200841997 九、發明說明： 【發明所屬之技術領域】 ， 本發明係關於一種研磨片材及其製造方法，詳言之，係 關於一種複合式研磨片材及其製造方法。 【先前技術】 一般拋光係以化學機械研磨（CMP)製程，對於一粗糙表 面之研磨，其係利用含有研磨粒子之研磨液平均分佈於一 研磨墊之表面上，同時將一待拋光元件抵住該研磨墊後， 進行一重複且規律之搓磨動作。該待拋光元件係諸如半導 體、儲存媒體緩衝層、積體電路、LCD平板玻璃、光學破 璃及光電面板等物體。 習知單層獨立式發泡研磨層，在製程上所產生之發泡 孔，因漿料濃度及成型溫度易使發泡孔之孔洞分佈及大小 較不易均勻，因而造成研磨墊品質不穩定。另一習知獨立 非發泡樹脂所形成之研磨層，其研磨表面無微細孔洞，無 • 法保持研磨漿液在研磨墊與被拋光物之間，而降低研磨之 功效。 圖6顯示一種習知複合式研磨墊，其係採高分子彈性體 直接塗佈於緩衝層，經凝固後使二者結合成一複合式研磨 墊。該習知緩衝層會因為不織布的均勻性不佳以及棉付量 差異，造成塗佈於緩衝層上之該高分子彈性體呈現平坦不 一的現象（亦即該高分子彈性體薄膜及該緩衝層之介面不 平坦），使得拋光效果不隹，甚至損傷被拋光物。 另一種習知複合式研磨墊，其係以高分子彈性體直接塗 114379.doc 200841997 佈於緩衝層’經凝固後以剖片方式取得高分子彈性體薄 膜再利用一雙面膠與另一緩衝層結合，而以剖片方式取 得之該高分子彈性體薄膜’會因設備及棉付量差異，造成 所取得高分子彈性體薄膜會呈現平坦不一的現象。 參考圖7,其顯示該習知緩衝層具有不平坦之表面。參 考圖8’其顯示貼附之該雙面膠具有不平坦之表面。參考 圖9其顯不利用該雙面膠結合後之該高分子彈性體薄膜 ”亥緩衝層具有不平坦之接著面。由圖7至圖9可以清楚地 2出，言亥習知製造方法戶斤製得之複合式研磨墊之表面及該 回刀子彈性體薄膜與該緩衝層之接著面，皆為不平坦之表 面。 因此，習知複合式研磨墊製造方法所製得之複合式研磨 墊，其表面之均勻度不佳，故研磨效果較差。再者，習知 技術中係利用一雙面膠結合該高分子彈性體薄膜及該緩衝 層，再加上該高分子彈性體薄膜及該緩衝層皆具有不平整 之表面，故該高分子彈性體薄膜及該緩衝層間之結合強度 較為薄弱。 因此，有必要提供一種創新且具進步性之複合式研磨片 材及其製造方法’以解決上述問題。 【發明内容】 本發明之一目的在於提供一種複合式研磨片材。該複合 式研磨片材包括一緩衝層及一拋光層。該緩衝層係為連續 多孔性材質，其具有一平整化表面。該拋光層係為連續多 孔丨生材質，複合於該平整化表面上，以形成一複合式研磨 H4379.doc 200841997 片材，其中該拋光層係用以拋光一待拋光元件。 本發明之另一目的在於提供一種複合式研磨片材之製造 方法。該製造方法包括：（a)提供一緩衝層，該緩衝層係為 連續多孔性材質，其具有一表面；（b)平整化該表面，使該 表面形成一平整化表面；及（c)複合一拋光層於該平整化表 面上，以形成一複合式研磨片材，其中該拋光層係為連續 多孔性材質，用以拋光一待拋光元件。200841997 IX. Description of the Invention: [Technical Field] The present invention relates to an abrasive sheet and a method of manufacturing the same, and more particularly to a composite abrasive sheet and a method of manufacturing the same. [Prior Art] Generally, the polishing is performed by a chemical mechanical polishing (CMP) process for polishing a rough surface by using a polishing liquid containing abrasive particles evenly distributed on the surface of a polishing pad while holding a member to be polished. After the polishing pad, a repeated and regular honing action is performed. The component to be polished is an object such as a semiconductor, a storage medium buffer layer, an integrated circuit, an LCD flat glass, an optical glass, and an optoelectronic panel. Conventional single-layer independent foamed abrasive layers, in the foaming holes produced in the process, due to the slurry concentration and the molding temperature, the pores of the foaming holes are less likely to be evenly distributed and the quality of the polishing pad is unstable. Another conventional abrasive layer formed of a non-foamed resin has no fine pores on the surface to be polished, and the abrasive slurry is prevented from being between the polishing pad and the object to be polished, thereby reducing the effect of the grinding. Fig. 6 shows a conventional composite polishing pad which is directly coated with a polymeric elastomer on a buffer layer and solidified to combine the two into a composite polishing pad. The conventional buffer layer may have a flatness in the polymer elastomer coated on the buffer layer due to the poor uniformity of the nonwoven fabric and the difference in the