PL2254940T3 - Radiator z przewodzących materiałów z tworzyw sztucznych - Google Patents

Radiator z przewodzących materiałów z tworzyw sztucznych

Info

Publication number
PL2254940T3
PL2254940T3 PL09722883T PL09722883T PL2254940T3 PL 2254940 T3 PL2254940 T3 PL 2254940T3 PL 09722883 T PL09722883 T PL 09722883T PL 09722883 T PL09722883 T PL 09722883T PL 2254940 T3 PL2254940 T3 PL 2254940T3
Authority
PL
Poland
Prior art keywords
heat sink
plastic materials
conductive plastic
sink made
conductive
Prior art date
Application number
PL09722883T
Other languages
English (en)
Inventor
Robert Hendrik Catharina Janssen
Van Franciscus Vehmendahl
Original Assignee
Dsm Ip Assets Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39891695&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL2254940(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Dsm Ip Assets Bv filed Critical Dsm Ip Assets Bv
Publication of PL2254940T3 publication Critical patent/PL2254940T3/pl

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/70Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77Auxiliary members characterised by their shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00Arrangements for thermal protection or thermal control
    • H10W40/20Arrangements for cooling
    • H10W40/25Arrangements for cooling characterised by their materials
    • H10W40/251Organics

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
PL09722883T 2008-03-20 2009-03-17 Radiator z przewodzących materiałów z tworzyw sztucznych PL2254940T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08005318 2008-03-20
PCT/EP2009/053129 WO2009115512A1 (en) 2008-03-20 2009-03-17 Heatsinks of thermally conductive plastic materials
EP09722883.7A EP2254940B1 (en) 2008-03-20 2009-03-17 Heatsinks of thermally conductive plastic materials

Publications (1)

Publication Number Publication Date
PL2254940T3 true PL2254940T3 (pl) 2014-11-28

Family

ID=39891695

Family Applications (1)

Application Number Title Priority Date Filing Date
PL09722883T PL2254940T3 (pl) 2008-03-20 2009-03-17 Radiator z przewodzących materiałów z tworzyw sztucznych

Country Status (7)

