CN101861592B - 增强型射频标识装置支撑及其制造方法 - Google Patents
增强型射频标识装置支撑及其制造方法 Download PDFInfo
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Abstract
本发明涉及一种用于制造射频标识装置(RFID)的方法,所述装置包括天线和连接到所述天线的芯片(12),所述方法包括以下步骤:在纸制或合成纸制支撑(20)上印制包括连接点(17和19)的天线(12);在天线的所述连接点之间放置粘性介电材料;在所述支撑上定位集成电路模块(10),所述模块包括接触区(17、18)和连接到模块的封装(14)内的接触区上的芯片(12),使得所述模块的接触区与所述天线的连接点相对;在所述支撑上放置热塑性材料层(22)和纸或合成纸层(24),这两个层(22和24)在模块(10)的封装(14)的位置上具有空腔(21、23);和将这三个层即天线支撑层(20)、热塑性材料层(22)和纸或合成纸层(24)层压在一起,以使得模块电连接到天线上并使得各层(20、22和24)聚集在一起。
Description
技术领域
本发明涉及被用于集成到诸如安全文档的物体中的射频标识装置,并特别涉及用于护照的增强型射频标识装置的支撑及其制造方法。
背景技术
无接触射频标识装置(RFID)越来越多地用于标识在受控的接近区域内移动或从一个区域移动到另一区域的人。无接触RFID装置是由天线和与天线的端子连接的芯片制成的装置。芯片通常不被供电,并且通过读取器的天线和RFID的天线之间的电磁耦合接收其能量,信息在RFID和读取器之间被交换,特别是存储在芯片中的涉及放置有RFID的物体的持有人的标识和他/她的进入受控的接近区域中的授权的信息。
这样,护照可包含标识护照持有人的RFID。芯片存储器包含诸如护照持有人的身份、他/她的出生国家、他/她的国籍、访问的不同的国家的签证、入境日期、活动限制、生物统计元素等的信息。RFID装置一般被加入护照的底封面板中。于是在护照封面的增强的底封面板上通过使用加载有导电粒子的墨印制天线。然后,将芯片通过胶合与天线的连接端子连接。然后,护照页的一折白页被对贴在增强的顶部封面板的背面。
RFID装置还可与护照分开地被制造,以便然后通过在例如护照的封面和底白页之间通过胶合而被加入。包括连接在一起的天线和芯片的RFID装置然后与纸、塑料或其它的“镶嵌体”一体化。
作为裸芯片的替代,还通过一般称为集成电路模块的封装芯片来发展RFID装置。这些模块的小型化的最新发展实际上允许在不增加护照的厚度或刚度的情况下将它们加入护照中。
制造集成模块的RFID装置支撑的问题在于模块与天线的连接。实际上,例如,用于连接模块与铜天线的诸如焊接的传统连接不适用于印制的天线。在天线支撑的天线连接点和模块接触点之间实现模块与天线的连接。由于在很小的面积上制成这种连接,因此它必须是可靠的和坚固的。在天线由导电墨构成的情况下,通过导电性粘合剂进行这种连接。制作这种连接需要以下的制造步骤:
-在支撑上印制包括接触点的天线;
-在天线接触点上沉积导电粘合剂点;
-将电子模块置于导电粘合剂点上;
-导电粘合剂通过穿过炉子而交联。
然后,通过一般地对天线支撑两侧的上、下卡体热压成形,实施构成卡的各层的常规的层压步骤。
这种连接具有缺点。当施加导电粘接剂时,会出现与模块的短路。并且,在层压步骤中或另外在护照上施加的撞击和冲击中施加的压力下,在交联中硬化的导电粘合剂点可能使天线接触点开裂。从而,最终的风险是破坏天线和集成电路模块之间的电接触并由此最终地损坏射频标识装置。
发明内容
因此,本发明的目的在于通过提供使得能够保证集成电路模块和天线之间的可靠的连接的射频标识装置的支撑的制造方法,来补救这些缺点。
本发明的另一目的在于,提供诸如集成这种射频标识装置的护照的身份小册子,在该小册子的封面的外侧没有任何芯片的可见标记。
因此,本发明的目的在于一种用于制造射频标识装置(RFID)的方法,该装置包括天线和与天线连接的芯片,该方法包括以下步骤:
-在纸制或合成纸制支撑上印制包括连接点的天线;
-在天线的连接点之间放置粘性介电材料;
-在支撑上定位集成电路模块,模块包括接触区和连接到模块的封装内的接触区上的芯片,使得所述模块的接触区与所述天线的连接点相对;
-在支撑上放置热塑性材料层和纸或合成纸层,这两个层在模块的封装的位置上具有空腔;和
