JP2011518444A5 - - Google Patents

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Publication number
JP2011518444A5
JP2011518444A5 JP2011506361A JP2011506361A JP2011518444A5 JP 2011518444 A5 JP2011518444 A5 JP 2011518444A5 JP 2011506361 A JP2011506361 A JP 2011506361A JP 2011506361 A JP2011506361 A JP 2011506361A JP 2011518444 A5 JP2011518444 A5 JP 2011518444A5
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JP
Japan
Prior art keywords
chamber
wall
excimer lamp
tubular body
excimer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011506361A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011518444A (ja
JP5319758B2 (ja
Filing date
Publication date
Priority claimed from US12/107,281 external-priority patent/US8022377B2/en
Application filed filed Critical
Publication of JP2011518444A publication Critical patent/JP2011518444A/ja
Publication of JP2011518444A5 publication Critical patent/JP2011518444A5/ja
Application granted granted Critical
Publication of JP5319758B2 publication Critical patent/JP5319758B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011506361A 2008-04-22 2009-04-16 エキシマ硬化処理のための装置 Expired - Fee Related JP5319758B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/107,281 US8022377B2 (en) 2008-04-22 2008-04-22 Method and apparatus for excimer curing
US12/107,281 2008-04-22
PCT/US2009/040809 WO2009131889A2 (en) 2008-04-22 2009-04-16 Method and apparatus for excimer curing

Publications (3)

Publication Number Publication Date
JP2011518444A JP2011518444A (ja) 2011-06-23
JP2011518444A5 true JP2011518444A5 (https=) 2012-06-07
JP5319758B2 JP5319758B2 (ja) 2013-10-16

Family

ID=41200336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011506361A Expired - Fee Related JP5319758B2 (ja) 2008-04-22 2009-04-16 エキシマ硬化処理のための装置

Country Status (6)

Country Link
US (1) US8022377B2 (https=)
JP (1) JP5319758B2 (https=)
KR (1) KR20110005721A (https=)
CN (1) CN102017100B (https=)
TW (1) TW201009947A (https=)
WO (1) WO2009131889A2 (https=)

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CN104254443B (zh) * 2012-04-25 2017-03-15 三菱丽阳株式会社 层积体及其制造方法
CN103872557B (zh) * 2012-12-11 2016-09-28 中国科学院大连化学物理研究所 一种非均匀电极单重态氧发生装置
US20140230770A1 (en) * 2013-02-20 2014-08-21 University Of Southern California Transient plasma electrode for radical generation
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US10573496B2 (en) 2014-12-09 2020-02-25 Applied Materials, Inc. Direct outlet toroidal plasma source
US10224210B2 (en) 2014-12-09 2019-03-05 Applied Materials, Inc. Plasma processing system with direct outlet toroidal plasma source
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US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
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US10381200B2 (en) * 2017-03-08 2019-08-13 Applied Materials, Inc. Plasma chamber with tandem processing regions
KR102453361B1 (ko) * 2018-05-18 2022-10-07 삼성전자주식회사 다중 경화 장치 및 다중 경화 장치를 이용한 반도체 칩의 제조 방법
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