JP2011504134A5 - - Google Patents

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Publication number
JP2011504134A5
JP2011504134A5 JP2010533253A JP2010533253A JP2011504134A5 JP 2011504134 A5 JP2011504134 A5 JP 2011504134A5 JP 2010533253 A JP2010533253 A JP 2010533253A JP 2010533253 A JP2010533253 A JP 2010533253A JP 2011504134 A5 JP2011504134 A5 JP 2011504134A5
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JP
Japan
Prior art keywords
pillar
composite assembly
electrode
pillars
width
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JP2010533253A
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English (en)
Japanese (ja)
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JP2011504134A (ja
JP5422847B2 (ja
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Priority claimed from PCT/US2008/082701 external-priority patent/WO2009061970A1/en
Publication of JP2011504134A publication Critical patent/JP2011504134A/ja
Publication of JP2011504134A5 publication Critical patent/JP2011504134A5/ja
Application granted granted Critical
Publication of JP5422847B2 publication Critical patent/JP5422847B2/ja
Expired - Fee Related legal-status Critical Current
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JP2010533253A 2007-11-06 2008-11-06 基板を処理するための複合トランスデューサー装置及びシステム、及びそれを造る方法 Expired - Fee Related JP5422847B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US98594707P 2007-11-06 2007-11-06
US60/985,947 2007-11-06
US3414208P 2008-03-05 2008-03-05
US61/034,142 2008-03-05
PCT/US2008/082701 WO2009061970A1 (en) 2007-11-06 2008-11-06 Composite transducer apparatus and system for processing a substrate and method of constructing the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013231278A Division JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Publications (3)

Publication Number Publication Date
JP2011504134A JP2011504134A (ja) 2011-02-03
JP2011504134A5 true JP2011504134A5 (cg-RX-API-DMAC7.html) 2011-03-31
JP5422847B2 JP5422847B2 (ja) 2014-02-19

Family

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Family Applications (2)

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JP2010533253A Expired - Fee Related JP5422847B2 (ja) 2007-11-06 2008-11-06 基板を処理するための複合トランスデューサー装置及びシステム、及びそれを造る方法
JP2013231278A Pending JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013231278A Pending JP2014112829A (ja) 2007-11-06 2013-11-07 基板を処理するための装置及び方法

Country Status (5)

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US (2) US8279712B2 (cg-RX-API-DMAC7.html)
JP (2) JP5422847B2 (cg-RX-API-DMAC7.html)
KR (1) KR101226071B1 (cg-RX-API-DMAC7.html)
CN (2) CN101918151B (cg-RX-API-DMAC7.html)
WO (1) WO2009061970A1 (cg-RX-API-DMAC7.html)

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KR102683447B1 (ko) * 2019-03-29 2024-07-08 엘지디스플레이 주식회사 표시 장치
KR102679871B1 (ko) * 2019-04-03 2024-06-28 엘지디스플레이 주식회사 표시장치
CN110572756A (zh) * 2019-09-11 2019-12-13 京东方科技集团股份有限公司 定向薄膜换能器及其制备方法、扬声器
KR102759031B1 (ko) * 2019-12-09 2025-01-22 엘지디스플레이 주식회사 표시장치
KR102763470B1 (ko) 2019-12-16 2025-02-05 엘지디스플레이 주식회사 표시장치
CN111085942B (zh) * 2019-12-31 2021-10-15 中国计量大学 一种基于相控空化效应的磨粒微射流抛光方法及抛光装置
KR102743312B1 (ko) 2020-03-04 2024-12-13 엘지디스플레이 주식회사 표시장치
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TW202430011A (zh) * 2020-12-22 2024-07-16 南韓商樂金顯示科技股份有限公司 振動裝置以及包含其的電子裝置
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