KR101577988B1 - 화학-기계적 평탄화 패드 - Google Patents

화학-기계적 평탄화 패드 Download PDF

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Publication number
KR101577988B1
KR101577988B1 KR1020107015204A KR20107015204A KR101577988B1 KR 101577988 B1 KR101577988 B1 KR 101577988B1 KR 1020107015204 A KR1020107015204 A KR 1020107015204A KR 20107015204 A KR20107015204 A KR 20107015204A KR 101577988 B1 KR101577988 B1 KR 101577988B1
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KR
South Korea
Prior art keywords
adhesive
layer
polishing pad
sheet
pressure
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Active
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KR1020107015204A
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English (en)
Korean (ko)
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KR20100106469A (ko
Inventor
오스카 케이. 수
폴 르페브르
마크 씨. 진
존 에릭 알데보흐
데이비드 아담 웰스
Original Assignee
에프엔에스테크 주식회사
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Publication date
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Publication of KR20100106469A publication Critical patent/KR20100106469A/ko
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Publication of KR101577988B1 publication Critical patent/KR101577988B1/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020107015204A 2007-12-31 2008-12-31 화학-기계적 평탄화 패드 Active KR101577988B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1795207P 2007-12-31 2007-12-31
US61/017,952 2007-12-31

Publications (2)

Publication Number Publication Date
KR20100106469A KR20100106469A (ko) 2010-10-01
KR101577988B1 true KR101577988B1 (ko) 2015-12-16

Family

ID=40799066

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107015204A Active KR101577988B1 (ko) 2007-12-31 2008-12-31 화학-기계적 평탄화 패드

Country Status (5)

Country Link
US (1) US8430721B2 (enExample)
EP (1) EP2242614A4 (enExample)
JP (1) JP2011507720A (enExample)
KR (1) KR101577988B1 (enExample)
WO (1) WO2009086557A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US20130205679A1 (en) * 2012-02-14 2013-08-15 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US20130225051A1 (en) * 2012-02-27 2013-08-29 Raymond Vankouwenberg Abrasive pad assembly
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
WO2015177943A1 (ja) * 2014-05-17 2015-11-26 株式会社サンツール ホットメルト接着剤のロール転写塗布方法および塗布装置
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
GB2537161B (en) * 2015-04-10 2019-06-19 Reckitt Benckiser Brands Ltd Novel material
CN106078493A (zh) * 2016-06-23 2016-11-09 上海汉虹精密机械有限公司 陶瓷盘砂轮片双面研磨加工蓝宝石晶片的方法
US11059150B2 (en) * 2017-08-10 2021-07-13 Dongguan Golden Sun Abrasives Co., Ltd. Elastic self-lubricating polishing tool

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005512832A (ja) * 2001-12-20 2005-05-12 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 研磨パッド
JP2005539398A (ja) 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
JP2007181907A (ja) * 2006-01-10 2007-07-19 Toyo Tire & Rubber Co Ltd 積層研磨パッド

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Publication number Priority date Publication date Assignee Title
JPH02250776A (ja) * 1989-03-21 1990-10-08 Rodeele Nitta Kk 半導体ウェハー研磨用クロスの製造方法
US5257478A (en) 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
JP2000077366A (ja) * 1998-08-28 2000-03-14 Nitta Ind Corp 研磨布及びその研磨布の研磨機定盤への脱着方法
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US6533645B2 (en) * 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6857941B2 (en) * 2001-06-01 2005-02-22 Applied Materials, Inc. Multi-phase polishing pad
US20040242132A1 (en) * 2001-07-19 2004-12-02 Susumu Hoshino Polishing element, cmp polishing device and productionj method for semiconductor device
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7654885B2 (en) * 2003-10-03 2010-02-02 Applied Materials, Inc. Multi-layer polishing pad
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7264641B2 (en) * 2003-11-10 2007-09-04 Cabot Microelectronics Corporation Polishing pad comprising biodegradable polymer
JP4592535B2 (ja) 2005-02-23 2010-12-01 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート
JP4937538B2 (ja) * 2005-07-13 2012-05-23 ニッタ・ハース株式会社 研磨布固定用の両面粘着テープおよびこれを備えた研磨布
JP5088865B2 (ja) * 2007-03-30 2012-12-05 東洋ゴム工業株式会社 研磨パッド
US20080318506A1 (en) * 2007-06-19 2008-12-25 John Edward Brown Abrasive article and method of making
JP5297026B2 (ja) * 2007-11-27 2013-09-25 富士紡ホールディングス株式会社 研磨パッドの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005512832A (ja) * 2001-12-20 2005-05-12 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 研磨パッド
JP2005539398A (ja) 2002-09-25 2005-12-22 ピーピージー インダストリーズ オハイオ， インコーポレイテッド 平坦化するための研磨パッド
JP2007181907A (ja) * 2006-01-10 2007-07-19 Toyo Tire & Rubber Co Ltd 積層研磨パッド

Also Published As

Publication number Publication date
KR20100106469A (ko) 2010-10-01
US8430721B2 (en) 2013-04-30
WO2009086557A1 (en) 2009-07-09
JP2011507720A (ja) 2011-03-10
EP2242614A1 (en) 2010-10-27
US20090170413A1 (en) 2009-07-02
EP2242614A4 (en) 2013-01-16

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