JP2011516633A - 熱伝導性プラスチック材料のヒートシンク - Google Patents
熱伝導性プラスチック材料のヒートシンク Download PDFInfo
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- JP2011516633A JP2011516633A JP2011500190A JP2011500190A JP2011516633A JP 2011516633 A JP2011516633 A JP 2011516633A JP 2011500190 A JP2011500190 A JP 2011500190A JP 2011500190 A JP2011500190 A JP 2011500190A JP 2011516633 A JP2011516633 A JP 2011516633A
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- Prior art keywords
- heat sink
- thermally conductive
- plastic material
- weight
- conductive plastic
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- 239000004033 plastic Substances 0.000 title claims abstract description 102
- 229920003023 plastic Polymers 0.000 title claims abstract description 102
- 239000000463 material Substances 0.000 title claims abstract description 72
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000010439 graphite Substances 0.000 claims abstract description 26
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 26
- 239000011247 coating layer Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000004891 communication Methods 0.000 claims abstract description 5
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000654 additive Substances 0.000 claims description 16
- 229920001169 thermoplastic Polymers 0.000 claims description 14
- 230000000996 additive effect Effects 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 14
- 239000000835 fiber Substances 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- 239000000945 filler Substances 0.000 description 11
- 239000000843 powder Substances 0.000 description 10
- 239000011231 conductive filler Substances 0.000 description 9
- 229920000049 Carbon (fiber) Polymers 0.000 description 8
- 239000004917 carbon fiber Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 7
- 239000002245 particle Substances 0.000 description 7
- 238000010292 electrical insulation Methods 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 229920001187 thermosetting polymer Polymers 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000011295 pitch Substances 0.000 description 4
- 239000012744 reinforcing agent Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229920006114 semi-crystalline semi-aromatic polyamide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000002991 molded plastic Substances 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004634 thermosetting polymer Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 229920003189 Nylon 4,6 Polymers 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000002196 Pyroceram Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000012963 UV stabilizer Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011304 carbon pitch Substances 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920006126 semicrystalline polymer Polymers 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
Λ⊥=面貫通(through−plane)熱伝導率であり、
Λ//=最大面内熱伝導率の方向での面内熱伝導率であり、本明細書においては平行または長手方向の熱伝導率とも記載され、
Λ±=最小面内熱伝導率の方向での面内熱伝導率である。
[材料]
標準的な溶融混合プロセスを使用して押出機中で、成形組成物を、ポリアミド−46と、それぞれ炭素ピッチ繊維(CPF)、窒化ホウ素(BN)、および膨張黒鉛(EG)とから調製した。適切な寸法の正方形の金型と、その正方形の一辺に位置する幅80mmおよび高さ1mmのフィルムゲートとを取り付けた射出成形機を使用して射出成形することによって、これらの組成物から80×80×1mmの寸法の試験サンプルを作製した。
IEC 60695−2−12に準拠してGWFI(グローワイヤー燃焼性指数)を測定した
面貫通(Λ⊥)熱伝導率および面内(Λ//)熱伝導率は、熱拡散率D、密度(ρ)、および熱容量(Cp)を求めることによって測定した。
Λx=Dx *ρ*Cp (V)
(式中、x=それぞれ//、±、および^である)
に従って求めた。
種々の材料および試験の組成および試験結果を以下の表Iにまとめている。
実施例Iで使用した材料を使用して、LEDデバイスの電子部品の保護ハウジングとして機能する円筒形カップの形状を有するLEDデバイス用ヒートシンクを成形した。カップの外面に熱硬化性ポリエステル粉末コーティングを静電コーティングし、標準的な硬化条件を使用してオーブン中で硬化させた。このカップは、非常に良好な熱遮蔽および放熱特性、ならびに電気絶縁性を示した。
Claims (13)
- 熱伝導性プラスチック材料の全重量を基準にして少なくとも20重量%の量の膨張黒鉛を含む熱伝導性プラスチック材料でできたプラスチック本体を含む、電気デバイスまたは電子デバイス用ヒートシンク。
- 少なくとも7.5W/m・Kの面内熱伝導率Λ//を有する熱伝導性プラスチック材料でできたプラスチック本体を含む、電気デバイスまたは電子デバイス用ヒートシンク。
- 前記プラスチック本体の表面の少なくとも一部を覆う金属コーティング層を含む、請求項1または2に記載のヒートシンク。
- 前記プラスチック本体の表面の少なくとも一部を覆う、電気絶縁性プラスチック材料からなるコーティング層を含む、請求項1または2に記載のヒートシンク。
- 前記熱伝導性プラスチック材料が導電性であり、前記コーティング層が塗布される場所において前記ヒートシンクが少なくとも1kVの絶縁破壊強度を有する、請求項4に記載のヒートシンク。
- 熱伝導性成分の総量を基準にして好ましくは少なくとも25重量%の量で膨張黒鉛を含む熱伝導性成分の混合物を、前記熱伝導性プラスチック材料が含む、請求項2に記載のヒートシンク。
- 前記熱伝導性プラスチック材料が、30〜80重量%の熱可塑性ポリマー、20〜70重量%の熱伝導性成分、および0〜50重量%の添加剤からなり、重量パーセント値(重量%)は、前記熱伝導性プラスチック材料の全重量を基準としている、請求項1〜6のいずれか1項に記載のヒートシンク。
- 電気デバイスまたは電子デバイス用ヒートシンクの製造方法であって、熱伝導性プラスチック材料を射出成形することによって、熱伝導性プラスチック本体を形成するステップと、続いて、前記プラスチック本体の少なくとも一部の上にコーティング層を塗布するステップとを含み、前記熱伝導性プラスチック材料が、前記熱伝導性プラスチック材料の全重量を基準にして少なくとも20重量%の量の膨張黒鉛を含む、および/または少なくとも7.5W/m・Kの面内熱伝導率Λ//を有する、方法。
- 前記プラスチック材料が導電性であり、前記コーティング層が電気絶縁性材料からなるか、または、前記プラスチック材料が非導電性であり、前記コーティング層が金属層であるかである、請求項8に記載の方法。
- 請求項1〜7のいずれか1項に記載のヒートシンク、あるいは請求項8または9に記載の方法によって得ることができるヒートシンクを、発熱するデバイスと熱伝導連通するように組み合わせるステップを含む、E&Eデバイスの製造方法。
- 熱源と、請求項1〜7のいずれか1項に記載のヒートシンクとを互いに熱伝導連通した状態で含む、電気デバイスまたは電子デバイス(E&Eデバイス)。
- 前記ヒートシンクに接続された半導体を含む半導体デバイスであるか、またはヒートスプレッダーに接続された金属コアPCB上に複数のLEDを含むLEDデバイスである、請求項11に記載のE&Eデバイス。
- ヒートシンクが、LEDデバイスの電子部品を覆う保護ハウジングである、請求項11に記載のE&Eデバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08005318.4 | 2008-03-20 | ||
EP08005318 | 2008-03-20 | ||
PCT/EP2009/053129 WO2009115512A1 (en) | 2008-03-20 | 2009-03-17 | Heatsinks of thermally conductive plastic materials |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011516633A true JP2011516633A (ja) | 2011-05-26 |
JP5430645B2 JP5430645B2 (ja) | 2014-03-05 |
Family
ID=39891695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011500190A Expired - Fee Related JP5430645B2 (ja) | 2008-03-20 | 2009-03-17 | 熱伝導性プラスチック材料のヒートシンク |
Country Status (7)
Country | Link |
---|---|
US (1) | US20110103021A1 (ja) |
EP (1) | EP2254940B1 (ja) |
JP (1) | JP5430645B2 (ja) |
KR (1) | KR101637616B1 (ja) |
CN (1) | CN101977976B (ja) |
PL (1) | PL2254940T3 (ja) |
WO (1) | WO2009115512A1 (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011225648A (ja) * | 2010-04-15 | 2011-11-10 | Kaneka Corp | 照明用放熱部材 |
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JP2011225648A (ja) * | 2010-04-15 | 2011-11-10 | Kaneka Corp | 照明用放熱部材 |
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JP2013118260A (ja) * | 2011-12-02 | 2013-06-13 | Nagase Chemtex Corp | 中空構造電子部品 |
KR20140074672A (ko) | 2012-12-10 | 2014-06-18 | 코웨이 주식회사 | 열재생 제습필터 및 이를 구비하는 제습기 |
KR102010980B1 (ko) * | 2012-12-10 | 2019-08-14 | 웅진코웨이 주식회사 | 열재생 제습필터 및 이를 구비하는 제습기 |
JP2016513139A (ja) * | 2012-12-20 | 2016-05-12 | ダウ グローバル テクノロジーズ エルエルシー | 無線通信塔のためのポリマー複合体構成部品 |
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JP2019054288A (ja) * | 2018-12-25 | 2019-04-04 | ナガセケムテックス株式会社 | 中空構造電子部品 |
Also Published As
Publication number | Publication date |
---|---|
CN101977976A (zh) | 2011-02-16 |
JP5430645B2 (ja) | 2014-03-05 |
PL2254940T3 (pl) | 2014-11-28 |
US20110103021A1 (en) | 2011-05-05 |
CN101977976B (zh) | 2014-08-27 |
KR20100126415A (ko) | 2010-12-01 |
EP2254940A1 (en) | 2010-12-01 |
WO2009115512A1 (en) | 2009-09-24 |
EP2254940B1 (en) | 2014-06-25 |
KR101637616B1 (ko) | 2016-07-07 |
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