_ 5腿以及長軸為90mm。本發明不透明遮 罩40放置於透鏡34與玻璃1 〇之間^使得在長軸邊緣18區域 被封閉如同投射於玻璃上載取橢圓形雷射光束點16。由於 —部份如圖4所顯示雷射光束能量由不透明遮罩所截取,在 玻璃表面10產生之切割能量相當於未遮蔽光束能量,其需 要操作雷射30為較高設定功率。 如圖5曲線圖所示,使用遮蔽光束對玻璃加熱,所產生 中間裂縫之深度顯著地隨著冷卻距離變化而改變^例如, 當嗔嘴位於投射於玻璃上經遮蔽光束點後5_時,使用32〇 瓦經遮蔽光束將產生約1〇〇微米中間裂縫深度。藉由調整 嘴嘴以產生12咖1冷卻距離,中間裂縫深度增加至約為11〇微 不0 最後將玻璃片10分裂為較小玻璃片再藉由施加彎曲力 ( CNS ) ,,4¾¾ ( 2!0Χ^ΪΤ Φ 464578 五、發明説明(γ) 矩於裂缝底下而達成。該彎曲能夠藉由使用傳統彎折裝置 (並未顯示出)使用一些較為傳統機器性表面劃線方法之分 裂破璃處理過程而達成。 使用作為玻璃分裂操作之雷射光束3 0應該能夠對被切 破璃表面加熱。因而雷射光線優先地為較玻璃之吸收波長 為短之波長。為了達成該情況,照射光線優先地在紅外線 範圍内,其波長大於2微米,例如使用波長在9-11微米範圍 之C〇2雷射;或波長在5-6微米之C0雷射,或波長在2. 6-3. 0 微米之HF雷射,或波長約2_ 9微米之YAG雷射。當目前試驗 主要使用C02雷射,其功率在150-300瓦範圍内,我們相信可 成功地使用較高功率之雷射。 雖然本發明已針對列舉目的詳細加以說明,人們了解 该詳細說明只作為該目的,以及熟知此技術者能夠由其中 作出許多變化,但是並不會脫離下列申請專利範圍界定出 之本發明精神及範圍。人們了解本發明上述所說明優先實 施例能夠容易地加以使用,作改變以及變化,但是其均含蓋 於下列申請專利範圍内。 除此,雖然一些相關元件已加以提及,其能夠替代針對 優先實施例戶斤說明及列舉之元件,此並不毫無遺漏地指出 所有可能相關情況,亦非限制申請專利範圍界定出本發明 為特定相關情況或其組合情況。熟知此技術者了解將存在 其他目别已知的或將發屐出之相關元件,其能夠加以使用 其本發明範圍内。 厶沽疚尺度適用中固S家標羋(CNS ) Λ4規格 2iO'X 297公) (!'The embodiments of the drawings will be described in detail. The following examples of material properties and the structure does not produce restrictions c klt- Ben Gongming is about the use of laser method to split the glass chip along the required split line. #_ 示 本 发财 年 料 '制, the top side of the glass has the main watch. Bo Zecai first made a score or scribe along the edge of the glass to form a crack initiation point 12 on the edge of the glass. The crack initiation point 12 is further corrected by the pin f to pass the light through the glass sheet 1G to form a crack 2Q. The laser beam spot 16 uses a laser, such as a CO2 laser, to form a first beam 32. Operating the C02 laser in a Moh mode will generate a light beam, and its energy distribution is shown in Figure 2. The first light beam 32 can be transformed by one or more lenses 34, such as a pair of cylindrical lenses, to form a second light beam 36, which has an oval shape 38. The second light beam is worn by one or more opaque masks 40 to form a third light beam 16. Any material capable of absorbing and dissipating the energy of the snow beam can be used to form the opaque mask 40. The carbon mask exhibits high thermal conductivity and is effective in this respect, although its lower oxidation temperature will limit the life of the carbon mask in the manufacturing environment. Another variation to form the opaque mask 40 includes any high temperature ceramic material. The opaque mask 40 should actually be sufficiently large to dissipate the heat generated without affecting other devices. Typical masks are 4 inches square and a quarter inch thick. The third light beam 37 has a truncated elliptical shape and heats a local area of the glass sheet along a desired split line. The heating point glass has a predetermined temperature gradient and distribution. It is determined that, ___________— " " T " In order to curb the house mark China (CNS > M «L Grid (210X29 "? 公 & 7464578 Λ7) Central standard> 1 V »Printed description of the invention (set)-Determined by the beam shape, energy and irradiation time ° Second, the glass is quenched by the fluid coolant 24 via the spray beam 22, which preferentially uses water. When operating in Within the correct thermal equilibrium range (considering the distribution of light east, beam energy, processing speed, water volume, and the distance between the water flow nozzle and the beam, as shown in the figure as c), the tensile stress caused by rapid cooling of the glass surface is sufficient to start from the formation Defect 12 generates intermediate cracks and causes cracks to propagate through the glass surface at a processing speed. As shown in FIG. 3a, the second beam produces an elliptical shape with a short axis of 3 and a long axis of b. According to the present invention, FIG. 3a is oval The light beam is intercepted at a distance from one end of the long axis as shown in FIG. 3b or at both ends as shown in FIG. 3C. The elliptical beam 36 is effectively longer than 20 faces, and more preferably greater than 30 before interception. _, And the highest priority is 4 (M2 (km or more.) The mask 40 can be preferentially installed to cover 20 to 40 when measuring along the long axis. The second beam 36 ^ laser beam point 16 intercepts the central axis pair The direction of travel of the split line required to pass through the glass sheet 10 is m. For thin glass sheets (1.1 or less), we find that the optimal length of the long axis of the laser beam point is related to the required running speed, of which the long The axis is preferentially at least 10% of the required laser marking speed per second. Therefore, for a laser scribe rate of 500mm for a 0.7mm thickness breaking glass, the long axis of the laser is preferentially at least 50mm long. The middle crack 20 only partially extends below the surface 