amount of cotton (ie, the polymer elastomer film and the buffer). The interface of the layer is not flat, so that the polishing effect is not flawed, and even the object to be polished is damaged. Another conventional composite polishing pad is directly coated with a polymer elastomer 114379.doc 200841997. The buffer layer is solidified and then obtained by dissection to obtain a polymer elastomer film and then a double-sided tape and another buffer. When the layers are combined, the polymer elastomer film obtained by the splitting method may cause a flatness of the obtained polymer elastomer film due to the difference in equipment and cotton dosage. Referring to Figure 7, it is shown that the conventional buffer layer has an uneven surface. Referring to Figure 8', it is shown that the double-sided tape attached has an uneven surface. Referring to FIG. 9, it is apparent that the polymer elastomer film after the double-sided tape is bonded has a non-flat interface. It can be clearly seen from FIG. 7 to FIG. The surface of the composite polishing pad prepared by the jin and the back surface of the knives elastomer film and the buffer layer are all uneven surfaces. Therefore, the composite polishing pad prepared by the conventional composite polishing pad manufacturing method The uniformity of the surface is not good, so the grinding effect is poor. Moreover, in the prior art, a double-sided adhesive is used to bond the polymeric elastomer film and the buffer layer, and the polymeric elastomer film and the The buffer layer has an uneven surface, so the bonding strength between the polymer elastomer film and the buffer layer is weak. Therefore, it is necessary to provide an innovative and progressive composite abrasive sheet and a manufacturing method thereof to solve SUMMARY OF THE INVENTION An object of the present invention is to provide a composite abrasive sheet comprising a buffer layer and a polishing layer. The buffer layer is continuous. a porous material having a flattened surface. The polishing layer is a continuous porous material laminated on the planarized surface to form a composite abrasive H4379.doc 200841997 sheet, wherein the polishing layer is used for Polishing a component to be polished. Another object of the present invention is to provide a method for manufacturing a composite abrasive sheet. The manufacturing method comprises: (a) providing a buffer layer which is a continuous porous material having a a surface; (b) planarizing the surface to form a planarized surface; and (c) compounding a polishing layer on the planarized surface to form a composite abrasive sheet, wherein the polishing layer is continuous A porous material used to polish a component to be polished.
藉由本發明之製造方法，可產生一表面極為平整之緩衝 層，使得複合於該平整化表面上之該拋光層同樣具有非常 平坦之表面，因此，本發明之該複合式研磨片材於拋光過 耘中，施加於一被拋光元件表面之應力較為平均，可使該 被拋光兀件在研磨後具有較平坦之表面，且不會刮傷或破 壞該被拋光70件，故本發明之該複合式研磨片材具有較佳 之拋光效果。另外，該複合式研磨片材具有較佳之均勻 度，故該緩衝層與該拋光層具有較佳之結合強度。 【實施方式] 本發明提供一種複合式研磨片材，該複合式研磨片材係 應用於化學機械研磨（CMp)製程中對—待拋光元件進行研 磨或拋光。该待拋光元件包括但不限於半導體、儲存媒體 缓衝層 '積體電路、LCD平板玻璃、光學玻璃及光電面板 等物體。 請參閱圖1A至圖3， 其顯示本發明第一實施例之複合式 研磨片材之製造方 11。參考圖1B，沈 法。參考圖1A，首先，提供一非織物 浸該非織物11於一高分子溶液12中。參 114379.doc 200841997 考圖ic，固化含高分子溶液之該非織，以形成—初始 緩衝層13,其中’含高分子溶液之該非織物n係利一㈣ 步驟固化。另夕卜，在烘烤步驟之前可另包括一凝固在該非 織物11中之該高分子溶液12之步驟，以及在凝固該高分子 溶液12步驟之後’可另包括—水洗含高分子溶液之該非織 物11之步驟。 參考圖1D’將該初始緩衝層13剖片，以形成一緩衝層 14,該緩衝層14具有一表面141。該緩衝層14係一具連通 多孔發泡性之高分子彈性體。 參考圖1E，平整化該緩衝層14之該表面141，使該表面 141形成一平整化表面142。較佳地，該平整化表面142之 不均勻度百分比低於6·0%。在該實施例中，係利用研磨方 法平整化該表面141。經研磨後之該平整化表面142之不均 勻度百分比可有效降低到1.8%至1.9%之間。較佳地，更可 在研磨步驟之後另包括一整燙該平整化表面142之步驟， 進一步增加該平整化表面142之均勻度。 在該實施例中，係以標準差方式計算該平整化表面142 之均勻度，其計算公式如下： 不均勻度百分比= 複數點最大厚度值-複數點最小厚度值 複數點厚度平均值X 2 Xl00〇/o 參考圖IF，複合一拋光層15於該緩衝層14之該平整化表 面142上，以形成一複合式研磨片材1，該拋光層丨5係為一 連續多孔性高分子彈性薄片，用以拋光一待拋光元件。要 注意的是，該拋光層15亦可具有複數個研磨粒子（圖未示 114379.doc •9- 200841997 出）均勻地分佈於該拋光層15，以增加表面研磨之功效。 參考圖2A至圖2C，該拋光層15係由以下步驟形成：首 先，提供一載體16;接著，塗佈一高分子組成物於該載體 16上；接著，固化該高分子組成物，以形成該拋光層15 ; 最後，分離該載體16及該拋光層15。該實施例中，該載體 16係為一不透水之薄膜，且該載體16之表面係為一平滑面 或亮面，藉此可使該拋光層15具有較佳之均勻性及均勻 度。較佳地，該載體16之材質係選自聚酯（PET)、寡苯烯 乙烯（OPP)、聚烯烴（TPE)、聚笨乙烯（PS)、聚丙烯（PP)、 聚乙烯（PE)、聚脲酯（PU)或其組成之群。在該實施例中， 該載體16及該拋光層15係利用機械物理方式分離，在其他 應用中，亦可利用化學方式分離該載體16及該拋光層15。 配合參考圖1F及圖2C，要注意的是，可選擇性地在分離 該載體16及該拋光層15之前進行一研磨整平該拋光層15之 步驟，或在複合該拋光層15於該緩衝層14之該平整化表面 142之後，再進行研磨整平該拋光層15之步驟，以增加該 拋光層15之均勻度，以及使該複合式研磨片材1具有更一 致之厚度，以期在進行拋光一被拋光元件時，該被拋光元 件表面受力較為平均，以提升研磨之品質。 配合參考圖1F及圖3，該拋光層15經研磨後，該拋光層 15之表面會產生複數條高分子彈性絨毛151，且因該拋光 層15係為一連續多孔性高分子彈性薄片，故亦會產生複數 個開孔152。藉此，在拋光過程中增加該複合式研磨片材1 與被抛光元件間研磨液之蘊含，以及使該研磨液中之研磨 114379.doc -10- 200841997 粒子分佈更均勻。 配合參考圖1F及圖4，較佳地，在複合該緩衝層14及該 拋光層15步驟之後，可另包括一形成複數個溝槽153於該 拋光層15上之步驟。依應用之不同，該等溝槽Μ)可為正 方形、三角形或矩形等幾何形狀。 請參閱圖5，其顯示本發明第二實施例之複合式研磨片 材之製造方法。該第二實施例之複合式研磨片材之製造方 法與上述第一實施例之複合式研磨片材之製造方法不同之 處在於，該第二實施例之複合式研磨片材之製造方法係將 一高分子組成物，直接塗佈於一經研磨整平之一緩衝層24 上，接著固化該高分子組成物，以形成一拋光層25，以製 作完成一複合式研磨片材2。 相同地，在固化步驟之後可另包括一研磨整平該拋光層 25之步驟，以增加該拋光層25之均勻度以及使該複合式研 磨片材2具有更一致之厚度。另外，在研磨步驟之後亦可 包括一形成複數個溝槽於該拋光層25上之步驟。依應用之 不同，該等溝槽可為正方形、三角形或矩形等幾何形狀。 再參考圖1F，其顯示本發明第一實施例之複合式研磨片 材之示意圖。該複合式研磨片材1包括一緩衝層14及一拋 光層15。該缓衝層14具有一平整化表面142，該平整化表 面142之不均勻度百分比低於6%。較佳地，該缓衝層14係 一具連通多孔發泡性之高分子彈性體。較佳地，該緩衝層 14係選自聚酯（PET)、寡笨烯已烯（OPP)、聚烯烴（TPE)、 聚苯乙烯（PS)、聚丙烯（pp)、聚乙烯（PE)、聚脲酯（PU)或 114379.doc -11 - 200841997 其組成之群。在其他應用中，該缓衝層14係可為以高分子 材料覆蓋非織物所形成之連續多孔性高分子彈性體。 該拋光層15複合於該平整化表面142上，以形成該複合 式研磨片材1。在該實施例中，該拋光層15係為一連續多 孔性高分子彈性薄片，用以拋光一待拋光元件，且具有複 數個研磨粒子（圖未示出）均勻地分佈於該拋光層丨5。在其 他應用中，該拋光層15係可為以高分子材料覆蓋非織物所 形成之連續多孔性高分子彈性薄片。 兹以下列實例予以詳細說明本發明，唯並不意味本發明 僅侷限於此等實例所揭示之内容。 實例1 : 首先’將一非織物沈浸於一具連通多孔發泡性之聚脲酯 (PU)高分子溶液中，並於固化含聚脲酯高分子溶液之該非 織物後將其剖片，使其厚度約為1 · 1 mm，並經過表面研 磨、修整及整燙後，以形成一具有平整化表面之緩衝層。 另外’以一厚度為〇〇3 mm之寡笨烯乙烯（Qpp)薄膜作為 一載體’在該載體表面上塗佈一厚度為1〇丨.1 之高分 子彈性體。接著，以25%之二甲基曱醯胺（DMF)使該高分 子彈性體凝固。凝固後之該高分子彈性體凝固之厚度約為 0.65 mm。接著，以75t-80t進行水洗步驟，再以13〇它 下進行一烘烤步驟，使該高分子彈性體烘乾後之厚度約為 〇·55 mm 〇 接著，將烘乾後之該高分子彈性體與該載體分離以形 成一拋光層。接著，將該拋光層複合於該緩衝層之該平整 114379.doc • 12- 200841997 化表面上。最後，研磨複合後之該拋光層表面，使整體厚 度約為1.55 mm,以製作完成本發明之複合式研磨片材。 實例2 : 首先將非織物沈浸於一具連通多孔發泡性之聚脲酯 (pu)高分子溶液中，並於固化含聚脲酯高分子溶液之該非 織物後將其剖片，使其厚度約為1 · 1 mm，並經過表面研 磨、修整及整烫後，以形成一具有平整化表面之緩衝層。 另外，以該具有平整化表面之緩衝層作為一載體，在該 緩衝層之該平整化表面上塗佈一厚度為i 〇-1丨mm之高分 子彈性體。接著，以25%之二曱基甲醯胺（DMF)使該高分 子彈性體凝固。凝固後之該高分子彈性體凝固之厚度約為 〇·65 mm。接著，以75°c-8(rc進行水洗步驟，再以13〇它 下進行一烘烤步驟，使該高分子彈性體烘乾後之厚度約為 0.55 mm 〇 接著’研磨烘乾後之該高分子彈性體，使整體厚度約為 1.55 mm，以製作完成本發明之複合式研磨片材。 藉由本發明之製造方法，可產生一表面極為平整之緩衝 層，使得複合於該緩衝層14上之該拋光層15同樣具有非常 平坦之表面，因此，本發明之該複合式研磨片材1於拋光 過程中，施加於一被拋光元件表面之應力較為平均，可使 該被拋光元件在研磨後具有較平坦之表面，且不會到傷咬 破壞該被拋光元件，故本發明之該複合式研磨片材1具有 較佳之拋光效果。另外，該複合式研磨片材1具有較佳之 均勻度，故該緩衝層14與該拋光層15具有較佳之結合強 114379.doc -13- 200841997 度。 惟上述實施例僅為說明本發明之原理及其功效，而非用 以限制本發明。因此，習於此技術之人士對上述實施例進 行修改及變化仍不脫本發明之精神。本發明之權利範圍應 如後述之申請專利範圍所列。 【圖式簡單說明】 圖1A顯示本發明非織物之示意圖； _ 圖1B顯示本發明該非織物浸入一高分子溶液中之示意 回 圖， 圖ic顯示本發明初始緩衝層之示意圖； 圖1D顯示本發明將該初始缓衝層剖片以形成一緩衝層之 示意圖； 圖1E顯示本發明平整化該緩衝層之表面之示意圖； 圖1 F顯示本發明第一實施例之複合式研磨片材之示意 Γ5Π · 圖， # 圖2八顯示本發明之載體之示意圖； ® 顯示本發明塗佈一高分子組成物於該載體上以形成 一拋光層之示意圖； 圖2C顯示本發明分離該載體及該拋光層之示意圖； 圖3顯示本發明該拋光層之表面具有複數條高分子彈性 絨毛之示意圖； ® 4顯示本發明形成複數個溝槽於該拋光層上之示意 圖： 圖5顯示本發明第二實施例之複合式研磨片材之示意 114379.doc 200841997 圖； 圖6顯示習知複合式研磨墊之示意圖； 圖7顯示習知緩衝層具有不平坦表面之示意圖； 圖8顯示習知貼附之雙面膠具有不平坦之表面之示意 圖；及 圖9顯示習知利用雙面膠結合後之高分子彈性體薄膜與 緩衝層具有不平坦之接著面之示意圖。 【主要元件符號說明】 1 第一實施例之複合式研磨片材 2 第二實施例之複合式研磨片材 11 非織物 12 高分子溶液 13 初始緩衝層 14 緩衝層 15 拋光層 24 緩衝層 25 拋光層 141 表面 142 平整化表面 151 高分子彈性絨毛 152 開孔 153 溝槽 114379.doc • 15-By the manufacturing method of the present invention, a buffer layer having an extremely flat surface can be produced, so that the polishing layer composited on the planarized surface also has a very flat surface, and therefore, the composite abrasive sheet of the present invention is polished. In the crucible, the stress applied to the surface of a polished component is relatively uniform, so that the polished bead has a relatively flat surface after grinding, and does not scratch or destroy the polished 70 pieces, so the composite of the present invention The abrasive sheet has a better polishing effect. Further, the composite abrasive sheet has a better uniformity, so that the buffer layer has a better bonding strength with the polishing layer. [Embodiment] The present invention provides a composite abrasive sheet which is used in a chemical mechanical polishing (CMp) process for grinding or polishing a member to be polished. The components to be polished include, but are not limited to, semiconductors, storage medium buffer layers, integrated circuit, LCD flat glass, optical glass, and photovoltaic panels. Referring to Figures 1A through 3, there is shown a manufacturing method 11 of a composite abrasive sheet according to a first embodiment of the present invention. Refer to Figure 1B, the sinking method. Referring to Figure 1A, first, a non-woven fabric is provided to impregnate the nonwoven fabric 11 in a polymer solution 12. Ref. 114379.doc 200841997 Test ic, curing the nonwoven fabric containing the polymer solution to form an initial buffer layer 13, wherein the non-woven fabric containing the polymer solution is cured in a step (4). In addition, a step of solidifying the polymer solution 12 in the non-woven fabric 11 may be further included before the baking step, and after the step of solidifying the polymer solution 12, 'may additionally include - washing the non-polymer solution