-将这三个层即天线支撑层、热塑性材料层和纸或合成纸层层压在一起,以使得模块电连接到天线上并使得各层聚集在一起。
附图说明
结合附图阅读以下的描述,本发明的目的、目标和特征将变得更加明显,其中,
图1表示电子模块的截面,
图2表示构成层压之前的RFID装置支撑的各层,
图3表示RFID装置支撑的截面。
具体实施方式
根据图1,集成电路模块包括芯片12、至少两个连接区17和18。通过在英语中称为“引线接合(wire bonding)”的非常小的导线或连接电缆制成芯片和连接区17和18之间的连接。芯片12和导线被封入基于不导电的抗性强的材料的保护树脂14中。封装14在某种意义上是包含芯片及其布线以使其不容易损坏并更容易操作的硬壳。封装具有在200和240μm之间的厚度。模块由此在其上面存在与封装14的上部对应的平坦表面,并在其下面存在用于与电路连接的接触区17和18。接触区17和18由导体材料制成,诸如铝,并且它们的厚度在70和100μm之间。
根据本制造方法的第一步骤,在支撑层20上实现天线。天线包括一个或多个线圈的集合。通过丝网印刷、苯胺橡皮版印刷、照相凹版印刷、胶版印刷或采用基于加有诸如例如银或金的导电粒子的环氧墨类型的导电墨或基于导电聚合物的喷墨印刷制成线圈。支撑层20是不流动的材料制成的,诸如纸或合成纸。纸由浆状微植物纤维制成,并且结果具有纤维结构。纸芯(du papier)当经受剪切应力时趋于分层,而非纤维合成纸具有微孔结构并且具有低密度。与纸类似,合成纸简化在160℃的量级的温度下实施的分层操作,原因是它在这些温度下是稳定的;与诸如PVC或PETG的热塑性材料不同,它不流动(fluer)。使用的合成纸由聚合物的非取向单一层构成,聚合物为诸如加有在40%和80%之间的矿物的聚乙烯或聚丙烯。通过其微孔网络,其成分使其具有0.57g/cm3的量级的低密度。支撑层的厚度最好在140和180μm之间。
图2所示的模块10用于连接到天线的连接点上。在本发明中,仅两个连接点31和32足以连接模块。连接点31和32为天线的连续体,作为结果,它们处于天线的线圈的延伸部分中,并且一般由与天线相同的材料制成。由此,也通过丝网印刷、苯胺橡皮版印刷、照相凹版印刷、胶版印刷或采用基于加有诸如例如银或金的导电粒子的环氧墨类型的导电墨或基于导电聚合物的喷墨印刷制成连接点。连接点的厚度在5和10μm之间。在连接点的制造中使用的墨是柔性的和非弹性的。因此,用于天线连接点的墨可能与用于制造天线的其余部分的墨不同。
图2所示的模块通过粘性材料34被胶合到天线支撑层20上,使得模块的接触区17和18与天线的连接点31和32相对。一旦构成连接点的墨变干并且粘性材料被施加,模块就被放置于天线支撑层上。天线支撑层上的模块的胶合必须在制造方法的整个持续过程中将模块保持和固定在其位置上。使用的粘性材料是将模块固定到支撑层20上的粘合剂。使用氰基丙烯酸盐粘合剂。还能够使用用于卡中并在插入卡中之前被设置在模块下的膜型“热熔”粘接剂。该胶合不被用作支撑和天线之间的电连接。
然后,为了层压步骤,在天线支撑上放置构成RFID装置支撑的各层。第一热塑性材料层22被直接定位于天线支撑层20上。对于层22使用的热塑性材料优选为聚氯乙烯(PVC),但也可以为聚酯(PET、PETG)、聚丙烯(PP)、聚碳酸酯(PC)或丙烯睛-丁二烯-苯乙烯(ABS)或聚氨酯(PU)膜。热塑性材料层22的厚度在100和160μm之间。层22包括尺寸接近于模块的被封装部分的上部的平坦表面的尺寸的空腔21。这样,空腔的边缘与模块的被封装部分的边缘匹配(配对)。这样,当层22被置于天线支撑20的层上的适当位置时,模块10位于空腔21中。第二层24位于第一层22上。层24由对于天线支撑层20描述的合成纸或纸制成。层24还有最好具有与空腔21相同的尺寸的空腔23。当为了层压步骤放置所有的层时,空腔21和23重叠。
RFID装置支撑制造方法的最后步骤在于将3个层即天线支撑层20、热塑性材料层22和纸或合成纸的层24层压在一起。层压步骤在于使所有的层经受直到150℃的温度升高和直到20巴的压强升高,然后降低温度和压强,整个根据一组确定持续时间的循环。优选在恒定压强下完成环境温度的降低,然后降低压强。在层压时,层22的PVC流体化并且俘获天线和模块的大部分。在层压时施加的压强与各层垂直并由此与接触区17和18垂直。
