JP2011501255A - 補強された無線周波数識別装置保持体およびその製造方法 - Google Patents
補強された無線周波数識別装置保持体およびその製造方法 Download PDFInfo
- Publication number
- JP2011501255A JP2011501255A JP2010528450A JP2010528450A JP2011501255A JP 2011501255 A JP2011501255 A JP 2011501255A JP 2010528450 A JP2010528450 A JP 2010528450A JP 2010528450 A JP2010528450 A JP 2010528450A JP 2011501255 A JP2011501255 A JP 2011501255A
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- module
- layer
- paper
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2804—Next to metal
Abstract
【解決手段】本発明はアンテナと該アンテナに接続されたチップ(12)を含む無線周波数識別装置(RFID)を作るための方法に関し、以下のステップを包含する:紙または合成紙で作った基板(20)上の接続スタッド(17、19)を含むアンテナ(12)を印刷するステップ;接着誘電体材料をアンテナ接続スタッドの間に配置するステップ;基板上に集積回路モジュール(10)を位置づけるステップであって、該基板は接触パッド(17、18)および該接触パッドにモジュール封止体(14)内で接続されているチップ(12)を含み、該モジュール接触パッドは複数の該アンテナ接続スタッドに相対して配置されるステップ;該基板上に熱可塑性層(22)および紙または合成紙の層(24)を配置するステップであって、2つの層(22、24)は該モジュール(10)の封止体(14)の位置に凹部(21、23)を備えるステップ;および、3つの層、すなわちアンテナ基板層(20)、熱可塑性層(22)および紙または合成紙の層(24)を、前記モジュールを前記アンテナに接続し、かつ複数の層(20,22および24)を一緒に一塊にするために、共に積層するステップ。
【選択図】図1
Description
− 保持体上に複数の接触部を特色として有するアンテナを印刷するステップ、
− 複数のアンテナパッドの上に導電性接着剤スポットを複数箇所に付着するステップ、
− 導電性接着剤の複数のスポット上に電子モジュールを実装するステップ、
− 炉を通過させることにより導電性接着剤を架橋結合するステップ。
− 紙または合成紙保持体上に複数の接触部を特色として有するアンテナを印刷するステップ、
− 当該アンテナの複数の接触部間に接着誘電体材料を配置するステップ、
− 当該保持体上に集積回路モジュールを位置付けするステップであって、該モジュールは複数の接触部(contacts)グループおよび当該モジュールの封止体内部で複数の接触部グループに接続されたチップを特色として有し、当該モジュールの複数の接触部は当該アンテナの複数の接触部に相対しているようにするステップ、
− 当該保持体上に熱可塑性層および紙または合成紙の層を配置するステップであって、当該2つの層には当該モジュールの封止体位置に逃げ(リセス:recess)が設けられており、
− アンテナ保持体層、熱可塑性層、および紙または合成紙層の3つの層を、当該モジュールを当該アンテナに電気的に接続しかつこれら複数の層を一塊にするべく一緒に積層するステップ。
12 チップ
14 封止部、保護樹脂
17 接触部
18 接触部
20 保持体層、アンテナ保持体
21 逃げ
22 層、熱可塑性層
23 逃げ
24 第二の層、層
31 接触部
32 接触部
Claims (7)
- アンテナと当該アンテナに接続されたチップ(12)を特色として有する無線周波数識別装置(RFID)を製造するための方法であって、前記方法は以下のステップを含む:
− 紙または合成紙で作った保持体(20)上の複数の接触部(17および18)を有するアンテナ(12)を印刷するステップ、
− 該アンテナの前記複数の接触部間に接着誘電体材料を配置するステップ、
− 前記保持体上に集積回路モジュール(10)を位置決めするステップであって、前記モジュールは、複数の接触部(17および18)のグループ、および前記アンテナの前記複数の接触部と相対する前記モジュールの複数の接触部グループに前記モジュールの封止体(14)内部で接続された前記チップ(12)、を特色として有し、
− 前記保持体上に熱可塑性層(22)および紙または合成紙の層(24)を設置するステップであって、当該2つの層(22および24)は当該モジュール(10)の封止体(14)の位置に逃げ(21,23)が設けられており、
− 前記モジュールを前記アンテナに電気的に接続し、かつ複数の層(20、22および24)を一緒に一塊にするべく、前記アンテナ保持体層(20)、熱可塑性層(22)および紙または合成紙の層(24)の3つの層を一緒に積層するステップ。 - 前記逃げ(21,23)の形状は前記封止体の形状に合うようにした請求項1に記載の製造方法。
- 前記逃げ(21,23)は同じ大きさである請求項1または2に記載の方法。
- 請求項1、2または3に記載の方法であって、接着誘電体材料(34)が前記保持体(20)の上、前記アンテナの接続(31,32)の間に、当該チップが位置づけされる前に設置され、前記モジュール(10)を当該保持体に相対する固定位置に維持するようにした方法。
- 前記アンテナ保持体層(20)に施された接着材料(34)は、シアノアクリレート接着剤である請求項1〜4のいずれかに記載の方法。
- 前記アンテナ接触部を形成するために使用されるインクは柔軟性がある請求項1〜5のいずれかに記載の方法。
- 前記積層ステップの間に、圧力をかけた状態で冷却がされる請求項1〜6のいずれかに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0707143 | 2007-10-11 | ||
FR0707143A FR2922342B1 (fr) | 2007-10-11 | 2007-10-11 | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
PCT/FR2008/001434 WO2009087295A1 (fr) | 2007-10-11 | 2008-10-13 | Support de dispositif d'identification radiofréquence renforcé et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011501255A true JP2011501255A (ja) | 2011-01-06 |
JP5379802B2 JP5379802B2 (ja) | 2013-12-25 |
Family
ID=39204661
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010528450A Expired - Fee Related JP5379802B2 (ja) | 2007-10-11 | 2008-10-13 | 補強された無線周波数識別装置保持体およびその製造方法 |
JP2010528451A Active JP5379803B2 (ja) | 2007-10-11 | 2008-10-13 | パスポートのための無線周波数識別装置およびその製作方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010528451A Active JP5379803B2 (ja) | 2007-10-11 | 2008-10-13 | パスポートのための無線周波数識別装置およびその製作方法 |