10 of the glass sheet 10 with a depth d so that the middle crack 20 is formed as a score line. The depth, shape and direction of the crack are determined by the thermoelastic stress distribution, which in turn is mainly determined by the following numbers Xiang Yinjing: the energy density, size, and shape of the beam spot; the relative displacement rate of the beam spot through the substrate material; the thermophysical properties, the coolant supplied to the heating area (please read the note on the back first and then fill out this page) ) L. Ding, 15 »1 A7 .464578 Explanation of the invention (supply) ... the supply conditions and quality; and the thermophysical and mechanical properties of the split material, its thickness, and surface state. In order to control the depth of the intermediate crack, the present invention uses intercepted elliptical light east 16 pairs of glass i 〇Heating. Therefore, it has the specific quality of this special shape light beam. The depth of the intermediate crack d changes as the projection point of the cold bell fluid moves relative to the laser beam. Figure 1 depicts the trailing edge of the laser light beam point 16 and the fluid coolant 24 Only X fires to the cooling distance c between the glass point 10. The cooling distance is changed by cooling the glass at a point closer to the laser. The intermediate cracks produced are shallower than the intermediate cracks formed using a larger cooling distance c. For example, an elliptical light beam formed by a laser 30 and a cylindrical lens 34. The short axis of the beam is 1-5 legs and the long axis is 90mm. The opaque mask 40 of the present invention is placed between the lens 34 and the glass 10 so that the region of the long axis edge 18 is closed as if projected on the glass to take the elliptical laser beam spot 16. Since-part of the laser beam energy is intercepted by the opaque mask as shown in Figure 4, the cutting energy generated on the glass surface 10 is equivalent to the unshielded beam energy, which requires the laser 30 to be operated at a higher set power. As shown in the graph of FIG. 5, when the glass is heated by using a shielded beam, the depth of the intermediate cracks significantly changes with the cooling distance ^ For example, when the pout is located 5_ Using a shielded beam of 32 watts will produce an intermediate crack depth of about 100 microns. By adjusting the mouth to produce a cooling distance of 12 coffees, the depth of the middle crack was increased to about 11 micron 0. Finally, the glass sheet 10 was split into smaller glass sheets, and then by applying a bending force (CNS), 4¾¾ (2 ! 0Χ ^ ΪΤ Φ 464578 Fifth, the description of the invention (γ) The moment is achieved under the crack. The bending can be broken by using the traditional bending device (not shown) using some of the more traditional mechanical surface scribing methods. Achieved by the processing process. The laser beam 30 used as the glass splitting operation should be able to heat the surface of the cut glass. Therefore, the laser light is preferentially shorter than the absorption wavelength of the glass. In order to achieve this, the light is irradiated 6-3. Preferably in the infrared range, its wavelength is greater than 2 microns, such as the use of a CO2 laser with a wavelength in the range of 9-11 microns; or a CO laser with a wavelength of 5-6 microns, or a wavelength of 2. 6-3. 0 micron HF laser, or YAG laser with a wavelength of about 2-9 micron. When the current test mainly uses a C02 laser with a power in the range of 150-300 watts, we believe that it can successfully use a higher power laser. Although the invention has been The purpose is to explain in detail, people understand that the detailed description is only for that purpose, and those skilled in the art can make many changes from it, but it will not depart from the spirit and scope of the invention defined by the scope of the following patent applications. People understand the invention The above-mentioned preferred embodiments can be easily used, changed and changed, but they are all included in the scope of the following patent applications. In addition, although some related elements have been mentioned, they can substitute for the preferred embodiments. The description and enumeration of the elements does not exhaustively point out all possible related situations, nor does it limit the scope of the patent application to define the invention as a specific related situation or a combination thereof. Those skilled in the art understand that there will be other items known The related components that are or will be released can be used within the scope of the present invention. 厶 Guild scale is applicable to the Chinese solid standard SCNCN (CNS) Λ4 specification 2iO'X 297 male) (! '