Country Link
US (1) US20110103021A1 (pl)
EP (1) EP2254940B1 (pl)
JP (1) JP5430645B2 (pl)
KR (1) KR101637616B1 (pl)
CN (1) CN101977976B (pl)
PL (1) PL2254940T3 (pl)
WO (1) WO2009115512A1 (pl)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
CN102762920B (zh) * 2010-02-11 2015-04-08 帝斯曼知识产权资产管理有限公司 Led照明装置
US10240772B2 (en) * 2010-04-02 2019-03-26 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
JP5740097B2 (ja) * 2010-04-15 2015-06-24 株式会社カネカ ヒートシンク用高熱伝導性樹脂成形体
FR2965699B1 (fr) 2010-10-05 2013-03-29 Commissariat Energie Atomique Dispositif pour la dissipation thermique destine a au moins un composant electronique et procede correspondant
US20120319031A1 (en) 2011-06-15 2012-12-20 Thermal Solution Resources, Llc Thermally conductive thermoplastic compositions
US9288513B2 (en) 2011-08-29 2016-03-15 Aerovironment, Inc. System and method of high-resolution digital data image transmission
US8559801B2 (en) * 2011-08-29 2013-10-15 Aerovironment, Inc. Ball turret heat sink and EMI shielding
US11401045B2 (en) 2011-08-29 2022-08-02 Aerovironment, Inc. Camera ball turret having high bandwidth data transmission to external image processor
US9156551B2 (en) 2011-08-29 2015-10-13 Aerovironment, Inc. Tilt-ball turret with gimbal lock avoidance
US8523462B2 (en) 2011-08-29 2013-09-03 Aerovironment, Inc. Roll-tilt ball turret camera having coiled data transmission cable
JP6119950B2 (ja) * 2011-12-02 2017-04-26 ナガセケムテックス株式会社 中空構造電子部品
CN103162268A (zh) 2011-12-14 2013-06-19 欧司朗股份有限公司 散热装置和具有该散热装置的照明装置
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
US20140080951A1 (en) 2012-09-19 2014-03-20 Chandrashekar Raman Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140080954A1 (en) * 2012-09-19 2014-03-20 Chandrashekar Raman Methods for making thermally conductve compositions containing boron nitride
US9434870B2 (en) 2012-09-19 2016-09-06 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
KR102010980B1 (ko) 2012-12-10 2019-08-14 웅진코웨이 주식회사 열재생 제습필터 및 이를 구비하는 제습기
US10287473B2 (en) 2012-12-20 2019-05-14 Dow Global Technologies Llc Polymer composite components for wireless-communication towers
US10156352B2 (en) 2013-04-19 2018-12-18 Covestro Llc In mold electronic printed circuit board encapsulation and assembly
JP6071981B2 (ja) * 2013-11-29 2017-02-01 ゼネラル・エレクトリック・カンパニイ 放射線検出装置及び放射線断層撮影装置
US20150221578A1 (en) * 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
EP2924062B1 (de) * 2014-03-27 2019-02-13 LANXESS Deutschland GmbH Flammwidrige Polyamidzusammensetzungen
CN104235649A (zh) * 2014-08-19 2014-12-24 宁波爱科电气实业有限公司 一种改进型led灯
KR102342312B1 (ko) 2014-12-29 2021-12-22 삼성디스플레이 주식회사 플렉서블 표시 장치
CN104617712B (zh) * 2015-01-22 2017-12-26 珠海格力电器股份有限公司 电机外壳和伺服电机
FR3034771B1 (fr) 2015-04-13 2019-04-19 Hutchinson Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation
FR3034775B1 (fr) 2015-04-13 2018-09-28 Hutchinson Materiau pour le stockage thermique
JP6508468B2 (ja) * 2015-07-24 2019-05-08 東芝ライテック株式会社 車両用照明装置、および車両用灯具
KR101791069B1 (ko) 2015-10-06 2017-10-27 주식회사 지티에스 그라파이트 복합 성형 소재 및 이를 이용한 방열재 제조방법
WO2018148116A1 (en) * 2017-02-09 2018-08-16 Polyone Corporation Thermally conductive polyvinyl halide
US20200001508A1 (en) 2017-03-07 2020-01-02 Covestro Llc Two shot injection molding process for thermoplastic parts
JP6467689B2 (ja) * 2017-03-13 2019-02-13 ナガセケムテックス株式会社 中空構造電子部品
US10098267B1 (en) * 2017-06-06 2018-10-09 Robert Bosch Llc Housing for a camera and method of manufacture
US10368465B2 (en) * 2017-09-07 2019-07-30 Lear Corporation Electrical unit
US10976120B2 (en) * 2017-10-13 2021-04-13 Hamilton Sundstrand Corporation Net shape moldable thermally conductive materials
DE102018120713A1 (de) * 2018-08-24 2020-02-27 Carl Freudenberg Kg Wärmetransportmaterial mit guten Schallabsorptionseigenschaften
JP6757787B2 (ja) * 2018-12-25 2020-09-23 ナガセケムテックス株式会社 中空構造電子部品
USD903610S1 (en) 2019-08-28 2020-12-01 Carbice Corporation Flexible heat sink
US20210063099A1 (en) 2019-08-28 2021-03-04 Carbice Corporation Flexible and conformable polymer-based heat sinks and methods of making and using thereof
USD904322S1 (en) 2019-08-28 2020-12-08 Carbice Corporation Flexible heat sink
USD906269S1 (en) 2019-08-28 2020-12-29 Carbice Corporation Flexible heat sink
WO2021076561A1 (en) 2019-10-15 2021-04-22 Covestro Llc Three part headlamp assembly
KR102280275B1 (ko) 2019-11-22 2021-07-21 더원씨엔티(주) 탄소복합 방열소재 및 그 제조방법
KR102384315B1 (ko) 2019-11-25 2022-04-07 재단법인 한국탄소산업진흥원 열가소성수지 기반 열전도성 마스터배치의 제조방법 및 그를 이용한 방열복합소재
WO2021198746A1 (en) * 2020-04-02 2021-10-07 Bosch Car Multimedia Portugal, S.A. Enclosure with integrated thermal management and improved emi-se
CN112123685B (zh) * 2020-08-04 2022-05-31 苏州呈润电子有限公司 一种显示器支架外壳新型注塑成型工艺
WO2023126667A1 (en) 2021-12-29 2023-07-06 Bosch Car Multimedia Portugal S.A Cover, enclosure and manufacturing method thereof, for electromagnetic shielding
GB2627959A (en) * 2023-03-08 2024-09-11 Continental Automotive Tech Gmbh Electronic device for a vehicle
US12180411B2 (en) * 2023-04-27 2024-12-31 Valeo Vision Thermally conductive component with a bulk molded compound and no base coat
WO2025174788A1 (en) 2024-02-13 2025-08-21 Covestro Llc Insert molding and in-mold coating over substrates with pressure sensitive elements

