.1317315 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種用於化學機械研磨法之研磨墊。 【先前技術】 化學機械研磨法（CMP)係使用研磨墊將基板之表面平坦 化之程序。CMP通常應用於研磨透鏡、鏡子、液晶顯示器 之基板、矽晶圓，及矽晶圓上之氧化層及/或金屬層。 以矽晶圓為例，首先切割單晶矽之晶錠。通常打磨該等 晶圓使其平整以利於隨後之化學蝕刻。蝕刻過程之後需要 一研磨過程。在研磨過程期間，研磨墊與研磨漿一起與晶 圓之表面上之矽原子發生化學反應，以使得經反應之表面 較下面之矽更柔軟。此外，經反應之表面不斷被擦除，導 致新鮮之矽暴露於研磨漿及研磨墊。 習知研磨墊包含基底材料，該材料包含纖維。一包含多 孔彈性體（例如’聚胺基甲酸酯）之研磨層亦提供於基底材 料之上或其中。藉由使用壓敏性黏接劑（pSA)，將習知研 磨塾固定至研磨機之研磨壓板或頭部。壓敏性黏接劑包含 一載體薄膜’該薄膜包含（例如）聚酯，且在載體薄膜上側 及下側具有低流動性黏接劑，此黏接劑稱為雙側黏接劑。 載體薄膜上側上之黏接劑經組態以耦接研磨墊之基底材 料’且載體薄膜下側上之黏接劑耦接研磨機之研磨壓板或 頭部。 因為研磨墊之基底材料包含纖維，所以基底材料之内容 物並非均勻分佈。可輕易觀察到基底材料之厚度變動。除 114388.doc 1317315 此之外’基底材料之表面並不平整且通常粗糖且起伏。此 等特徵使得基底材料難以緊密且完全地附著至壓敏性黏接 劑之載體薄膜上表面上的黏接劑。可於基底材料與壓敏性 黏接劑之間的界面輕易觀察到氣泡及空隙。因此，研磨漿 可經由氣泡及空隙輕易滲透至基底材料與壓敏性黏接劑之 間的界面中。從而縮短了研磨墊之壽命。另外，當更換研 磨墊時，壓敏性黏接劑之殘留物易於遺留在研磨壓板或頭 β上’且必需移除壓敏性黏接劑之殘留物，且用於更換研 磨墊所需時間的持續過程延長。化學機械研磨法之效果及 效率兩者皆因此而降低。 【發明内容】 本發明之一目的為提供一種研磨墊，其包含： 一基底材料，其包含纖維； 一具低滲透率之膜，該膜具有一上表面；及 一緩衝層，其形成於該基底材料與該具低滲透率之膜之 該上表面之間，且嵌入該基底材料之該等纖維中。 、 本發明之另一目的為提供一種研磨一基板之方法，= 法包含使用如上所述之研磨墊研磨該基板之—表面。μ 且本發明之又一目的為提供一種用於製造如請求工 研磨塾之方法，該方法包含以下步驟： (a) 提供該基底材料； (b) 以一緩衝層溶液浸潰該基底材料且形成該緩衝 (C)將該具低滲透率之膜塗覆至該緩衝層。 ，及 【實施方式】 114388.doc 1317315 本發明係提供一種研磨塾，其包含： 一基底材料’其包含纖維； 一具低滲透率之臈；及 一緩衝層，其形成於該基底材料與該具低滲透率之臈之 一上表面之間，且嵌入該基底材料之該等纖維中。 根據本發明，任一包含纖維之基底材料可應用於本發明 中。較佳地，該基底材料為非編織品，且更佳地，該基底 材料為滚軋非編織品。該滾軋非編織品可以捲筒對捲筒之 方式使用，與製造涉及模製或鑄造之單個研磨墊的習知方 法比較’此方式改良了分批均勻性。 如本文所使用，「非編織品」意指所製造之藉由摩擦力 及/或内聚力及/或黏著力而黏結之定向纖維或無規定向纖 維之薄片、腹板或氈片，除去紙張及併入連接線或長絲或 藉由濕磨（無淪是否經額外縫製）而黏結之編織、針織、簇 織、縫編產品，無論是否另外用針縫製。纖維可為天然或 人造來源。其可為切斷或連續之長絲或可當場形成。視形 成腹板之方法而定，非編織品通常包含複合物非編織品、 針紮非編織品、熔噴非編織品、紡黏非編織品、乾法非編 織品、濕法非編織品、縫編非編織品，或水刺非編織品。 較之編織品，非編織品具有更佳材料性質。 如本文所使用，術語「纖維」意指一單個纖維或複合物 纖維，較佳為複合物纖維。根據待研磨之基板來選擇纖 維。基底材料表面之纖維提供用於研磨之突起且亦提供一 支架，該支架允許研磨層之彈性體置於由其界定之空間 114388.doc 317315 中。A習此領域技術者可選擇合適種類之纖維且將彈性體 聚合物與根據說明書之揭示内容之纖維協調。較佳地，長 纖維由至少一種選自由以下各物組成之群的材料製成：聚 醯胺、對苯二甲醯胺、聚酯、聚曱基丙烯酸甲酯、聚對苯 二曱酸乙二酯、聚丙烯腈，及其混合物。 如本文中所使用，術語「具低滲透率之膜」係指一膜或 薄臈，其大體上防止根據本發明之具低滲透率之膜之上表 _ 面上的緩衝層滲透至具低滲透率之膜之下表面。較佳地， 具低滲透率之膜之材料係選自由以下各物組成之群：聚對 苯二甲酸乙二酯（PET)、聚丙烯（PP)、聚碳酸酯（pc)，及聚 乙烯（PE)。此外，聚丙烯為定向聚丙烯（〇pp)。 根據本發明之緩衝層係形成於基底材料與具低滲透率之 膜之上表面之間，且截入基底材料之纖維中。因為根據本 卷明之緩衝層係嵌入基底材料之纖維中，所以其充當美底 材料與具低渗透率之膜之間的中間物。才艮據本發明^衝 _ 1! A相修飾該基底材料之表面，且能夠填充基底材料 之粗糖及起伏點。因此，具低滲透率之膜可定位於緩衝層 2平整表面上。在根據本發明之研磨墊中觀察不到氣泡及 $隙。而且，根據本發明之研磨墊緊密且完全地黏附至研 磨壓板或頭部而不會有研磨漿滲透。研磨塾之壽命延長且 研磨塾可方便地更換。此外，根據本發明之緩衝層提供緩 2作用’用於消除研磨時對研磨塾之損壞。化學機械研磨 、、之效果及效率兩者皆因此而得以改良。 本發月之-較佳實施例中，緩衝層為糊劑。該糊劑替 114388.doc 1317315 代了習知研磨墊中之載體薄膜之上側上的黏接劑，用於直 接黏附至具低滲透率之膜。較佳地，該糊劑之黏度在丨cps 至30,000 eps之間。為填充基底材料之粗糙及起伏點，該 f月劑較佳為流動糊劑。舉例而言，該糊劑可包含聚胺基曱 酸酯或聚鍵。 在本發明之一較佳實施例中，該糊劑為二組份糊劑。該 二組份糊劑係指包含兩個彼此相互作用或交聯以達到黏著 效果之組份的糊劑。較佳地，該二組份糊劑包含多元醇樹 脂及聚異氰酸醋。Hi也，該多元醇樹脂為聚胺基甲㈣ 或聚趟。 在本發明之一較佳實施例中，該研磨墊進一步包含一糊 狀層，該糊狀層形成於該具低滲透率之膜之下表面上。更 佳地，該糊狀層為壓敏性黏接劑或聚胺基甲酸酯。如本文 *中所使用’「壓敏性黏接劑」包含一載體薄膜及在該載體 薄膜之上側及下側上的黏接劑。較佳地，該載體薄膜之材 料係選自由以下各物組成之群：聚對苯二甲酸乙二醋、聚 丙烯及聚乙烯。 在本發明之另一較佳實施例中，該研磨墊進一步包含一 研磨層，該研磨層包含多孔彈性體。如本文中所使用，術 語口「彈性體」（亦稱為「彈性聚合物」）係指一種展現類橡 膠品質之聚合物。研磨時，彈性體起良好緩衝作用，以避 免擦傷待研磨之基板之表面。在本發明之—較佳實施例 中’此等彈性體為泡珠樹脂。如本文中所使用，術語「泡 泳樹脂」係指含有熱塑樹脂及熱分解發泡劑之材料。較佳 114388.doc l3l73l5 地’該等彈性體包括至少一種選自由以下各物組成之群的 材料：聚醯胺、聚碳酸酯、聚丙烯腈、聚甲基丙烯酸酯、 壤氧樹脂、酚系樹脂、聚甲基丙烯酸甲酯、聚胺酯、乙稀 笨聚合物、丙烯酸系樹脂’及聚胺基甲酸酯。更佳地，該 彈性體為聚胺基甲酸酯。 本發明亦提供一種研磨一基板之方法，該方法包含使用 如以上所提及之研磨墊研磨該基板之一表面。 本發明亦提供一種用於製造如上所述之研磨塾之方法， 讀方法包含以下步驟： (a) 提供該基底材料； (b) 以一緩衝層溶液浸潰該基底材料且形成該緩衝層；及 (c) 將該具低滲透率之膜塗覆至該緩衝層。 以下實例僅為說明之目的而給出，且並非意欲限制本發 明之範疇。 比較實例： 浸潰：將基底材料之非編織品浸潰至含聚胺基甲酸醋的 彈性體溶液中。 固化：浸潰之後’將基底材料置入包含溶於水中之25重 量％之二甲基甲醯胺的固化溶液中。 洗滌：藉由擠出輪移除殘留物及過量固化溶液。然後在 水中洗條基底材料且然後使其經擠出輪擠壓數次。 乾燥：洗滌之後，乾燥基底材料。 拋光：乾燥之後，使基底材料經受機械研磨以得到具有 合適厚度之基底材料。 114388.doc 1317315 糊狀層：然後將雙側壓敏性黏接劑（BA3 13)塗覆至聚低 渗透率之膜上。糊狀層在穿透式電子顯微鏡下之照片展示 於圖1中。 黏結強度：黏結強度在(M kg/crn與〇·3 kg/cm之間。 