KR101539125B1 - 인쇄 집적 회로소자를 포함하는 무선 장치 및 이의 제조 및 사용 방법 - Google Patents

인쇄 집적 회로소자를 포함하는 무선 장치 및 이의 제조 및 사용 방법 Download PDF

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Publication number
KR101539125B1
KR101539125B1 KR1020107007755A KR20107007755A KR101539125B1 KR 101539125 B1 KR101539125 B1 KR 101539125B1 KR 1020107007755 A KR1020107007755 A KR 1020107007755A KR 20107007755 A KR20107007755 A KR 20107007755A KR 101539125 B1 KR101539125 B1 KR 101539125B1
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South Korea
Prior art keywords
antenna
substrate
integrated circuit
stock
inductor
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Expired - Fee Related
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KR1020107007755A
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English (en)
Korean (ko)
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KR20100065186A (ko
Inventor
패트릭 스미스
크리스웰 최
바이크람 퍼베이트
제임스 몬터규 클리브스
비벡 수브라마니안
리차드 영
빈스 비비아노
Original Assignee
코비오 인코포레이티드
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Publication of KR20100065186A publication Critical patent/KR20100065186A/ko
Application granted granted Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Details Of Aerials (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020107007755A 2007-10-10 2008-10-10 인쇄 집적 회로소자를 포함하는 무선 장치 및 이의 제조 및 사용 방법 Expired - Fee Related KR101539125B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US97905707P 2007-10-10 2007-10-10
US60/979,057 2007-10-10
US98058107P 2007-10-17 2007-10-17
US60/980,581 2007-10-17
US12/249,707 2008-10-10
US12/249,707 US9004366B2 (en) 2007-10-10 2008-10-10 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same

Publications (2)

Publication Number Publication Date
KR20100065186A KR20100065186A (ko) 2010-06-15
KR101539125B1 true KR101539125B1 (ko) 2015-07-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107007755A Expired - Fee Related KR101539125B1 (ko) 2007-10-10 2008-10-10 인쇄 집적 회로소자를 포함하는 무선 장치 및 이의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US9004366B2 (enExample)
EP (1) EP2201546B1 (enExample)
JP (2) JP2011516932A (enExample)
KR (1) KR101539125B1 (enExample)
CN (1) CN101896947B (enExample)
CA (1) CA2702399C (enExample)
WO (1) WO2009049264A1 (enExample)

