JP2011516932A5 - - Google Patents

Download PDF

Info

Publication number
JP2011516932A5
JP2011516932A5 JP2010529125A JP2010529125A JP2011516932A5 JP 2011516932 A5 JP2011516932 A5 JP 2011516932A5 JP 2010529125 A JP2010529125 A JP 2010529125A JP 2010529125 A JP2010529125 A JP 2010529125A JP 2011516932 A5 JP2011516932 A5 JP 2011516932A5
Authority
JP
Japan
Prior art keywords
pad
layer
integrated circuit
antenna
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010529125A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011516932A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/079653 external-priority patent/WO2009049264A1/en
Publication of JP2011516932A publication Critical patent/JP2011516932A/ja
Publication of JP2011516932A5 publication Critical patent/JP2011516932A5/ja
Pending legal-status Critical Current

Links

JP2010529125A 2007-10-10 2008-10-10 プリント集積回路を含む無線デバイス並びにその製造及び使用方法 Pending JP2011516932A (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US97905707P 2007-10-10 2007-10-10
US60/979,057 2007-10-10
US98058107P 2007-10-17 2007-10-17
US60/980,581 2007-10-17
PCT/US2008/079653 WO2009049264A1 (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
US12/249,707 US9004366B2 (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same
US12/249,707 2008-10-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014115841A Division JP5881223B2 (ja) 2007-10-10 2014-06-04 プリント集積回路を含む無線デバイス並びにその製造及び使用方法

Publications (2)

Publication Number Publication Date
JP2011516932A JP2011516932A (ja) 2011-05-26
JP2011516932A5 true JP2011516932A5 (enExample) 2011-11-24

Family

ID=40533230

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010529125A Pending JP2011516932A (ja) 2007-10-10 2008-10-10 プリント集積回路を含む無線デバイス並びにその製造及び使用方法
JP2014115841A Expired - Fee Related JP5881223B2 (ja) 2007-10-10 2014-06-04 プリント集積回路を含む無線デバイス並びにその製造及び使用方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014115841A Expired - Fee Related JP5881223B2 (ja) 2007-10-10 2014-06-04 プリント集積回路を含む無線デバイス並びにその製造及び使用方法

Country Status (7)