Family Cites Families (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4471837A (en) * 1981-12-28 1984-09-18 Aavid Engineering, Inc. Graphite heat-sink mountings
FR2654387B1 (fr) * 1989-11-16 1992-04-10 Lorraine Carbone Materiau multicouche comprenant du graphite souple renforce mecaniquement, electriquement et thermiquement par un metal et procede de fabrication.
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US6869642B2 (en) * 2000-05-18 2005-03-22 Raymond G. Freuler Phase change thermal interface composition having induced bonding property
US6395199B1 (en) * 2000-06-07 2002-05-28 Graftech Inc. Process for providing increased conductivity to a material
JP4759122B2 (ja) * 2000-09-12 2011-08-31 ポリマテック株式会社 熱伝導性シート及び熱伝導性グリス
NL1016340C2 (nl) * 2000-10-05 2002-04-08 Dsm Nv Halogeenvrije vlamvertragende samenstelling en vlamdovende polyamidesamenstelling.
JP2002121404A (ja) * 2000-10-19 2002-04-23 Polymatech Co Ltd 熱伝導性高分子シート
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
JP2003037227A (ja) * 2001-07-23 2003-02-07 Nippon Leakless Corp 膨張黒鉛製ヒートシンク
US20050032966A1 (en) * 2001-10-17 2005-02-10 Jawk Meijer Polymeric nanocomposite
DE10203971A1 (de) * 2002-01-31 2003-08-14 Bayer Ag Schlagzäh-modifizierte Polyamidformmassen mit erhöhter Schmelzeviskosität und verbesserter Oberflächenqualität
US20030183379A1 (en) * 2002-03-29 2003-10-02 Krassowski Daniel W. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US7108055B2 (en) * 2002-03-29 2006-09-19 Advanced Energy Technology Inc. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US6886233B2 (en) * 2002-05-13 2005-05-03 Egc Enterprises, Inc. Method for decreasing the thickness of flexible expanded graphite sheet
DE10224887A1 (de) * 2002-06-05 2003-12-18 Bayer Ag Flammwidrig ausgerüstete Kunststoff-Formmassen
US6771502B2 (en) * 2002-06-28 2004-08-03 Advanced Energy Technology Inc. Heat sink made from longer and shorter graphite sheets
US20050155743A1 (en) * 2002-06-28 2005-07-21 Getz George Jr. Composite heat sink with metal base and graphite fins
US6749010B2 (en) * 2002-06-28 2004-06-15 Advanced Energy Technology Inc. Composite heat sink with metal base and graphite fins
JP3834528B2 (ja) * 2002-07-11 2006-10-18 ポリマテック株式会社 熱伝導性高分子成形体の製造方法
JP2004051852A (ja) * 2002-07-22 2004-02-19 Polymatech Co Ltd 熱伝導性高分子成形体及びその製造方法
DE20314532U1 (de) * 2003-09-16 2004-02-19 Pries, Wulf H. Vorrichtung zur Ableitung von Wärme von elektronischen und elektrischen Bauelementen
WO2005036927A2 (en) * 2003-10-03 2005-04-21 Aavid Thermalloy, Llc Lowered pressure point for heat sink retention hardware
US7303820B2 (en) * 2003-10-14 2007-12-04 Graftech International Holdings Inc. Heat spreader for display device
US7292441B2 (en) * 2003-11-25 2007-11-06 Advanced Energy Technology Inc. Thermal solution for portable electronic devices
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices
US7803856B2 (en) * 2004-05-04 2010-09-28 Sabic Innovative Plastics Ip B.V. Halogen-free flame retardant polyamide composition with improved electrical and flammability properties
US20050250885A1 (en) * 2004-05-04 2005-11-10 General Electric Company Halogen-free flame retardant polyamide composition with improved electrical properties
CN101006136B (zh) * 2004-07-01 2011-08-31 索维高级聚合物股份有限公司 芳族聚酰胺组合物和由其制造的制品