containing the non-polymer solution The step of the fabric 11. The initial buffer layer 13 is sectioned with reference to FIG. 1D' to form a buffer layer 14, which has a surface 141. The buffer layer 14 is a polymer elastomer having a porous foaming property. Referring to FIG. 1E, the surface 141 of the buffer layer 14 is planarized such that the surface 141 forms a planarized surface 142. Preferably, the unevenness percentage of the planarized surface 142 is less than 6.00%. In this embodiment, the surface 141 is planarized by a grinding method. The percentage of unevenness of the planarized surface 142 after grinding can be effectively reduced to between 1.8% and 1.9%. Preferably, the step of ironing the planarization surface 142 is further included after the grinding step to further increase the uniformity of the planarized surface 142. In this embodiment, the uniformity of the planarized surface 142 is calculated in a standard deviation manner, and the calculation formula is as follows: percent unevenness = complex point maximum thickness value - complex point minimum thickness value complex point thickness average value X 2 Xl00 〇/o Referring to FIG. IF, a composite polishing layer 15 is formed on the planarized surface 142 of the buffer layer 14 to form a composite abrasive sheet 1 which is a continuous porous polymeric elastic sheet. For polishing a component to be polished. It is to be noted that the polishing layer 15 may also have a plurality of abrasive particles (not shown in the drawings, 139379.doc • 9-200841997) uniformly distributed on the polishing layer 15 to increase the effect of surface grinding. Referring to FIGS. 2A to 2C, the polishing layer 15 is formed by first providing a carrier 16; then, coating a polymer composition on the carrier 16; then, curing the polymer composition to form The polishing layer 15; finally, the carrier 16 and the polishing layer 15 are separated. In this embodiment, the carrier 16 is a water impermeable film, and the surface of the carrier 16 is a smooth or glossy surface, whereby the polishing layer 15 can have better uniformity and uniformity. Preferably, the material of the carrier 16 is selected from the group consisting of polyester (PET), oligostyrene (OPP), polyolefin (TPE), polystyrene (PS), polypropylene (PP), and polyethylene (PE). Polyurethane (PU) or a group thereof. In this embodiment, the carrier 16 and the polishing layer 15 are separated by mechanical physical means. In other applications, the carrier 16 and the polishing layer 15 may also be chemically separated. Referring to FIG. 1F and FIG. 2C, it is noted that a step of polishing and polishing the polishing layer 15 may be selectively performed before the carrier 16 and the polishing layer 15 are separated, or the polishing layer 15 may be composited in the buffer. After the planarizing surface 142 of the layer 14, the step of polishing the polishing layer 15 is further performed to increase the uniformity of the polishing layer 15, and the composite abrasive sheet 1 has a more uniform thickness for the purpose of proceeding. When polishing a polished component, the surface of the component being polished is more evenly stressed to improve the quality of the polishing. Referring to FIG. 1F and FIG. 3, after the polishing layer 15 is polished, a plurality of polymer elastic fluffs 151 are generated on the surface of the polishing layer 15, and since the polishing layer 15 is a continuous porous polymer elastic sheet, A plurality of openings 152 are also created. Thereby, the inclusion of the polishing liquid between the composite abrasive sheet 1 and the member to be polished is increased during the polishing process, and the particle distribution of the polishing in the polishing liquid is more uniform. Referring to FIG. 1F and FIG. 4, preferably, after the step of laminating the buffer layer 14 and the polishing layer 15, a step of forming a plurality of trenches 153 on the polishing layer 15 may be further included. Depending on the application, the grooves 可) may be geometric shapes such as square, triangle or rectangle. Referring to Figure 5, there is shown a method of manufacturing a composite abrasive sheet according to a second embodiment of the present invention. The manufacturing method of the composite abrasive sheet of the second embodiment is different from the method for manufacturing the composite abrasive sheet of the first embodiment in that the manufacturing method of the composite abrasive sheet of the second embodiment is A polymer composition is directly coated on a buffer layer 24 which is ground and flattened, and then the polymer composition is cured to form a polishing layer 25 to complete a composite abrasive sheet 2. Similarly, a step of grinding and flattening the polishing layer 25 may be additionally included after the curing step to increase the uniformity of the polishing layer 25 and to make the composite abrasive sheet 2 have a more uniform thickness. Alternatively, a step of forming a plurality of grooves on the polishing layer 25 may be included after the polishing step. Depending on the application, the grooves may be geometric shapes such as squares, triangles or rectangles. Referring again to Figure 1F, there is shown a schematic view of a composite abrasive sheet of a first embodiment of the present invention. The composite abrasive sheet 1 comprises a buffer layer 14 and a polishing layer 15. The buffer layer 14 has a planarized surface 142 having a non-uniformity percentage of less than 6%. Preferably, the buffer layer 14 is a polymeric elastomer having a porous foaming property. Preferably, the buffer layer 14 is selected from the group consisting of polyester (PET), oligoethylene (OPP), polyolefin (TPE), polystyrene (PS), polypropylene (pp), and polyethylene (PE). , Polyurea (PU) or 114379.doc -11 - 200841997 The group of its constituents. In other applications, the buffer layer 14 may be a continuous porous polymeric elastomer formed by covering a non-woven fabric with a polymeric material. The polishing layer 15 is composited on the planarized surface 142 to form the composite abrasive sheet 1. In this embodiment, the polishing layer 15 is a continuous porous polymer elastic sheet for polishing a member to be polished, and has a plurality of abrasive particles (not shown) uniformly distributed on the polishing layer 丨5. . In other applications, the polishing layer 15 may be a continuous porous polymeric elastic sheet formed by covering a non-woven fabric with a polymer material. The invention is illustrated by the following examples, which are not intended to be construed as limiting the invention. Example 1: Firstly, a non-woven fabric was immersed in a polyurea (PU) polymer solution which is connected to a porous foaming property, and after the non-woven fabric containing the polyurea polymer solution was solidified, it was cut into pieces. It has a thickness of about 1 · 1 mm and is surface-polished, trimmed and ironed to form a buffer layer with a flattened surface. Further, a high molecular weight elastomer having a thickness of 1 Å was coated on the surface of the carrier by using a film of oligo(ethylene oxide (Qpp) having a thickness of 〇〇3 mm as a carrier. Next, the high molecular elastomer was solidified with 25% dimethyl decylamine (DMF). The solidified elastomer after solidification has a thickness of about 0.65 mm. Next, the water washing step is performed at 75t-80t, and then a baking step is performed under 13〇, so that the thickness of the polymer elastomer after drying is about 〇·55 mm. Then, the polymer after drying is dried. The elastomer is separated from the carrier to form a polishing layer. Next, the polishing layer is composited on the flat surface of the buffer layer. Finally, the surface of the composite layer after the compounding was ground to have an overall thickness of about 1.55 mm to prepare a composite abrasive sheet of the present invention. Example 2: First, the non-woven fabric is immersed in a polyurea (pu) polymer solution connected to the porous foaming property, and after curing the non-woven fabric containing the polyurea polymer solution, the film is cut into thicknesses. It is approximately 1 · 1 mm and is surface-polished, trimmed and ironed to form a buffer layer with a flattened surface. Further, a buffer layer having a flattened surface is used as a carrier, and a high molecular weight elastomer having a thickness of i 〇 -1 丨 mm is coated on the flattened surface of the buffer layer. Next, the high molecular elastomer was solidified with 25% dimethylformamide (DMF). The solidified elastomer after solidification has a thickness of about 〇·65 mm. Next, the water washing step is performed at 75 ° c-8 (rc, and then a baking step is performed under 13 Torr, the thickness of the polymeric elastomer after drying is about 0.55 mm, followed by 'grinding and drying The polymeric elastomer has an overall thickness of about 1.55 mm to produce a composite abrasive sheet of the present invention. By the manufacturing method of the present invention, a buffer layer having an extremely flat surface can be produced so as to be laminated on the buffer layer 14. The polishing layer 15 also has a very flat surface. Therefore, the composite abrasive sheet 1 of the present invention has a relatively uniform stress applied to the surface of a member to be polished during polishing, so that the member to be polished can be polished. The composite abrasive sheet 1 of the present invention has a better polishing effect, and the composite abrasive sheet 1 has a better uniformity, and has a flat surface and does not damage the polished member. Therefore, the buffer layer 14 and the polishing layer 15 have a better bonding strength of 114379.doc -13 - 200841997. However, the above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Therefore, those skilled in the art can make modifications and changes to the above-described embodiments without departing from the spirit of the invention. The scope of the invention should be as set forth in the appended claims. [FIG. 1A shows the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1B is a schematic view showing the non-woven fabric of the present invention immersed in a polymer solution, and FIG. 1C is a schematic view showing the initial buffer layer of the present invention; FIG. 1D is a view showing the initial buffer layer of the present invention. 1E is a schematic view showing the surface of the buffer layer of the present invention; FIG. 1F shows a schematic diagram of the composite abrasive sheet of the first embodiment of the present invention. FIG. Schematic diagram of the carrier; ® shows a schematic diagram of coating a polymer composition on the carrier to form a polishing layer; FIG. 2C shows a schematic diagram of separating the carrier and the polishing layer of the present invention; FIG. 3 shows the polishing of the present invention. The surface of the layer has a schematic diagram of a plurality of polymer elastic fluff; ® 4 shows a schematic diagram of forming a plurality of grooves on the polishing layer according to the present invention: A schematic diagram of a composite abrasive sheet according to a second embodiment of the present invention 114379.doc 200841997; Figure 6 shows a schematic view of a conventional composite polishing pad; Figure 7 shows a schematic view of a conventional buffer layer having an uneven surface; A schematic view of a double-sided adhesive having an uneven surface; and FIG. 9 is a schematic view showing a conventional polymer elastomer film and a buffer layer having an uneven back surface. 1 composite abrasive sheet of the first embodiment 2 composite abrasive sheet of the second embodiment 11 non-woven fabric 12 polymer solution 13 initial buffer layer 14 buffer layer 15 polishing layer 24 buffer layer 25 polishing layer 141 surface 142 flat Surface 151 polymer elastic fluff 152 opening 153 groove 114379.doc • 15-