JP2011508437A - 平坦な面を有する電子デバイス用封入アセンブリ - Google Patents

平坦な面を有する電子デバイス用封入アセンブリ Download PDF

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Publication number
JP2011508437A
JP2011508437A JP2010539922A JP2010539922A JP2011508437A JP 2011508437 A JP2011508437 A JP 2011508437A JP 2010539922 A JP2010539922 A JP 2010539922A JP 2010539922 A JP2010539922 A JP 2010539922A JP 2011508437 A JP2011508437 A JP 2011508437A
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JP
Japan
Prior art keywords
electronic device
encapsulation assembly
barrier
substrate
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2010539922A
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English (en)
Japanese (ja)
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JP2011508437A5 (https=
Inventor
デウィー フーベルト マシュー
ダニエル トレメル ジェームズ
ディー．フリッシュクネヒト カイル
トルオン ニュージェント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011508437A publication Critical patent/JP2011508437A/ja
Publication of JP2011508437A5 publication Critical patent/JP2011508437A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/874—Passivation; Containers; Encapsulations including getter material or desiccant
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
JP2010539922A 2007-12-21 2008-12-20 平坦な面を有する電子デバイス用封入アセンブリ Withdrawn JP2011508437A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1580207P 2007-12-21 2007-12-21
PCT/US2008/087873 WO2009086228A1 (en) 2007-12-21 2008-12-20 Flat plate encapsulation assembly for electronic devices

Publications (2)

Publication Number Publication Date
JP2011508437A true JP2011508437A (ja) 2011-03-10
JP2011508437A5 JP2011508437A5 (https=) 2012-02-09

Family

ID=40824689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010539922A Withdrawn JP2011508437A (ja) 2007-12-21 2008-12-20 平坦な面を有する電子デバイス用封入アセンブリ

Country Status (6)

Country Link
US (1) US20100270919A1 (https=)
EP (1) EP2225767A4 (https=)
JP (1) JP2011508437A (https=)
KR (1) KR20100108392A (https=)
TW (1) TW201002126A (https=)
WO (1) WO2009086228A1 (https=)

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JP2015505792A (ja) * 2011-11-02 2015-02-26 フエロ コーポレーション 低融点ガラス系を用いた無機基材のマイクロ波シーリング

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CN102484079B (zh) * 2009-06-01 2015-09-23 住友化学株式会社 电子器件的封装工艺及结构
US8568184B2 (en) * 2009-07-15 2013-10-29 Apple Inc. Display modules
KR101074805B1 (ko) * 2009-12-04 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101074807B1 (ko) * 2009-12-10 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
JP5290268B2 (ja) 2009-12-31 2013-09-18 三星ディスプレイ株式會社 バリア・フィルム複合体、これを含む表示装置、バリア・フィルム複合体の製造方法、及びこれを含む表示装置の製造方法
JP5611812B2 (ja) * 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体、これを含む表示装置及び表示装置の製造方法
JP5611811B2 (ja) 2009-12-31 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． バリア・フィルム複合体及びこれを含む表示装置
US20110195541A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming n-type diffusion layer, method for forming n-type diffusion layer, and method for producing photovoltaic cell
US20110195540A1 (en) * 2010-02-05 2011-08-11 Hitachi Chemical Company, Ltd. Composition for forming p-type diffusion layer, method for forming p-type diffusion layer, and method for producing photovoltaic cell
WO2011130632A1 (en) * 2010-04-15 2011-10-20 Ferro Corporation Low-melting lead-free bismuth sealing glasses
SG186085A1 (en) * 2010-06-03 2013-01-30 Alnylam Pharmaceuticals Inc Biodegradable lipids for the delivery of active agents
JP5724684B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セル及び発光デバイス
JP5724685B2 (ja) * 2011-07-01 2015-05-27 日本電気硝子株式会社 発光デバイス用セルの製造方法及び発光デバイスの製造方法
EP2751044B1 (en) * 2011-09-13 2020-04-22 Ferro Corporation Induction sealing of inorganic substrates
US20130098675A1 (en) * 2011-10-21 2013-04-25 Qualcomm Mems Technologies, Inc. Method and apparatus for application of anti-stiction coating
EP2788006B1 (en) 2011-12-07 2026-01-07 Alnylam Pharmaceuticals, Inc. Biodegradable lipids for the delivery of active agents
JP6623157B2 (ja) * 2013-08-16 2019-12-18 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 光学部品を作製する方法、光学部品、および光学部品を含む製品
EP3176225B1 (en) * 2014-07-29 2020-02-19 Boe Technology Group Co. Ltd. Functional material, preparation method therefor, organic light-emitting diode display panel
CN104157798A (zh) * 2014-08-21 2014-11-19 深圳市华星光电技术有限公司 Oled的封装方法及结构
CN104810484B (zh) * 2015-05-07 2017-01-04 合肥鑫晟光电科技有限公司 封装胶、封装方法、显示面板及显示装置
WO2017139542A1 (en) 2016-02-11 2017-08-17 Skyworks Solutions, Inc. Device packaging using a recyclable carrier substrate
US20170243739A1 (en) * 2016-02-24 2017-08-24 Skyworks Solutions, Inc. 3d micromold and pattern transfer
US10453763B2 (en) 2016-08-10 2019-10-22 Skyworks Solutions, Inc. Packaging structures with improved adhesion and strength
FR3068706A1 (fr) * 2017-07-04 2019-01-11 Arkema France Materiau absorbant pour la protection des dispositifs electroniques
US12467308B2 (en) * 2022-11-23 2025-11-11 LuxWall, Inc. Vacuum insulated panel with tellurium oxide and/or vanadium oxide inclusive seal
TWI862281B (zh) * 2023-11-16 2024-11-11 世界先進積體電路股份有限公司 微機電封裝及其製造方法

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US6049167A (en) * 1997-02-17 2000-04-11 Tdk Corporation Organic electroluminescent display device, and method and system for making the same
JPH11195487A (ja) * 1997-12-27 1999-07-21 Tdk Corp 有機ｅｌ素子
JP2000003783A (ja) * 1998-06-12 2000-01-07 Tdk Corp 有機ｅｌ表示装置
EP1210739A2 (de) * 1999-09-09 2002-06-05 Siemens Aktiengesellschaft Organische lichtemittierende diode und herstellungsverfahren
EP1336207A1 (en) * 2000-11-08 2003-08-20 Koninklijke Philips Electronics N.V. Electro-optical device
US20060087230A1 (en) * 2004-10-22 2006-04-27 Eastman Kodak Company Desiccant film in top-emitting OLED
JP4605499B2 (ja) * 2004-10-28 2011-01-05 富士電機ホールディングス株式会社 有機ｅｌディスプレイの封止構造
JP2007005060A (ja) * 2005-06-22 2007-01-11 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法
US7564185B2 (en) * 2006-02-20 2009-07-21 Samsung Mobile Display Co., Ltd. Organic electroluminescence display device and manufacturing method thereof
KR101252701B1 (ko) * 2006-03-29 2013-04-09 헨켈 아게 운트 코. 카게아아 방사선 또는 열 경화성 배리어 밀봉제
TWI421607B (zh) * 2006-08-24 2014-01-01 Creator Technology Bv 可撓性裝置上的滲透阻障
KR100858811B1 (ko) * 2006-11-10 2008-09-17 삼성에스디아이 주식회사 전자 방출 표시 소자의 제조 방법
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015505792A (ja) * 2011-11-02 2015-02-26 フエロ コーポレーション 低融点ガラス系を用いた無機基材のマイクロ波シーリング
JP2018108929A (ja) * 2011-11-02 2018-07-12 フエロ コーポレーション 低融点ガラス系を用いた無機基材のマイクロ波シーリング方法、及びシーリングガラス組成物

Also Published As

Publication number Publication date
KR20100108392A (ko) 2010-10-06
EP2225767A1 (en) 2010-09-08
WO2009086228A1 (en) 2009-07-09
EP2225767A4 (en) 2011-09-28
TW201002126A (en) 2010-01-01
US20100270919A1 (en) 2010-10-28

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