Claims (1)

I ίΠ * % 人 IT 作 Α8 ΒΒ CS DS 46457 Β 申請專利範圍 l.—種玻璃劃線之方法,其藉由將雷射光束通過於破璃> 面上,該方法包含下列步驟: '内么 操作雷射以形成第一光束; 利用一個或多個透鏡將第一.光束轉變而形成第二光束 其在投射玻璃上具有長軸及短軸之拉伸橢圓形光束點. 在相對第二光束至少一端處物理性地封閉—部份第二光 束以減小第二光束點之長軸以及形成第三光束; 移動第三光束通過賴表面_成加熱_,在該處移 動第二光束,其具有導引邊緣以及尾端邊緣; ρ由'^対出冷卻劑於加熱玻璃上_動第三光束尾端邊 緣為預先決定距離以在玻璃中形成裂縫。 而i t依據申請專利範圍第1項之方法,其中包含下列步驟:改 •交預先決定之距離以有效控制裂縫深度。 3·依射請專利範圍第1項之方法,其f雷射聰2雷射。 4.依據中請專利範圍第丨項之方法,其t雷射以腺式操作。 5·依據申請專利範圍第丨項之方法,其中第 於 璃之移動速率〇至·秒。 M 依據申請專利範圍第1項之方法,其中使用兩個圓柱形透 鏡將第一光束轉變為第二光束。 7.依據申請專概圍幻項之紐,其巾第二光束物理性地 封閉於相對第二光束點—個端部部份之區域處。 ^依據巾請專利範圍第丨項之方法,其中第二光束物理性地 ’閉於相對第—光束點兩個個端部部份之區域處。 9_依據巾請專利範㈣丨項之方法,其巾第二光束長轴在封 故張尺度I ίΠ *% Human IT as Α8 Β CS DS 46457 Β Patent application scope l. A method of scoring a glass by passing a laser beam on the glass surface, the method includes the following steps: '内What is the operation of the laser to form a first beam; using one or more lenses to transform the first beam into a second beam which has long and short axis stretched oval beam spots on the projection glass. At least one end of the light beam is physically closed-part of the second light beam to reduce the long axis of the second light beam point and form a third light beam; move the third light beam through the surface to become heated, and move the second light beam there, It has a leading edge and a trailing edge; ρ sends out the coolant on the heated glass and moves the trailing edge of the third beam to a predetermined distance to form a crack in the glass. The method according to item 1 of the scope of patent application includes the following steps: Change the predetermined distance to effectively control the crack depth. 3. According to the method of the first scope of the patent application, its f laser 2 is laser. 4. According to the method in the patent scope, the laser is operated in gland. 5. The method according to item 丨 of the scope of patent application, wherein the moving speed of the glass is 0 to · seconds. M The method according to item 1 of the patent application, wherein two cylindrical lenses are used to transform the first light beam into a second light beam. 7. According to the application for enveloping magic items, the second light beam of the towel is physically closed at the area opposite to the second light beam point, one end portion. ^ The method according to item 丨 of the patent application, wherein the second light beam is physically closed at the two end portions opposite to the first light beam point. 9_ According to the method of the patent claim of the towel, the long axis of the second beam of the towel is sealed. 4M5784M578 Φ諳 Λ8 B8 CS DS 貧專利範園 經濟部中央標準局分Η · 閉°卩知弟二光束後減少20至40百分比 ▲ t桌申明專利範圍第1項之方法,其中封閉部份第二光 :,光束點之長軸為至12。腿被減小至封閉後之 焚車&马50麵至8〇晒。 1’牙里刀裂玻璃片之方法,其包含. (a)移動雷射光束通過玻㈣所f要分级該雷射光束 f投射玻㈣上具有賴MM彡光束,fM統束點具有長 軸及短軸,並使長軸對準於分裂線; (b ),卩麻n沿著所f要分裂線以及在雷射光束後為預 先決定距離處通過玻璃片以傳播部份深度裂缝;以及 (〇沿著該裂縫將玻璃分裂。 12, 依據巾料纖職丨丨狀方法,射域取麵形光 束點藉由封閉相對橢圓形光束點—端之—部份雷射光束而 形成,其將減少光束點之長軸。 13, 依據申請專利範圍第丨2項之方法,其中相對橢圓形光束 點每一端部之部份雷射光束被封閉。 14, 依據申請專利範圍第丨丨項之方法,其中更進一步包含改 變預先決定之距離以有效控制裂縫深度。 15, 依據申請專利範圍第丨丨項之方法,其中雷射光束由c〇2 雷射產生。 16·依據申請專利範圍第11項之方法,其中雷射光束以D模 式操作雷射產生。 π·依據申請專利範圍第丨丨項之方法,其中雷射光束相對於 玻璃片之移動速度為2〇〇至700酬/秒。 (诗先閱讀背而之;±意?項再填寫本頁〕 ----來 - ί—'! _ - .邹 464578 Λ 8 Β8 C8 08 ,2 申請 •冲丨 18·依據申請專利範園第11項之方法,其中在封閉部份第 光束後第二光束之長軸減小2 0 %至4 0 %。 ;:;,先閱讀"'而之注意事項再填寫本頁) 裝 訂丨,Φ 谙 Λ8 B8 CS DS Analysis of the Central Standards Bureau of the Ministry of Economic Affairs of the Patent-poor Patent Fanyuan · Closed: After the two beams are reduced, the percentage is reduced by 20 to 40% :, The long axis of the beam spot is to 12. The legs were reduced to 50% of the burned car & 80% sun after being closed. The method of 1 'guillotine slicing a glass sheet includes: (a) moving a laser beam through a glass beam f to be classified; the laser beam f is projected on the glass beam having a MM beam; And the short axis and align the long axis with the split line; (b) Ramie n passes through the glass sheet along the f to be split line and a predetermined distance after the laser beam to propagate some deep cracks; and (〇 The glass is split along this crack. 12, According to the towel fabric method, the area of the beam-shaped beam spot is formed by closing a part of the laser beam that is opposite to the oval beam spot, which is The long axis of the beam spot will be reduced. 13, The method according to item 丨 2 of the scope of the patent application, in which part of the laser beam at each end of the relatively elliptical beam spot is closed. 14, according to the scope of the patent application scope 丨 丨Method, which further includes changing the predetermined distance to effectively control the crack depth. 15, The method according to item 丨 丨 in the scope of the patent application, in which the laser beam is generated by a co2 laser. 16. According to the scope of patent application No. 11 Method, in which the laser beam is in the D mode Π · According to the method in the scope of application for patent application, π, wherein the moving speed of the laser beam relative to the glass sheet is from 200 to 700 rpm / second. Please fill in this page again.] ---- Come-ί— '! _-. Zou 464578 Λ 8 Β8 C8 08, 2 Application • Chong 丨 18 · According to the method of the 11th patent application park, in the closed section After copying the first beam, the long axis of the second beam is reduced by 20% to 40%.;:;, Please read " 'and note this before filling out this page) Binding 丨,
TW089104530A 1999-03-09 2000-03-10 Control of median crack depth in laser scoring TW464578B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/264,938 US6327875B1 (en) 1999-03-09 1999-03-09 Control of median crack depth in laser scoring

