200914190 九、發明說明 【發明所屬之技術領域】 本發明係關於高脆性非金屬材料製之被加工物之加工 方法以及其裝置’特別是關於利用熱應力之非金屬材料製 之被加工物之加工方法以及其裝置，其是利用雷射光聚光 照射於被加工物表面所形成的劃線之加工方法以及其裝 置。 【先前技術】 相關技術之習知裝置，係包括專利文獻1〜專利文獻 4等所提出的技術。 第5圖顯示專利文獻1(日本特開平1-108006號公報） 所提出的技術，圖中之符號1 0 1是以玻璃爲代表之高脆性 非金屬材料製的被加工物，在被加工物1 01之加工預定線 103的端部位置用硬質工具等形成缺口 1〇2(初期龜裂）， 在缺口 1 02的附近用雷射束產生的熱源1 〇4進行照射。用 熱源1 0 4局部持續加熱被加工物1 〇 1時，熱應力會作用於 假想等溫線1 05的切線方向，而從缺口 1 〇2前端朝熱源 104方向發生龜裂106。因此，只要讓熱源104沿加工預 定線103移動，龜裂〗06會追隨熱源104而將脆性材料製 的被加工物1 〇】分割成期望的形狀。 第6圖顯示專利文獻2(日本特開平5-3 2428號公報） 所提出的技術。該方法，首先在高脆性非金屬材料製的被 加工物1 1 1的表面部，如第6(a)圖所示讓具有高吸收率之 200914190 紫外線雷射光L !聚光，使該聚光點沿加工預定線（〖3 )移 動。藉此’在聚光點附近產生燒餓（ablation)，使被加工 物1 1 1的一部分蒸散而如第6(b)圖所示形成淺劃線槽 112。接著’沿著該細長槽112(將被加工物的一部分除去 而形成）如第6(c)圖所示對被加工物11丨照射具有高吸收 率之紅外線雷射光L2，藉由淺劃線槽1〗2所產生之熱應 力如桌6 (d)圖所不沿劃線的深度進行分割。 第7圖顯示專利文獻3(日本特表平8_5〇9947號公報） 所揭不的技術，沿高脆性非金屬材料製的被加工物丨2 1之 加工預定線’在形成從表面延伸至內部的龜裂而進行分割 時’係在加工預定線上’使雷射光等的構成加熱區之加熱 射束1 2 2邊移動邊照射，然後，對於被加熱射束丨2 2照射 的加熱區，藉由位於加熱射束1 2 2後方之冷卻噴嘴所噴射 的冷卻媒體進行冷卻而形成冷卻區123，並以V = k X a(b + 1) / <5 1所規定的速度來進行分割。 藉此’藉由選擇冷卻條件和與分割速度有關之加熱射 束1 22的參數’可在被加工物丨2〗形成必要深度的盲龜裂 1 2 4 (以下稱「肓裂痕」）（劃線）。在此加工法，僅對被加工 物1 2〗的表面附近施予加熱及冷熱即可實施，因此可實現 分割速度之高速化。 在此’ V :射束點和被加工物1 2 1的相對移動速度 k :被加工物1 2 1的材料之熱物理特性及射 束的輸出密度 a :被加工物1 2 1的材料之表面上的加熱射 -6- 200914190 束的橫方向長度 b :被加工物1 2 1的材料之表面上的加熱射 束的縱方向長度 1 :加熱射束點的後端緣至冷卻區1 3 3的前 端緣之距離（以下稱「加熱冷卻間距離」） (5 1 :肓裂痕深度 專利文獻4(日本特表2003-534132號公報）所記載的 加工法，如第8圖所示係依序執行：在被加工物1 3 1生成 微裂痕之第1步騾、用雷射射束照射被加工物1 3 1以進行 加熱之第2步驟、對雷射照射之熱影響區域內從冷卻噴嘴 噴霧冷媒以進行冷卻之第3步驟、以及讓既定力作用於冷 卻區域背後的場所而進行完全分割之第4步驟。在此，在 第4步驟作用之既定力，例如包括：第1〇圖所示之機械 斷裂工具（斷頭台（guillotine)型斷裂機等）、第9圖之符號 1 8 8所代表之可膨脹的溝槽用空氣袋（凹設於載台的溝槽 內所埋設的管狀袋）、通過光閘之雙重斷裂射束或單一 TEM射束（對分割頂定線的周圍施予熱衝擊力）。就其裝置 而言，係在將用來生成肓裂痕之第1步驟至第3步驟一體 實施之一體化裂痕生成裝置的前方，具備用來將被加工物 1 3 1施以預熱之雷射劃線加速裝置。 專利文獻1 :日本特開平1 -1 〇 8 0 0 6號公報 專利文獻2 :日本特開平5 -3 2428號公報 專利文獻3:日本特表平8-509947號公報 專利文獻4:日本特表2003-534132號公報 200914190 【發明內容】 專利文獻1所記載的發明，僅從缺口 1 02的附近照射 雷射束產生的熱源104，由於用來切開被加工物101之分 割線的龜裂前端係朝與加工表面垂直的方向，起因於熱平 衡之些微變動可能就會使分割線偏離加工預定線1 03。 我，由於是在不超過被加工物101的軟化點溫度的範圍來 照射熱源104 ’足以讓龜裂106急速進展的熱應力難以產 生。因此，無法謀求分割速度的高速化，且隨著被加工物 1 〇 1的尺寸變大，分割速度有變小的傾向。此外，並無法 正確地控制龜裂深度，而存在著種種的技術課題。 專利文獻2記載的發明，因燒蝕而蒸散之被加工物 111的微粉末會飛散附著於被加工物111的表面和加工裝 置的內部，可能會造成後製程的阻礙，因此必須使用微粉 末的除去裝置等的附帶設備。在淺劃線槽1 1 2的表面經由 燒蝕而產生熱改質，可能造成截面強度及品質之降低，而 可能會對切斷面的強度和品質產生重大的不良影響。再 者’依淺劃線槽1 1 2的前端形狀的不同，要沿加工預定線 正確地進行切斷可能會有困難，又即使是照射上限功率不 超過被加工物1 0 1的軟化點之紅外線雷射光，其熱應力仍 不足而可能無法達成淺劃線槽1 1 2之深化。 專利文獻3記載的發明，雖能解決專利文獻1、2記 載的發明的問題，但並無法任意改變盲裂痕i 24的深度， 本申請發明人等認知到，例如在同一被加工物1 2 1的加工 -8- 200914190 中’要改變盲裂痕124的深度時，必須變更控制選自移動 速度V、加熱射束122(加熱區）的縱橫方向長度a、b、加 熱冷卻間距離1、射束的輸出密度k當中任一個或複數個 參數。其中，雖然改變移動速度V看起來最簡單，但如 此會使被加工物121表面承受的加熱熱量及冷卻熱量發生 變動。因此，因過熱而造成被加工物121表面熔融、或相 反地因熱量不足而造成無法發生足夠的熱應力等的現象、 或加熱冷卻間距離L會偏離正確値等的現象會發生，而變 成無法形成肓裂痕1 2 4。結果，在同一被加工物1 2 1的加 工中，要任意改變肓裂痕1 24的深度是不可能的。附帶言 之，要對被加工物1 2 1的端部附近進行分割時，肓裂痕 1 2 4可能不是垂直而是彎曲的，此時會發生改變深度的必 要性。 此外，也無法在被加工物的全厚形成盲裂痕。因此， 當然的’在其全厚度，無法任意控制盲裂痕的深度。 專利文獻4記載的發明存在著，無法在被加工物的全 厚度任意控制肓裂痕的深度之課題。其理由在於，一體化 之裂痕生成，雖有可能形成一定深度的肓裂痕（通常爲板 厚的一半以下）’且即使用步驟4的輔助切斷裝置之任一 方法最終皆可達成分割，但在該肓裂痕進展的途中並無法 讓其停止。 又，就第3步驟而言，由於是對雷射照射後之熱影響 區域內從冷卻噴嘴噴霧冷媒進行冷卻以生成冷卻區域，故 在冷卻區域的前後部分僅生成單一的加熱區域，在1個被 -9- 200914190 加工物的加工中，並無法僅將冷卻區域後部的加熱區域 (再加熱區域）之加熱能量在同一面積下進行任意調整。在 前部的加熱區域（加熱區域）之加熱能量維持同一面積且同 一量下，將後部的加熱區域（再加熱區域）之加熱能量維持 同一面積而進行增減調整，當然也無法達成。 此外，所存在的技術課題還包括，在所構成之輔助切 斷裝置內，非接觸方式之雙重斷裂射束或單一 TEM射束 所產生之熱衝擊力，難以獲得穩定的斷裂面品質。 在專利文獻4，係用光閘遮斷雷射光的一部分來調整 功率，因此照射於被加工物之雷射光的照射面積會發生變 動。因此，要將被加工物以不完全斷裂的方式正確地劃線 至既定深度，是有困難的。 本發明係爲了解決上述課題而構成者，其目的係提供 一種彈性且實用的非金屬材料之加工方法及其裝置，是對 玻璃、陶瓷或半導體材料等的高脆性非金屬材料，將複數 個加熱能量和冷熱能量組合照射，以不會在被加工物產生 缺陷的方式藉由該材料中產生的熱應力來讓劃線龜裂朝期 望的方向進展，且能形成既定深度的劃線龜裂。其構成如 下所說明。 請求項1記載的發明，係一種高脆性非金屬材料製之 被加工物之加工方法，在將高脆性非金屬材料製之被加工 物1沿線狀的加工預定線2b進行劃線時， 依序具備：用強度受控制之加熱能量照射既定的加熱 區域3並沿加工預定線2 b進行掃描之第1步驟；對位於 -10- 200914190 前述第1步驟的加熱區域3之相對移動方向穿 的冷卻區域4a照射冷熱能量，並沿加工預定 形成劃線之第2步驟；對位於前述第2步磨 4a之相對移動方向的後方之既定的再加熱區j 度受控制之加熱能量，並沿加工預定線2 b連 成劃線龜裂5 b之第3步驟；而構成高脆性多| 之被加工物之加工方法，其特徵在於： 爲了使由劃線進展成之劃線龜裂 5 b形 度， 設6 :劃線龜裂5b的既定深度、 δ 〇 :在第2步驟結束後之劃線深度、 第3步驟之再加熱區域5a之每單位谊 量、 A :取決於被加工物1的形狀特性及熱转 數、 m : m k 1的實數係數， 以符合劃線龜裂5 b的深度特性式：5 $式’來調整第3步驟的再加熱區域5a之每 加熟能量P。 請求項2記載的發明，係在請求項1記_ 金屬材料製之被加工物之加工方法中，在前述 $行微小龜裂形成步驟，以在被加工物i之 2b &至少劃線開始端部形成微小龜裂2a。 請求項3記載的發明，係在請求項1或2 5後方之既定 線2b掃描以 艮的冷卻區域 或5 a照射強 I行掃描以形 _金屬材料製 成既定的深 積的加熱能 性之比例係 o+A . Pm 的 單位面積的 之高脆性非 第1步驟之 加工預定線 記載之高脆 -11 - 200914190 性非金屬材料製之被加工物之加工方法中，前s 驟，作爲加熱能量係使用c 0 2雷射，藉由照射 而以低於被加工物1軟化點的溫度將加熱區域 熱’加熱區域3的形狀呈長軸朝加工預定線2b 向之橢圓形狀，且前述橢圓形狀在相對移動方向 有較高的能量密度分布。 請求項4記載的發明，係在請求項1、2或 高脆性非金屬材料製之被加工物之加工方法中， 步驟’係放射含有水微粒子的空氣流以將冷熱能 加工物1，該空氣流的水分量，係具有足夠將被 步驟的加熱能量照射而昇溫後之被加工物1的被 卻至室溫之潛熱量，且設定成，在前述第2步驟 存於被加工面之水微粒子全部都會因前述第3步 能量而蒸發。 請求項5記載的發明，係在請求項1、2、3 之高脆性非金屬材料製之被加工物之加工方法中 3步驟，作爲加熱能量係使用再加熱用的C Ο 2雷 照射再加熱用的C 02雷射而以低於被加工物1軟 度進行加熱，再加熱區域5 a的形狀呈長軸朝加 2b的垂直方向之橢圓形狀，且前述橢圓形狀在 方向的前部具有較高的能量密度分布。 請求項6記載的發明，係在請求項3、4或 高脆性非金屬材料製之被加工物之加工方法中， 第1步驟的加熱能量所使用之C02雷射的輸出， S第1步 co2雷射 3施予加 的切線方 的後部具 3記載之 前述第2 量施予被 前述第1 加工面冷 結束後殘 驟之加熱 或4記載 ，前述第 射，藉由 化點的溫 工預定線 相對移動 5記載之 作爲前述 爲了形成 -12- 200914190 適當的劃線，係符合30〜3 00W範圍的條件，且設al 加熱區域3的橢圓的短軸長度、bl爲加熱區域3的橢 的長軸長度、h爲被加工物1的板厚時，係符合 al=(l〜40)xh、 bl=(10〜100)xh 的關係； 且前述co2雷射，是以焦點位置對準被加工物1的 加工面的內部之狀態對加工預定線2 b從相對移動方向 前方傾斜射入。 請求項7記載的發明，係在請求項5或6記載之高 性非金屬材料製之被加工物之加工方法中，前述第3步 之再加熱區域5 a，係形成於和前述第2步驟的冷卻區 4a之相對移動方向的後方距離（0〜10)xl〇_3m的位置， 爲加熱能量所使用之前述再加熱用的C02雷射的輸出係 合調整維持在 100〜1000W範圍的條件，且設a2爲再 熱區域5a的橢圓的短軸長度、b2爲再加熱區域5a的 圓的長軸長度、h爲被加工物1的板厚時’係符合 a2=(4〜25)xh' b2=(10〜60)xh 的關係； 且前述再加熱用co2雷射，是以焦點位置對準被加 面的內部之狀態對加工預定線2b從相對移動方向的後 傾斜射入。 請求項8記載的發明，係在請求項7記載之高脆性 金屬材料製之被加工物之加工方法中，前述第2步驟之 卻區域4a在加工預定線2b的垂直方向之寬度’係比前 第1步驟之C〇2雷射所產生的加熱區域3的橢圓的短軸 度al更大，但比前述第3步驟之再加熱用的C〇2雷射 爲 圓 被 的 脆 驟 域 作 符 加 橢 工 方 非 冷 述 長 所 -13- 200914190 產生的再加熱區域5a的橢圓的長軸長度b2更小。 請求項9記載的發明，係一種高脆性非金屬材料製之 被加工物之加工方法，在將載台6上的高脆性非金屬材料 製之被加工物1沿線狀的加工預定線2b進行劃線時， 依序具備：用強度受控制之加熱能量照射既定的加熱 區域3並沿加工預定線2b進行掃描之第1步驟；對位於 前述第1步驟的加熱區域3之相對移動方向的後方之既定 的冷卻區域4a照射冷熱能量，並沿加工預定線2b掃描以 形成劃線之第2步驟；對位於前述第2步驟的冷卻區域 4a之相對移動方向的後方之既定的再加熱區域5&照射強 度受控制之加熱能量’並沿加工預定線2b進行掃描之第 3步驟；而構成高脆性非金屬材料製之被加工物之加工方 法，其特徵在於： 進行第3步驟之再加熱手段2 〇，係具備雷射振盪裝 置20’藉由照射從雷射振盪裝置20射出的雷射光21來 將被加工物1的再加熱區域5 a施予加熱，以使由劃線進 展成之劃線龜裂5 b形成既定的深度，爲了形成既定深度 的劃線龜裂5 b所進行之雷射光2 1之加熱能量的調整，是 以不改變再加熱區域5a的形狀、面積及加熱能量分布比 例的方式，來對雷射振盪裝置20之雷射光21的輸出進行 增減調節’且將形成有既定深度的劃線龜裂5 b後之被加 工物1以一體的方式用機械人從載台6搬出，然後，沿劃 線龜裂5 b分割被加工物1，以獲得複數個構件。 請求項1 0記載的發明，係一種高脆性非金屬材料製 -14- 200914190 之被加工物之加工裝置，其依序具備：用來在被加工物1 的加工預定線2 b之至少劃線開始端部形成微小龜裂2 a之 微小龜裂形成手段；用來進行第1步驟之加熱手段1 〇， 係將強度受控制之加熱能量照射於既定的加熱區域3以沿 加工預定線2b進行掃描；用來進行第2步驟之冷卻手段 3 〇，係對位於前述第1步驟的加熱區域3之相對移動方向 的後方之既定的冷卻區域4 a照射冷熱能量，並沿加工預 定線2b掃描以形成劃線；用來進行第3步驟之再加熱手 段2 0，係對位於前述第2步驟的冷卻區域4a之相對移動 方向的後方之既定的再加熱區域5 a照射強度受控制之加 熱能量，並沿加工預定線2b進行掃描以形成劃線龜裂 5b ； 藉此將高脆性非金屬材料製之被加工物1沿線狀的加 工預定線2b進行劃線之高脆性非金屬材料製之被加工物 之加工裝置；其特徵在於： 爲了使由劃線進展成的劃線龜裂5 b形成既定深度， 設5 :劃線龜裂5 b的深度、 5 〇 :在第2步驟結束後之劃線深度、 P :第3步驟之再加熱區域5 a之每單位面積的加熱能 量、 A :取決於被加工物1的形狀特性及熱特性之比例係 數、 m: m^l的實數係數， 以符合劃線龜裂5 b的深度特性式：5。+ A · Pm的 -15- 200914190 方式，來調整第3步驟的再加熱區域5a之每單位面積的 加熱能量P。 依據獨立請求項1、1 〇記載之發明，係讓被加工物相 對移動，並將一連串的步驟，亦即第1步驟至第3步驟依 序一體作用於被加工物，且將第3步驟之加熱能量依據劃 線龜裂的深度特性式來進行增減調整，如此將藉由第1步 驟及第2步驟而沿加工預定線形成之龜裂狀的劃線，藉由 第3步驟在控制成期望的任意深度下，讓具有更深的劃線 面之劃線龜裂以較高速度進展。特別是，將賦予第1步驟 的加熱區域的加熱能量維持於同一面積且同一量下，將維 持於同一面積之後部的再加熱區域之加熱能量進行增減調 整，藉此能使龜裂狀的劃線進展成任意深度的劃線龜裂。 由劃線進展成的劃線龜裂，藉由將第3步驟的加熱能量依 據劃線龜裂的深度特性式進行增減調整，即可高精度地形 成期望的深度。 此外，不是讓被加工物蒸散來進行劃線，而是利用熱 應力來穩定地進行切開，可防止材料蝕損所造成的分割環 境之惡化（微粉末之飛散等）、分割面強度和截面品質的變 差。再者，在將被加工物的端面施以加工的情形，在習知 技術’實際的加工線容易脫離加工預定線而發生彎曲；但 依據本發明，由於能任意地控制劃線深度，故可將沿著加 工預定線之加工線的軌道在加工中進行修正。 依據請求項2記載的發明’能以形成於加工預定線的 至少劃線開始端部之微小龜裂作爲起點，而具有劃線容易 -16- 200914190 進展的效果。 依據請求項3記載的發明，在第丨步驟，作爲加熱能 量係使用C〇2雷射，加熱區域的形狀呈長軸朝加工預定線 的切線方向之橢圓形狀，且橢圓形狀在相對移動方向的後 部具有較高的能量密度分布。藉此，能簡單且正確地形成 具有既定溫度及既定壓縮應力之橢圓形狀的加熱區域，以 讓第2步驟之冷卻區域所形成之劃線確實且穩定地生成。 亦即’藉由照射縱長的加熱雷射束，在加工預定線的附近 產生壓縮應力，又馬上照射冷熱能量，以將加熱區域急劇 冷卻，因此會產生大的拉伸應力，而讓劃線沿著加工預定 線穩定地進展。只要在加工預定線之至少劃線開始端部形 成微小龜裂，會在該微小龜裂發生大的拉伸應力，而讓該 龜裂沿著加工預定線穩定地進展。 依據請求項4記載的發明，在第2步驟，係放射含有 水微粒子的空氣流以將冷熱能量施予被加工物1，因此能 簡單地形成具有既定溫度及既定拉伸應力之冷卻區域。而 且，空氣流的水分量，係具有足夠將在第1步驟昇溫後之 被加工物1的被加工面冷卻至室溫之潛熱量，且設定成， 在第2步驟結束後殘存於被加工面之水微粒子全部都會因 第3步驟之加熱能量而蒸發，因此，具有既定拉伸應力之 冷卻區域的形成、防止被加工面殘存的水分所造成之品質 降低，兩者可同時達成。 依據請求項5記載的發明，在第3步驟，作爲加熱能 量係使用再加熱用的C 02雷射，再加熱區域5 a的形狀呈 -17- 200914190 長軸朝加工預定線2b的垂直方向之橢圓形狀，且橢圓形 狀在相對移動方向的前部具有較高的能量密度分布。藉 此，能簡單且正確地形成具有既定溫度及既定壓縮應力之 橢圓形狀的加熱區域，以簡單且正確地控制第2步驟之冷 卻區域所形成之劃線進展深度。亦即，對開始沿加工預定 線進展之劃線照射橫長的加熱雷射束時，劃線前端附近會 成爲集中壓縮應力場，而容易發生讓劃線前端朝深度方向 進展之彎曲力矩。由於利用彎曲力矩的大小可控制該劃線 深度，藉由調整該橫長的加熱雷射束之功率（第3步驟之 再加熱區域之每單位面積的加熱能量）即可獲得具有期望 深度的劃線面之劃線龜裂。 依據請求項6記載的發明，是以焦點位置對準被加工 物1的被加工面的內部之狀態將第1步驟的加熱區域設定 成既定大小，且作爲加熱能量所使用之C 0 2雷射的輸出維 持在30〜300W範圍，藉此能在第2步驟形成具有既定拉 伸應力之冷卻區域而適當地形成劃線。又只要C02雷射是 對加工預定線2b從相對移動方向的前方傾斜射入，就不 會對第2步驟的冷熱能量之賦予造成阻礙。 依據請求項7記載的發明，是以再加熱用的C02雷射 的焦點位置對準被加工物的被加工面的內部之狀態將第3 步驟的再加熱區域設定成既定大小，且作爲再度的加熱能 量所使用之C〇2雷射的輸出維持在100〜1000W範圍，藉 此能讓第2步驟形成之劃線適當地進展成期望的深度。又 只要C02雷射是對加工預定線2b從相對移動方向的後方 -18- 200914190 傾斜射入，就不會對第2步驟的冷熱能量之賦予造成阻 礙。 依據請求項8記載的發明，第2步驟之冷卻區域在加 工預定線2b的垂直方向之寬度，係比第1步驟之C02雷 射所產生的加熱區域的橢圚的短軸長度更大，且比第3步 驟之再加熱用的C02雷射所產生的再加熱區域的橢圓的長 軸長度更小，因此，能以加熱區域全體用冷卻區域來冷卻 且冷卻區域全體用再加熱區域來加熱的方式，形成適當大 小的冷卻區域而使進行良好的劃線。 依據請求項9記載之發明，除能獲得和請求項1、1 0 記載的發明相同的效果以外，尙能發揮以下的效果。在調 整從（第2)雷射振盪裝置射出之雷射光（再加熱射束）的功 率時，基本上射束形狀（profile)不改變而僅使整體的功率 改變。亦即’第3步驟之再加熱區域的形狀、面積不會改 變。因此’再加熱區域和冷卻區域之相對位置不改變，作 用在龜裂狀的劃線之拉伸應力、亦即讓龜裂開口之力量， 僅依功率來改變。因此，讓龜裂開口的力量，可按照雷射 光（再加熱射束）的功率來連續地控制，而容易讓劃線龜裂 形成期望的既定深度。 又’只要讓劃線龜裂的深度依被加工物1的場所而形 成適當的不同深度，可將形成既定深度（混合存在有較深 部位和較淺部位）之劃線龜裂的被加工物用機械人從載台 以一體的方式搬出’在接下來的步驟沿劃線龜裂將被加工 物分割即可獲得複數片的構件。結果，被加工物之處理容 -19- 200914190 易性及後步驟之分割容易性兩者可同時兼備。 【實施方式】 以下，對本發明之一實施形態參照第1圖〜第 作說明。 圖中之符號1代表，生成缺口、亦即劃線的加 之脆性材料製基板狀的被加工物，是以玻璃爲代表 屬材料所製造。通常，被加工物1 (脆性非金屬材 被加工物）爲透明體。被加工物1，是以可更換的 載於載台6上，爲了沿設定成直線狀之加工預定線 行分割，在加工預定線2b上隔著間隔依序設有： 步驟形成的加熱區域3、在第2步驟形成的冷卻區 在第3步驟形成的再加熱區域5 a之各中心；可視 進行微小龜裂形成步驟，以在被加工物1之被加工 少劃線開始端部施予微小龜裂2 a。加熱區域5和 區域5 a是隔著間隔來形成，又加熱區域3及再加 5 a ’係用低於被加工物丨軟化點的溫度來加熱。 在載台6，如第2圖所示，係一體裝設有：用 微小龜裂2a之龜裂生成手段40、構成用來生成加 3之加熱手段的要部之第1雷射振盪裝置1 〇、用來 卻區域之冷卻手段3 0、構成用來再度生成加熱區 加熱手段的要部之第2雷射振盪裝置20。亦即， 生成手段40、第1雷射振盪裝置1〇、冷卻手段3〇 雷射振盪裝置20設定於加工系統用載台（未圖示） 4圖來 工對象 之非金 料製之 方式裝 2b進 在第1 域4、 需要來 面的至 再加熱 熱區域 來生成 熱區域 生成冷 域之再 將龜裂 及第2 ’該加 -20- 200914190 工系統用載台或基板載置用載台6之至少一方係具備驅動 裝置（未圖示），藉此使被加工物1及載台6相對於加工系 統（亦即加熱區域3、冷卻區域4a及再加熱區域5a)沿加 工預定線2b在箭頭A1方向連續相對移動。 爲了使該加工系統（加熱區域3、冷卻區域4a及再加 熱區域5a)沿加工預定線2b在箭頭A方向以一體的方式 進行相對移動，不僅是將第1雷射振盪裝置1 0、冷卻手 段3 0及第2雷射振盪裝置2 0設置於加工系統用載台（未 圖示），射束擴展器12、22、紅外線用反射鏡13、23、柱 面鏡14、24、冷卻手段30也設置於加工系統用載台，並 保持成一體。第1、第2雷射振盪裝置1 〇、20，係個別獨 立的雷射振盪裝置，個別可對雷射光的功率（加熱能量密 度（每單位面積的加熱能量））進行增減調節。 龜裂生成手段40，如第2圖所示並不具備驅動機 構，而設有利用和被加工物1的接觸來進行旋轉之旋轉 刀。該龜裂生成手段40，在加工系統開始對被加工物1 進行加工前，沿加工預定線2 b的延長線上從被加工物1 的外側在箭頭A 1方向進行相對移動、亦即掃描，以在被 加工物1之加工預定線2b之至少劃線開始端部形成微小 龜裂2a，在劃線開始端部形成劃線的起頭之複期龜裂 後，從加工預定線2b迅速退離。如此般，使用龜裂生成 手段4 0按照需要來進行的微小龜裂形成步驟，係在形成 加熱區域3之第1步驟之前，在被加工物1的被加工面之 劃線開始端部（在第2圖爲被加工物1的左端），按照需要 -21 - 200914190 來生成微小龜裂。 第1雷射振盪裝置10，如第2圖所示，係射出第1 雷射光之紅外線雷射光1 1。從第1雷射振盪裝置1 0射出 的紅外線雷射光1 1 ’通過紅外線雷射用擴展器丨2而調整 長軸射束徑後，經由紅外線用反射鏡1 3進行反射而透過 柱面鏡1 4後’照射至被加工物1，而生成橢圓形之用來 將被加工物1予以局部加熱之加熱區域3。這時是調整 成，紅外線雷射光1 1的焦點位於被加工物1的內部，且 雷射光1 1的射束從射束之相對移動方向（箭頭A1方向）的 前方傾斜照射。亦即，照射至被加工物1的部分之紅外線 雷射光U ’從俯視觀察，係位於加工預定線2b上。 形成於被加工物1之加熱區域3，係被紅外線雷射光 1 1加熱而具有壓縮應力的區域’藉由柱面鏡1 4將紅外線 雷射光1 1之射束形狀聚光成橢圓形，以長軸對準加工預 定線2 b方向的方式進行照射。加熱區域3的短軸寬度， 是用柱面鏡1 4來控制，長軸寬度的調整是使用射束擴展 器1 2。 用來生成加熱區域3之紅外線雷射光n，例如是使 用波長1〇.6μιη的C〇2雷射。在藉由照射c〇2雷射來以比 被加工物1軟化點低的溫度進行加熱時，較佳爲，c〇2雷 射照射區域的形狀呈長軸朝加工預定線2b的切線方向之 橢圓形’且在橢圓形的後部，其能量密度分布比前部爲 高。第1步驟，是以後既定區域照射強度受控制之加熱能 量的方式’沿加工預定線2 b進行紅外線雷射光丨丨之掃 -22- 200914190 描。 第1步驟之加熱能量所使用之co2雷射的輸出， 適當地形成龜裂狀的劃線，藉由進行至第3步驟而形 有期望深度的斷裂面之劃線龜裂5 b，是以維持3 0〜 範圍的條件來設定第1雷射振盪裝置1 0。設a 1爲力[ 域3的橢圓的短軸長度、bl爲加熱區域3的橢圓的 長度、h爲被加工物1的板厚時，係符合 al=(l 〜40)xh、bl=(l〇 〜l〇〇)xh 的關係。 冷卻手段3 0，係將從水補給槽3 2通過配管3 1 的水、和從空氣壓縮器3 4通過配管3 3供應的壓縮空 混合成霧狀的冷卻媒體3 5，將該霧狀的冷卻媒體3 5 嘴吹到被加工物1的加熱區域3之正後方，藉此生成 冷卻加工預定線2b上的被加工物1且具有拉伸應力 卻區域4a。冷卻區域4a較佳爲，生成於相對移動方丨 的加熱區域3的後方，更佳爲，以加熱區域3之短軸 的程度在相對移動方向 A1延伸。水、壓縮空氣，都 由調整閥（未圖示）來進行流量之增減調整。在液晶面 的元件進行切斷時，由於水滴的附著會造成問題，水 量宜爲較少，因此噴嘴前端越細越好。藉由相對移動 卻區域4a而在被加工物1的加工預定線2b上發生之 應力，會使微小龜裂2a進展至龜裂前端4b的位置。 裂成爲劃線。依被加工物1材料之不同，即使是省略 龜裂2 a的情形，藉由依序形成加熱區域3及冷卻 4a，可能也會讓和微小龜裂2a相同的龜裂從被加工 爲了 •成具 3 00 W i熱區 長軸 供應 氣， 從噴 用來 之冷 句A1 長度 是藉 板等 供應 的冷 拉伸 該龜 微小 區域 物1 -23- 200914190 的端部進展。 作爲冷熱能量，在放射出含有微粒子（由水噴霧而成） 之空氣流時，較佳爲設定成適當的水分量。亦即所賦予的 水分量較佳爲，具有足夠將被第1步驟的加熱能量照射而 昇溫後之被加工物1的被加工面冷卻至室溫之潛熱量，且 設定成’在第2步驟結束後殘存於被加工面（至少殘存於 加工預定線2 b或其附近）之水微粒子全部都會因第3步驟 之加熱能量而蒸發的程度。 第2步驟，係在第1步驟的加熱能量的照射區域之後 方，照射供應冷熱能量來沿加工預定線2 b進行掃描。 利用熱應力之對非金屬材料照射紅外線雷射來進行的 劃線’會在被加工物1的表面部形成壓縮應力場，接著藉 由冷卻媒體來形成冷卻區域而引發拉伸應力，該應力在超 過材料的抗張強度時產生。 弟2雷射振盪裝置2 0之紅外線雷射光，例如是使用 波長10.6μηι的再加熱用C02雷射。從第2雷射振盪裝置 20射出之第2雷射光之雷射光21’通過紅外線雷射用擴 展器2 2而調整長軸射束徑後，經由紅外線用反射鏡2 3進 行反射而透過柱面鏡24後’照射至被加工物1，而生成 橢圓形之用來將被加工物1予以局部加熱之再加熱區域 5 a。這時是調整成’紅外線雷射光21的焦點位於被加工 物1的內部，且雷射光1 1的射束從射束之相對移動方向 (箭頭A 1方向）的後方傾斜照射。亦即，照射至被加工物 1的部分之紅外線雷射光1 1，從俯視觀察，係位於加工預 -24- 200914190 定線2b上。又較佳爲，在再加熱區域5 a的前端和冷卻區 域4a的後端之間，調整成隔著既定的間隔距離。該既定 的間隔距離具體而言爲0〜1 〇mm的距離。 如此般，再加熱區域5 a，係藉由紅外線雷射光2 1用 比被加工物1 1的軟化點低的溫度進行加熱而將劃線前端 (龜裂前端4b)切開的區域，藉由柱面鏡24將紅外線雷射 光21之射束形狀聚光成橢圓形，以長軸對準加工預定線 2b的垂直方向的方式進行照射。再加熱區域5a的短軸寬 度，是用柱面鏡24來控制，長軸寬度的調整是使用射束 擴展器22。生成該再加熱區域5a之第3步驟，係將強度 受控制之加熱能量照射至既定的再加熱區域5 a而沿加工 預定線2b進行掃描。 在第3步驟，作爲加熱能量是使用再加熱用的C〇2雷 射’且在藉由照射再加熱用的C02雷射而以低於被加工物 1軟化點的溫度進行加熱時，係照射於隔著既定距離以避 免抵減劃線形成作用（賦予冷卻區域4a之冷熱能量所產生） 的位置，且照射區域的形狀呈長軸朝加工預定線2b的垂 直方向之橢圓形狀，且該橢圓形狀之行進方向前部，其能 量密度分布比後部爲高。第3步驟的加熱能量，藉由增減 調整其全體量（輸出），能使第1步驟及第2步驟所形成之 劃線進展成期望深度而形成劃線龜裂5b。 第3步驟之再加熱區域5 a，係形成於和第2步驟的 冷卻區域4a之相對移動方向的後方距離（0〜；ι〇)χ1〇- 3m 的位置，作爲加熱能量所使用之再加熱用C02雷射（紅外 -25- 200914190 線雷射光2 1)的射束輸出係符合1 0 0〜1 0 0 0 W範圍的條 件。又設a2爲再加熱區域5a的橢圓的短軸長度、b2爲 再加熱區域5 a的橢圓的長軸長度、h爲被加工物1的板 厚時，係符合a2 = (4〜25)xh、b2 = (10〜60)xh的關係。 關於冷卻區域4 a和再加熱區域5 a之位置關係，實際 上是根據實驗來求出··以再加熱能量最少的能量來形成既 定深度的劃線龜裂5b之位置關係。依被加工物1之板 厚、被加工物1是由單板或貼合玻璃所構成，在隨後的步 驟能達成完全切斷之劃線龜裂5 b深度、冷卻區域4 a和加 熱區域5a之位置關係會有不同，故不得不根據實驗求 出。 第2步驟之冷卻區域4a呈大致圓形，冷卻區域4a之 加工預定線2b之垂直方向寬度及切線方向寬度，都比第 1步驟之C〇2雷射所形成之加熱區域3的橢圓之短軸長度 al大，且都比第3步驟之再加熱用C02雷射所形成之再 加熱區域5 a的橢圓的長軸長度b2小。又呈橢圓形之再加 熱區域5a之長軸長度b2，係比加熱區域3之短軸長度 大，再加熱區域5a之短軸長度則比加熱區域3之長軸長 度小。 又，在照射紅外線雷射光1 1時·，若以超過被加工物 1的軟化點之溫度進行加熱，冷卻後會殘留熱應力而無法 控制材料的劃線龜裂5b之形成，因此必須注意不可過度 加熱。又在加熱區域3的後方生成之冷卻區域4 a、以及 在冷卻區域4a的後方生成之再加熱區域5a，係將第1步 -26- 200914190 驟所形成之加熱區域3、第2步驟所形成之冷卻區域4a 以及第3步驟所形成之再加熱區域5 a的各中心，朝相對 移動方向A1的相反方向隔著間隔依序設定在加工預定線 2b上。 接著說明其作用。 首先將被加工物1載置於載台6上，按照需要進行微 小龜裂形成步驟。亦即，在被加工物1之被加工面的加工 預定線2b之劃線開始端部形成微小龜裂，以讓劃線圓滑 地開始並圓滑地繼續。此外，從第1雷射振盪裝置10射 出紅外線雷射光1 1，從第2雷射振盪裝置2 0射出雷射光 2 1，從冷卻手段3 0吹出冷卻媒體3 5。 在此狀態，使位於右端位置之載台6朝箭頭A1的相 反方向相對移動，以使加工系統（加熱區域3、冷卻區域 4a及再加熱區域5a)以一體的方式沿加工預定線2b朝移 動方向（箭頭A 1方向）進行相對移動。藉此，紅外線雷射 光1 1開始從被加工物1之加工預定線2b的左端進行局部 照射，被紅外線雷射光U照射之被加工物1的部位，會 上昇至比被加工物1軟化點低的既定溫度而生成加熱區域 3。在形成有微小龜裂2a的情形，是從包含微小龜裂2a 的部分開始進行紅外線雷射光1 1之局部照射。在加熱區 域3，在加熱中心發生較強的壓縮應力，在其外周隔著緩 衝帶而發生較弱的拉伸應力。加熱區域3之大小，可藉由 透過支承台（具備微調整機構，未圖示）設置於加工系統用 載台之柱面鏡1 4來任意改變。 -27- 200914190 接著，藉由載台6之相對移動，在加熱區域3、亦即 雷射光1 1的照射區域之正後方，從被加工物1之加工預 定線2b之左端（微小龜裂2a)開始噴出冷卻媒體35(將水和 空氣在冷卻手段30內混合成霧狀），以生成冷卻區域4a。 藉此，會發生較強的拉伸應力，而產生局部的強應力集 中，因此會超過被加工物1之抗張強度，而使發生於端部 之龜裂開始朝龜裂HU端4b進展。所進展之龜裂成爲劃 線。龜裂狀的劃線，係形成於被加工物1的表面附近，並 不會將被加工物1切斷。在形成有微小龜裂2 a的情形， 在微小龜裂2a之銳利的前端部位會發生強拉伸應力，而 在微小龜裂2a的前端內部會產生強的應力集中，因此很 容易就超過被加工物1之抗張強度，而使微小龜裂2a開 始朝龜裂則端穩定地進展’藉此生成劃線。 接著，藉由載台6之相對移動，和冷卻區域4a、亦 即冷卻媒體3 5的噴霧區域隔著適當距離，紅外線雷射光 2 1開始從被加工物1之加工預定線2b的左端（微小龜裂 2 a)進行局部照射，以上昇至比被加工物1軟化點低的既 定溫度而生成再加熱區域5a。在再加熱區域5a，一旦冷 卻後的被加工物1會被再度加熱，且成爲長軸朝加工預定 線2 b的垂直方向之壓縮應力場，因此龜裂前端4 b及其附 近之被加工物1的內部會發生大的彎曲應力，龜裂前端 開始朝被加工物1的內部方向（深度方向）進展。亦即， 劃線會進展至龜裂前端4b位置而到達再加熱區域5 a，如 此劃線也會朝深度方向進展’而獲得既定劃線深度的劃線 -28- 200914190 龜裂5b。 藉由在第1步驟用紅外線雷射光1 i照射縱長的加熱 射束（沿加工預定線2 b的切線方向形成細長之橢圓形射 束），在加工預定線2b的附近發生壓縮應力，又在緊接著 的第2步驟照射冷熱能量’使加熱區域到達冷卻區域4 a 時被急劇冷卻’因此在加工預定線2b的開始端部（視需要 而形成之微小龜裂）會發生大的拉伸應力，該龜裂開始穩 定地沿著加工預定線2b進展，而形成劃線。對於開始進 展的龜裂、亦即劃線，在第3步驟照射橫長的加熱射束 (沿加工預定線2 b的正交方向形成細長之橢圓形雷射光 2 1)時’劃線的前端周邊、亦即龜裂前端周邊之廣面積會 成爲壓縮應力場，而發生足夠讓龜裂朝深度方向進展之彎 曲力矩。利用彎曲力矩的大小可控制該龜裂深度，調整該 橫長的加熱射束之功率即可獲得期望深度的連續龜裂之劃 線龜裂5b。該加熱射束的功率調整，可在維持於相同照 射面積下由第3步驟單獨來進行，又在對1個被加工物j 的加工預定線2b進行加工的途中也能單獨進行。劃線龜 裂5 b之深度的改變，在加工預定線交叉的情形是有必要 的’又在被加工物1的端部附近進行劃線時，由於劃線可 能無法垂直而變得彎曲，這時必須改變深度來抑制彎曲。 接著說明，不將被加工物1完全分割，使劃線龜裂 5b的深度停止於期望的既定深度之好處。 將玻璃板或面板所構成之被加工物1，最後分割成既 定形狀的複數個面板（構件）時，相較於照射雷射光1 1、2 1 -29- 200914190 而將其完全分割成各構件的情形’使劃線所進展成之劃線 龜裂5b的深度在中途停止而保留一部分，而在隨後的步 驟分割成各構件的情形，可能處理會更容易。然而，在劃 線龜裂5 b過深的情形，在機械人將被加工物1移送至下 個步驟的途中等的處理時，劃線龜裂會進展而可能發生被 加工物1之不小心分割；相反地在劃線龜裂5 b過淺的情 形，在隨後的步驟難以分割，一體化的狀態反而會造成麻 煩。這時，若能在分割步驟之前使被加工物1維持一體 化，且能按照1個被加工物1之部位來改變劃線深度，即 可進行最佳處理及高效率的處理。 亦即，將形成有劃線龜裂5b(以既定深度做改變）之被 加工物1 (以一體的方式）用機械人從載台6搬出後，沿劃 線龜裂5 b將被加工物1分割，即可獲得複數片的基板（構 件）。例如，在移送中劃線龜裂5 b深度會進展而容易斷裂 的部位，係形成較淺的劃線龜裂5b ;在不容易斷裂的部 位’則形成較深的劃線龜裂5 b。藉此，處理容易性及隨 後步驟的分割容易性，兩者可同時兼備。 第 4圖係顯不，對於3種板厚（0.7mm、0.5mm、 0.3 mm)之玻璃基板構成的被加工物1，用來生成再加熱區 域5 a之紅外線雷射光2 1的功率（雷射光2 1的能量密度） 和劃線深度（劃線龜裂5b的深度）的關係的實驗結果例。 具體而言，係照射約0.02〜0.22(W/mm2)範圍的能量密度 之雷射光21。可將第2雷射振盪裝置20的功率由50W起 以200〜250W的範圍進行調節來據以實現。 -30- 200914190 如此可知，不論玻璃基板的板厚如何’隨著紅外線雷 射光 21之能量密度由約 〇,〇2W/mm2增力Q至約0.09〜 0.22W/mm2，劃線深度（劃線龜裂5b的深度）會連續變大， 在玻璃基板到達完全分割爲止的期間’能使劃線深度（劃 線龜裂5 b的深度）任意改變。亦即代表著’藉由增減調整 第3步驟的紅外線雷射光21之功率（能量密度），即可任 意控制再加熱區域5 a的壓縮應力’亦即作用於龜裂前端 4b(劃線的內端部）之彎曲應力。然而’用來生成再加熱區 域5 a之加熱能量所使用之再加熱用C 02雷射的射束輸 出，只要如上述般將第2雷射振盪裝置20的功率調整維 持於100〜1000W的範圍即可。 依實驗可導出’第3步驟的紅外線雷射光2 1所產生 之加熱能量密度P(再加熱區域5a之每單位面積之加熱能 量）和劃線龜裂5b的深度6，符合以下的關係式：5 = δ 0 + A . Pm(劃線龜裂5b之深度特性式） 在此，（5 :劃線龜裂5b的既定深度（期望的既定深 度）、 5 〇 :在第2步驟結束後之劃線深度' P:第3步驟之加熱能量密度（再加熱區域（5a)之每單 位面積（mm2)的加熱能量）、 A :取決於被加工物（1)的形狀特性及熱特性之比例係 數、 m: m^l的實數係數。 此劃線龜裂5b的深度特性式之參數，亦即，第2步 -31 - 200914190 驟結束後之劃線深度（5 ο、取決於被加工物（1)的形狀特性 及熱特性之比例係數A以及實數係數m，可依以下的實驗 順序來決定。被加工物1的形狀特性，除被加工物1的厚 度以外，還包含面板的構造不同。面板構件之貼合玻璃構 成的被加工物1，由於具有讓玻璃彼此接合之密封材’依 該密封材的圖案，劃線龜裂5b的深度會有不同。被加工 物1之熱特性，除比熱外，還包含熱傳導率、熱膨脹率等 等。再加熱區域5a之大小及形狀，在1片被加工物1之 處理中完全相同而不做改變。 實際上，對於加工對象之被加工物1，係實施順序1 〜3 0 事先決定出應形成的劃線龜裂5b的深度（5。劃線龜 裂5b的深度，是根據：是否進行完全分割、下個步驟之 分割步驟的分割手段、防止在機械人進行移動中發生斷裂 等的觀點，並考慮全厚來決定。對於既定厚度（全厚）的被 加工物1，在以既定的相對移動速度來形成既定深度的劃 線龜裂5b時，是用順序1)來求取劃線的深度<5 〇。劃線的 深度（5 G，可根據應形成的劃線龜裂5b的深度5而大致決 定出。 順序1)在期望的既定相對移動速度下，依實驗來決 定第1及第2步驟的加工條件，求出第2步驟結束後之劃 線深度（5 0。在此，第1步驟的加工條件，是依加熱能量 及加熱區域3的大小來決定。第2步驟的加工條件，是冷 熱能量及加熱區域3和冷卻區域4a的位置關係等等。 -32- 200914190 順序2)在該相對移動速度下之順序1)求出的加工條 件下，以實驗來改變第3步驟之再加熱區域5a之每單位 面積的加熱能量P(紅外線雷射光功率），對於換算成加熱 能量密度之適當代表値（P!、P2…），求出劃線龜裂5b的深 度（5 1、5 2…）。再加熱區域5 a之每單位面積之加熱能量 p ’係在加工預定線2b之既定位置的掃描線上的能量。 順序3)將順序1)及順序2)求出之ό 〇(第2步驟結束 後之劃線深度）以及（Ρ,，δ !)、（P2, 5 2)…代入劃線龜裂5b 的深度特性式5，用最小平方法來求出比例係數A及實 數係數m。 對於實驗所得之第4圖的3種板厚，分別求出劃線的 深度（5 〇、比例係數A及實數係數m，並整理於表1。從 表1可知，3種板厚的劃線龜裂5 b的深度<5之符合率R 都在0.98以上，因此大致是符合<5 = 6 o + A _ Pm的關係 式。如此可知，由該等特性式分別在既定的相對移動速度 (1 8 Omm/sec ' 310mm/sec、370mm/sec)下獲得第 2 步驟結 束後之既定的劃線深度（5 〇時，藉由將第3步驟的紅外線 雷射光（C02雷射）之加熱能量P(W/mm2)調整成適當値，可 獲得期望的劃線龜裂5b的深度6。亦即，在1片被加工 物1的處理中改變加熱能量P，可調整劃線龜裂5 b的深 度δ 。 -33- 200914190 !特性式 0.9717 0.9773 0.9983 特性式 5=160+7.962χ104 · Ρ33611 0=150+3.472x104 · P2'4214 5=120+3.588χ104 · P21825 Α値 7.962χ104 3.472χ104 '3.588xl04 1 ! 〔表1〕劃線龜裂深度的參數和 S 3.3611 2.4214 1 2.1825 iM 160μηι 150μιη 120μηι 1 加工對象的條件 將0.7mm板厚玻璃以 180mm/sec進行分割 將0.5mm板厚玻璃以 31 Omm/sec進行分割 將0.3mm板厚玻璃以 370mm/sec進行分割 rUIm/TW〕PH,〔曰=!〕?:扫酹(掛如挺)鑛環 si^^^aSI^s鑛·· Ή (5顧 -34- 200914190200914190 IX. OBJECT OF THE INVENTION [Technical Field] The present invention relates to a method for processing a workpiece made of a high-brittle non-metallic material and a device thereof, particularly for processing a workpiece made of a non-metallic material using thermal stress. The method and the device thereof are a method for processing a scribe line formed by irradiating a surface of a workpiece with laser light, and a device thereof. [Prior Art] A conventional device of the related art includes the techniques proposed in Patent Documents 1 to 4 and the like. Fig. 5 is a view showing a technique proposed in Patent Document 1 (Japanese Laid-Open Patent Publication No. Hei No. Hei 1-108006). The symbol 1 0 1 in the figure is a workpiece made of a highly brittle non-metallic material typified by glass. The end position of the processing line 103 of 1-10 is formed by a hard tool or the like to form a notch 1〇2 (initial crack), and is irradiated with a heat source 1 〇4 generated by a laser beam in the vicinity of the notch 102. When the workpiece 1 〇 1 is continuously heated by the heat source 104, the thermal stress acts on the tangential direction of the imaginary isotherm 105, and the crack 106 occurs from the front end of the notch 1 〇2 toward the heat source 104. Therefore, as long as the heat source 104 is moved along the processing predetermined line 103, the crack 06 follows the heat source 104 to divide the workpiece 1 made of a brittle material into a desired shape. Fig. 6 shows a technique proposed in Patent Document 2 (Japanese Laid-Open Patent Publication No. Hei 5-3 2428). In this method, first, in the surface portion of the workpiece 1 1 1 made of a highly brittle non-metallic material, as shown in Fig. 6(a), the 200914190 ultraviolet laser light L! having a high absorption rate is collected to condense the light. The point moves along the planned line (〖3). Thereby, ablation is generated in the vicinity of the condensing point, and a part of the workpiece 1 1 1 is evaporated to form a shallow scribe groove 112 as shown in Fig. 6(b). Then, along the elongated groove 112 (formed by removing a part of the workpiece), the workpiece 11 is irradiated with infrared laser light L2 having a high absorption rate as shown in Fig. 6(c), by a light The thermal stress generated by the groove 1 is divided as shown in Table 6 (d) without the depth of the scribe line. Fig. 7 is a view showing a technique disclosed in Patent Document 3 (Japanese Laid-Open Patent Publication No. Hei No. Hei 8-5-9947), in which a predetermined line of processing of a workpiece 丨2 1 made of a high-brittle non-metallic material extends from the surface to the inside. When the crack is split and is divided, it is irradiated to the heating beam constituting the heating zone, such as laser light, while moving, and then the heating zone irradiated by the heated beam 丨2 2 is borrowed. The cooling medium 123 is cooled by a cooling medium ejected by a cooling nozzle located behind the heating beam 12 2, and is V = k X a(b + 1) / <5 1 is divided by the speed specified. By selecting the cooling condition and the parameter of the heating beam 1 22 related to the dividing speed, a blind crack 1 2 4 (hereinafter referred to as "cracking") can be formed in the workpiece 丨2. line). In this processing method, heating and cold heat can be applied only to the vicinity of the surface of the workpiece 1 2, so that the speed of the dividing speed can be increased. Here, 'V: relative movement speed k of the beam spot and the workpiece 1 2 1 : thermophysical properties of the material of the workpiece 1 2 1 and output density of the beam a : material of the workpiece 1 2 1 Heating on the surface -6- 200914190 Length of the bundle in the transverse direction b: Length of the longitudinal direction of the heated beam on the surface of the material of the workpiece 1 2 1 : Heating the trailing edge of the beam spot to the cooling zone 13 The distance between the front end edge of the third edge (hereinafter referred to as "the distance between the heating and the cooling") (5 1 : the cracking depth is described in the patent document 4 (Japanese Patent Laid-Open Publication No. 2003-534132). Execution: the first step of generating a microcrack in the workpiece 1 31, the second step of irradiating the workpiece with the laser beam 1 3 1 for heating, and the cooling in the heat affected zone of the laser irradiation The third step of completely cooling the nozzle spray refrigerant to perform cooling, and the fourth step of completely dividing the predetermined force to the position behind the cooling region. Here, the predetermined force acting in the fourth step includes, for example, the first map. The mechanical breaking tool shown (guillotine type fracture machine, etc.), 9 symbol of the symbol 1 8 8 represents an inflatable air bag (a tubular bag recessed in the groove of the stage), a double-breaking beam passing through the shutter or a single TEM beam (right The device is provided with a thermal impact force in the vicinity of the dividing line. The device is provided in front of the integrated crack generating device which is integrally implemented in the first step to the third step for generating the flaws. The processed object 1 3 1 is subjected to a pre-heated laser scribe line acceleration device. Patent Document 1: Japanese Patent Laid-Open Publication No. Hei No. Hei No. Hei. Japanese Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. Since the crack front end for cutting the dividing line of the workpiece 101 is oriented perpendicular to the machined surface, slight variations in the heat balance may cause the dividing line to deviate from the planned line of the line 103. I, because it is not More than the softening of the workpiece 101 The temperature range is irradiated to the heat source 104'. It is difficult to generate thermal stress which is sufficient for the rapid development of the crack 106. Therefore, the speed of the division speed cannot be increased, and the division speed becomes smaller as the size of the workpiece 1〇1 becomes larger. Further, there is a problem in that the crack depth cannot be accurately controlled, and various technical problems exist. In the invention described in Patent Document 2, the fine powder of the workpiece 111 which is evaporated due to ablation is scattered and adhered to the workpiece 111. The surface and the inside of the processing apparatus may cause hindrance to the post-process, and therefore it is necessary to use an attached device such as a micro-powder removing device. Thermal modification occurs on the surface of the underlined groove 1 1 2 by ablation, which may cause a decrease in the strength and quality of the cross section, and may have a significant adverse effect on the strength and quality of the cut surface. Furthermore, depending on the shape of the front end of the shallow groove 1 1 2, it may be difficult to cut the line correctly along the planned line, and even if the upper limit power does not exceed the softening point of the workpiece 1 0 1 Infrared laser light, whose thermal stress is still insufficient, may not be able to achieve deepening of the shallow groove 1 1 2 . The invention described in Patent Document 3 can solve the problems of the inventions described in Patent Documents 1 and 2, but the depth of the blind crack i 24 cannot be arbitrarily changed. The inventors of the present application have recognized that, for example, the same workpiece 1 2 1 Processing-8- 200914190 "In order to change the depth of the blind crack 124, it is necessary to change the length of the longitudinal and lateral directions a, b selected from the moving speed V, the heating beam 122 (heating zone), the distance between the heating and cooling 1, and the beam Any one or a plurality of parameters of the output density k. Among them, although it is easiest to change the moving speed V, the heating heat and the cooling heat which are subjected to the surface of the workpiece 121 are changed. Therefore, a phenomenon in which the surface of the workpiece 121 is melted due to overheating, or conversely, insufficient thermal stress is caused by insufficient heat, or a distance L between heating and cooling may be deviated from the correct enthalpy, and the like may become impossible. The formation of a fissure 1 2 4 is formed. As a result, it is impossible to arbitrarily change the depth of the cleavage 1 24 in the processing of the same workpiece 1 2 1 . Incidentally, when the vicinity of the end portion of the workpiece 1 2 1 is to be divided, the crack 1 2 4 may not be vertical but curved, and the necessity of changing the depth occurs. In addition, blind cracks cannot be formed in the full thickness of the workpiece. Therefore, of course, at its full thickness, the depth of the blind crack cannot be arbitrarily controlled. According to the invention described in Patent Document 4, there is a problem that the depth of the crack cannot be arbitrarily controlled at the full thickness of the workpiece. The reason is that the formation of cracks in the integration may form a crack of a certain depth (usually less than half of the thickness of the sheet) and that any method using the auxiliary cutting device of the step 4 may eventually achieve the division, but It is impossible to stop the cleft crack on its way. Further, in the third step, since the cooling agent spray cooling is performed in the heat-affected zone after the laser irradiation to generate the cooling zone, only a single heating zone is formed in the front and rear portions of the cooling zone, in one In the processing of the workpiece of -9-200914190, it is not possible to arbitrarily adjust the heating energy of the heating zone (reheating zone) at the rear of the cooling zone in the same area. When the heating energy of the heating zone (heating zone) in the front portion is maintained at the same area and the heating energy of the heating zone (reheating zone) in the rear portion is maintained at the same area, the heating energy is increased and decreased, which is of course impossible. Further, the technical problems that exist include that it is difficult to obtain a stable fracture surface quality in a non-contact double-breaking beam or a single TEM beam in the auxiliary cutting device. In Patent Document 4, since a part of the laser light is blocked by the shutter to adjust the power, the irradiation area of the laser beam irradiated to the workpiece changes. Therefore, it is difficult to correctly scribe the workpiece to a predetermined depth in a manner that is not completely broken. The present invention has been made to solve the above problems, and an object thereof is to provide an elastic and practical method and apparatus for processing a non-metallic material, which is a high-brittle non-metallic material such as glass, ceramic or semiconductor material, which is heated in plurality. The energy and the combination of the heat and the cold energy are irradiated so that the crater crack progresses in a desired direction by the thermal stress generated in the material without causing defects in the workpiece, and a scribe crack of a predetermined depth can be formed. The composition is as follows. The invention according to claim 1 is a method for processing a workpiece made of a highly brittle non-metallic material, and when the workpiece 1 made of a highly brittle non-metallic material is scribed along a line-shaped processing line 2b, There is provided a first step of illuminating a predetermined heating zone 3 with a controlled heating energy and scanning along a predetermined line 2b; and cooling the relative movement direction of the heating zone 3 of the first step of -10-200914190 The region 4a irradiates the cold heat energy, and the second step of forming the scribe line along the processing is scheduled; the controlled reheating zone j is located at the rear of the second step grind 4a in the relative moving direction, and is controlled along the processing. The second step of the line 2b is connected to the step 5b of the scribing crack 5b; and the processing method of the workpiece which constitutes the high brittleness is characterized in that: in order to make the scribing cracked into 5b shape by the scribing 6: the predetermined depth of the scribe crack 5b, δ 〇: the depth of the scribe line after the end of the second step, the unit amount of the reheating region 5a of the third step, A: depending on the workpiece 1 Shape characteristics and heat transfer number, m : The real coefficient of m k 1 is adjusted in accordance with the depth characteristic formula of the scribing crack 5 b: 5 $' to adjust the per-cooking energy P of the reheating zone 5a of the third step. According to the invention of claim 2, in the method of processing a workpiece made of a metal material, in the step of forming the micro-cracking step, at least the scribing of the workpiece i is performed at least 2b & A micro crack 2a is formed at the end. The invention described in claim 3 is characterized in that the predetermined line 2b behind the request item 1 or 2 5 is scanned with a cooling area of 艮 or a strong I line of 5 a is irradiated to form a predetermined deep product of heating energy. The ratio is o+A. The high brittleness per unit area of Pm is not described in the processing line of the first step. The high-brittle -11 - 200914190 processing method of the workpiece made of non-metallic materials, in the first step, the heating energy system uses c 0 2 The laser is irradiated with a temperature lower than the softening point of the workpiece 1 to shape the shape of the heating region 'heating region 3 toward the elliptical shape toward the predetermined line 2b, and the elliptical shape has a relative movement direction. Higher energy density distribution. According to the invention of claim 4, in the processing method of the object 1 or 2 or the workpiece made of a highly brittle non-metallic material, the step 'is radiating an air stream containing water particles to heat the hot and cold energy workpiece 1, the air. The amount of moisture in the flow is sufficient to cause the latent heat of the workpiece 1 to be heated to the room temperature after being heated by the heating energy of the step, and is set to be the water microparticles deposited on the surface to be processed in the second step. All will evaporate due to the energy of the third step described above. The invention described in claim 5 is a three-step process for processing a workpiece made of a highly brittle non-metallic material of claims 1, 2, and 3, and is heated and reheated by using a C Ο 2 Ray for reheating. The C 02 laser is used to heat lower than the softness of the workpiece 1 , and the shape of the reheating region 5 a has an elliptical shape with a long axis toward the vertical direction of the addition 2b, and the elliptical shape has a front portion in the direction. High energy density distribution. The invention according to claim 6 is the output of the C02 laser used for the heating energy of the first step in the processing method of the workpiece 3, 4 or the workpiece made of a highly brittle non-metallic material, S step 1 co2 The second amount of the tangential portion of the laser 3 is applied, and the second amount is applied to the heating of the residual portion after the cold finish of the first processing surface, or the fourth shot, and the first shot is scheduled by the temperature of the chemical point. The relative movement of the line 5 is described as a suitable scribe line for forming -12-200914190, which satisfies the condition of the range of 30 to 300 W, and the short axis length of the ellipse of the al heating zone 3 and the ellicity of the heating zone 3 are bl. When the length of the long axis and h are the thickness of the workpiece 1, the relationship of a1=(l~40)xh and bl=(10~100)xh is satisfied; and the aforementioned co2 laser is aligned with the focus position. The state of the inside of the machined surface of the workpiece 1 is obliquely incident on the planned line 2b from the relative movement direction. The invention according to claim 7 is the method for processing a workpiece made of a high-grade non-metallic material according to claim 5 or 6, wherein the reheating region 5 a of the third step is formed by cooling in the second step. The position of the rearward distance (0 to 10) x l 〇 _3 m in the relative movement direction of the region 4a is the condition that the output coupling of the above-mentioned reheating CO 2 laser used for heating energy is maintained in the range of 100 to 1000 W, and Let a2 be the minor axis length of the ellipse of the reheating zone 5a, b2 be the major axis length of the circle of the reheating zone 5a, and h be the plate thickness of the workpiece 1 'corresponding to a2=(4~25)xh' b2 The relationship of (10 to 60)xh; and the above-described reheating co2 laser is incident on the processing target line 2b from the rearward direction of the relative movement direction in a state in which the focus position is aligned with the inside of the surface to be added. The invention according to claim 8 is the method for processing a workpiece made of a high-brittle metal material according to claim 7, wherein the width of the second step 4a in the vertical direction of the planned line 2b is before the ratio The short axis a1 of the ellipse of the heating zone 3 produced by the C〇2 laser of the first step is larger, but is smaller than the C〇2 laser for reheating of the third step. The addition of the ellipse is not a cold description of the length of the ellipse of the reheating zone 5a of the resulting reheating zone 5a is smaller. The invention according to claim 9 is a method for processing a workpiece made of a highly brittle non-metallic material, and the workpiece 1 made of a highly brittle non-metallic material on the stage 6 is drawn along a line-shaped processing line 2b. In the case of a line, the first step of irradiating the predetermined heating zone 3 with the intensity of the controlled heating energy and scanning along the planned line 2b is provided in sequence; the rear side of the relative moving direction of the heating zone 3 located in the first step The predetermined cooling zone 4a irradiates the cold heat energy and scans along the planned line 2b to form a second step of the scribe line; and the predetermined reheating zone 5& illuminates the rear of the cooling zone 4a located in the second step. a third step of processing the intensity-controlled heating energy 'and scanning along the planned line 2b; and a method for processing a workpiece made of a highly brittle non-metallic material, characterized by: performing the third step of reheating means 2 The laser oscillating device 20' is configured to heat the reheating region 5a of the workpiece 1 by irradiating the laser beam 21 emitted from the laser oscillating device 20, so that The scribing progresses into a line crack 5b to form a predetermined depth, and the heating energy of the laser light 2 1 for forming a predetermined depth of the scribing crack 5 b is adjusted so as not to change the shape of the reheating region 5a. The area and the ratio of the heating energy distribution are used to increase or decrease the output of the laser light 21 of the laser oscillating device 20, and the workpiece 1 having a predetermined depth of the scribed crack 5b is integrated. The method is carried out by the robot from the stage 6, and then the workpiece 1 is divided along the scribing crack 5b to obtain a plurality of members. The invention described in claim 10 is a processing apparatus for a workpiece of a high-brittle non-metallic material, 14-200914190, which is provided with at least a scribe line for processing a predetermined line 2b of the workpiece 1. a microcrack formation means for forming a microcrack 2a at the beginning end; a heating means 1 for performing the first step, irradiating the intensity-controlled heating energy to the predetermined heating zone 3 to proceed along the planned line 2b Scanning; a cooling means 3 for performing the second step, irradiating the predetermined cooling area 4a located behind the relative moving direction of the heating zone 3 of the first step, and scanning the hot line with the processing line 2b The scribing line is formed; and the reheating means 20 for performing the third step is for irradiating the heating energy whose intensity is controlled to the predetermined reheating zone 5a located behind the relative movement direction of the cooling zone 4a of the second step. And scanning along the planned line 2b to form the scribe line crack 5b; thereby, the highly brittle non-metallic material of the workpiece 1 made of the high-brittle non-metallic material is scribed along the line-shaped processing line 2b. A processing apparatus for a workpiece to be processed; characterized in that: in order to form a predetermined depth of the scribe line crack 5 b which is formed by scribing, let 5: the depth of the scribe line crack 5 b, 5 〇: at the second The depth of the scribe line after the end of the step, P: the heating energy per unit area of the reheating zone 5 a of the third step, A : the proportional coefficient depending on the shape characteristics and the thermal characteristics of the workpiece 1 , m: m^l The real coefficient is in accordance with the depth characteristic of the cleaving crack 5 b: 5. + A · Pm -15- 200914190 mode to adjust the heating energy P per unit area of the reheating zone 5a of the third step. According to the invention described in the independent claims 1, 1 ,, the workpiece is relatively moved, and a series of steps, that is, steps 1 to 3 are sequentially applied to the workpiece, and the third step is The heating energy is increased or decreased according to the depth characteristic formula of the scribed crack, so that the cracked scribe line formed along the planned line by the first step and the second step is controlled by the third step. At any desired depth, the crack with a deeper dash surface progresses at a higher speed. In particular, the heating energy of the heating zone provided in the first step is maintained at the same area and the same amount, and the heating energy of the reheating zone maintained at the rear of the same area is adjusted to increase or decrease, thereby enabling cracking. The scribing progresses to a scribing crack at any depth. The scribing crack formed by the scribing can be adjusted to a desired depth with high precision by adjusting the heating energy of the third step in accordance with the depth characteristic formula of the scribing crack. In addition, instead of smearing the workpiece, the scribing is performed, and the thermal stress is used to stably perform the slitting, thereby preventing the deterioration of the divided environment caused by the material corrosion (the scattering of the fine powder, etc.), the strength of the split surface, and the quality of the section. The deterioration. Further, in the case where the end surface of the workpiece is processed, in the prior art, the actual processing line is easily bent away from the planned line; however, according to the present invention, since the depth of the scribe line can be arbitrarily controlled, The track of the processing line along the planned line is corrected during processing. According to the invention of claim 2, it is possible to use the microcrack formed at least at the start end of the scribing line as a starting point, and the effect of the scribing is easy to progress from -16 to 200914190. According to the invention of claim 3, in the second step, a C〇2 laser is used as the heating energy, and the shape of the heating region has an elliptical shape in which the long axis is in the tangential direction of the planned line, and the elliptical shape is in the relative moving direction. The rear has a higher energy density distribution. Thereby, it is possible to easily and accurately form an elliptical heating region having a predetermined temperature and a predetermined compressive stress, so that the scribe line formed in the cooling region of the second step is reliably and stably generated. That is, by irradiating the longitudinally heated laser beam, compressive stress is generated in the vicinity of the planned line, and the cold heat energy is immediately irradiated to rapidly cool the heating region, thereby generating a large tensile stress and allowing the scribing Progressing steadily along the planned line. When a minute crack is formed at the start end of at least the scribing line of the planned line, a large tensile stress is generated in the microcrack, and the crack is stably progressed along the planned line. According to the invention of claim 4, in the second step, the air stream containing the water fine particles is radiated to apply the cold heat energy to the workpiece 1, so that the cooling region having the predetermined temperature and the predetermined tensile stress can be easily formed. Further, the amount of moisture in the air flow is sufficient to cool the surface to be processed of the workpiece 1 after the temperature rise in the first step to room temperature, and is set to remain on the surface to be processed after the completion of the second step. All of the water fine particles are evaporated by the heating energy of the third step. Therefore, the formation of the cooling zone having a predetermined tensile stress and the prevention of the deterioration of the quality of the moisture remaining on the processed surface can be achieved at the same time. According to the invention of claim 5, in the third step, the C02 laser for reheating is used as the heating energy, and the shape of the reheating region 5a is -17-200914190, and the long axis is oriented in the vertical direction of the planned line 2b. The elliptical shape and the elliptical shape have a higher energy density distribution in the front portion in the relative moving direction. Thereby, the elliptical shape heating region having a predetermined temperature and a predetermined compressive stress can be simply and accurately formed to simply and correctly control the progress of the scribe line formed by the cooling region of the second step. That is, when a long-length heated laser beam is irradiated to a line which starts to advance along the processing line, a concentrated compressive stress field is formed in the vicinity of the leading end of the scribing line, and a bending moment which causes the leading end of the scribing line to progress in the depth direction is likely to occur. Since the depth of the scribe line can be controlled by the magnitude of the bending moment, the stroke having the desired depth can be obtained by adjusting the power of the horizontally heated laser beam (the heating energy per unit area of the reheating zone of the third step). The line of the line is cracked. According to the invention of claim 6, the heating zone of the first step is set to a predetermined size in a state in which the focus position is aligned with the inside of the workpiece surface of the workpiece 1, and the C 0 2 laser used as the heating energy is used. The output is maintained in the range of 30 to 300 W, whereby the cooling region having a predetermined tensile stress can be formed in the second step to appropriately form the scribe line. Further, as long as the C02 laser is obliquely incident on the front line 2b from the relative movement direction, the cold heat energy in the second step is not hindered. According to the invention of the seventh aspect of the invention, the reheating region of the third step is set to a predetermined size in a state in which the focus position of the CO 2 laser for reheating is aligned with the inside of the workpiece surface of the workpiece, and is re-established. The output of the C 〇 2 laser used for heating energy is maintained in the range of 100 to 1000 W, whereby the scribe line formed in the second step can be appropriately advanced to a desired depth. Further, as long as the C02 laser is obliquely incident on the processing target line 2b from the rear of the relative movement direction -18-200914190, the heat and energy of the second step will not be hindered. According to the invention of claim 8, the width of the cooling zone of the second step in the vertical direction of the planned line 2b is larger than the minor axis length of the ellipsoid of the heating zone generated by the CO2 laser of the first step, and Since the length of the major axis of the ellipse in the reheating region generated by the CO 2 laser for reheating in the third step is smaller, the entire heating region can be cooled by the cooling region and the entire cooling region can be heated by the reheating region. In this way, a properly sized cooling zone is formed to allow for good scribing. According to the invention described in the claim 9, the following effects can be obtained in addition to the effects similar to those of the inventions of claims 1 and 10. When the power of the laser light (reheated beam) emitted from the (second) laser oscillation device is adjusted, basically the beam profile does not change and only the overall power is changed. That is, the shape and area of the reheating zone in the third step are not changed. Therefore, the relative position of the reheating zone and the cooling zone does not change, and the tensile stress acting on the cracked scribe line, that is, the force of the crack opening, is changed only by the power. Therefore, the force of the crack opening can be continuously controlled in accordance with the power of the laser light (reheating beam), and it is easy for the scribing crack to form a desired predetermined depth. Further, as long as the depth of the scribing crack is formed at a different depth depending on the location of the workpiece 1, the workpiece having a predetermined depth (mixed with a deeper portion and a shallower portion) may be formed. The robot is carried out in an integrated manner from the stage. 'In the next step, the workpiece is divided along the scribe line to obtain a plurality of members. As a result, both the processing capacity of the workpiece and the ease of division of the subsequent steps can be simultaneously achieved. [Embodiment] Hereinafter, an embodiment of the present invention will be described with reference to Figs. 1 to 1 . Reference numeral 1 in the drawing denotes a workpiece which is formed into a notch, that is, a scribed line and a substrate material made of a brittle material, and is produced by using glass as a representative material. Usually, the workpiece 1 (brittle non-metallic workpiece) is a transparent body. The workpiece 1 is placed on the stage 6 so as to be replaceable, and is divided in order to be processed along a predetermined line to be processed in a straight line, and is sequentially disposed on the planned line 2b at intervals: a heating region 3 formed in steps The cooling zone formed in the second step is in the center of the reheating zone 5a formed in the third step; the microcrack forming step can be visually performed to apply a small amount to the end of the workpiece 1 to be processed. Crack 2 a. The heating zone 5 and the zone 5a are formed with a gap therebetween, and the heating zone 3 and the additional 5 a' are heated at a temperature lower than the softening point of the workpiece. As shown in Fig. 2, the stage 6 is integrally provided with a crack generating means 40 for forming a small crack 2a, and a first laser oscillation device 1 constituting a main portion for generating a heating means for adding 3 The second cooling device 20 for constituting the main portion of the heating zone heating means is formed by the cooling means 30 for the area. In other words, the generating means 40, the first laser oscillation device 1A, and the cooling means 3, the laser oscillation device 20 is set in the processing system stage (not shown). 2b enters the first domain 4, and needs to come to the reheating hot zone to generate the hot zone to generate the cold zone and then crack and the second 'this plus -20- 200914190 system mounting platform or substrate loading load At least one of the stages 6 is provided with a driving device (not shown), whereby the workpiece 1 and the stage 6 are processed along the processing line with respect to the processing system (that is, the heating area 3, the cooling area 4a, and the reheating area 5a). 2b continuously moves in the direction of the arrow A1. In order to relatively move the processing system (the heating zone 3, the cooling zone 4a, and the reheating zone 5a) along the planned line 2b in the direction of the arrow A, not only the first laser oscillation device 10 but also the cooling means are provided. 30 and the second laser oscillation device 20 are provided on a processing system stage (not shown), beam expanders 12 and 22, infrared mirrors 13 and 23, cylindrical mirrors 14 and 24, and cooling means 30. It is also installed in the processing system and is kept in one. The first and second laser oscillation devices 1 and 20 are individual laser oscillation devices, and the power of the laser light (heating energy density (heating energy per unit area)) can be individually increased or decreased. The crack generating means 40 does not include a driving mechanism as shown in Fig. 2, but is provided with a rotary blade that rotates by contact with the workpiece 1. The crack generating means 40 performs relative movement, that is, scanning, from the outside of the workpiece 1 in the direction of the arrow A 1 along the extension line of the planned line 2 b before the processing system starts processing the workpiece 1 to The micro crack 2a is formed at at least the start end of the scribing line 2b of the workpiece 1 and the crack is formed at the beginning of the scribing line, and then the strip is quickly retracted from the processing line 2b. In this manner, the microcrack formation step performed by the crack generating means 40 as needed is before the first step of forming the heating region 3, at the end of the scribing of the surface to be processed of the workpiece 1 (in Fig. 2 is the left end of the workpiece 1), and micro-cracks are generated as required - 21 - 200914190. As shown in Fig. 2, the first laser oscillation device 10 emits infrared laser light 1 1 of the first laser light. The infrared laser light 1 1 ' emitted from the first laser oscillation device 10 is adjusted by the infrared laser expander 丨 2 to adjust the long-axis beam diameter, and then reflected by the infrared mirror 13 and transmitted through the cylindrical mirror 1 After 4, it is irradiated to the workpiece 1 to form an elliptical heating zone 3 for locally heating the workpiece 1. At this time, it is adjusted such that the focus of the infrared laser light 1 1 is located inside the workpiece 1, and the beam of the laser light 11 is obliquely irradiated from the front of the beam in the relative moving direction (the direction of the arrow A1). That is, the portion of the infrared laser light U' irradiated to the workpiece 1 is located on the planned line 2b in plan view. The heating region 3 formed in the workpiece 1 is heated by the infrared laser light 1 1 and has a compressive stress region. The cylindrical mirror 14 condenses the beam shape of the infrared laser light 11 into an elliptical shape. The long axis is irradiated in such a manner as to align the planned line 2b direction. The short-axis width of the heating zone 3 is controlled by a cylindrical mirror 14 which is adjusted using a beam expander 12. The infrared laser light n used to generate the heating region 3 is, for example, a wavelength of 1 〇. 6μιη C〇2 laser. When the c〇2 laser is irradiated and heated at a temperature lower than the softening point of the workpiece 1, it is preferable that the shape of the c〇2 laser irradiation region has a long axis toward the tangential direction of the planned line 2b. The elliptical shape and at the rear of the elliptical shape have a higher energy density distribution than the front portion. The first step is a method in which the irradiation intensity of the predetermined area is controlled by the heating energy of the infrared radiation pupil -22-200914190 along the planned line 2b. The output of the co2 laser used for the heating energy in the first step is appropriately formed into a crack-like scribe line, and by performing the third step, a scribe line crack 5b having a fracture surface having a desired depth is formed. The first laser oscillation device 10 is set to maintain the condition of 3 0 to the range. Let a 1 be the force [the short axis length of the ellipse of the domain 3, bl the length of the ellipse of the heating zone 3, and h be the thickness of the workpiece 1 in accordance with al = (l ~ 40) xh, bl = ( L〇~l〇〇)xh relationship. The cooling means 30 is a mist-like cooling medium 35 which is mixed with water from the water supply tank 3 2 through the pipe 3 1 and compressed air supplied from the air compressor 34 through the pipe 3 3 to form a mist. The cooling medium 35 is blown directly to the rear of the heating region 3 of the workpiece 1, thereby generating the workpiece 1 on the cooling planned line 2b and having the tensile stress region 4a. The cooling zone 4a is preferably formed behind the heating zone 3 of the relative moving square, and more preferably extends in the relative moving direction A1 to the extent of the minor axis of the heating zone 3. Both the water and the compressed air are adjusted and adjusted by the regulating valve (not shown). When the components on the liquid crystal surface are cut, problems may occur due to the adhesion of water droplets, and the amount of water is preferably small, so that the tip end of the nozzle is as fine as possible. The stress generated in the planned line 2b of the workpiece 1 by the relative movement of the region 4a causes the microcrack 2a to progress to the position of the crack tip 4b. Crack into a line. Depending on the material of the workpiece 1, even if the crack 2a is omitted, by forming the heating zone 3 and the cooling 4a in sequence, the same crack as the microcrack 2a may be processed to be formed. 3 00 W i hot zone long-axis supply gas, from the spray used to the cold sentence A1 length is the end of the cold stretch of the turtle tiny area 1 -23- 200914190. As the cold heat energy, when an air stream containing fine particles (sprayed by water) is emitted, it is preferably set to an appropriate moisture content. In other words, it is preferable that the amount of moisture to be supplied is sufficient to cool the surface to be processed of the workpiece 1 after being heated by the heating energy of the first step to room temperature, and set to 'in the second step. After the end, all of the water microparticles remaining on the surface to be processed (at least in the vicinity of the planned line 2b or in the vicinity thereof) are evaporated by the heating energy of the third step. In the second step, after the irradiation region of the heating energy in the first step, the supply of the cold heat energy is irradiated to scan along the planned line 2b. A scribing line by irradiating an infrared laser with a non-metallic material by thermal stress forms a compressive stress field on the surface portion of the workpiece 1, and then a cooling medium is formed by a cooling medium to induce a tensile stress. Produced when the tensile strength of the material is exceeded. Brother 2 laser oscillating device 20 infrared laser light, for example, using a wavelength of 10. The reheating of 6μηι was performed with a C02 laser. The laser beam 21' of the second laser beam emitted from the second laser oscillation device 20 is adjusted by the infrared laser expander 22 to adjust the long-axis beam diameter, and then reflected by the infrared mirror 23 and transmitted through the cylinder. After the mirror 24 is irradiated to the workpiece 1, an elliptical reheating region 5a for locally heating the workpiece 1 is formed. At this time, the focus of the 'infrared laser light 21 is adjusted to be inside the workpiece 1, and the beam of the laser beam 11 is obliquely irradiated from the rear of the beam in the relative moving direction (the direction of the arrow A1). That is, the portion of the infrared laser light 11 irradiated to the workpiece 1 is located on the processing line -24 - 200914190 alignment 2b in plan view. Further preferably, the front end of the reheating zone 5a and the rear end of the cooling zone 4a are adjusted to be spaced apart by a predetermined distance. The predetermined separation distance is specifically a distance of 0 to 1 〇 mm. In this manner, the reheating region 5 a is obtained by heating the infrared laser light 2 1 at a temperature lower than the softening point of the workpiece 1 1 to cut the end of the scribe line (the crack tip 4b) by the column. The mirror 24 condenses the beam shape of the infrared laser beam 21 into an elliptical shape, and illuminates so that the long axis is aligned with the vertical direction of the planned line 2b. The short-axis width of the reheating zone 5a is controlled by the cylindrical mirror 24, and the adjustment of the major axis width is performed using the beam expander 22. The third step of generating the reheating zone 5a is to irradiate the intensity of the controlled heating energy to the predetermined reheating zone 5a and scan along the planned line 2b. In the third step, when the heating energy is C〇2 laser 'for reheating' and the temperature is lower than the softening point of the workpiece 1 by the CO 2 laser for reheating, the irradiation is performed. The position is separated by a predetermined distance to avoid the formation of the scribe line (which is generated by the cold heat energy of the cooling area 4a), and the shape of the irradiation area is an elliptical shape in which the long axis is perpendicular to the vertical direction of the processing line 2b, and the ellipse The front portion of the shape in the direction of travel has a higher energy density distribution than the rear portion. The heating energy in the third step is adjusted by increasing or decreasing the total amount (output), so that the scribe line formed in the first step and the second step can be advanced to a desired depth to form the scribe crack 5b. The reheating zone 5a of the third step is formed at a position rearward (0 to; ι〇) χ1 〇 - 3 m in the relative movement direction of the cooling zone 4a of the second step, and is used as reheating for heating energy. The beam output of the C02 laser (IR-25-200914190 line laser light 2 1) is in the range of 1 0 0~1 0 0 W. Further, a2 is the minor axis length of the ellipse of the reheating region 5a, b2 is the major axis length of the ellipse of the reheating region 5a, and h is the thickness of the workpiece 1, which corresponds to a2 = (4 to 25) xh. , b2 = (10~60) xh relationship. Regarding the positional relationship between the cooling zone 4a and the reheating zone 5a, the positional relationship of the scribing crack 5b of a predetermined depth is actually obtained by experimentally obtaining the energy with the least amount of reheating energy. Depending on the thickness of the workpiece 1, the workpiece 1 is composed of a veneer or a laminated glass, and in the subsequent steps, a fully cut scribe crack 5 b depth, a cooling zone 4 a, and a heating zone 5a can be achieved. The positional relationship will be different, so it has to be determined experimentally. The cooling zone 4a of the second step has a substantially circular shape, and the width of the vertical direction and the width of the tangential direction of the planned line 2b of the cooling zone 4a are shorter than the ellipse of the heating zone 3 formed by the C〇2 laser of the first step. The shaft length a1 is large and is smaller than the major axis length b2 of the ellipse of the reheating zone 5a formed by the re-heating CO2 laser of the third step. The length of the major axis b2 of the reheating region 5a which is further elliptical is larger than the length of the minor axis of the heating zone 3, and the length of the minor axis of the reheating zone 5a is smaller than the length of the major axis of the heating zone 3. In addition, when the infrared laser light 11 is irradiated, if the heating is performed at a temperature exceeding the softening point of the workpiece 1, the thermal stress remains after cooling, and the formation of the scribing crack 5b of the material cannot be controlled. Overheated. Further, the cooling region 4a generated behind the heating region 3 and the reheating region 5a generated behind the cooling region 4a are formed by the heating region 3 and the second step formed in the first step -26-200914190. The respective centers of the cooling region 4a and the reheating region 5a formed in the third step are sequentially set on the planned line 2b at intervals in the opposite direction to the relative movement direction A1. Next, the effect will be explained. First, the workpiece 1 is placed on the stage 6, and a micro crack forming step is performed as needed. In other words, a micro crack is formed at the end of the scribing line of the planned line 2b of the surface to be processed of the workpiece 1 so that the scribing starts smoothly and smoothly. Further, the infrared laser light 11 is emitted from the first laser oscillation device 10, and the laser light is emitted from the second laser oscillation device 20, and the cooling medium 35 is blown from the cooling means 30. In this state, the stage 6 at the right end position is relatively moved in the opposite direction of the arrow A1 to move the processing system (the heating area 3, the cooling area 4a, and the reheating area 5a) in an integrated manner along the planned line 2b. The direction (arrow A 1 direction) is relatively moved. Thereby, the infrared laser light 1 1 is locally irradiated from the left end of the planned line 2b of the workpiece 1, and the portion of the workpiece 1 irradiated with the infrared laser light U rises to be lower than the softening point of the workpiece 1. The heating zone 3 is generated at a predetermined temperature. In the case where the minute crack 2a is formed, partial irradiation of the infrared laser light 11 is performed from the portion including the minute crack 2a. In the heating zone 3, a strong compressive stress occurs in the heating center, and a weak tensile stress is generated in the outer periphery thereof via the buffer zone. The size of the heating zone 3 can be arbitrarily changed by being placed on the cylindrical mirror 14 of the processing system through the support table (provided with a fine adjustment mechanism, not shown). -27- 200914190 Next, by the relative movement of the stage 6, the left end of the planned line 2b of the workpiece 1 (the micro crack 2a) is directly behind the irradiation area of the heating region 3, that is, the laser light 1 1 The discharge of the cooling medium 35 (mixing water and air into the mist in the cooling means 30) is started to generate the cooling zone 4a. As a result, a strong tensile stress occurs, and local strong stress is concentrated, so that the tensile strength of the workpiece 1 is exceeded, and the crack occurring at the end portion starts to progress toward the crack HU end 4b. The crack in progress becomes a line. The cracked scribe line is formed in the vicinity of the surface of the workpiece 1 and does not cut the workpiece 1. In the case where the minute crack 2 a is formed, strong tensile stress occurs at the sharp front end portion of the micro crack 2a, and strong stress concentration occurs inside the tip end of the micro crack 2a, so it is easy to exceed the The tensile strength of the workpiece 1 is such that the microcrack 2a starts to progress toward the crack and the end progresses steadily, thereby generating a scribe line. Then, by the relative movement of the stage 6, and the cooling area 4a, that is, the spray area of the cooling medium 35, is separated by an appropriate distance, the infrared laser light 2 1 starts from the left end of the planned line 2b of the workpiece 1 (small The crack 2 a) is locally irradiated to rise to a predetermined temperature lower than the softening point of the workpiece 1 to generate the reheating region 5a. In the reheating zone 5a, once the cooled workpiece 1 is heated again, and becomes a compressive stress field in the vertical direction of the long axis toward the planned line 2b, the cracked tip 4b and its vicinity are processed. A large bending stress occurs in the inside of the first step, and the tip end of the crack starts to progress toward the inside (depth direction) of the workpiece 1. That is, the scribe line progresses to the position of the crack front end 4b and reaches the reheating area 5a, so that the scribe line also progresses toward the depth direction to obtain the scribe line of the predetermined scribe line depth -28-200914190 crack 5b. By irradiating the longitudinal heating beam with the infrared laser light 1 i in the first step (forming an elongated elliptical beam along the tangential direction of the planned line 2 b), compressive stress occurs in the vicinity of the planned line 2b, and In the second step immediately following, the cold heat energy is irradiated, and the heating region is rapidly cooled when it reaches the cooling region 4a. Therefore, a large stretching occurs at the beginning end of the processing planned line 2b (small crack formed as necessary). With the stress, the crack starts to stably progress along the planned line 2b to form a scribe line. For the crack that starts to progress, that is, the scribing, in the third step, when the horizontally long heating beam is irradiated (the elongated elliptical laser light 2 1 is formed along the orthogonal direction of the planned line 2 b), the front end of the scribing line The surrounding area, that is, the wide area around the front end of the crack, becomes a compressive stress field, and a bending moment sufficient for the crack to progress in the depth direction occurs. The cracking depth can be controlled by the magnitude of the bending moment, and the power of the horizontally long heating beam can be adjusted to obtain a continuous cracking crack 5b of a desired depth. The power adjustment of the heating beam can be performed separately by the third step while maintaining the same irradiation area, and can be performed separately during the processing of the processing target line 2b of one workpiece j. The change in the depth of the scribing crack 5 b is necessary in the case where the predetermined line is crossed. When the scribing is performed near the end of the workpiece 1, the scribing may not be vertical and may become curved. The depth must be changed to suppress the bend. Next, the advantage that the depth of the scribing crack 5b is stopped at a desired predetermined depth without completely dividing the workpiece 1 is explained. When the workpiece 1 composed of a glass plate or a panel is finally divided into a plurality of panels (members) of a predetermined shape, it is completely divided into components as compared with the irradiation of the laser light 1 1 , 2 1 -29 - 200914190 In the case where the depth of the scribe line crack 5b is stopped in the middle to retain a part, and the division into the members in the subsequent steps may be easier to handle. However, in the case where the scribing crack 5b is too deep, when the robot transfers the workpiece 1 to the middle of the next step, the scribing crack progresses and the workpiece 1 may be inadvertently Dividing; conversely, in the case where the scribing crack 5 b is too shallow, it is difficult to divide in the subsequent steps, and the state of integration may cause trouble. In this case, if the workpiece 1 can be maintained integrated before the dividing step, and the depth of the scribing can be changed in accordance with the position of one workpiece 1, optimum processing and high-efficiency processing can be performed. In other words, the workpiece 1 (in an integrated manner) in which the scribing crack 5b (changed at a predetermined depth) is formed is carried out by the robot from the stage 6, and the workpiece is processed along the scribe line 5b. By dividing one, a plurality of substrates (members) can be obtained. For example, in the transfer, the portion where the depth of the cleaving crack 5b progresses and is easily broken is formed into a shallow scribing crack 5b, and a deep scribing crack 5b is formed in the portion which is not easily broken. Thereby, the easiness of handling and the ease of division of the subsequent steps can be achieved at the same time. Figure 4 shows no, for 3 kinds of plate thickness (0. 7mm, 0. 5mm, 0. The workpiece 1 composed of a glass substrate of 3 mm) is used to generate the power of the infrared laser light 2 1 of the reheating region 5 a (the energy density of the laser light 2 1 ) and the depth of the scribe line (the depth of the scribe crack 5 b ) An example of the experimental results of the relationship. Specifically, it is about 0. 02~0. Laser light 21 with an energy density in the range of 22 (W/mm2). The power of the second laser oscillation device 20 can be adjusted from 50 W in the range of 200 to 250 W. -30- 200914190 It can be seen that regardless of the thickness of the glass substrate, the energy density of the infrared laser beam 21 increases from about 〇2W/mm2 to about 0. 09~ 0. 22W/mm2, the depth of the scribe line (the depth of the scribe line crack 5b) is continuously increased, and the scribe line depth (the depth of the scribe line crack 5b) can be arbitrarily changed during the period until the glass substrate reaches the complete division. That is, by adjusting the power (energy density) of the infrared laser light 21 of the third step by increasing or decreasing, the compressive stress of the reheating zone 5 a can be arbitrarily controlled, that is, acting on the crack front end 4b (lined Bending stress at the inner end). However, the beam output of the C02 laser for reheating used to generate the heating energy for the reheating zone 5a is maintained in the range of 100 to 1000 W as described above. Just fine. According to the experiment, the heating energy density P (heating energy per unit area of the reheating region 5a) generated by the infrared laser light 2 in the third step and the depth 6 of the scribing crack 5b can be derived, and the following relationship is satisfied: 5 = δ 0 + A . Pm (depth characteristic of the scribe crack 5b) Here, (5: the predetermined depth of the scribe crack 5b (desired predetermined depth), 5 〇: the scribe depth after the end of the second step 'P: Heating energy density in 3 steps (heating energy per unit area (mm2) of the reheating zone (5a)), A: Proportional coefficient depending on the shape characteristics and thermal characteristics of the workpiece (1), m: m^l The real coefficient of the line. The parameter of the depth characteristic of the undercut crack 5b, that is, the depth of the scribe line after the end of the second step -31 - 200914190 (5 ο, depending on the shape characteristics of the workpiece (1) and The proportional coefficient A and the real coefficient m of the thermal characteristics can be determined in the following experimental order. The shape characteristics of the workpiece 1 include the structure of the panel in addition to the thickness of the workpiece 1. The laminated glass of the panel member The workpiece 1 having the structure has a seal material for joining the glass. The depth of the scribe line crack 5b differs depending on the pattern of the seal material. The heat characteristics of the workpiece 1 include heat conduction in addition to specific heat. Rate, thermal expansion rate, etc. Reheating area 5a The shape is exactly the same in the processing of one workpiece 1 without change. Actually, for the workpiece 1 to be processed, the order 1 to 3 0 is determined in advance to determine the undercut crack 5b to be formed. Depth (5. The depth of the scribe crack 5b is determined based on whether or not the division is performed by the complete division, the division step of the next step, and the prevention of breakage during movement of the robot, and the thickness is determined. When the workpiece 1 having a predetermined thickness (full thickness) is formed into a scribe crack 5b having a predetermined depth at a predetermined relative moving speed, the depth of the scribe line is obtained by the sequence 1). <5 〇. The depth of the scribe line (5 G can be roughly determined according to the depth 5 of the scribe line crack 5b to be formed. Sequence 1) The processing of the first and second steps is determined experimentally at a desired predetermined relative movement speed. Under the condition, the depth of the scribe line after the completion of the second step is obtained (50. Here, the processing conditions in the first step are determined according to the heating energy and the size of the heating region 3. The processing conditions in the second step are the cold heat energy. And the positional relationship between the heating zone 3 and the cooling zone 4a, etc. -32- 200914190 Sequence 2) Under the processing conditions determined in the sequence 1) of the relative moving speed, the reheating zone 5a of the third step is experimentally changed. The heating energy P (infrared laser light power) per unit area is determined as the appropriate representative 値 (P!, P2...) converted into the heating energy density, and the depth (5 1 , 5 2 ...) of the scribe crack 5b is obtained. . The heating energy p ′ per unit area of the reheating zone 5 a is the energy on the scanning line of the predetermined position of the planned line 2b. Sequence 3) The order 1) and the order 2) are obtained (the depth of the scribe line after the end of the second step) and (Ρ, δ !), (P2, 5 2)... are substituted into the scribe line 5b. In the depth characteristic formula 5, the proportional coefficient A and the real coefficient m are obtained by the least square method. For the three kinds of plate thicknesses in the fourth graph obtained in the experiment, the depth of the scribe line (5 〇, the proportional coefficient A, and the real coefficient m) were obtained and summarized in Table 1. From Table 1, it can be seen that the three kinds of thicknesses are scribed. Crack 5 b depth <5 the coincidence rate R is above 0.98, so it is roughly consistent <5 = 6 o + A _ Pm relationship. Thus, it can be seen that the predetermined scribe depth (5 〇 at the end of the second step) is obtained by the predetermined relative moving speeds (1 8 Omm/sec '310 mm/sec, 370 mm/sec). By adjusting the heating energy P (W/mm2) of the infrared laser light (C02 laser) in the third step to an appropriate enthalpy, the depth 6 of the desired scribe crack 5b can be obtained. That is, in one workpiece 1 In the treatment, the heating energy P is changed, and the depth δ of the scribe crack 5 b can be adjusted. -33- 200914190 ! Characteristic formula 0.9717 0.9773 0.9983 Characteristic formula 5=160+7.962χ104 · Ρ33611 0=150+3.472x104 · P2'4214 5=120+3.588χ104 · P21825 Α値7.962χ104 3.472χ104 '3.588xl04 1 ! [Table 1] Parameters of the cracking depth and S 3.3611 2.4214 1 2.1825 iM 160μηι 150μιη 120μηι 1 The conditions of the processing object will be 0.7mm thickness The glass is divided by 180 mm/sec. The 0.5 mm thick glass is divided at 31 Omm/sec. The 0.3 mm thick glass is divided by 370 mm/sec. rUIm/TW]PH, [曰=!]?: Broom (hanging Ting) mine ring si^^^aSI^s mine·· Ή (5 Gu-34- 200914190
劃線深度 (mm) LO L〇 〇 cn o g r*-( ο in 寸 ο in CO CZ5 ο CZ5 in LO o in (Nl 〇 Ο CO ο o LT> 1—H o <=> CvJ <=) CO OJ c=> CZ5 1 i CZ5 LO 1 Ή CD CO 1 4 CZ5 g o CO C5 掃描速度 (mm/s) § t— 0 CO 1 4 o 1—< § ο οα C=5 CN1 CM CD s 〇 C^i CN1 o oa o OO ο cr> CO o CQ CO 写 CO zr> CO cr> c— CO C3 S 〇 G5 2 o § C3 r—( LO s LO 1冷熱-後方加熱 1射束間距離 1 (mm) 〇> LO CD LO 〇 ς=5 uri C3 cz> LO o l〇 Ο m LO 呀 ◦ o 呀· LO 寸 CD L〇 CO CD 〇〇 LO <NJ C5 CN1* LO C3 t-^ LO cz> 板厚 1 h(mm) 1 1 ^ T-^ I 1 1—^ 1—1 卜 C5 卜 C=> 卜 C5 0.63 CO CO c£ CO ς〇 CD uo o LO <ZD LO o* CO c=> CO c=> CO c=> <N3 C5 OJ C=5 OJ c£ 0.05 0.05 LO <=3 o 後方加熱射束參數 輸出（w) ! cr> LO C2> 〇 CJl· 1000 c=> c=> CO CP LO CO C2> QO OO OJ 〇> C5 CO co o LO CN3 CVJ o o CO C3 (Nl CD CO CM o LO (NJ 〇 OO T~H C=5 Cs) CO O in CM CZ> G5 l H <=5 LO o C3 OJ b(mm) LO LO r H LO C<l f 嶒 (N1 r H CD 05 05 LO G5 r H LO C5 1 t L〇 C=j r 4 LO OO LO OO* ΙΛ OO 卜 卜 卜 CO CO CO CO CO CO a(mm) cr> un> CO L〇 o LO m CO LO CO LTD CO CO CO CO CO CO CO r H CO CO r 1 CO OO 04 OO CNJ 〇〇 Cvj LO CN] L〇 r-H I H »*—< r- t 1—1 1 前方加熱射束參數 輸出（w) C5 CO f叫 LO CO r H c LO T—^ LO C75 CD l H § r H <3> cn LO CT> LO o C=5 OO LO 〇〇 o σϊ LO § LO OO o CO LO CO LO CO LO > < 另 b(mm) CD 呀 写 OO OJ OO (NI OO csl OJ CVJ OJ OJ (N\ (N1 03 > H CNJ T~H C<1 1 H LO CD LO ai LO CT5 LO to in CO LO CD Osl <>i (Ni <Ni c<i 1- a(mm) C2> CO CO <z> CO Csl cs! C^3 C<J c<i 〇〇 1 Ή OO 〇0 1—^ CD 1 1 H CO i H CO 1—H 1 H < H 1 < 1 蛘 〇0 ¢=5 〇〇 C5 〇0 ci r-H 〇 r-^ 〇 C=3 材料 無鹼玻璃 無驗玻璃 無驗玻璃 無鹼玻璃 無鹼玻璃 無鹼玻璃 無驗玻璃 無鹼玻璃 無鹼玻璃 無驗玻璃 無驗玻璃 無驗玻璃 無鹼玻璃 無鹼玻璃 無驗玻璃 無鹼玻璃 無驗玻璃 無驗玻璃 無驗玻璃 無鹼玻璃1 無驗玻璃 ^6 T—^ C<l CO LO cc> 卜 〇0 05 Ο v ·Η <N1 T—^ CO I 1 1 嶙 m i 1 CO ，丨H 卜 r _ 00 1—^ cn r-H 35 200914190 表2，係改變2種雷射光1 1、21之射束參數以及玻 璃基板（被加工物1)之板厚，顯示進行劃線試驗的結果 (No. 1〜2 1)。設第i步驟之加熱能量所使用的c〇2雷射之 參數爲前方加熱射束參數，設第3步驟之加熱能量所使用 的C02雷射之參數爲後方加熱射束參數，設第2步驟的冷 卻區域4a之後端緣和第3步驟的再加熱區域5a之前端緣 間之距離爲冷熱-後方加熱射束距離，設被加工物1及載 台6和加工系統（亦即加熱區域3、冷卻區域4a、再加熱 區域5a)之連續相對移動速度爲掃描速度。 如此可知，無鹼玻璃製之玻璃基板（1)的各板厚 (1 . 1 m m、0 · 7 m m、0 · 6 3 m m、0 · 5 m m、0.3 m m、0 · 2 m m 及 0.05mm)之劃線深度（劃線龜裂5b的深度<5 )，不僅會受以 下參數的影響，亦即呈橢圓形之雷射光1 1、2 1之射束尺 寸（al、bl、a2、b2)、第1、第2雷射振盪裝置10、20之 射束功率（輸出）、冷卻區域4a和再加熱區域5a之距離、 劃線速度（掃描速度）等，且該等參數間具有特定的關係。 雖然依被加工物1的厚度而異，但只要使切斷面（劃 線龜裂5b)延伸至被加工物1的背面，藉由在加工預定線 2b上從行進方向前側起依序生成加熱區域3、冷卻區域 4a以及再加熱區域5a，並使加熱區域3、冷卻區域4a以 及再加熱區域5 a相對於被加工物1移動，即可將被加工 物1完全分割。當切斷面（劃線龜裂5b)之延伸無法將被加 工物1完全切斷時（包含不讓被加工物1完全切斷的情 形），在隨後的步驟，讓斷裂力作用於被加工物1 ’以將 -36- 200914190 被加工物1沿切斷面（劃線龜裂5 b)進行切斷。 然而，在專利文獻4’雖是藉由光閘來將雷射光的一 部分遮斷，以進行加熱能量之調整’但再加熱射束（雷射 光2 1)的加熱能量之調整’則比利用光閘之加熱能量的調 整更具效果。其理由如下所述。 從第2雷射振盪裝置20射出之雷射光21 (再加熱射 束）的功率調整，當藉由調整第2雷射振盪裝置20的輸出 來進行時，基本上射束形狀（Profile)不改變而僅使整體的 加熱能量（第3步驟的加熱能量密度（再加熱區域5a之每 單位面積之加熱能量））改變後照射於被加工物1 °亦即’ 在同樣的相對移動速度下，第3步驟之再加熱區域5 a的 形狀、面積及雷射光2 1之照射能量分布的比例不會改 變。因此，再加熱區域5 a和冷卻區域4 a之相對位置不改 變，作用於劃線前端的拉伸應力、亦即讓龜裂開口的力僅 取決於功率（再加熱區域5a之每單位面積之加熱能量）而 改變。因此，讓劃線開口的力，可按照功率（再加熱區域 5a之每單位面積之加熱能量）來連續地控制，而能使一條 劃線龜裂5 b邊改變邊形成期望的深度。另一方面，利用 光閘來調整加熱能量的情形，由於雷射射束的一部分被切 斷’其射束形狀（照射形狀、面積）會改變。 如此般，由於利用光閘的調整，除加熱能量外’同時 也會改變射束形狀，因此再加熱區域5 a和冷卻區域4 a之 位置關係會急劇改變。如此，作用於龜裂狀的劃線之拉伸 應力的變動、消滅等現象容易引發，而難以形成期望深度 -37- 200914190 之劃線龜裂。 亦即，用光閘來遮蔽（或開放）再加熱用雷射光21的 後側（遠離冷卻區域4 a側）或前側以調整被加丁物1之加 熱能量，在運用於一個被加工物1之一條劃線龜裂5 b的 加工途中會發生困難。其理由在於’藉由遮蔽（或開放）雷 射光2 1的後側或前側以增減調整加熱能量的方式，由於 雷射光21的後端緣部或前端緣部會移動，在被加工物1 和雷射光21進行相對移動下’進一步改變再加熱區域 5 a (照射雷射光2 1所產生）和冷卻區域4 a的相對關係，如 此要正確地進行龜裂進展作業會有困難。 【圖式簡單說明】 第1圖係顯示本發明的1實施形態之高脆性非金屬材 料製之被加工物之加工方法的原理之立體圖。 第2圖係本發明的1實施形態之加工裝置整體的立體 圖。 第3圖係本發明的1實施形態之加工狀態之說明圖。 第4圖係本發明的丨實施形態之雷射能量密度-劃線 深度的特性之線圖。 第5圖係習知切斷方法之說明圖。 第6圖係顯示其他習知的加工方法，第6 (a)圖係照射 UV雷射之說明圖，第6(1))圖係照射co2雷射之說明圖， 第6(c)圖係劃線孔之說明圖，第6(d)圖係切斷薄板玻璃之 說明圖。 -38- 200914190 圖。 圖。 第9 (a)圖顯示膨 :說明圖。 第7圖係其他習知的加工方法之立體 第8圖係其他習知的加工方法之立體 第9圖係顯示其他習知的加工方法， 脹狀態，第9(b)圖顯示非膨脹狀態。 第1 〇圖係前述其他習知的加工方法；Ϊ 【主要元件符號說明】 1 、 101、 111、 121、 131:被加工物 2 a :微小龜裂 2b、103、1 13 :加工預定線 3 :加熱區域 4a :冷卻區域 4b :龜裂前端 5 a :再加熱區域 5 b :劃線龜裂 6 .載台 1 〇 :加熱手段（第1雷射振盪裝置） 1 1、21、L2 :紅外線雷射光 12、22 :射束擴展器 1 3、2 3 :紅外線用反射鏡 14、24 :柱面鏡 20 :再加熱手段（第2雷射振盪裝置） 3 0 :冷卻手段 3 1、33 :配管 -39- 200914190 3 2 :水補給槽 3 4 :空氣壓縮器 3 5 :冷卻媒體 40 :龜裂生成手段 1 0 2 :缺口 1 〇 4 :熱源 1 〇 5 :假想等溫線 106 :龜裂 1 1 2 :細長槽 1 2 2 :加熱射束 1 2 3 :冷卻區 124 :盲裂痕 1 8 8 :溝槽用空氣袋 L 1 :紫外線雷射光 -40Dash depth (mm) LO L〇〇cn ogr*-( ο in inch ο in CO CZ5 ο CZ5 in LO o in (Nl 〇Ο CO ο o LT> 1—H o <=> CvJ <= CO OJ c=> CZ5 1 i CZ5 LO 1 Ή CD CO 1 4 CZ5 go CO C5 Scanning speed (mm/s) § t— 0 CO 1 4 o 1—< § ο οα C=5 CN1 CM CD s 〇C^i CN1 o oa o OO ο cr> CO o CQ CO Write CO zr> CO cr> c—CO C3 S 〇G5 2 o § C3 r—( LO s LO 1 hot and cold - rear heating 1 beam Distance 1 (mm) 〇> LO CD LO 〇ς=5 uri C3 cz> LO ol〇Ο m LO 呀◦ 呀· LO inch CD L〇CO CD 〇〇LO <NJ C5 CN1* LO C3 t- ^ LO cz> Plate thickness 1 h(mm) 1 1 ^ T-^ I 1 1—^ 1—1 C C5 Bu C=> Bu C5 0.63 CO CO c £ CO ς〇CD uo o LO <ZD LO o* CO c=> CO c=> CO c=><N3 C5 OJ C=5 OJ c£ 0.05 0.05 LO <=3 o Rear heating beam parameter output (w) ! cr> LO C2> ;〇CJl· 1000 c=>c=> CO CP LO CO C2> QO OO OJ 〇> C5 CO co o LO CN3 CVJ oo CO C3 (Nl CD CO CM o LO (NJ 〇OO T~HC= 5 Cs) CO O in CM CZ> G5 l H <=5 LO o C3 OJ b (mm) LO LO r H LO C<lf 嶒(N1 r H CD 05 05 LO G5 r H LO C5 1 t L〇C=jr 4 LO OO LO OO* ΙΛ OO 卜卜卜 CO CO CO CO CO CO a (mm) cr>un> CO L〇o LO m CO LO CO LTD CO CO CO CO CO CO CO r H CO CO r 1 CO OO 04 OO CNJ 〇〇Cvj LO CN] L〇rH IH »*—< R- t 1—1 1 front heating beam parameter output (w) C5 CO f is called LO CO r H c LO T—^ LO C75 CD l H § r H <3> cn LO CT> LO o C=5 OO LO 〇〇o σϊ LO § LO OO o CO LO CO LO CO LO >< Another b(mm) CD 呀 OJ OO (NI OO csl OJ CVJ OJ OJ (N\ (N1 03 > H CNJ T~H C<1 1 H LO CD LO ai LO CT5 LO to in CO LO CD Osl <>i (Ni <Ni c<i 1- a(mm) C2> CO CO <z> CO Csl Cs! C^3 C<J c<i 〇〇1 Ή OO 〇0 1—^ CD 1 1 H CO i H CO 1—H 1 H < H 1 < 1 蛘〇0 ¢=5 〇〇C5 〇0 ci rH 〇r-^ 〇C=3 Material Alkali-free glass No glass No glass, Alkali-free glass, Alkali-free glass, Alkali-free glass, No glass, Alkali-free glass, Alkali-free glass, No glass, No glass, No glass, No glass Alkali glass Alkali-free glass, no glass, alkali-free glass, no glass, no glass, no glass, no alkali glass, no glass, 6 T—^ C<l CO LO cc> 〇0 0 Ο v ·Η <N1 T— ^ CO I 1 1 嶙mi 1 CO , 丨H 卜 r _ 00 1—^ cn rH 35 200914190 Table 2, changing the beam parameters of the two kinds of laser light 1 1 and 21 and the glass substrate (worked object 1) The thickness of the plate indicates the result of the scribing test (No. 1 to 2 1). The parameter of the c〇2 laser used for the heating energy of the i-th step is the front heating beam parameter, and the parameter of the C02 laser used for the heating energy of the third step is the rear heating beam parameter, and the second step is set. The distance between the rear edge of the cooling zone 4a and the front edge of the reheating zone 5a of the third step is the hot-cold-rear heating beam distance, and the workpiece 1 and the stage 6 and the processing system (ie, the heating zone 3, The continuous relative moving speed of the cooling zone 4a and the reheating zone 5a) is the scanning speed. Thus, the thickness of each glass substrate (1) made of alkali-free glass (1. 1 mm, 0 · 7 mm, 0 · 6 3 mm, 0 · 5 mm, 0.3 mm, 0 · 2 mm, and 0.05 mm) The depth of the scribing (the depth of the scribing crack 5b < 5 ) is not only affected by the following parameters, that is, the beam size of the elliptical laser light 1 1 , 2 1 (al, bl, a2, b2) ), the beam power (output) of the first and second laser oscillation devices 10 and 20, the distance between the cooling region 4a and the reheating region 5a, the scribing speed (scanning speed), and the like, and the parameters have specific relationship. Depending on the thickness of the workpiece 1, the cut surface (the scribe crack 5b) is extended to the back surface of the workpiece 1, and heating is sequentially generated from the front side in the traveling direction on the planned line 2b. The region 3, the cooling region 4a, and the reheating region 5a, and moving the heating region 3, the cooling region 4a, and the reheating region 5a with respect to the workpiece 1, can completely divide the workpiece 1. When the extension of the cut surface (the scribe line crack 5b) cannot completely cut the workpiece 1 (including the case where the workpiece 1 is not completely cut), in the subsequent step, the breaking force is applied to the processed portion. The object 1' is cut along the cut surface (line crack 5b) from -36 to 200914190. However, in Patent Document 4', a part of the laser light is blocked by the shutter to adjust the heating energy 'but the heating energy of the reheated beam (laser beam 2 1) is better than the light used. The adjustment of the heating energy of the gate is more effective. The reason is as follows. The power adjustment of the laser light 21 (reheating beam) emitted from the second laser oscillation device 20 is performed by adjusting the output of the second laser oscillation device 20, and the beam shape is substantially unchanged. However, only the entire heating energy (the heating energy density in the third step (the heating energy per unit area of the reheating region 5a) is changed and then irradiated to the workpiece at 1 °, that is, at the same relative moving speed, The shape and area of the reheating zone 5 a of the 3 steps and the ratio of the irradiation energy distribution of the laser light 2 1 do not change. Therefore, the relative position of the reheating zone 5a and the cooling zone 4a does not change, and the tensile stress acting on the leading end of the scribe line, that is, the force of the crack opening depends only on the power (per unit area of the reheating zone 5a) Heating energy) changes. Therefore, the force of the scribe line opening can be continuously controlled in accordance with the power (heating energy per unit area of the reheating zone 5a), and a scribe line crack 5b can be changed to form a desired depth. On the other hand, in the case where the shutter is used to adjust the heating energy, since a part of the laser beam is cut off, its beam shape (irradiation shape, area) changes. In this way, since the adjustment of the shutter is used, the beam shape is changed in addition to the heating energy, and thus the positional relationship between the reheating region 5a and the cooling region 4a is drastically changed. As described above, the phenomenon of fluctuation or extinction of the tensile stress acting on the cracked scribe line is likely to be caused, and it is difficult to form a scribe crack having a desired depth of -37 to 200914190. That is, the shutter is used to shield (or open) the rear side of the reheating laser light 21 (away from the cooling area 4a side) or the front side to adjust the heating energy of the added material 1 to be applied to a workpiece 1 Difficulties occur during the processing of one of the lines and cracks 5 b. The reason is that 'the rear side or the front side of the laser light 21 is shielded (or opened) to increase or decrease the heating energy, and since the rear end edge or the front end edge of the laser light 21 moves, the workpiece 1 is processed. The relative relationship between the reheating region 5 a (generated by the irradiation of the laser light 2 1 ) and the cooling region 4 a is further changed under the relative movement of the laser light 21, so that it is difficult to accurately perform the crack progressing operation. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the principle of a method for processing a workpiece made of a high-brittle non-metallic material according to an embodiment of the present invention. Fig. 2 is a perspective view showing the entire processing apparatus according to the first embodiment of the present invention. Fig. 3 is an explanatory view showing a processing state of the embodiment of the present invention. Fig. 4 is a line diagram showing the characteristics of the laser energy density - scribe depth of the 丨 embodiment of the present invention. Fig. 5 is an explanatory view of a conventional cutting method. Fig. 6 shows other conventional processing methods, Fig. 6(a) is an explanatory diagram of irradiation of UV laser, and Fig. 6(1)) is an explanatory diagram of irradiation of co2 laser, Fig. 6(c) The explanatory diagram of the scribe line, and the 6th (d) figure is an explanatory view of the thin glass. -38- 200914190 Picture. Figure. Figure 9 (a) shows the expansion: an explanatory diagram. Fig. 7 is a perspective view of another conventional processing method. Fig. 8 is a perspective view of another conventional processing method. Fig. 9 shows other conventional processing methods, a swollen state, and Fig. 9(b) shows a non-expanded state. The first drawing is the other conventional processing method; Ϊ [Main component symbol description] 1, 101, 111, 121, 131: workpiece 2 a : micro crack 2b, 103, 1 13 : processing line 3 : heating zone 4a : cooling zone 4 b : cracked tip 5 a : reheating zone 5 b : scribing crack 6 . stage 1 〇 : heating means (first laser oscillating device) 1 1, 21, L2 : infrared Laser light 12, 22: beam expander 1 3, 2 3 : infrared mirror 14 , 24 : cylindrical mirror 20 : reheating means (second laser oscillation device) 3 0 : cooling means 3 1 , 33 : Piping -39- 200914190 3 2 : Water supply tank 3 4 : Air compressor 3 5 : Cooling medium 40 : Crack generation means 1 0 2 : Notch 1 〇 4 : Heat source 1 〇 5 : Imaginary isotherm 106 : Crack 1 1 2 : elongated slot 1 2 2 : heating beam 1 2 3 : cooling zone 124 : blind crack 1 8 8 : air bag for groove L 1 : ultraviolet laser light-40