JP2011507720A - 化学的機械的平坦化パッド - Google Patents

化学的機械的平坦化パッド Download PDF

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Publication number
JP2011507720A
JP2011507720A JP2010541543A JP2010541543A JP2011507720A JP 2011507720 A JP2011507720 A JP 2011507720A JP 2010541543 A JP2010541543 A JP 2010541543A JP 2010541543 A JP2010541543 A JP 2010541543A JP 2011507720 A JP2011507720 A JP 2011507720A
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JP
Japan
Prior art keywords
adhesive
layer
polishing pad
sheet
exhibits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010541543A
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English (en)
Japanese (ja)
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JP2011507720A5 (enExample
Inventor
オスカー ケイ． ス
ポール ロフェヴル
マーク シー． ジン
ジョン エリック アルデボー
デイヴィッド アダム ウェルズ
Original Assignee
イノパッド，インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by イノパッド，インコーポレイテッド filed Critical イノパッド，インコーポレイテッド
Publication of JP2011507720A publication Critical patent/JP2011507720A/ja
Publication of JP2011507720A5 publication Critical patent/JP2011507720A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010541543A 2007-12-31 2008-12-31 化学的機械的平坦化パッド Pending JP2011507720A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1795207P 2007-12-31 2007-12-31
PCT/US2008/088672 WO2009086557A1 (en) 2007-12-31 2008-12-31 Chemical-mechanical planarization pad

Publications (2)

Publication Number Publication Date
JP2011507720A true JP2011507720A (ja) 2011-03-10
JP2011507720A5 JP2011507720A5 (enExample) 2012-02-16

Family

ID=40799066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010541543A Pending JP2011507720A (ja) 2007-12-31 2008-12-31 化学的機械的平坦化パッド

Country Status (5)

Country Link
US (1) US8430721B2 (enExample)
EP (1) EP2242614A4 (enExample)
JP (1) JP2011507720A (enExample)
KR (1) KR101577988B1 (enExample)
WO (1) WO2009086557A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017537801A (ja) * 2014-11-21 2017-12-21 キャボット マイクロエレクトロニクス コーポレイション 化学機械研磨のためのコーティングされた圧縮サブパッド

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20130225051A1 (en) * 2012-02-27 2013-08-29 Raymond Vankouwenberg Abrasive pad assembly
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
WO2015177943A1 (ja) * 2014-05-17 2015-11-26 株式会社サンツール ホットメルト接着剤のロール転写塗布方法および塗布装置
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
GB2537161B (en) * 2015-04-10 2019-06-19 Reckitt Benckiser Brands Ltd Novel material
CN106078493A (zh) * 2016-06-23 2016-11-09 上海汉虹精密机械有限公司 陶瓷盘砂轮片双面研磨加工蓝宝石晶片的方法
US11059150B2 (en) * 2017-08-10 2021-07-13 Dongguan Golden Sun Abrasives Co., Ltd. Elastic self-lubricating polishing tool

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250776A (ja) * 1989-03-21 1990-10-08 Rodeele Nitta Kk 半導体ウェハー研磨用クロスの製造方法
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
WO2003009362A1 (en) * 2001-07-19 2003-01-30 Nikon Corporation Polishing element, cmp polishing device and productionj method for semiconductor device
JP3110199U (ja) * 2003-10-03 2005-06-16 アプライド　マテリアルズ　インコーポレイテッド 多層研磨パッド
JP2006504260A (ja) * 2002-10-28 2006-02-02 キャボット マイクロエレクトロニクス コーポレイション 化学機械的研磨のための透明な多孔性材料
JP2007021604A (ja) * 2005-07-13 2007-02-01 Nitta Haas Inc 研磨布固定用の両面粘着テープおよびこれを備えた研磨布
JP2008252017A (ja) * 2007-03-30 2008-10-16 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2009125894A (ja) * 2007-11-27 2009-06-11 Fujibo Holdings Inc 研磨パッドの製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6857941B2 (en) * 2001-06-01 2005-02-22 Applied Materials, Inc. Multi-phase polishing pad
US7097549B2 (en) * 2001-12-20 2006-08-29 Ppg Industries Ohio, Inc. Polishing pad
KR100697904B1 (ko) * 2002-09-25 2007-03-20 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 연마 패드
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7264641B2 (en) * 2003-11-10 2007-09-04 Cabot Microelectronics Corporation Polishing pad comprising biodegradable polymer
JP4592535B2 (ja) 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP2007181907A (ja) * 2006-01-10 2007-07-19 Toyo Tire & Rubber Co Ltd 積層研磨パッド
US20080318506A1 (en) * 2007-06-19 2008-12-25 John Edward Brown Abrasive article and method of making

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02250776A (ja) * 1989-03-21 1990-10-08 Rodeele Nitta Kk 半導体ウェハー研磨用クロスの製造方法
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
WO2003009362A1 (en) * 2001-07-19 2003-01-30 Nikon Corporation Polishing element, cmp polishing device and productionj method for semiconductor device
JP2006504260A (ja) * 2002-10-28 2006-02-02 キャボット マイクロエレクトロニクス コーポレイション 化学機械的研磨のための透明な多孔性材料
JP3110199U (ja) * 2003-10-03 2005-06-16 アプライド　マテリアルズ　インコーポレイテッド 多層研磨パッド
JP2007021604A (ja) * 2005-07-13 2007-02-01 Nitta Haas Inc 研磨布固定用の両面粘着テープおよびこれを備えた研磨布
JP2008252017A (ja) * 2007-03-30 2008-10-16 Toyo Tire & Rubber Co Ltd 研磨パッド
JP2009125894A (ja) * 2007-11-27 2009-06-11 Fujibo Holdings Inc 研磨パッドの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017537801A (ja) * 2014-11-21 2017-12-21 キャボット マイクロエレクトロニクス コーポレイション 化学機械研磨のためのコーティングされた圧縮サブパッド

Also Published As

Publication number Publication date
KR20100106469A (ko) 2010-10-01
US8430721B2 (en) 2013-04-30
KR101577988B1 (ko) 2015-12-16
WO2009086557A1 (en) 2009-07-09
EP2242614A1 (en) 2010-10-27
US20090170413A1 (en) 2009-07-02
EP2242614A4 (en) 2013-01-16

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