Country Status (15)
Country | Link |
---|---|
US (2) | US8038831B2 (ja) |
EP (2) | EP2203876B1 (ja) |
JP (2) | JP5379802B2 (ja) |
KR (2) | KR101534283B1 (ja) |
CN (2) | CN101861592B (ja) |
BR (2) | BRPI0817554A2 (ja) |
CA (2) | CA2702286C (ja) |
ES (1) | ES2534863T3 (ja) |
FR (2) | FR2922342B1 (ja) |
HK (2) | HK1149352A1 (ja) |
IL (2) | IL204920A (ja) |
MX (2) | MX2010003823A (ja) |
PT (1) | PT2203876E (ja) |
TW (2) | TWI487622B (ja) |
WO (2) | WO2009087295A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100288436A1 (en) * | 2008-02-04 | 2010-11-18 | Solido 3D, Ltd. | Depicting interior details in a three-dimensional object |
US20100295286A1 (en) * | 2009-05-13 | 2010-11-25 | Goldstein Keith E | Cover and method of manufacturing the same |
WO2010130025A1 (en) * | 2009-05-15 | 2010-11-18 | Fyi Design Dept. Ltd. | Methods and apparatus for affixing hardware to garments |
FR2948796A1 (fr) * | 2009-07-28 | 2011-02-04 | Ask Sa | Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication |
JP2011108733A (ja) | 2009-11-13 | 2011-06-02 | Casio Computer Co Ltd | 半導体装置及びその製造方法 |
JP2012137807A (ja) * | 2010-12-24 | 2012-07-19 | Toppan Printing Co Ltd | Ic付冊子及びその製造方法 |
CN102622641B (zh) * | 2011-01-30 | 2015-07-29 | 上海祯显电子科技有限公司 | 一种无源射频传感装置 |
EP2605188A1 (fr) * | 2011-12-14 | 2013-06-19 | Gemalto SA | Procédé de fabrication de cartes à puce |
CN103158393A (zh) * | 2011-12-15 | 2013-06-19 | 北京燕京科技有限公司 | 一种rfid证件及其制作方法 |
EP3129239B1 (en) | 2014-04-07 | 2018-06-27 | Avery Dennison Retail Information Services, LLC | Heat transfer and method of use on specific merchandising articles for a specific event |
CN104626719B (zh) * | 2015-01-14 | 2017-12-19 | 铜陵富仕三佳机器有限公司 | 一种用于塑封系统中的覆膜机构 |
MX2017010502A (es) * | 2015-02-20 | 2018-03-14 | Nid Sa | Proceso de fabricacion de un dispositivo que incluye al menos un elemento electronico asociado a un substrato y a una antena. |
FR3047101B1 (fr) | 2016-01-26 | 2022-04-01 | Linxens Holding | Procede de fabrication d’un module de carte a puce et d’une carte a puce |
WO2020041605A1 (en) | 2018-08-22 | 2020-02-27 | Liquid Wire Inc. | Structures with deformable conductors |
CN110689105B (zh) * | 2018-09-26 | 2024-04-09 | 深圳市融智兴科技有限公司 | 超薄rfid智能卡封装方法 |
EP3696731B1 (en) * | 2019-02-18 | 2022-01-05 | Assa Abloy AB | Secure rfid device |
TWI804158B (zh) * | 2022-01-17 | 2023-06-01 | 宏通數碼科技股份有限公司 | 卡片結構 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11345302A (ja) * | 1998-06-02 | 1999-12-14 | Toppan Printing Co Ltd | Icチップの実装方法、icモジュール、インレットおよびicカード |
JP2001043342A (ja) * | 1999-07-30 | 2001-02-16 | Toppan Forms Co Ltd | チップカード |
JP2005284813A (ja) * | 2004-03-30 | 2005-10-13 | Toppan Forms Co Ltd | Rf−idメディアの製造方法 |
JP2007121815A (ja) * | 2005-10-31 | 2007-05-17 | Nec Tokin Corp | シールタグインレット |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2782821B1 (fr) * | 1998-08-27 | 2001-10-12 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
AU5809099A (en) * | 1998-09-11 | 2000-04-03 | Motorola, Inc. | Radio frequency identification tag apparatus and related method |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
JP2000148949A (ja) * | 1998-11-06 | 2000-05-30 | Dainippon Printing Co Ltd | 非接触icカードおよびその製造方法 |
FR2787609B1 (fr) * | 1998-12-21 | 2001-02-09 | Gemplus Card Int | Procede de fabrication de carte a puce sans contact |
US6248199B1 (en) * | 1999-04-26 | 2001-06-19 | Soundcraft, Inc. | Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements |
US6421013B1 (en) * | 1999-10-04 | 2002-07-16 | Amerasia International Technology, Inc. | Tamper-resistant wireless article including an antenna |
FR2801709B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude |
EP1143378A1 (en) * | 2000-04-04 | 2001-10-10 | Smartag (S) Pte. Ltd. | Method for manufacturing of RFID inlet |
WO2001075772A2 (en) * | 2000-04-04 | 2001-10-11 | Smartag (S) Pte Ltd. | Method for manufacturing of rfid inlet |
US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
FR2824018B1 (fr) * | 2001-04-26 | 2003-07-04 | Arjo Wiggins Sa | Couverture incorporant un dispositif d'identification radiofrequence |
FR2826153B1 (fr) * | 2001-06-14 | 2004-05-28 | A S K | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
FR2826154B1 (fr) * | 2001-06-14 | 2004-07-23 | A S K | Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux |
JP2003016407A (ja) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 非接触型icカードとその製造方法 |
JP4899277B2 (ja) * | 2001-09-11 | 2012-03-21 | 大日本印刷株式会社 | 非接触通信カード |
JP2003085510A (ja) * | 2001-09-13 | 2003-03-20 | Dainippon Printing Co Ltd | 非接触通信機能を有する紙製icカードと紙製icカード用基材およびゲーム用紙製icカード |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
FR2844621A1 (fr) * | 2002-09-13 | 2004-03-19 | A S K | Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee |
US7224280B2 (en) * | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
JP2004334268A (ja) * | 2003-04-30 | 2004-11-25 | Dainippon Printing Co Ltd | 紙片icタグと紙片icタグ付き書籍・雑誌、紙片icタグ付き書籍 |
US20060285301A1 (en) * | 2003-05-05 | 2006-12-21 | Axalto Sa | Method for making a pre-laminated inlet |
US7755484B2 (en) * | 2004-02-12 | 2010-07-13 | Avery Dennison Corporation | RFID tag and method of manufacturing the same |
FR2877462B1 (fr) * | 2004-10-29 | 2007-01-26 | Arjowiggins Security Soc Par A | Structure comportant un dispositif electronique pour la fabrication d'un document de securite. |
FR2881251B1 (fr) * | 2005-01-24 | 2007-04-13 | Ask Sa | Livret d'identite a dispositif d'identification radiofrequence resistant aux milieux humides |
FR2881252A1 (fr) * | 2005-01-24 | 2006-07-28 | Ask Sa | Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication |
FR2900484B3 (fr) * | 2006-04-28 | 2008-08-08 | Ask Sa | Support de dispositif d'identification radiofrequence et son procede de fabrication |
FR2900485B3 (fr) * | 2006-04-28 | 2008-08-08 | Ask Sa | Support de dispositif d'identification radiofrequence et son procede de fabrication |
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
-
2007
- 2007-10-11 FR FR0707143A patent/FR2922342B1/fr not_active Expired - Fee Related
-
2008
- 2008-04-08 FR FR0801931A patent/FR2922343B1/fr not_active Expired - Fee Related
- 2008-10-13 JP JP2010528450A patent/JP5379802B2/ja not_active Expired - Fee Related
- 2008-10-13 TW TW097139124A patent/TWI487622B/zh active
- 2008-10-13 ES ES08870419.2T patent/ES2534863T3/es active Active
- 2008-10-13 US US12/250,404 patent/US8038831B2/en active Active
- 2008-10-13 KR KR1020107007914A patent/KR101534283B1/ko active IP Right Grant
- 2008-10-13 WO PCT/FR2008/001434 patent/WO2009087295A1/fr active Application Filing
- 2008-10-13 CA CA2702286A patent/CA2702286C/fr active Active
- 2008-10-13 BR BRPI0817554 patent/BRPI0817554A2/pt not_active IP Right Cessation
- 2008-10-13 JP JP2010528451A patent/JP5379803B2/ja active Active
- 2008-10-13 KR KR1020107007916A patent/KR20100075910A/ko active IP Right Grant
- 2008-10-13 BR BRPI0818440 patent/BRPI0818440A2/pt not_active Application Discontinuation