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KR200461991Y1 (ko) * 2011-12-22 2012-08-20 주식회사 이그잭스 별도의 루프부 시트와 다이폴부 시트로 이루어진 유에이치에프 알에프아이디 태그
CN104205178A (zh) * 2012-02-02 2014-12-10 尼奥生态系统有限公司 售卖产品的系统和方法
DE102012010560B4 (de) * 2012-05-29 2020-07-09 Mühlbauer Gmbh & Co. Kg Transponder, Verfahren zur Herstellung eines Transponders und Vorrichtungzum Herstellen des Transponders
CN103778460A (zh) * 2012-10-12 2014-05-07 上海中京电子标签集成技术有限公司 带有大接触板的无线射频识别集成电路
US9424507B2 (en) * 2014-04-01 2016-08-23 Nxp B.V. Dual interface IC card components and method for manufacturing the dual-interface IC card components
US9476635B2 (en) * 2014-06-25 2016-10-25 Haier Us Appliance Solutions, Inc. Radio frequency identification heat flux measurement systems for refrigerator vacuum insulation panels
US9519904B2 (en) * 2014-10-19 2016-12-13 Thin Film Electronics Asa NFC/RF mechanism with multiple valid states for detecting an open container, and methods of making and using the same
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CN106030618B (zh) * 2014-11-07 2018-11-20 株式会社村田制作所 无线通信装置及其制造方法、以及带rfic元件贴片及其制作方法
WO2016168089A1 (en) * 2015-04-10 2016-10-20 Thin Film Electronics Asa Sensor-based nfc/rf mechanism with multiple valid states for detecting an open or compromised container
CN106471524B (zh) * 2015-06-18 2019-07-30 株式会社村田制作所 载带及其制造方法以及rfid标签的制造方法
US20180285706A1 (en) * 2015-10-06 2018-10-04 Thin Film Electronics Asa Electronic Device Having an Antenna, Metal Trace(s) and/or Inductor With a Printed Adhesion Promoter Thereon, and Methods of Making and Using the Same
US10636866B2 (en) * 2015-10-21 2020-04-28 Toray Industries, Inc. Capacitor, method for manufacturing same, and wireless communication device using same
US10667397B2 (en) * 2015-12-11 2020-05-26 Thin Film Electronics Asa Electronic device having a plated antenna and/or trace, and methods of making and using the same
WO2017184603A1 (en) * 2016-04-18 2017-10-26 Thin Film Electronics Asa Bottles with smart labels, and methods of making and using smart labels for bottles
CN105868823A (zh) * 2016-06-03 2016-08-17 广东楚天龙智能卡有限公司 一种生产良率高的双界面ic卡用线圈、采用该线圈的ic卡及其生产方法
CN109478246B (zh) 2016-07-15 2021-12-10 株式会社村田制作所 Rfid标签的制造装置以及rfid标签的制造方法
WO2018102645A1 (en) * 2016-12-01 2018-06-07 Avery Dennison Retail Information Services, Llc A mixed structure method of layout of different size elements to optimize the area usage on a wafer
US20180253632A1 (en) * 2017-03-03 2018-09-06 Thin Film Electronics Asa Connectable smart label or tag, and methods of making and connecting the same
CN107219028A (zh) * 2017-05-05 2017-09-29 华东师范大学 一种基于喷墨打印技术的柔性无线压力检测系统的制备方法
TWI806772B (zh) * 2017-08-17 2023-06-21 日商東京威力科創股份有限公司 工業製造設備中特性的即時感測裝置和方法
SE542007C2 (en) * 2017-10-13 2020-02-11 Stora Enso Oyj A method and an apparatus for producing a radio-frequency identification transponder
US10783418B2 (en) * 2017-10-16 2020-09-22 Semtech Corporation Transmitting tag
CN110600439A (zh) * 2018-06-12 2019-12-20 深圳市环基实业有限公司 一种rfid芯片及其制作方法
WO2019245729A1 (en) 2018-06-18 2019-12-26 Tokyo Electron Limited Reduced interference, real-time sensing of properties in manufacturing equipment
US11742363B2 (en) 2018-10-22 2023-08-29 Ensurge Micropower Asa Barrier stacks for printed and/or thin film electronics, methods of manufacturing the same, and method of controlling a threshold voltage of a thin film transistor
WO2020092489A1 (en) * 2018-10-30 2020-05-07 Avery Dennison Retail Information Services, Llc Ultrasonically welded label systems and methods
US12049338B2 (en) * 2019-06-20 2024-07-30 Tetra Laval Holdings & Finance S.A. Method for a packaging material
DE102020107881A1 (de) * 2019-11-25 2021-05-27 Sensormatic Electronics, LLC Flexibler wassergeschützter sensortag
US11281874B2 (en) * 2020-06-11 2022-03-22 The Board Of Trustees Of The Leland Stanford Junior University Flexible tag device and flexible sensing system comprising the same
DE102020209307A1 (de) * 2020-07-23 2022-01-27 Robert Bosch Gesellschaft mit beschränkter Haftung Radarsensor mit Hohlleiterstruktur

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US20050136358A1 (en) * 2003-12-19 2005-06-23 Palo Alto Research Center Incorporated Patterning using wax printing and lift off

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Also Published As

Publication number Publication date
EP2201546A4 (en) 2016-06-22
EP2201546A1 (en) 2010-06-30
EP2201546B1 (en) 2018-10-03
CA2702399A1 (en) 2009-04-16
JP2014160515A (ja) 2014-09-04
US20090095818A1 (en) 2009-04-16
CA2702399C (en) 2019-01-08
CN101896947A (zh) 2010-11-24
KR20100065186A (ko) 2010-06-15
JP5881223B2 (ja) 2016-03-09
US9004366B2 (en) 2015-04-14
WO2009049264A1 (en) 2009-04-16
JP2011516932A (ja) 2011-05-26
CN101896947B (zh) 2016-05-11

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