實例： 浸潰：將基底材料之非編織品浸潰至含聚胺基甲酸酯的 彈性體溶液中。.1317315 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a polishing pad for a chemical mechanical polishing method. [Prior Art] Chemical mechanical polishing (CMP) is a procedure for flattening the surface of a substrate using a polishing pad. CMP is commonly used in abrasive lenses, mirrors, substrates for liquid crystal displays, germanium wafers, and oxide and/or metal layers on germanium wafers. Taking a germanium wafer as an example, the ingot of the single crystal germanium is first cut. The wafers are typically ground to flatten for subsequent chemical etching. A grinding process is required after the etching process. During the grinding process, the polishing pad, together with the slurry, chemically reacts with the ruthenium atoms on the surface of the crystal to make the reacted surface softer than the underlying crucible. In addition, the reacted surface is continuously erased, causing fresh enamel to be exposed to the slurry and the polishing pad. Conventional polishing pads comprise a substrate material comprising fibers. An abrasive layer comprising a porous elastomer (e.g., 'polyurethane) is also provided on or in the substrate material. The conventional grinding nip is fixed to the grinding platen or head of the grinder by using a pressure sensitive adhesive (pSA). The pressure sensitive adhesive comprises a carrier film. The film comprises, for example, a polyester and has a low flow adhesive on the upper and lower sides of the carrier film. This adhesive is referred to as a double side adhesive. The adhesive on the upper side of the carrier film is configured to couple the base material of the polishing pad' and the adhesive on the underside of the carrier film is coupled to the abrasive platen or head of the mill. Since the base material of the polishing pad contains fibers, the contents of the substrate material are not uniformly distributed. The thickness variation of the base material can be easily observed. Except for 114388.doc 1317315, the surface of the substrate material is not flat and usually has coarse sugar and undulations. These characteristics make it difficult for the base material to adhere tightly and completely to the adhesive on the upper surface of the carrier film of the pressure-sensitive adhesive. Air bubbles and voids can be easily observed at the interface between the base material and the pressure sensitive adhesive. Therefore, the slurry can be easily infiltrated into the interface between the base material and the pressure-sensitive adhesive via bubbles and voids. Thereby shortening the life of the polishing pad. In addition, when the polishing pad is replaced, the residue of the pressure-sensitive adhesive is liable to remain on the polishing platen or the head β' and it is necessary to remove the residue of the pressure-sensitive adhesive, and the time required for replacing the polishing pad The continuous process is extended. Both the effects and efficiencies of the chemical mechanical polishing method are thus reduced. SUMMARY OF THE INVENTION An object of the present invention is to provide a polishing pad comprising: a substrate material comprising fibers; a low permeability film having an upper surface; and a buffer layer formed on the substrate A substrate material is interposed between the upper surface of the film having a low permeability and embedded in the fibers of the substrate material. Another object of the present invention is to provide a method of polishing a substrate, the method comprising: grinding the surface of the substrate using a polishing pad as described above. μ and a further object of the present invention