200942361 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種拋光墊及其製造方法，詳言之，係關 於一種研磨層直接形成於一底材表面之拋光塾及其製造方 法。 【先前技術】 般拋光係以化學機械研磨（CMP)製程，對於一粗糖表 面之研磨’其係利用含有研磨粒子之研磨液平均分佈於— © 研磨墊之表面上，同時將一待拋光元件抵住該研磨塾後， 進行一重複且規律之搓磨動作。該待拋光元件係諸如半導 體' 儲存媒鱧底材、積體電路、LCD平板玻璃、光學玻璃 及光電面板等物體。 在習知技術中’其係以多層貼合方式製成一拋光墊，例 如：一研磨層與一底材利用一背膠貼合（請參考中華民國 專利申請案公告第M269996號之多層研磨墊）；或由複數個 薄層貼合而成之一研磨層與一底材以一背膠貼合（請參考 ^ 中華民國專利申請案公開第200513348號之用於化學機械 拋光之多層抛光墊）。 當上述之該等習知拋光塾浸入拋光液後，不同材質之研 磨層及底材、以及接著用之背膠具有不同之收縮率，故容 易會有應力產生。另外，該背膠長時間浸入拋光液中，會 逐漸降低接著能力’而造成拋光墊表面之平坦度不佳。此 外’在進行拋光作業，經由拋光機施加壓力以拋光一待拋 光物時’拋光墊表面較突出地方容易造成研磨層嚴重之損 127710.doc -6 - 200942361 耗，並且容易刮傷待拋光物材之表面。 再者，該等習知拋光墊受到研磨層厚度之限制，無法有 較長的孔洞儲存拋光液及拋光後產生之殘屑，容易造成孔 洞被拋光後產生之殘屑填充而逐漸變小，因此降低抛光效 果’且減少拋光墊之使用壽命。 因此’有必要提供一種創新且具進步性之抛光塾及其製 造方法，以解決上述問題。 【發明内容】 本發明^供一種抛光塾’該抛光塾包括一底材及一研磨 層。該底材係以一高分子體包覆一纖維層而成，該底材具 有一表面。該研磨層結合於該表面，該研磨層具有複數個 孔洞。 本發明另提供一種拋光墊之製造方法，該製造方法包 括：（a)提供一底材’該底材係以一高分子體包覆一纖維層 而成’該底材具有一表面；（b)形成一液態高分子材料於該 表面；及（c)固化該液態高分子材料’以形成一研磨層，該 研磨層結合於該表面且具有複數個孔洞。 本發明係將該液態高分子材料直接形成於該底材之該表 面’再固化該液態高分子材料，以於該底材上形成平坦之 該研磨層，藉此達到較佳之一體性及平坦度。再者，該研 磨層係呈長條狀之結構且具有該等孔洞，其對於研磨液中 之研磨粒子具有較佳之蘊含能力，並且，該拋光墊具有較 高之Μ縮率’故該拋光墊可與待拋光物可緊緊結合且不會 刮傷待拋光物之表面，故可提升研磨之效率及品質。 127710.doc 200942361 【實施方式】 本發明提供一種拋光墊，該拋光墊係應用於化學機械研 磨（CMP)製程中對一待拋光元件進行研磨或拋光。該待拋 光元件包括但不限於半導體、儲存媒體底材、積體電路' LCD平板玻璃、光學玻璃及光電面板等物體。 參考圖1，其顯示本發明拋光墊之示意圖。該拋光墊1包 括一底材11及一研磨層12。在本實施例中，該底材丨丨係以 一高分子體111包覆一纖維層112而成，該底材11具有一表 面113。較佳地，該表面113係為一經平坦化之表面。該纖 維層112可為一布材（例如：不織布）。在本實施例中，該高 分子體111係為一連續發泡體。其中，該高分子體1丨丨係選 自聚脲酯（PU)、聚丙烯（PP)、聚酯（pet)或高分子樹脂材 料’該纖維層112之材質係選自聚丙烯、聚酯、尼龍 (Nylon)或其所組成之群。 該研磨層12結合於該底材11之該表面113，且該研磨層 12具有複數個孔洞121。較佳地，該等孔洞121分佈之厚度 係為該研磨層12總厚度之至少二分之一。 在本實施例中，該拋光墊1之壓縮率係為5%至50%，該 拋光墊1之回復率係大於80%，該拋光墊1之厚度係為0.5至 3.0公釐，該拋光墊1之密度係為0.2至0.6公克/立方公分》 另外，在其他應用中，該纖維層112之部分纖維114係顯 露於該底材11之該表面113，該研磨層12更包覆顯露之該 纖維層112之該等纖維114(如圖2所示）。因此，該研磨層12 不僅附著於該底材11之該表面113，更包覆顯露之該纖維 127710.doc 200942361 層112之該等纖維114，故該研磨層12與該底材丨丨之間具有 更佳之結合性。 圖3顯示本發明拋光墊之製造方法流程圖。配合參考圖2 及圖3，首先’參考步驟S21 ’提供一底材11。該底材η係 以一高分子體111包覆一纖維層112而成，該底材11具有— 表面113。在本實施例中，該底材丨丨係經由以下步驟所形 成。首先’提供一纖維基材，接著，浸置該纖維基材於一 高分子溶液中，使該高分子溶液包覆該纖維基材，最後， ® 固化該高分子溶液，以形成該底材11。 參考步驟S22 ’形成一液態高分子材料於該底材丨丨之該 表面。在本實施例中，係以塗佈方式形成該液態高分子材 料於該底材11之該表面113，但不限定於該塗佈方式，該 液態高分子材料亦可以任何方式形成於該底材η之該表面 113。其中’該液態高分子材料係選自聚脲酯、聚丙稀、 聚酯或高分子樹脂材質。 馨 參考步驟S23，固化該液態高分子材料，以形成一研磨 層12’以製作完成本發明之拋光墊1。其中，該研磨層a 結合於該底材11之該表面113且具有複數個孔洞121。在該 固化步驟中，其可選擇性地以自然乾燥方式固化該液態高 分子材料，或以風乾方式固化該液態高分子材料。 要注意的是’該液態南分子材料形成於該底材11之該表 面且固化後形成一平坦之表面，可再將該平坦之表面接觸 一凝固槽中之液態高分子材料，以進行單面交換形成該研 磨層12,使得該研磨層12之結構增長並呈長條狀。 127710.doc 200942361 本發明係將該液態高分子材料直接形成於該底材u之該 表面113 ’再固化該液態南分子材料，以於該底材11上形 成平坦之該研磨層12，藉此達到較佳之一體性及較佳之平 坦度。再者，該研磨層12係呈長條狀之結構且具有該等孔 洞121，其對於研磨液中之研磨粒子具有較佳之蘊含能 力，並且’該拋光墊1具有較高之壓縮率。因此，該拋光 墊1可與待拋光物可緊緊結合且不會刮傷待拋光物之表 面，故可提升研磨之效率及品質》 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士對上述實施例進 行修改及變化仍不脫本發明之精神β本發明之權利範圍應 如後述之申請專利範圍所列。 【圖式簡單說明】 圖1顯示本發明抛光墊之示意圖； 圖2顯示本發明另一態樣之拋光塾示意圖；及 圖3顯示本發明拋光墊之製造方法流程圖β 【主要元件符號說明】 1 本發明之拋光塾 11 底材 12 研磨層 111 高分子體 112 纖維層 113 表面 114 織維 127710.doc -10·BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing pad and a method of manufacturing the same, and more particularly to a polishing crucible in which an abrasive layer is directly formed on a surface of a substrate and a method of manufacturing the same. [Prior Art] The general polishing is a chemical mechanical polishing (CMP) process for grinding a rough sugar surface by using a polishing liquid containing abrasive particles evenly distributed on the surface of the polishing pad while a component to be polished is After the grinding crucible, a repeated and regular honing action is performed. The component to be polished is an object such as a semiconductor 'storage media substrate, an integrated circuit, an LCD flat glass, an optical glass, and a photovoltaic panel. In the prior art, a polishing pad is formed by a multi-layer bonding method, for example, a polishing layer and a substrate are bonded by a backing tape (refer to the multilayer polishing pad of the Republic of China Patent Application No. M269996). Or a laminate of a plurality of thin layers and a substrate bonded with a backing material (refer to the multi-layer polishing pad for chemical mechanical polishing of the Republic of China Patent Application Publication No. 200513348) . When the above-mentioned conventional polishing crucibles are immersed in the polishing liquid, the grinding layers and the substrates of the different materials, and the adhesives used subsequently have different shrinkage ratios, so that stress is easily generated. In addition, the long-term immersion of the adhesive into the polishing liquid gradually lowers the adhesive ability and causes the flatness of the surface of the polishing pad to be poor. In addition, 'When polishing is performed, pressure is applied through the polishing machine to polish a to-be-polished material. 'The surface of the polishing pad is more prone to cause serious damage to the polishing layer, and it is easy to scratch the material to be polished. The surface. Moreover, the conventional polishing pad is limited by the thickness of the polishing layer, and it is not possible to have a long hole to store the polishing liquid and the residue generated after polishing, and it is easy to cause the hole to be filled and become smaller and smaller. Reduce the polishing effect' and reduce the life of the polishing pad. Therefore, it is necessary to provide an innovative and progressive polishing crucible and its manufacturing method to solve the above problems. SUMMARY OF THE INVENTION The present invention provides a polishing crucible that includes a substrate and an abrasive layer. The substrate is formed by coating a fiber layer with a polymer body having a surface. The abrasive layer is bonded to the surface, the abrasive layer having a plurality of holes. The invention further provides a method for manufacturing a polishing pad, comprising: (a) providing a substrate, wherein the substrate is coated with a fiber layer and a fiber layer; the substrate has a surface; Forming a liquid polymer material on the surface; and (c) curing the liquid polymer material ' to form an abrasive layer bonded to the surface and having a plurality of pores. In the present invention, the liquid polymer material is directly formed on the surface of the substrate to re-solidify the liquid polymer material to form a flat abrasive layer on the substrate, thereby achieving better body and flatness. . Furthermore, the polishing layer has a long strip structure and has such pores, which has a better impregnation ability for the abrasive particles in the polishing liquid, and the polishing pad has a high shrinkage ratio, so the polishing pad It can be tightly combined with the object to be polished without scratching the surface of the object to be polished, so that the efficiency and quality of the grinding can be improved. 127710.doc 200942361 [Embodiment] The present invention provides a polishing pad for use in a chemical mechanical polishing (CMP) process for grinding or polishing a component to be polished. The object to be polished includes, but is not limited to, a semiconductor, a storage medium substrate, an integrated circuit 'LCD flat glass, an optical glass, and an optoelectronic panel. Referring to Figure 1, there is shown a schematic view of a polishing pad of the present invention. The polishing pad 1 includes a substrate 11 and an abrasive layer 12. In the present embodiment, the substrate is formed by coating a fiber layer 112 with a polymer body 111 having a surface 113. Preferably, the surface 113 is a planarized surface. The fibrous layer 112 can be a cloth (e.g., non-woven). In the present embodiment, the high molecular body 111 is a continuous foam. Wherein, the polymer 1 is selected from the group consisting of polyurea (PU), polypropylene (PP), polyester (pet) or polymer resin material. The material of the fiber layer 112 is selected from the group consisting of polypropylene and polyester. Nylon or a group of them. The abrasive layer 12 is bonded to the surface 113 of the substrate 11, and the abrasive layer 12 has a plurality of holes 121. Preferably, the holes 121 are distributed to a thickness of at least one-half of the total thickness of the abrasive layer 12. In this embodiment, the polishing pad 1 has a compression ratio of 5% to 50%, the polishing pad 1 has a recovery ratio of more than 80%, and the polishing pad 1 has a thickness of 0.5 to 3.0 mm. The density of 1 is 0.2 to 0.6 g/cm 3 . In addition, in other applications, a portion of the fibers 114 of the fibrous layer 112 are exposed on the surface 113 of the substrate 11 , and the polishing layer 12 is further coated. The fibers 114 of the fibrous layer 112 (shown in Figure 2). Therefore, the polishing layer 12 is not only attached to the surface 113 of the substrate 11, but also covers the fibers 114 of the layer 119710.doc 200942361 of the exposed fiber, so that between the polishing layer 12 and the substrate Better combination. Figure 3 is a flow chart showing the method of manufacturing the polishing pad of the present invention. Referring to Figures 2 and 3, a substrate 11 is first provided with reference to step S21'. The substrate η is formed by coating a fiber layer 112 with a polymer body 111 having a surface 113. In the present embodiment, the substrate is formed through the following steps. First, a fiber substrate is provided, and then the fiber substrate is immersed in a polymer solution, the polymer solution is coated on the fiber substrate, and finally, the polymer solution is cured to form the substrate 11 . Referring to step S22', a liquid polymer material is formed on the surface of the substrate. In this embodiment, the liquid polymer material is formed on the surface 113 of the substrate 11 by coating, but is not limited to the coating method, and the liquid polymer material may be formed on the substrate in any manner. This surface 113 of η. Wherein the liquid polymer material is selected from the group consisting of polyurea ester, polypropylene, polyester or polymer resin. Xin Referring to step S23, the liquid polymer material is cured to form a polishing layer 12' to produce a polishing pad 1 of the present invention. The polishing layer a is bonded to the surface 113 of the substrate 11 and has a plurality of holes 121. In the curing step, the liquid high molecular material may be selectively cured in a natural drying manner or the liquid high molecular material may be cured in an air drying manner. It should be noted that the liquid south molecular material is formed on the surface of the substrate 11 and solidified to form a flat surface, and the flat surface can be contacted with the liquid polymer material in a solidification tank for single-sided surface. The formation of the abrasive layer 12 is exchanged such that the structure of the abrasive layer 12 grows and is elongated. 127710.doc 200942361 In the present invention, the liquid polymer material is directly formed on the surface 113 of the substrate u to re-solidify the liquid south molecular material to form a flat abrasive layer 12 on the substrate 11. A preferred one and a better flatness are achieved. Further, the polishing layer 12 has a long strip structure and has the holes 121 which have a better implied ability for the abrasive particles in the polishing liquid, and the polishing pad 1 has a higher compression ratio. Therefore, the polishing pad 1 can be tightly combined with the object to be polished without scratching the surface of the object to be polished, so that the efficiency and quality of the polishing can be improved. However, the above embodiments are merely illustrative of the principle and effect of the present invention. Rather than limiting the invention. Therefore, those skilled in the art can modify and change the above-described embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a polishing pad of the present invention; FIG. 2 is a schematic view showing a polishing process of another aspect of the present invention; and FIG. 3 is a flow chart showing a manufacturing method of the polishing pad of the present invention. 1 Polishing crucible 11 of the present invention Substrate 12 Abrasive layer 111 Polymer 112 Fibre layer 113 Surface 114 Weaving 127710.doc -10·