Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
  • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
  • B24B37/11—Lapping tools
  • B24B37/20—Lapping pads for working plane surfaces
  • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
  • B24B37/11—Lapping tools
  • B24B37/20—Lapping pads for working plane surfaces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
  • B24B37/11—Lapping tools
  • B24B37/20—Lapping pads for working plane surfaces
  • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
  • B24D11/001—Manufacture of flexible abrasive materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
  • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
  • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
  • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
  • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
  • B24D3/28—Resins or natural or synthetic macromolecular compounds
  • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Definitions

• the present invention relates to a chemical-mechanical planarization (CMP) pad with an adhesive layer having dual functionality.
• CMP chemical-mechanical planarization
• polishing pads for chemical-mechanical planarization may include a composite of a first porous or filler-dispersed polymeric layer stacked with a second, soft layer.
• the soft second layer has what was termed as a different hydrostatic modulus from the first layer and serving as a pressure equalizer to provide equal pressures across the semiconductor surface for uniform polish.
• a third layer of adhesive may be applied to the second layer for the purpose of attaching the composite pad to the polishing tool.
• the use of a three layer structure in the conventional pad may increase the risk of separation or delamination between layers during polish.
• the three layer structure may entrap air bubbles or extraneous contaminants between layers resulting in difficult to detect protrusions on the pad surface, which may lead to scratching defects and non-uniformity of polish.
• the polishing pad may include a polymer layer including a three-dimensional network and a composite layer having the ability to equalize pressure across the pad surface including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
• a further aspect relates to a method of affixing a polishing pad to a tool.
• the method may include adhering a polishing pad to a tool.
• the polishing pad may include a polymer layer, having a three-dimensional network, and a composite layer having the ability to equalize pressure across the pad surface including a first adhesive.
• the composite may exhibit a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
• Another aspect of the present disclosure relates to a method of forming a polishing pad.
• the method may include providing a polymer layer having a three- dimensional network therein and adhering a composite layer having the ability to equalize pressure across the pad surface including a first adhesive to the polymer layer.
• the composite may exhibit a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.
• FIG. 1 illustrates an example of a CMP pad contemplated herein.
• FIG. 2 illustrates an example of a CMP pad contemplated herein.
• the present invention relates to a polishing pad including a first porous or filler-dispersed polymer layer.
• the first layer may be stacked directly to a composite, having the ability to equalize pressures across the semiconductor surface.
• the composite may include one or more adhesive layers as well as an additional layer positioned between the adhesive layers.
• a composite that possesses pressure equalizing ability across the semiconductor surface during polish may include a sheet 12 including one or more layers 14, 16 of an adhesive coated onto the surfaces of the sheet.
• the composite may be adhered to the polymer layer 20.
• the resulting composite may exhibit an overall hydrostatic modulus from 1 to 500 psi, including all values and increments therein, when compressed under a pressure of 1 to 50 psi, including all values and increments therein.
• the range of hydrostatic modulus may be from 150 to 250 psi, when compressed under a pressure of 1 to 10 psi, which may be broadly employed during CMP of semiconductor wafers.
• the polymer layer may be formed by including a three-dimensional network of soluble or insoluble materials dispersed or at least partially encapsulated in a binder.
• the polymer material may be in the form of particles, fibers and/or fabrics.
• the binder may include a polymer material, such as a polyurethane.
• the binder may exhibit a hardness H 1 that is greater than the hardness H 2 of the three-dimensional network materials.
• the three-dimensional network may be placed into a mold cavity and the binder material may also be poured into the mold cavity. Heat and/or pressure may be applied to the binder and three-dimensional network mixture in the mold cavity and the polishing pad may be formed. Additional heating and/or curing steps may be employed in the formation of the pad as well. Furthermore, the pad may also be abraded to expose the three-dimensional network contained or encapsulated therein. In some examples, all or a portion of the three dimensional network may be removed from the pad providing a relatively porous three-dimensional network in the polymer layer.
• the composite may include one adhesive layer. Accordingly, attention is next directed to FIG. 2, which illustrates another exemplary embodiment herein, which contains adhesive layer 16 adhered to the first porous or filled dispersed polymer layer 20. As may be appreciated, in this embodiment, the use of the sheet 12 may be avoided. However, once again, such a resulting composite may be configured to exhibit an overall hydrostatic modulus from 1 to 500 psi, through the combination of the adhesive layer 16 and polymer layer 20. Such values of hydrostatic modulus again include all values and increments between 1-500 psi, when compressed under a pressure of 1 to 50 psi.
• the adhesive 14 applied to one side of the sheet may or may not be the same as the adhesive 16 applied to the opposite side of the sheet.
• the adhesive 14 applied to one side of the sheet may exhibit a 180 degree peel strength (PS 1 ) greater than 2.5 lbs/inch in accordance with ASTM test standard D903-98(2004).
• the adhesive 16 applied to the opposite side of the sheet may exhibit a lower 180 degree peel strength (PS 2 ) of 1 to 1.5 lbs/inch in accordance with the above ASTM standard Accordingly, the peel strength of the adhesive 14 may be greater than the peel strength of the adhesive 16 and PS 1 may be greater (>) than PS 2 . .
• the adhesive applied to one side of the sheet may be acrylic based and the adhesive applied to the other side of the sheet may be sourced from a different polymer component, such as a diene type elastomer.
• the diene type elastomer adhesive may be cross-linked to increase its cohesive strength.
• the acrylic based adhesive side may be attached to the polishing pad while the diene type elastomer based side may be attached to the polishing tool surface.
• the pad may be relatively easily detached from the polishing tool due to the lower peel strength and higher cohesive strength. This may prevent adhesive residue from being left on the tool surface.
• the adhesives may include, but are not limited to, one or more materials such as polybutadiene and polyisoprene elastomers.
• the polyisoprene may be natural (e.g., cis-1,4 polyisoprene) or synthetic.
• the adhesives may include acrylic elastomers and/or polyurethane type elastomers.
• the adhesives may include, epoxy type polymer systems and/or polyimide type systems, such as bismaleimide type adhesives.
• the adhesive or adhesives may be applied at a thickness in the range of 1 mil to 200 mils, including all values and increments therein, such as in the range of 1 mil to 20 mil, etc.
• the adhesive may be applied by various spray or coating processes, such as dip coating, screen printing, reverse roll coating, gap coating, metering rod coating, slot die coating, air knife coating, spray coating, etc.
• the sheet may include, but is not limited to, one or more materials such as polypropylene, polyethylene, polyester, polyamide, polyimide, polyurethane, polysulfone, styrene and their solid and foam configurations.
• the sheet may also be a fabric, including woven or non-woven fabrics, or foam including a plurality of gas filled cells or pores.
• the thickness of the sheet may range from 0.1 to 500 mils including all values and increments therein, such as from 1 to 100 mils.
• the composite layer containing the adhesive as disclosed herein may efficiently provide the dual function of an adhesive and a pressure equalizer.
• the pad herein may consist of a polymer layer including a three-dimensional network and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein said composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi, with no other components necessary for such pad performance.
• the composite layer in the pad may also only include a sheet including a first side and a second side, a first layer of said first adhesive disposed on said first side of said sheet and a second layer of a second adhesive disposed on said second side of said sheet.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Mechanical Treatment Of Semiconductor (AREA)
• Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

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ID=40799066

Family Applications (1)

Country Status (5)

Cited By (1)

Families Citing this family (9)

Citations (3)

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• 2008
  • 2008-12-31 EP EP08867501A patent/EP2242614A4/en not_active Withdrawn
  • 2008-12-31 WO PCT/US2008/088672 patent/WO2009086557A1/en not_active Ceased
  • 2008-12-31 KR KR1020107015204A patent/KR101577988B1/ko active Active
  • 2008-12-31 US US12/347,788 patent/US8430721B2/en active Active
  • 2008-12-31 JP JP2010541543A patent/JP2011507720A/ja active Pending

Patent Citations (3)

Non-Patent Citations (1)

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