Country Link
US (1) US9004366B2 (enExample)
EP (1) EP2201546B1 (enExample)
JP (2) JP2011516932A (enExample)
KR (1) KR101539125B1 (enExample)
CN (1) CN101896947B (enExample)
CA (1) CA2702399C (enExample)
WO (1) WO2009049264A1 (enExample)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010127509A1 (en) * 2009-05-08 2010-11-11 Confidex Ltd. Rfid transponder
US9183973B2 (en) * 2009-05-28 2015-11-10 Thin Film Electronics Asa Diffusion barrier coated substrates and methods of making the same
WO2011118379A1 (ja) * 2010-03-24 2011-09-29 株式会社村田製作所 Ｒｆｉｄシステム
KR200461991Y1 (ko) * 2011-12-22 2012-08-20 주식회사 이그잭스 별도의 루프부 시트와 다이폴부 시트로 이루어진 유에이치에프 알에프아이디 태그
EP2810258A4 (en) * 2012-02-02 2015-09-09 Neo Eco Systems Ltd SYSTEM AND METHOD FOR AUTOMATIC PRODUCT DISTRIBUTION
DE102012010560B4 (de) * 2012-05-29 2020-07-09 Mühlbauer Gmbh & Co. Kg Transponder, Verfahren zur Herstellung eines Transponders und Vorrichtungzum Herstellen des Transponders
CN103778460A (zh) * 2012-10-12 2014-05-07 上海中京电子标签集成技术有限公司 带有大接触板的无线射频识别集成电路
US9424507B2 (en) * 2014-04-01 2016-08-23 Nxp B.V. Dual interface IC card components and method for manufacturing the dual-interface IC card components
US9476635B2 (en) * 2014-06-25 2016-10-25 Haier Us Appliance Solutions, Inc. Radio frequency identification heat flux measurement systems for refrigerator vacuum insulation panels
US9519904B2 (en) * 2014-10-19 2016-12-13 Thin Film Electronics Asa NFC/RF mechanism with multiple valid states for detecting an open container, and methods of making and using the same
JP5907365B1 (ja) * 2014-11-07 2016-04-26 株式会社村田製作所 無線通信デバイスおよびその製造方法、ならびにｒｆｉｃ素子付きシールおよびその作製方法
WO2016072335A1 (ja) * 2014-11-07 2016-05-12 株式会社 村田製作所 無線通信デバイスおよびその製造方法、ならびにｒｆｉｃ素子付きシールおよびその作製方法
US20160300240A1 (en) * 2015-04-10 2016-10-13 Thin Film Electronics Asa Sensor-based nfc/rf mechanism with multiple valid states for detecting an open or compromised container, and methods of making and using the same
WO2016203882A1 (ja) * 2015-06-18 2016-12-22 株式会社村田製作所 キャリアテープ及びその製造方法、並びにｒｆｉｄタグの製造方法
US20180285706A1 (en) * 2015-10-06 2018-10-04 Thin Film Electronics Asa Electronic Device Having an Antenna, Metal Trace(s) and/or Inductor With a Printed Adhesion Promoter Thereon, and Methods of Making and Using the Same
WO2017069059A1 (ja) 2015-10-21 2017-04-27 東レ株式会社 コンデンサおよびその製造方法ならびにそれを用いた無線通信装置
WO2017100752A2 (en) * 2015-12-11 2017-06-15 Thin Film Electronics Asa Electronic device having a plated antenna and/or trace, and methods of making and using the same
CN109415146A (zh) * 2016-04-18 2019-03-01 薄膜电子有限公司 具有智能标签的瓶子和用于瓶子的智能标签的制造及使用方法
CN105868823A (zh) * 2016-06-03 2016-08-17 广东楚天龙智能卡有限公司 一种生产良率高的双界面ic卡用线圈、采用该线圈的ic卡及其生产方法
WO2018012391A1 (ja) 2016-07-15 2018-01-18 株式会社村田製作所 Ｒｆｉｄタグの製造装置及びｒｆｉｄタグの製造方法
US20180158788A1 (en) * 2016-12-01 2018-06-07 Avery Dennison Retail Information Services, Llc Mixed structure method of layout of different size elements to optimize the area usage on a wafer
US20180253632A1 (en) * 2017-03-03 2018-09-06 Thin Film Electronics Asa Connectable smart label or tag, and methods of making and connecting the same
CN107219028A (zh) * 2017-05-05 2017-09-29 华东师范大学 一种基于喷墨打印技术的柔性无线压力检测系统的制备方法
CN110998820B (zh) * 2017-08-17 2023-10-20 东京毅力科创株式会社 用于实时感测工业制造设备中的属性的装置和方法
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
KR20200068718A (ko) * 2017-10-16 2020-06-15 셈테크 코포레이션 전송 태그
CN110600439A (zh) * 2018-06-12 2019-12-20 深圳市环基实业有限公司 一种rfid芯片及其制作方法
CN112088303A (zh) 2018-06-18 2020-12-15 东京毅力科创株式会社 对制造设备中的特性的降低干扰的实时感测
US11742363B2 (en) 2018-10-22 2023-08-29 Ensurge Micropower Asa Barrier stacks for printed and/or thin film electronics, methods of manufacturing the same, and method of controlling a threshold voltage of a thin film transistor
US11763119B2 (en) * 2018-10-30 2023-09-19 Avery Dennison Retail Information Services Llc Ultrasonically welded label systems and methods
JP7586844B2 (ja) * 2019-06-20 2024-11-19 テトラ ラバル ホールディングス アンド ファイナンス エス エイ 包装材料のための方法
DE102020107881A1 (de) * 2019-11-25 2021-05-27 Sensormatic Electronics, LLC Flexibler wassergeschützter sensortag
US11281874B2 (en) * 2020-06-11 2022-03-22 The Board Of Trustees Of The Leland Stanford Junior University Flexible tag device and flexible sensing system comprising the same
DE102020209307A1 (de) * 2020-07-23 2022-01-27 Robert Bosch Gesellschaft mit beschränkter Haftung Radarsensor mit Hohlleiterstruktur