DE102004039148A1 (de) * 2004-08-12 2006-02-23 Clariant Gmbh Glühdrahtbeständige flammwidrige Polymere
US7233501B1 (en) * 2004-09-09 2007-06-19 Sun Microsystems, Inc. Interleaved memory heat sink
DE102004048876A1 (de) * 2004-09-13 2006-03-30 Bayer Ag Halogenfreie flammgeschützte thermoplastische Formmassen auf Basis von Polyamid mit erhöhter Glühdrahtbeständigkeit
US7161809B2 (en) * 2004-09-15 2007-01-09 Advanced Energy Technology Inc. Integral heat spreader
US20060068205A1 (en) * 2004-09-24 2006-03-30 Carbone Lorraine Composants Composite material used for manufacturing heat exchanger fins with high thermal conductivity
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
US7306847B2 (en) * 2005-01-28 2007-12-11 Graftech International Holdings Inc. Heat spreader for display device
EP1852489A1 (en) * 2005-02-21 2007-11-07 Fuji Electric Holdings Co., Ltd.; Reactive flame retardant and flame-retardant resin processed article
JP4753624B2 (ja) * 2005-05-24 2011-08-24 富士電機株式会社 難燃性樹脂加工品
JP4757538B2 (ja) * 2005-05-24 2011-08-24 富士電機株式会社 難燃性樹脂加工品
JP5225558B2 (ja) * 2005-05-26 2013-07-03 テクノポリマー株式会社 熱伝導性樹脂組成物及び成形品
JP4659827B2 (ja) * 2005-05-30 2011-03-30 株式会社カネカ グラファイトフィルムの製造方法
EP1746077A1 (de) * 2005-06-21 2007-01-24 Sgl Carbon Ag Metallbeschichtete Graphitfolie
US7385819B1 (en) * 2005-06-27 2008-06-10 Graftech International Holdings Inc. Display device
JP4681373B2 (ja) * 2005-07-06 2011-05-11 帝人化成株式会社 熱可塑性樹脂組成物
DE102005050704A1 (de) * 2005-10-22 2007-05-03 Clariant Produkte (Deutschland) Gmbh Glühdrahtbeständige flammwidrige Polymere
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias
US7365988B2 (en) * 2005-11-04 2008-04-29 Graftech International Holdings Inc. Cycling LED heat spreader
US7423080B2 (en) * 2006-03-03 2008-09-09 Sabic Innovative Plastics Ip B.V. Radiation crosslinking of halogen-free flame retardant polymer
US8580171B2 (en) * 2006-03-24 2013-11-12 Sgl Carbon Ag Process for manufacture of a latent heat storage device
JP2007291267A (ja) * 2006-04-26 2007-11-08 Teijin Ltd 熱伝導性成形材料及びこれを用いた成形シート
JP5460949B2 (ja) * 2006-05-02 2014-04-02 信越化学工業株式会社 低分子シロキサン量の揮散を低減した難燃樹脂組成物
EP2071002A4 (en) * 2006-06-21 2009-11-18 Hitachi Kasei Polymer Co Ltd THERMALLY CONDUCTIVE THERMOPLASTIC ADHESIVE COMPOSITION
US8864908B2 (en) * 2006-07-14 2014-10-21 Toyo Tanso Co., Ltd. Crucible protection sheet and crucible apparatus using the crucible protection sheet
WO2008053843A1 (fr) * 2006-11-01 2008-05-08 Hitachi Chemical Co., Ltd. Feuille conductrice de chaleur, procédé de production de la feuille, et radiateur utilisant la feuille
US7486517B2 (en) * 2006-12-20 2009-02-03 Nokia Corporation Hand-held portable electronic device having a heat spreader
WO2008092635A1 (en) * 2007-02-02 2008-08-07 Dsm Ip Assets B.V. Heat transport assembly
US20080246186A1 (en) * 2007-04-09 2008-10-09 Scott Michael Fisher Composition and method for making polyarylene ether copolymers
CN101679716B (zh) * 2007-05-30 2013-03-27 大科能树脂有限公司 吹塑用热塑性树脂组合物及其吹塑制品
US20090134370A1 (en) * 2007-07-20 2009-05-28 Herve Cartier Conductive halogen free flame retardant thermoplastic composition
US8773856B2 (en) * 2010-11-08 2014-07-08 Graftech International Holdings Inc. Method of making an electronic device

Also Published As

Publication number Publication date
WO2009115512A1 (en) 2009-09-24
EP2254940B1 (en) 2014-06-25
JP2011516633A (ja) 2011-05-26
KR101637616B1 (ko) 2016-07-07
CN101977976B (zh) 2014-08-27
US20110103021A1 (en) 2011-05-05
CN101977976A (zh) 2011-02-16
EP2254940A1 (en) 2010-12-01
JP5430645B2 (ja) 2014-03-05
KR20100126415A (ko) 2010-12-01

Similar Documents

Publication Publication Date Title
PL2254940T3 (pl) Radiator z przewodzących materiałów z tworzyw sztucznych
DE502007003871D1 (de) Stromschiene mit Wärmeableitung
DK2267082T3 (da) Varmeledende harpikssammensætning
EP2248406A4 (en) HEATSINK DEVICE
EP2412597A4 (en) HEAT SINK
EP2185745A4 (en) Thermocouple
FI20075497A0 (fi) Jäähdytyselementti
DK2307842T3 (da) Varmeveksler
DK3421795T3 (da) Køleapparat
FI20080295A0 (fi) Jäähdytyselementti sähkökoneeseen
EP2314972A4 (en) Heat exchanger
DK2433474T3 (da) Lysdiode med kølelegeme
ITMI20091187A1 (it) Scambiatore di calore
BRPI0908499A2 (pt) termômetro eletrônico
EP2463903A4 (en) HEAT SINK
EP2267392A4 (en) Heat exchanger
DE602008000346D1 (de) Kühleinheit
ES1070817Y (es) Lavabo
ES1064662Y (es) Radiador electrico
ITUD20070025A1 (it) Scambiatore di calore
ITBS20060171A1 (it) Struttura di radiatore per riscaldamento
ES1069853Y (es) Fregadero
EP2252842A4 (en) HEAT EXCHANGER
ES1072954Y (es) Termostato electronico
FR2912208B1 (fr) Echangeur di phasique