is to provide a method for manufacturing a polishing crucible as claimed, the method comprising the steps of: (a) providing the substrate material; (b) impregnating the substrate material with a buffer layer solution and Forming the buffer (C) applies the film having a low permeability to the buffer layer. And [Embodiment] 114388.doc 1317315 The present invention provides a polishing crucible comprising: a substrate material comprising fibers; a low permeability crucible; and a buffer layer formed on the substrate material and the Between one of the upper surfaces of the substrate having a low permeability and embedded in the fibers of the substrate material. According to the present invention, any of the substrate materials comprising fibers can be used in the present invention. Preferably, the base material is a non-woven fabric, and more preferably, the base material is a rolled non-woven fabric. The rolled non-woven article can be used in the form of a roll-to-roll, as compared to conventional methods of making a single polishing pad involving molding or casting. This approach improves batch uniformity. As used herein, "non-woven" means oriented fibers or webs, webs or mats that are bonded by friction and/or cohesion and/or adhesion to remove paper and A woven, knitted, tufted, stitch-spun product that incorporates a tie or filament or that is bonded by wet grinding (whether or not it is additionally sewn), whether or not otherwise sewn with a needle. The fibers can be of natural or artificial origin. It may be a cut or continuous filament or may be formed on the spot. Depending on the method of forming the web, the nonwoven fabric usually comprises a composite non-woven fabric, a needle-punched nonwoven fabric, a melt-blown non-woven fabric, a spunbond non-woven fabric, a dry non-woven fabric, a wet non-woven fabric, Stitched non-woven fabric, or spunlace non-woven fabric. Non-woven fabrics have better material properties than woven fabrics. As used herein, the term "fiber" means a single fiber or composite fiber, preferably a composite fiber. The fibers are selected according to the substrate to be polished. The fibers on the surface of the substrate material provide protrusions for grinding and also provide a support that allows the elastomer of the abrasive layer to be placed in the space defined by it 114388.doc 317315. A skilled artisan can select a suitable type of fiber and coordinate the elastomeric polymer with the fibers according to the disclosure of the specification. Preferably, the long fibers are made of at least one material selected from the group consisting of polyamine, terephthalamide, polyester, polymethyl methacrylate, and polyethylene terephthalate. Diesters, polyacrylonitriles, and mixtures thereof. As used herein, the term "film having a low permeability" means a film or a thin sheet which substantially prevents the buffer layer on the surface of the film having a low permeability according to the present invention from penetrating to a low surface. The lower surface of the membrane of permeability. Preferably, the material of the film having low permeability is selected from the group consisting of polyethylene terephthalate (PET), polypropylene (PP), polycarbonate (pc), and polyethylene. (PE). Further, the polypropylene is oriented polypropylene (〇pp). The buffer layer according to the present invention is formed between the base material and the upper surface of the film having a low permeability and is cut into the fibers of the base material. Since the buffer layer according to the present invention is embedded in the fibers of the base material, it acts as an intermediate between the base material and the film having a low permeability. According to the present invention, the surface of the base material is modified by the A phase, and the raw sugar and the undulation point of the base material can be filled. Therefore, the film having a low permeability can be positioned on the flat surface of the buffer layer 2. No bubbles and gaps were observed in the polishing pad according to the present invention. Moreover, the polishing pad according to the present invention adheres tightly and completely to the grinding platen or head without penetration of the slurry. The life of the grinding crucible is extended and the grinding crucible can be easily replaced. Further, the buffer layer according to the present invention provides a slowing action to eliminate damage to the grinding flaw during grinding. Both chemical mechanical polishing, effects and efficiency have been improved. In the preferred embodiment of the present month, the buffer layer is a paste. The paste replaces the adhesive on the upper side of the carrier film in the conventional polishing pad for 114388.doc 1317315 for direct adhesion to a film having a low permeability. Preferably, the paste has a viscosity of between 丨cps and 30,000 eps. To fill the roughness and undulation of the substrate material, the phlegm is preferably a flow paste. For example, the paste may comprise a polyamino phthalate or a poly bond. In a preferred embodiment of the invention, the paste is a two component paste. The two-component paste refers to a paste comprising two components which interact or crosslink with each other to achieve an adhesive effect. Preferably, the two component paste comprises a polyol resin and a polyisocyanate. Hi, the polyol resin is polyaminomethyl (tetra) or polyfluorene. In a preferred embodiment of the invention, the polishing pad further comprises a paste layer formed on the lower surface of the film having a low permeability. More preferably, the paste layer is a pressure sensitive adhesive or a polyurethane. The "pressure sensitive adhesive" as used herein contains a carrier film and an adhesive on the upper and lower sides of the carrier film. Preferably, the material of the carrier film is selected from the group consisting of polyethylene terephthalate, polypropylene and polyethylene. In another preferred embodiment of the invention, the polishing pad further comprises an abrasive layer comprising a porous elastomer. As used herein, the term "elastomer" (also known as "elastic polymer") refers to a polymer that exhibits a rubber-like quality. When grinding, the elastomer acts as a good buffer to avoid scratching the surface of the substrate to be polished. In the preferred embodiment of the invention, the elastomers are bead resins. As used herein, the term "bubble resin" means a material comprising a thermoplastic resin and a thermally decomposable blowing agent. Preferably, the elastomers comprise at least one material selected from the group consisting of polyamines, polycarbonates, polyacrylonitriles, polymethacrylates, lyophiles, phenolics. Resin, polymethyl methacrylate, polyurethane, ethylene polymer, acrylic resin' and polyurethane. More preferably, the elastomer is a polyurethane. The present invention also provides a method of polishing a substrate comprising grinding a surface of the substrate using a polishing pad as mentioned above. The present invention also provides a method for manufacturing a polishing crucible as described above, the reading method comprising the steps of: (a) providing the substrate material; (b) impregnating the substrate material with a buffer layer solution and forming the buffer layer; And (c) applying the film having a low permeability to the buffer layer. The following examples are given for illustrative purposes only and are not intended to limit the scope of the invention. Comparative Example: Immersion: A non-woven fabric of a base material was impregnated into an elastomer solution containing a polyurethane. Curing: After impregnation The substrate material was placed in a solidified solution containing 25 wt% of dimethylformamide dissolved in water. Washing: The residue and excess curing solution are removed by an extrusion wheel. The base material is then washed in water and then extruded through the extrusion wheel several times. Drying: After washing, the substrate material is dried. Polishing: After drying, the substrate material is subjected to mechanical grinding to obtain a substrate material having a suitable thickness. 114388.doc 1317315 Paste layer: A two-sided pressure sensitive adhesive (BA3 13) is then applied to the film of low permeability. A photograph of the paste layer under a transmission electron microscope is shown in Fig. 1. Bonding strength: The bonding strength is between (M kg/crn and 〇·3 kg/cm. Example: Immersion: The non-woven fabric of the base material is impregnated into the polyurethane-containing elastomer solution.
固化.浸潰之後，將基底材料置入包含溶於水中之2 5重 量％之二甲基甲醯胺的固化溶液中。 洗務：藉由擠出輪移除殘留物及過量固化溶液。然後在 水中洗滌基底材料且然後使其經擠出輪擠壓數次。 乾燥：洗滌之後’乾燥基底材料。 拋光：乾燥之後，使基底材料經受機械研磨以得到具有 合適厚度之基底材料。 緩衝層：以二組份糊劑（BA313)浸潰研磨墊。 。具低滲透率之膜：將聚對苯二甲酸乙二醋薄膜塗覆至緩 衝層上以形成聚低滲透率之膜。 、糊狀層：然後將雙側壓敏性黏接劑（BA313)塗覆至聚 渗透率之膜上。糊狀層在穿透式電子顯微鏡 / 於圖2中。 ’、、、月展不 黏結強度：黏結強度大於〇.6 kg/cm。 上述實施例僅為說明本發明之原理及其功效， 本I明。本發明所屬技術領域中具通常知識者對上:制 例所做之修改及變化仍不違背本發明之精神。本發明之： 114388.doc 12- 1317315After curing, the substrate material was placed in a solidified solution containing 25 wt% of dimethylformamide dissolved in water. Washing: The residue and excess curing solution are removed by an extrusion wheel. The substrate material is then washed in water and then extruded through the extrusion wheel several times. Drying: After washing, the substrate material is dried. Polishing: After drying, the substrate material is subjected to mechanical grinding to obtain a substrate material having a suitable thickness. Buffer layer: The polishing pad was impregnated with a two-component paste (BA313). . Film with low permeability: A film of polyethylene terephthalate is applied to the buffer layer to form a film of poly-low permeability. Paste layer: A two-sided pressure sensitive adhesive (BA313) was then applied to the film of polypermeability. The paste layer is in a transmission electron microscope / in Figure 2. ',,, and the monthly exhibition does not bond strength: the bond strength is greater than 〇.6 kg/cm. The above embodiments are merely illustrative of the principles and effects of the present invention. Modifications and variations made by the skilled person in the art to which the invention pertains are not inconsistent with the spirit of the invention. The present invention: 114388.doc 12- 1317315
利範圍應如後述之申請專利範圍所列。 【圖式簡單說明】 圖1繪示比較實例之糊狀層在穿透式電子顯微鏡下之視 圖；及 圖2繪示實例之糊狀層在穿透式電子顯微鏡下之視圖。 114388.doc -13 -The scope of profit should be as listed in the scope of patent application described later. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a paste layer of a comparative example under a transmission electron microscope; and Fig. 2 is a view showing a paste layer of an example under a transmission electron microscope. 114388.doc -13 -