Publications (1)

Publication Number Publication Date
TW464578B true TW464578B (en) 2001-11-21

Family

ID=23008282

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089104530A TW464578B (en) 1999-03-09 2000-03-10 Control of median crack depth in laser scoring

Country Status (4)

Country Link
US (1) US6327875B1 (en)
JP (2) JP2000281371A (en)
KR (1) KR100604765B1 (en)
TW (1) TW464578B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404683B (en) * 2008-05-27 2013-08-11 Corning Inc Scoring of non-flat materials
CN109311726A (en) * 2016-06-03 2019-02-05 康宁股份有限公司 The mechanical device and method for causing stress when management separation flexible glass band on crack tip
TWI821250B (en) * 2018-03-06 2023-11-11 美商康寧公司 Apparatus and method for controlling substrate thickness

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19955824A1 (en) * 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Method and device for cutting a workpiece made of brittle material
JP4786783B2 (en) * 2000-08-18 2011-10-05 日本板硝子株式会社 Method for cutting glass plate and glass disk for recording medium
US6812430B2 (en) * 2000-12-01 2004-11-02 Lg Electronics Inc. Glass cutting method and apparatus with controlled laser beam energy
WO2002100620A1 (en) * 2001-06-11 2002-12-19 Mitsuboshi Diamond Industrial Co., Ltd. Device and method for scribing fragile substance
JP2004536759A (en) * 2001-07-25 2004-12-09 ヴラディミア シュテファノヴィッチ コンドラテンコ How to cut brittle non-metallic materials
US20030134734A1 (en) 2001-08-08 2003-07-17 Shiro Nishimoto Press molding method for glass and manufacturing method for glass substrate using this method
TW583046B (en) * 2001-08-10 2004-04-11 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing brittle material substrate
KR100794284B1 (en) * 2001-09-29 2008-01-11 삼성전자주식회사 Method for cutting non-metal substrate
WO2003076150A1 (en) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
US6919531B2 (en) * 2002-03-25 2005-07-19 Agilent Technologies, Inc. Methods for producing glass substrates for use in biopolymeric microarrays
JP4032857B2 (en) * 2002-07-24 2008-01-16 ソニー株式会社 Glass substrate for touch panel, touch panel and portable terminal
GB0222342D0 (en) * 2002-09-26 2002-11-06 British Nuclear Fuels Plc Surface treatment of concrete
DE10330179A1 (en) * 2003-07-02 2005-01-20 Jenoptik Automatisierungstechnik Gmbh Method for separating flat workpieces made of ceramic
US7407843B2 (en) * 2004-04-23 2008-08-05 Sharp Laboratories Of America, Inc. Four-transistor Schmitt trigger inverter
US20060166415A1 (en) * 2004-06-07 2006-07-27 Sharp Laboratories Of America, Inc. Two-transistor tri-state inverter
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
US20060021977A1 (en) * 2004-07-30 2006-02-02 Menegus Harry E Process and apparatus for scoring a brittle material incorporating moving optical assembly
BRPI0513669A (en) * 2004-07-30 2008-05-13 Mitsuboshi Diamond Ind Co Ltd substrate intermediate crack formation method and substrate intermediate crack formation equipment
US20060249553A1 (en) * 2005-05-06 2006-11-09 Ljerka Ukrainczyk Ultrasonic induced crack propagation in a brittle material
US20070039990A1 (en) * 2005-05-06 2007-02-22 Kemmerer Marvin W Impact induced crack propagation in a brittle material
US20060261118A1 (en) * 2005-05-17 2006-11-23 Cox Judy K Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
US20060280920A1 (en) * 2005-06-10 2006-12-14 Abbott John S Iii Selective contact with a continuously moving ribbon of brittle material to dampen or reduce propagation or migration of vibrations along the ribbon
ATE389497T1 (en) * 2005-06-21 2008-04-15 Fameccanica Data Spa DEVICE AND DEVICE FOR LASER CUTTING ARTICLES, IN PARTICULAR SANITARY PRODUCTS AND THEIR COMPONENTS, WITH A LASER FOCUS POINT DIAMETER OF 0.1 TO 0.3 MM
DE102005038027A1 (en) * 2005-08-06 2007-02-08 Jenoptik Automatisierungstechnik Gmbh Process for cutting brittle flat materials
US20070138228A1 (en) * 2005-12-16 2007-06-21 Brown James W Method and apparatus for finishing a glass sheet
DE102006024825A1 (en) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Method and device for edge trimming a float glass ribbon
US20080041833A1 (en) * 2006-08-21 2008-02-21 Nicholas Dominic Cavallaro Thermal tensioning during thermal edge finishing