- 2008-10-13 CN CN2008801160890A patent/CN101861592B/zh not_active Expired - Fee Related
- 2008-10-13 MX MX2010003823A patent/MX2010003823A/es active IP Right Grant
- 2008-10-13 EP EP08870419.2A patent/EP2203876B1/fr active Active
- 2008-10-13 CA CA2702272A patent/CA2702272A1/fr not_active Abandoned
- 2008-10-13 WO PCT/FR2008/001435 patent/WO2009087296A2/fr active Application Filing
- 2008-10-13 MX MX2010003822A patent/MX2010003822A/es active IP Right Grant
- 2008-10-13 CN CN2008801160886A patent/CN101861591B/zh not_active Expired - Fee Related
- 2008-10-13 US US12/250,090 patent/US8172978B2/en not_active Expired - Fee Related
- 2008-10-13 PT PT88704192T patent/PT2203876E/pt unknown
- 2008-10-13 TW TW97139298A patent/TWI469875B/zh active
- 2008-10-13 EP EP08870402.8A patent/EP2203875B1/fr active Active
-
2010
- 2010-04-08 IL IL204920A patent/IL204920A/en active IP Right Grant
- 2010-04-08 IL IL204919A patent/IL204919A0/en active IP Right Grant
-
2011
- 2011-04-11 HK HK11103629.0A patent/HK1149352A1/xx not_active IP Right Cessation
- 2011-04-11 HK HK11103630.7A patent/HK1149353A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11345302A (ja) * | 1998-06-02 | 1999-12-14 | Toppan Printing Co Ltd | Icチップの実装方法、icモジュール、インレットおよびicカード |
JP2001043342A (ja) * | 1999-07-30 | 2001-02-16 | Toppan Forms Co Ltd | チップカード |
JP2005284813A (ja) * | 2004-03-30 | 2005-10-13 | Toppan Forms Co Ltd | Rf−idメディアの製造方法 |
JP2007121815A (ja) * | 2005-10-31 | 2007-05-17 | Nec Tokin Corp | シールタグインレット |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5379802B2 (ja) | 補強された無線周波数識別装置保持体およびその製造方法 | |
US7688209B2 (en) | Radio frequency identification device resistant to humid environments and its manufacturing method | |
KR100766643B1 (ko) | 섬유상 물질로 된 안테나 지지체를 이용한 무접촉 혼성스마트 카드의 제조방법 | |
AU776169B2 (en) | Method for making a non-contact smart card with an antenna support made of fibrous material | |
US8616455B2 (en) | Radio frequency identification device in polycarbonate and its manufacturing method | |
US7714724B2 (en) | Radio frequency identification device support and its manufacturing method | |
US20110011939A1 (en) | Contact-less and dual interface inlays and methods for producing the same | |
WO2006005985A1 (en) | Contactless identification device | |
JP2007523415A (ja) | ブック型セキュリティ文書の製造方法およびブック型セキュリティ文書 | |
US20240013021A1 (en) | Card with fingerprint biometrics | |
US7710276B2 (en) | Radio frequency identification device support and its manufacturing method | |
KR100622140B1 (ko) | 섬유단자를 갖는 콤비카드 및 이의 제조방법 | |
WO2005062246A1 (en) | Identification document | |
CN213303073U (zh) | 一种用于电子护照的射频单元及电子护照 | |
JPH1086569A (ja) | Icカード及びその製造方法 | |
KR101351904B1 (ko) | 무선 주파수 인식장치 지지대 및 이의 제조방법 | |
JP2022148016A (ja) | Icカード | |
WO2023072750A1 (en) | Leadframeless contactless module | |
WO2005034031A1 (en) | Identification document |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111003 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121218 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121225 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130322 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130329 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130424 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130604 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130807 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130903 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130927 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |