CN101918151B - 用于处理基板的复合换能器装置和系统及其构造方法 - Google Patents

用于处理基板的复合换能器装置和系统及其构造方法 Download PDF

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Publication number
CN101918151B
CN101918151B CN200880124087.6A CN200880124087A CN101918151B CN 101918151 B CN101918151 B CN 101918151B CN 200880124087 A CN200880124087 A CN 200880124087A CN 101918151 B CN101918151 B CN 101918151B
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composite component
cylinder
electrode
transducer
width
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Chinese (zh)
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CN101918151A (zh
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约翰·科贝勒
理查德·诺瓦克
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Ecoron Technologies
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Goldfinger Technologies LLC
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CN200880124087.6A 2007-11-06 2008-11-06 用于处理基板的复合换能器装置和系统及其构造方法 Active CN101918151B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210450381.4A CN102974524B (zh) 2007-11-06 2008-11-06 用声能处理物体的装置和方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US98594707P 2007-11-06 2007-11-06
US60/985,947 2007-11-06
US3414208P 2008-03-05 2008-03-05
US61/034,142 2008-03-05
PCT/US2008/082701 WO2009061970A1 (en) 2007-11-06 2008-11-06 Composite transducer apparatus and system for processing a substrate and method of constructing the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210450381.4A Division CN102974524B (zh) 2007-11-06 2008-11-06 用声能处理物体的装置和方法

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CN101918151A CN101918151A (zh) 2010-12-15
CN101918151B true CN101918151B (zh) 2013-01-02

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CN201210450381.4A Active CN102974524B (zh) 2007-11-06 2008-11-06 用声能处理物体的装置和方法

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US (2) US8279712B2 (cg-RX-API-DMAC7.html)
JP (2) JP5422847B2 (cg-RX-API-DMAC7.html)
KR (1) KR101226071B1 (cg-RX-API-DMAC7.html)
CN (2) CN101918151B (cg-RX-API-DMAC7.html)
WO (1) WO2009061970A1 (cg-RX-API-DMAC7.html)

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US8805031B2 (en) * 2008-05-08 2014-08-12 Sonavation, Inc. Method and system for acoustic impediography biometric sensing
CN102468117B (zh) * 2010-11-05 2015-05-27 北京七星华创电子股份有限公司 一种清洁晶片装置
KR101299966B1 (ko) * 2010-11-22 2013-08-26 주식회사 휴먼스캔 고출력 초음파 프로브
CN102594278B (zh) * 2011-01-05 2014-12-31 香港理工大学 一种复合压电振子及其制备方法
US8551251B2 (en) 2011-04-28 2013-10-08 Lam Research Ag Ultrasonic treatment method and apparatus
CN102570901B (zh) * 2012-01-17 2015-12-23 罗振华 压力发电模块
JP5990930B2 (ja) * 2012-02-24 2016-09-14 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
CN109201440B (zh) * 2013-02-02 2020-11-13 北方华创艾可隆公司 使用声能处理基板的系统、设备和方法
CN105378957A (zh) * 2013-05-08 2016-03-02 达尔豪西大学 声波发射器和植入式接收器
CN112893067B (zh) 2014-07-11 2022-07-08 微创医学科技有限公司 多胞元换能器
FR3029435B1 (fr) * 2014-12-08 2019-11-15 Institut Polytechnique De Grenoble Dispositif vibrant comportant des reflecteurs mecaniques encastres pour definir une zone active de propagation de modes de plaque et appareil mobile comportant le dispositif
CN104646350B (zh) * 2015-02-12 2016-10-19 北京七星华创电子股份有限公司 一种图形晶圆无损伤清洗装置
KR102339058B1 (ko) 2016-03-11 2021-12-16 한국전자통신연구원 유연 압전 콤포지트 및 이를 포함하는 압전 장치
JP6907539B2 (ja) * 2017-01-06 2021-07-21 セイコーエプソン株式会社 超音波デバイス、超音波プローブ、及び超音波装置
KR101919454B1 (ko) * 2017-07-31 2018-11-16 엘지디스플레이 주식회사 디스플레이 장치 및 이를 이용한 컴퓨팅 장치
EP3613514B1 (en) 2018-08-20 2025-05-21 LG Display Co., Ltd. Method of manufacturing a flexible vibration module
KR102662671B1 (ko) * 2019-03-29 2024-04-30 엘지디스플레이 주식회사 표시 장치
KR102721452B1 (ko) 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
KR102683447B1 (ko) * 2019-03-29 2024-07-08 엘지디스플레이 주식회사 표시 장치
KR102679871B1 (ko) * 2019-04-03 2024-06-28 엘지디스플레이 주식회사 표시장치
CN110572756A (zh) * 2019-09-11 2019-12-13 京东方科技集团股份有限公司 定向薄膜换能器及其制备方法、扬声器
KR102759031B1 (ko) * 2019-12-09 2025-01-22 엘지디스플레이 주식회사 표시장치
KR102763470B1 (ko) 2019-12-16 2025-02-05 엘지디스플레이 주식회사 표시장치
CN111085942B (zh) * 2019-12-31 2021-10-15 中国计量大学 一种基于相控空化效应的磨粒微射流抛光方法及抛光装置
KR102743312B1 (ko) 2020-03-04 2024-12-13 엘지디스플레이 주식회사 표시장치
US12114117B2 (en) * 2020-12-09 2024-10-08 Lg Display Co., Ltd. Apparatus including vibration member to generate sound and vibration for enhancing sound characteristic and sound pressure level characteristic
KR102867807B1 (ko) * 2020-12-09 2025-10-01 엘지디스플레이 주식회사 장치
TW202430011A (zh) * 2020-12-22 2024-07-16 南韓商樂金顯示科技股份有限公司 振動裝置以及包含其的電子裝置
CN113058767B (zh) * 2021-03-05 2022-05-31 Tcl华星光电技术有限公司 支撑柱及对位机构
KR20230084941A (ko) * 2021-12-06 2023-06-13 엘지디스플레이 주식회사 장치
KR20230096545A (ko) 2021-12-23 2023-06-30 엘지디스플레이 주식회사 장치
KR20230103751A (ko) * 2021-12-31 2023-07-07 엘지디스플레이 주식회사 장치 및 이를 포함하는 운송 장치
CN116159730A (zh) * 2022-12-23 2023-05-26 东莞市西喆电子有限公司 一种超声波兆声清洗振板

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US4672591A (en) * 1985-01-21 1987-06-09 Siemens Aktiengesellschaft Ultrasonic transducer
US5317618A (en) * 1992-01-17 1994-05-31 Mitsubishi Denki Kabushiki Kaisha Light transmission type vacuum separating window and soft X-ray transmitting window
US5629578A (en) * 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
US6755352B1 (en) * 2003-01-22 2004-06-29 Kohji Toda Bridge-type ultrasonic atomizer
US6758094B2 (en) * 2001-07-31 2004-07-06 Koninklijke Philips Electronics, N.V. Ultrasonic transducer wafer having variable acoustic impedance

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US6755352B1 (en) * 2003-01-22 2004-06-29 Kohji Toda Bridge-type ultrasonic atomizer

Also Published As

Publication number Publication date
US8279712B2 (en) 2012-10-02
JP2011504134A (ja) 2011-02-03
US20130167881A1 (en) 2013-07-04
CN102974524B (zh) 2016-06-22
KR20100098525A (ko) 2010-09-07
CN102974524A (zh) 2013-03-20
WO2009061970A1 (en) 2009-05-14
KR101226071B1 (ko) 2013-01-24
JP5422847B2 (ja) 2014-02-19
US20090231959A1 (en) 2009-09-17
CN101918151A (zh) 2010-12-15
JP2014112829A (ja) 2014-06-19

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