US8496866B2 (en) 2007-04-25 2013-07-30 Ceramtec Gmbh Chip resistor substrate
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US7971012B2 (en) * 2007-05-15 2011-06-28 Pitney Bowes Inc. Mail processing computer automatic recovery system and method
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
JP5171838B2 (en) * 2007-10-11 2013-03-27 三星ダイヤモンド工業株式会社 Laser scribing method for brittle material substrate
US8011207B2 (en) * 2007-11-20 2011-09-06 Corning Incorporated Laser scoring of glass sheets at high speeds and with low residual stress
US8051679B2 (en) * 2008-09-29 2011-11-08 Corning Incorporated Laser separation of glass sheets
US8347651B2 (en) * 2009-02-19 2013-01-08 Corning Incorporated Method of separating strengthened glass
US9302346B2 (en) * 2009-03-20 2016-04-05 Corning, Incorporated Precision laser scoring
US8539795B2 (en) * 2009-05-13 2013-09-24 Corning Incorporated Methods for cutting a fragile material
US8132427B2 (en) 2009-05-15 2012-03-13 Corning Incorporated Preventing gas from occupying a spray nozzle used in a process of scoring a hot glass sheet
US8622625B2 (en) * 2009-05-29 2014-01-07 Corning Incorporated Fiber end face void closing method, a connectorized optical fiber assembly, and method of forming same
US8592716B2 (en) * 2009-07-22 2013-11-26 Corning Incorporated Methods and apparatus for initiating scoring
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
CN102596831B (en) 2009-11-03 2015-01-07 康宁股份有限公司 Laser scoring of a moving glass ribbon having a non-constant speed
US8171753B2 (en) * 2009-11-18 2012-05-08 Corning Incorporated Method for cutting a brittle material
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
TWI524962B (en) 2009-12-16 2016-03-11 康寧公司 Separation of glass sheets from a laser-scored curved glass ribbon
CN101879665A (en) * 2010-06-24 2010-11-10 浙江工业大学 Laser cutting method of brittle material baseplate
TWI513670B (en) * 2010-08-31 2015-12-21 Corning Inc Methods of separating strengthened glass substrates
US8887529B2 (en) 2010-10-29 2014-11-18 Corning Incorporated Method and apparatus for cutting glass ribbon
WO2012172960A1 (en) * 2011-06-15 2012-12-20 旭硝子株式会社 Method for cutting glass plate
US8635887B2 (en) * 2011-08-10 2014-01-28 Corning Incorporated Methods for separating glass substrate sheets by laser-formed grooves
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
DE102012103176B3 (en) 2012-04-12 2013-05-29 Jenoptik Automatisierungstechnik Gmbh Apparatus and method for introducing separation cracks into a substrate
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
CN102749746B (en) * 2012-06-21 2015-02-18 深圳市华星光电技术有限公司 Liquid crystal substrate cutting device and liquid crystal substrate cutting method
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
DE102012110971A1 (en) * 2012-11-14 2014-05-15 Schott Ag Separating transparent workpieces
KR101948382B1 (en) 2013-01-30 2019-02-14 코닝 인코포레이티드 Apparatus and methods for continuous laser cutting of flexible glass
US9260337B2 (en) 2014-01-09 2016-02-16 Corning Incorporated Methods and apparatus for free-shape cutting of flexible thin glass
US10017411B2 (en) 2014-11-19 2018-07-10 Corning Incorporated Methods of separating a glass web
DE102015104802A1 (en) * 2015-03-27 2016-09-29 Schott Ag Method for separating glass by means of a laser, and glass product produced according to the method
DE102015104801A1 (en) * 2015-03-27 2016-09-29 Schott Ag Method and apparatus for continuous separation of glass
CN106112282A (en) * 2016-07-13 2016-11-16 京东方科技集团股份有限公司 A kind of for CO2the decision method of the crackle of cut and system
US10688599B2 (en) * 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
JP7134182B2 (en) 2017-03-22 2022-09-09 コーニング インコーポレイテッド How to split glass web
CN107868958B (en) * 2017-12-01 2023-12-05 浙江工业大学 Flexible self-adaptive composite carbon brush type electromagnetic composite field synchronous laser cladding device
CN109986211A (en) * 2019-04-15 2019-07-09 深圳市安思科电子科技有限公司 A kind of laser marking device with long service life with regulatory function
DE102020123928A1 (en) 2020-09-15 2022-03-17 Schott Ag Process and device for cutting glass foils

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695498A (en) * 1970-08-26 1972-10-03 Ppg Industries Inc Non-contact thermal cutting
US3790362A (en) * 1970-09-15 1974-02-05 Ppg Industries Inc Directional control for thermal severing of glass
US5053171A (en) * 1986-10-14 1991-10-01 Allergan, Inc. Manufacture of ophthalmic lenses by excimer laser
JPS63315937A (en) * 1987-06-18 1988-12-23 Hitachi Electronics Eng Co Ltd Direction adjusting method for laser beam in printed board inspecting device
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (en) 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Process of cutting of nonmetal materials
US5776220A (en) 1994-09-19 1998-07-07 Corning Incorporated Method and apparatus for breaking brittle materials
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
JPH1110379A (en) * 1997-06-24 1999-01-19 Hitachi Constr Mach Co Ltd Optical system for laser beam machining
US6489588B1 (en) * 1999-11-24 2002-12-03 Applied Photonics, Inc. Method and apparatus for separating non-metallic materials

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404683B (en) * 2008-05-27 2013-08-11 Corning Inc Scoring of non-flat materials
CN109311726A (en) * 2016-06-03 2019-02-05 康宁股份有限公司 The mechanical device and method for causing stress when management separation flexible glass band on crack tip
CN109311726B (en) * 2016-06-03 2021-10-15 康宁股份有限公司 Apparatus and method for managing mechanically induced stress on crack tips during separation of flexible glass ribbon
TWI821250B (en) * 2018-03-06 2023-11-11 美商康寧公司 Apparatus and method for controlling substrate thickness

Also Published As

Publication number Publication date
JP2011246349A (en) 2011-12-08
JP5525491B2 (en) 2014-06-18
KR100604765B1 (en) 2006-07-26
KR20010014540A (en) 2001-02-26
JP2000281371A (en) 2000-10-10
US6327875B1 (en) 2001-12-11

Similar Documents

Publication Publication Date Title
TW464578B (en) Control of median crack depth in laser scoring
US10377658B2 (en) Apparatuses and methods for laser processing
TWI742076B (en) Laser cutting and removal of contoured shapes from transparent substrates
US6420678B1 (en) Method for separating non-metallic substrates
TW460422B (en) Method and apparatus for cutting through a flat workpiece made of brittle material along a predetermined cutting line
US6259058B1 (en) Apparatus for separating non-metallic substrates
JP3923526B2 (en) Method and apparatus for breaking fragile materials
CN109909622B (en) Laser machining of grooves and holes
US6252197B1 (en) Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
EP3274306B1 (en) Laser cutting and processing of display glass compositions
CN105271689B (en) The method for delineating sheet of brittle material
KR101358672B1 (en) Transparent material cutting method using ultrafast pulse laser and dicing apparatus for thereof
CN106029589B (en) It is cut by laser composite material glassware and cutting method
TWI649148B (en) Method for laser cutting a display glass component and glass article prepared by the method
US6800831B1 (en) Method and device for rapid cutting of a workpiece from a brittle material
US20190062196A1 (en) Apparatuses and methods for laser processing transparent workpieces using an afocal beam adjustment assembly
TWI798401B (en) Method for selective laser processing of transparent workpiece stacks
TW201228960A (en) Methods of separating strengthened glass substrates
WO2008140818A2 (en) Method and apparatus for scoring and separating a brittle material with a single beam of radiation
KR20160093593A (en) Method and apparatus for internally marking a substrate having a rough surface
TW200914190A (en) A device and device and method of making the high delicate non-metalic products
JP2012006795A (en) Cutting method and cutting apparatus
JP2017171530A (en) Cross section edge non-processing mirror surface cutting method
JP6725836B2 (en) Method for manufacturing cut glass plate and cutting device for glass base plate
CN117957086A (en) Phase-modified quasi-non-diffracted laser beam for synchronized high angle laser machining of transparent workpieces

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees