200846132 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於化學機械研磨之研磨塾。 【先前技術】 化學機械研磨（CMP)為用於使用研磨墊平坦化基板表面 之程序。CMP —般應用於研磨透鏡、鏡面、液晶顯示器之 基板、矽晶圓以及矽晶圓上之氧化及/或金屬層。 以矽晶圓作為實例，首先將單晶矽結晶塊切片。通常對 該晶圓進行磨光，以使其變平坦以隨後進行化學蝕刻。在 蝕刻過程之後需要研磨過程。在研磨過程期間，研磨墊連 同漿液一起與晶圓表面上之矽原子進行化學反應，以使得 經反應之表面比其下的矽柔軟。此外，不斷擦去經反應之 表面，從而導致新鮮矽暴露於漿液及研磨墊。 省知研磨墊包含基底材料，該基底材料包括纖維。亦在 該基底材料上或該基底材料中提供包含多孔彈性體（例如 聚氨酯）之研磨層。藉由使用感壓黏合劑（pSA)，將該習知 研磨塾緊固至研磨機之研磨平板或研磨頭。該感壓黏合劑 包含載體膜，該載體膜包括（例如）聚酯，且在載體膜之上 側及下側上具有具低流動性之黏合劑。此類黏合劑已知為 雙面黏合劑。載體膜上側上之黏合劑經配置以耦接研磨墊 之基底材料，且載體膜下側上之黏合劑將耦接研磨機之研 磨平板或研磨頭。 因為研磨塾之基底材料包含纖維，所以基底材料之内含 物未均勻分布，容易觀測到基底材料之厚度變化。另外， 114385 200846132 基底材料之表面不平坦，且通常為粗糙且起伏的。此類特 徵使得基底材枓難以丰固地並完全地附著至pSA之承栽膜 上。另一方面，研磨機之研磨平板或研磨頭通常具有平坦 • 表面。從而，基底材料與載體膜之間的黏合強度比載體膜 - 與研磨機之研磨平板或研磨頭之間的黏合強度更弱。因 此’研磨墊容易與研磨機分離。另外，當更換研磨墊時， 谷易將PS A之殘餘物遺留在研磨平板或研磨頭上，且需要 Φ 移除PSA之殘餘物並使更換研磨墊所需之時間加長。另 外，約〇·1 mm之載體膜厚度太薄，且容易出現折疊線。另 一方面，習知黏合劑之耐酸鹼性不令人滿意。因而，CMp 之作用及效率均降低。 【發明内容】 本發明之一個目的在於提供一種研磨墊，該研磨墊包 含： 一基底材料，包含纖維； •-具有低滲透性之薄膜’該薄膜具有上表面及下表面；. 一個二液型糊劑，其形成於該具有低滲透性之薄膜之上 表面上，用於將基底材料黏合至該具有低滲透性之薄膜； 以及 一聚氨酯糊劑，其形成於該具有低滲透性之薄膜之下表 面上。 本發明之另一目的在於提供一種研磨基板之方法，該方 法包含使用如上述之研磨墊來研磨基板表面。 本發明之又一目的在於提供一種用於製造如上述之研磨 114385 200846132 塾*之方法，該方法包含以下步驟： ⑷在該具右歸隸之薄膜之二液型物 劑； (b)將基底材料黏合至該二液型糊劑；以及 (0將聚氨酯糊劑施加至該具有低滲透性之薄膜之下表 面0 如上述之研磨墊可防止研磨墊與研磨平板或研磨頭分 離’並易於更換該研詩而不會在研磨平板或研磨頭上遺 留殘餘物。 【實施方式】 本發明在於提供一種研磨墊，該研磨墊包含： 一基底材料，包含纖維； -具有低滲透性之薄膜，該薄膜具有上表面及下表面； 一個二液型糊劑，其形成於該具有低滲透性之薄膜之該 上表面上，用於將該基底材料黏合至該具有低滲透性之薄 膜；以及 一聚氨醋糊劑，其形成於該具有低滲透性之薄膜之該下 表面上。 根據本發明，任何包含纖維之基底材料可應用於本發 明。較佳地，基底材料包含不織布，且更佳地，基底材料 包含滾壓不織布。可利用連續滾壓（r〇ll t〇_r〇11)方式使用 該等滚壓不織布’與包含模製或鱗造之生產單個研磨塾之 習知方法相比，該連續滾壓方式改進批次均勻性。 如本文使用’「不織布」指藉由摩擦力、及/或内聚力及/ 114385 200846132 或黏合力接合的有方向地或隨機地定向纖維之製造片、網 或鼓，不包括紙及經編織、針織、簇生、縫編而併八有接 ’ 結線或細絲或由濕式礙磨進行黏結（無論是否經額外針縫） 之產品。該等纖維可具有天然或人造來源。其可為定長或 • ㈣細絲，或可原位形成。取決於形成網之方法，不織布 通常包含複合不織布、針刺不織布、溶喷不織布、纺黏不 織布、乾式成網不織布、濕式成網不織布、縫編不織布或 • 水刺不織布。與織布相比’不織布具有較好的材料特性。 如本文使s ’術語「纖維」指單纖維或複合纖維，較佳 地指複合纖維。根據待研磨之基板來選擇該纖維。基底材 料之纖維提供用於研磨之突出物，且亦提供支架，必要 時，該支架允許研磨層之彈性體置於由該支架界定之空間 h本發明所屬技術領域中具通常知識者可根據本說明書 之揭示内容來選擇合適種類之纖維’並使彈性體與纖維協 胃。較佳地，該纖維由選自由以下各物組成之群之至少__ 種材料製成：聚醯胺、對苯二胺、聚酯、聚甲基丙烯酸甲 S曰、聚對苯二甲酸乙二酷、聚丙稀腈及其混合物。 如本文使用，術語「具有低滲透性之薄膜」指一種薄膜 或膜，根據本發明，其實質上防止該具有低渗透性之薄膜 之上表面上的糊劑滲透至該具有低滲透性之薄膜之下表 面。較佳地，具有低滲透性之薄膜之材料選自由以下各物 組成之群：聚對苯二甲酸乙二酷（PET)、聚丙稀（pp)及聚 乙烯㈣以及其混合物。另外，該聚丙稀為定向聚丙稀 (OPP) 〇 114385 200846132 在本發明之一個較佳實施例中200846132 IX. Description of the Invention: [Technical Field to Which the Invention Is Ascribed] The present invention relates to a polishing crucible for chemical mechanical polishing. [Prior Art] Chemical mechanical polishing (CMP) is a procedure for planarizing a substrate surface using a polishing pad. CMP is typically applied to abrasive lenses, mirrors, substrates for liquid crystal displays, germanium wafers, and oxidized and/or metal layers on germanium wafers. Taking a germanium wafer as an example, a single crystal germanium crystal block is first sliced. The wafer is typically polished to flatten it for subsequent chemical etching. A grinding process is required after the etching process. During the grinding process, the polishing pad, along with the slurry, chemically reacts with the ruthenium atoms on the surface of the wafer such that the reacted surface is softer than the ruthenium beneath it. In addition, the reacted surface is continuously wiped off, causing fresh enamel to be exposed to the slurry and the polishing pad. It is known that the polishing pad comprises a substrate material comprising fibers. An abrasive layer comprising a porous elastomer (e.g., polyurethane) is also provided on or in the substrate material. The conventional abrasive crucible is fastened to the grinding plate or the abrading head of the grinder by using a pressure sensitive adhesive (pSA). The pressure-sensitive adhesive comprises a carrier film comprising, for example, a polyester, and having a binder having a low fluidity on the upper side and the lower side of the carrier film. Such adhesives are known as double-sided adhesives. The adhesive on the upper side of the carrier film is configured to couple the substrate material of the polishing pad, and the adhesive on the underside of the carrier film is coupled to the grinding plate or polishing head of the grinder. Since the base material of the abrasive crucible contains fibers, the contents of the base material are not uniformly distributed, and the thickness variation of the base material is easily observed. In addition, 114385 200846132 The surface of the base material is not flat and is generally rough and undulating. Such characteristics make it difficult for the base material to adhere to the substrate of the pSA in a substantial and complete manner. On the other hand, the grinding plate or grinding head of the grinder usually has a flat surface. Thus, the bond strength between the base material and the carrier film is weaker than the bond strength between the carrier film - the abrasive plate or the grinding head of the grinder. Therefore, the polishing pad is easily separated from the grinder. In addition, when replacing the polishing pad, Gu Yi left the residue of PS A on the grinding plate or the grinding head, and required Φ to remove the residue of the PSA and lengthen the time required to replace the polishing pad. In addition, the thickness of the carrier film of about 1 mm is too thin, and the folding line is liable to occur. On the other hand, the acid and alkali resistance of conventional binders is not satisfactory. Therefore, the role and efficiency of CMp are reduced. SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing pad comprising: a substrate material comprising fibers; - a film having low permeability, the film having an upper surface and a lower surface; a paste formed on the upper surface of the film having low permeability for bonding the base material to the film having low permeability; and a polyurethane paste formed on the film having low permeability On the lower surface. Another object of the present invention is to provide a method of polishing a substrate comprising polishing the surface of the substrate using a polishing pad as described above. It is still another object of the present invention to provide a method for producing the above-described abrasive 114385 200846132 塾*, the method comprising the steps of: (4) a two-liquid type agent in the right-handed film; (b) a substrate The material is bonded to the two-component paste; and (0 applies a polyurethane paste to the lower surface of the film having low permeability. The polishing pad as described above prevents the polishing pad from separating from the polishing plate or the polishing head' and is easy to replace. The invention does not leave a residue on the grinding plate or the polishing head. [Embodiment] The present invention provides a polishing pad comprising: a substrate material comprising fibers; - a film having low permeability, the film Having an upper surface and a lower surface; a two-liquid type paste formed on the upper surface of the film having low permeability for bonding the substrate material to the film having low permeability; and a polyamine A vinegar paste formed on the lower surface of the film having low permeability. According to the present invention, any substrate material comprising fibers can be applied to the present invention. Preferably, The base material comprises a non-woven fabric, and more preferably, the base material comprises a rolled non-woven fabric. The use of the continuous rolling (r〇ll t〇_r〇11) manner of the use of the rolled non-woven fabrics and the production comprising molding or scale production The continuous rolling method improves batch uniformity compared to the conventional method of grinding a single crucible. As used herein, '"nonwoven fabric" refers to a directional orientation by friction, and/or cohesion and /114385 200846132 or adhesion. Or randomly orienting the fibers to produce sheets, nets or drums, excluding paper and woven, knitted, tufted, stitched and spliced with 'knots or filaments or by wet imperfections (whether or not with additional needles) The fibers may be of natural or artificial origin. They may be fixed length or • (4) filaments, or may be formed in situ. Depending on the method of forming the web, the non-woven fabric usually comprises a composite nonwoven fabric, a needle-punched nonwoven fabric, and a solvent. Non-woven fabric, spunbonded non-woven fabric, dry-laid non-woven fabric, wet-laid non-woven fabric, stitch-woven non-woven fabric or • spunlace non-woven fabric. Compared with weaving fabric, 'non-woven fabric has good material properties. Let s 'the term "fiber" refer to a single fiber or a composite fiber, preferably a composite fiber. The fiber is selected according to the substrate to be polished. The fiber of the substrate material provides a protrusion for grinding, and a stent is also provided, if necessary The stent allows the elastomer of the abrasive layer to be placed in a space defined by the stent. Those of ordinary skill in the art to which the present invention pertains can select a suitable type of fiber according to the disclosure of the present specification and allow the elastomer and fiber to co-stomach Preferably, the fiber is made of at least one material selected from the group consisting of polyamine, p-phenylenediamine, polyester, polymethyl methacrylate, polyterephthalic acid. Ethylene, polyacrylonitrile, and mixtures thereof. As used herein, the term "film having low permeability" means a film or film which, according to the present invention, substantially prevents the surface of the film having low permeability. The paste penetrates into the underlying surface of the film having low permeability. Preferably, the material of the film having low permeability is selected from the group consisting of polyethylene terephthalate (PET), polypropylene (pp), and polyethylene (iv), and mixtures thereof. Additionally, the polypropylene is oriented polypropylene (OPP) 〇 114385 200846132 in a preferred embodiment of the invention
中’具有低滲透性之薄膜之 具有低滲透性之薄膜之厚度 足以避免折疊線，以具有令人滿意之韌性。 二液型糊劑形成於具有低滲透性之薄膜之上表面上，以The thickness of the film having a low permeability of the film having a low permeability is sufficient to avoid the folding line to have satisfactory toughness. a two-component paste formed on the upper surface of the film having low permeability to
型糊劑嵌入至基底材料之纖維中， 所以其在基底材料與具 有低滲透性之薄膜之間提供強黏合強度。 根據本發明之二液型糊劑指包含彼此相互作用或交聯以 實現黏合作用之兩種成分的糊劑。較佳地，該二液型糊劑 包含多元醇樹脂及聚異氰酸醋。更佳地，該多元醇樹脂為 聚氨ί旨。 在本發明之另一較佳實施例中，該二液型糊劑具有在自 約2至約13之pH範圍内之耐酸驗性。該耐酸驗性之寬廣範 圍為藉由調節該二液型糊劑中之成分而獲得。舉例而言， 選擇耐酸或耐驗性成分。 在本發明之一個較佳實施例中，該二液型糊劑具有在自 約10°c至約200°c之溫度範圍内之耐溫性。 根據本發明，該聚氨酯糊劑形成於具有低滲透性之薄膜 之下表面上。聚氨酯糊劑用於將研磨墊附著至研磨機之研 磨平板或研磨頭。較佳地，基底材料與具有低滲透性之薄 膜之間由二液型糊劑提供之黏合強度，比具有低滲透性之 >專膜與研磨機之研磨平板或研磨頭之間由聚氨酯糊劑提供 之黏合強度更強。此類設計防止研磨墊與研磨平板或研磨 114385 -10· 200846132 頭刀離並易於更換該研磨墊而不會在研磨平板或研磨頭 上邊留殘餘物。 較佳地，根據本發明之研磨墊進一步包含形成於聚氨酯 糊剑下方之具有低滲透性之第二薄膜。較佳地，該具有低 渗透性之第二薄膜之材料選自由以下各物組成之群：聚對 苯一甲馱乙一酯、聚丙烯及聚乙烯以及其混合物。 在本發明之一個更佳實施例中，該研磨墊進一步包含第 糊w丨’其形成於該具有低滲透性之第二薄膜下方，用於 將研磨墊附著至研磨機之研磨平板或研磨頭。較佳地，該 第二糊劑包含聚氨酯。 在本發明之另一較佳實施例中，該研磨墊進一步包含位 於基底材料上的研磨層，該研磨層包含多孔彈性體。如本 文使用，術語「彈性體」（亦稱為「彈性聚合體」）指展現 類似橡膠品質之一聚合物種類。當研磨時，該彈性體充當 良好的緩衝器以避免刮傷待研磨之基板表面。在本發明之 一個較佳實施例中，該彈性體包含發泡樹脂。如本文使 用，術語「發泡樹脂」指含有熱塑樹脂及熱分解發泡劑之 材料。較佳地，該彈性體包括選自由以下各物組成之群之 至少一者：聚醯胺、聚碳酸酯、聚氨基腈、聚甲基丙烯酸 酯、環氧樹脂、酚醛樹脂、聚甲基丙烯酸甲酯、聚氨基 酯、乙烯苯聚合體、丙烯酸樹脂、聚氨酯及其混合物。更 佳地，該彈性體包含聚氨酯。 本發明亦提供一種研磨基板之方法，該方法包含使用如 上述之研磨墊來研磨基板表面。 114385 • 11- 200846132 本發明亦提供一種用於製造如上述之研磨墊之方法，該 方法包合以下步騍： ⑷在具有低滲透性之薄膜之上表面上施加二液型糊劑； (b)將基底材料黏合至該二液型糊劑；以及 (C)將聚氨S旨糊劑施加至具有低滲透性之薄膜之下表面。 在本發明之-個較佳實施例中，在步驟⑷之前在具有低 滲透性之第二薄膜上施加聚氨酯糊劑。 在本發明之另-較佳實施财，纟具有低渗透性之第二 薄膜上形成第二糊劑。 茲以下列實例予以詳細說明本發明，唯其並不意謂本發 明僅侷限於此等實例所揭示之内容。 習知研磨墊1 :基底材料藉由具有聚對苯二甲酸乙二酯 薄膜之感壓黏合劑（雙面黏合劑、Τ〇γ〇 INK⑧、BpS_ 3156D)而緊固至研磨平板。 根據本發明之研磨墊2 :基底材料藉由二液型糊劑 (HOME MAOW®，5 101)而黏合至第一聚對笨二甲酸乙二酯 薄膜。第一聚氨酯糊劑形成於第一聚對苯二甲酸乙二酯薄 膜之下表面上。另外，具有第二聚對苯二曱酸乙二酯薄膜 之第二聚氨酯糊劑進一步施加於第一聚對笨二甲酸乙二酯 薄膜上。該研磨墊進一步藉由第二聚氨酯糊劑而緊固至研 磨平板。 濕式剝離試驗·將研磨墊浸泡在水、pH 2之酸性溶液及 pH 12之鹼性溶液中持續24小時。藉由以1〇〇 mm/min之速 度觀測3 cm至13 cm之間的平均值來測量層間黏合力。 114385 -12- 200846132 乾式剝離试驗：藉由以100 mm/min之速度觀測3 cm至13 cm之間的平均值來測畺層間黏合力。 表1中展示結果： , 表1 聚繁 苯二甲酸乙二酯薄膜與基底材料之間的黏合強度 條件 乾 濕 酸 鹼 墊1 1.4 1.3 0.4 0.4 墊2 1.6 1.5 1.1 1.1 聚蜚 士苯二曱酸乙二酯薄膜與研磨斗 -板之間的黏合3 1度 條件 乾 濕 酸 驗 墊1 0.7 0.5 0.5 0.5 墊2 0.9 0*8 0.8 0.9 上述實施例僅為說明本發明之原理及其功效，而非限制 本發明。習於此技術之人士對上述實施例所做之修改及變 化仍不違背本發明之精神。本發明之權利範圍應如後述之 申請專利範圍所列。The paste is embedded in the fibers of the base material so that it provides a strong bond strength between the base material and the film having low permeability. The two-liquid type paste according to the present invention refers to a paste containing two components which interact with each other or crosslink to achieve adhesion. Preferably, the two-component paste comprises a polyol resin and polyisocyanuric acid. More preferably, the polyol resin is a polyurethane. In another preferred embodiment of the invention, the two-component paste has acid resistance in a pH range from about 2 to about 13. The broad range of acid resistance is obtained by adjusting the components in the two-liquid type paste. For example, an acid or test resistant ingredient is selected. In a preferred embodiment of the invention, the two-component paste has a temperature resistance in a temperature range from about 10 ° C to about 200 ° C. According to the present invention, the urethane paste is formed on the lower surface of the film having low permeability. Polyurethane paste is used to attach the polishing pad to the grinding plate or grinding head of the grinder. Preferably, the bonding strength between the base material and the film having low permeability is provided by the two-liquid type paste, and the polyurethane sheet is provided between the grinding plate or the grinding head of the film and the grinding machine having a low permeability. The agent provides a stronger bond strength. This type of design prevents the polishing pad from being detached from the abrasive plate or abrasive 114385 -10· 200846132 and is easy to replace without leaving residue on the abrasive plate or polishing head. Preferably, the polishing pad according to the present invention further comprises a second film having a low permeability formed under the polyurethane paste. Preferably, the material of the second film having low permeability is selected from the group consisting of poly(p-phenylene), polypropylene, and polyethylene, and mixtures thereof. In a further preferred embodiment of the present invention, the polishing pad further comprises a first paste formed under the second film having low permeability for attaching the polishing pad to the grinding plate or the polishing head of the grinder . Preferably, the second paste comprises polyurethane. In another preferred embodiment of the invention, the polishing pad further comprises an abrasive layer on the substrate material, the abrasive layer comprising a porous elastomer. As used herein, the term "elastomer" (also known as "elastic polymer") refers to a polymer species that exhibits a similar rubber quality. When ground, the elastomer acts as a good buffer to avoid scratching the surface of the substrate to be ground. In a preferred embodiment of the invention, the elastomer comprises a foamed resin. As used herein, the term "foamed resin" means a material containing a thermoplastic resin and a thermally decomposable blowing agent. Preferably, the elastomer comprises at least one selected from the group consisting of polyamine, polycarbonate, polyacrylonitrile, polymethacrylate, epoxy resin, phenolic resin, polymethacrylic acid. Methyl esters, polyurethanes, vinyl benzene polymers, acrylic resins, polyurethanes, and mixtures thereof. More preferably, the elastomer comprises polyurethane. The present invention also provides a method of polishing a substrate comprising polishing a substrate surface using a polishing pad as described above. 114385 • 11- 200846132 The present invention also provides a method for manufacturing a polishing pad as described above, the method comprising the following steps: (4) applying a two-liquid type paste on the surface of the film having low permeability; (b) Adhesively bonding the base material to the two-part paste; and (C) applying the polyurethane paste to the lower surface of the film having low permeability. In a preferred embodiment of the invention, a polyurethane paste is applied to the second film having low permeability prior to step (4). In a further preferred embodiment of the invention, a second paste is formed on the second film having a low permeability. The invention is illustrated by the following examples, which are not intended to limit the invention. Conventional polishing pad 1: The base material is fastened to the abrasive plate by a pressure-sensitive adhesive (double-sided adhesive, Τ〇γ〇 INK8, BpS_3156D) having a polyethylene terephthalate film. The polishing pad 2 according to the present invention: the base material is bonded to the first polyethylene terephthalate film by a two-liquid paste (HOME MAOW®, 5 101). The first urethane paste is formed on the lower surface of the first polyethylene terephthalate film. Further, a second urethane paste having a second polyethylene terephthalate film is further applied to the first polyethylene terephthalate film. The polishing pad is further fastened to the grinding plate by a second polyurethane paste. Wet Peel Test • The polishing pad was immersed in water, an acidic solution of pH 2, and an alkaline solution of pH 12 for 24 hours. The interlaminar adhesion was measured by observing the average value between 3 cm and 13 cm at a speed of 1 〇〇 mm/min. 114385 -12- 200846132 Dry peel test: The interlaminar adhesion was measured by observing the average value between 3 cm and 13 cm at a speed of 100 mm/min. The results shown in Table 1 are as follows: Table 1 The bond strength between the polyethylene terephthalate film and the substrate material. Dry and wet acid and alkali pad 1 1.4 1.3 0.4 0.4 Pad 2 1.6 1.5 1.1 1.1 Polysteaphthalic acid Adhesion between the ethylene glycol film and the grinding bucket-plate 3 1 degree condition dry and wet acid test pad 1 0.7 0.5 0.5 0.5 pad 2 0.9 0*8 0.8 0.9 The above examples are merely illustrative of the principle and efficacy of the present invention, and The invention is not limited. Modifications and variations of the embodiments described above will be apparent to those skilled in the art without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims.
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