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6100804A (en) 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6891110B1 (en) 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
EP1039543B1 (en) * 1999-03-24 2014-02-26 Motorola Solutions, Inc. Circuit chip connector and method of connecting a circuit chip
US6509217B1 (en) 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
WO2005006247A1 (en) * 2003-07-15 2005-01-20 Axalto S.A. Chip card including tamper-proof security features
US7768405B2 (en) * 2003-12-12 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and manufacturing method thereof
US7309563B2 (en) * 2003-12-19 2007-12-18 Palo Alto Research Center Incorporated Patterning using wax printing and lift off
JP4671681B2 (ja) * 2003-12-19 2011-04-20 株式会社半導体エネルギー研究所 半導体装置及びその作製方法
US7405665B2 (en) 2003-12-19 2008-07-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, RFID tag and label-like object
JP4761779B2 (ja) * 2004-01-23 2011-08-31 株式会社半導体エネルギー研究所 Ｉｄラベル、ｉｄカード、ｉｄタグ、及び物品
WO2005089143A2 (en) 2004-03-12 2005-09-29 A K Stamping Co. Inc. Manufacture of rfid tags and intermediate products therefor
US7292148B2 (en) 2004-06-18 2007-11-06 Avery Dennison Corporation Method of variable position strap mounting for RFID transponder
US7307527B2 (en) 2004-07-01 2007-12-11 Avery Dennison Corporation RFID device preparation system and method
US7164353B2 (en) * 2004-12-22 2007-01-16 Avery Dennison Corporation Method and system for testing RFID devices
KR100634327B1 (ko) * 2005-04-13 2006-10-13 한국기계연구원 롤-투-롤 윤전인쇄방식을 이용한 전자소자의 제조방법 및그 제조장치
US7359823B2 (en) 2005-05-25 2008-04-15 Avery Dennison RFID device variable test systems and methods
US7465674B2 (en) * 2005-05-31 2008-12-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US7413124B2 (en) * 2005-07-19 2008-08-19 3M Innovative Properties Company RFID reader supporting one-touch search functionality
US7646305B2 (en) 2005-10-25 2010-01-12 Checkpoint Systems, Inc. Capacitor strap

Similar Documents

Publication Publication Date Title
JP2011516932A5 (enExample)
JP4494771B2 (ja) スマートラベルおよびスマートラベルウェブ
JP2005513585A5 (enExample)
JP2012510115A5 (ja) デバイスの製造方法、および、印刷アンテナを備えるデバイス
JP5536211B2 (ja) 部品のパッケージ化又は実装方法
US20160255717A1 (en) Multilayer wiring board
JP4498378B2 (ja) 基板およびその製造方法、回路装置およびその製造方法
JP5088544B2 (ja) 無線ｉｃデバイスの製造方法
KR101219905B1 (ko) 인쇄회로기판 및 그의 제조 방법
KR20090105661A (ko) 다층 인쇄회로기판 및 그 제조방법
KR101905879B1 (ko) 인쇄회로기판 및 그의 제조 방법
US20040106288A1 (en) Method for manufacturing circuit devices
WO2018012391A1 (ja) Ｒｆｉｄタグの製造装置及びｒｆｉｄタグの製造方法
TW202005006A (zh) 在撓性或剛性載具上的單分電子基板及相關方法
JP4086607B2 (ja) 回路装置の製造方法
JP5672991B2 (ja) 非接触通信媒体の製造方法
JP6838688B1 (ja) Ｒｆｉｃモジュール、ｒｆｉｄタグ及びそれらの製造方法
JP2020074054A (ja) Ｒｆｉｄタグの製造方法、ｒｆｉｄタグの製造装置、及び転写シートの製造方法
KR101369861B1 (ko) 연성 인쇄회로기판 및 그 제조방법
KR20090051529A (ko) 전기소자 내장 다층 연성 인쇄회로기판 및 그 제조 방법
JP2007088461A5 (enExample)
KR101154352B1 (ko) 임베디드 인쇄회로기판용 부재 및 그 제조 방법 및 임베디드 인쇄회로기판용 부재를 이용한 임베디드 인쇄회로기판 제조 방법
JP2006080440A (ja) 回路基板及び半導体装置
KR101510625B1 (ko) 임베디드 연성회로기판의 제조방법
JP2009517730A (ja) トランスポンダ及びその製造方法