图3表示层压步骤之后的模块和模块附近的3个层的截面。在层压步骤中,构成RFID装置支撑的三个层的厚度减小。这样,纸或合成纸层20和24损失它们的厚度的约22%。例如,初始厚度为180μm的层20或24在层压之后具有140μm的厚度。热塑性材料层22减小其厚度55%。
层压时在整个模块上施加压强。模块的接触区压于天线的连接点上,从而导致连接点和支撑层20的变形。该变形为型腔(empreinte)的形式,型腔内表面精确地与连接区的外表面匹配。这样,在模块的连接区和连接点18的导电墨之间的最大接触表面上存在紧密接触。构成支撑层20的材料以及连接点18的导电墨是可变形的和非弹性的,因此即使当压力被释放时,这两种材料也不趋于返回它们的初始形状。
并且,在层压时,层22的变软的热塑性材料完全与模块的轮廓和位于层22的任一侧的层20和24的内表面匹配。热塑性材料用作层20和24之间的粘合剂,使得一旦硬化就完全粘接于各层和模块上。热塑性材料层的任一侧的两个层20和24在层压时压强的作用下被施加应力,并且,在模块的接触区上保持施加的应力,使得一旦层24的热塑性材料硬化,模块和天线之间的电接触就是永久的和可靠的。层压步骤由此使得能够使模块与天线电连接并且将层20、22和24聚结在一起。这样,与通过芯片一旦被安装在天线连接点之间就与天线电连接的称为“倒装芯片”的方法安装裸芯片相比,模块的定位步骤仅使得能够将后者机械保持在天线之间。通过与使用的材料组合实现的方法,模块与天线电连接。实际上,纸或合成纸层20和22在接触区的位置上挤夹模块,并且,通过一旦冷却就硬化的热塑性材料层22保持挤夹效果。
在模块的封装的和刚硬的部分上施加的压强趋于进一步压缩支撑层20的正位于其正下方的部分。这种效果趋于使得RFID装置支撑在其整个表面上具有相等的厚度。这样,当被插入护照封面中时,模块的位置是不可见的。
根据本发明的制造方法使得获得可靠和抗性强的射频标识装置。对于该装置在诸如护照的安全文档中的使用,该优点是明显的。实际上,护照页和支撑RFID装置的封面会经受来自盖印或签证粘贴的冲击,这种冲击将使电子芯片暴露于不可忽视的破坏风险中。另外,模块和天线之间的电连接不具有诸如焊锡或导电粘接剂的使得模块关于天线不可动的任何刚性元件,结果是更加坚固和更加可靠。
Claims (7)
1.一种用于制造射频标识装置(RFID)的方法,所述装置包括天线和连接到所述天线的芯片,所述方法包括以下步骤:
在纸制或合成纸制的天线支撑层上印制包括连接点的天线;
在天线的所述连接点之间放置粘性介电材料;
在所述天线支撑层上定位集成电路模块,所述模块包括接触区和在模块的封装内连接到接触区上的芯片,使得所述模块的接触区与所述天线的连接点相对;
在所述天线支撑层上放置热塑性材料层和纸或合成纸层,这两个层在模块的封装的位置上具有空腔;和
将这三个层即天线支撑层、热塑性材料层和纸或合成纸层层压在一起,以使得模块电连接到天线上,从而天线支撑层和纸或合成纸层在接触区和天线的连接点的位置处挤夹模块,其中通过在层压步骤后硬化了的热塑性材料层保持挤夹。
2.根据权利要求1的制造方法,其中,所述空腔的形状使得这些空腔与封装的形状匹配。
3.根据权利要求1或2的方法,其中,所述空腔具有相同的尺寸。
4.根据权利要求1或2的方法,其中,在模块定位步骤之前,在所述天线支撑层上在所述天线的连接点之间放置粘性介电材料,以将所述模块相对于所述天线支撑层保持在固定位置上。
5.根据权利要求4的方法,其中被放置在天线支撑层上的粘性材料是氰基丙烯酸盐粘合剂。
6.根据权利要求1或2的方法,其中用于制成天线连接点的墨是柔性的。
7.根据权利要求1或2的方法,其中,层压步骤包括使所有的层经受直到150℃的温度升高和直到20巴的压强升高,然后降低温度和压强。
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FR0707143A FR2922342B1 (fr) | 2007-10-11 | 2007-10-11 | Support de dispositif d'identification radiofrequence renforce et son procede de fabrication |
PCT/FR2008/001434 WO2009087295A1 (fr) | 2007-10-11 | 2008-10-13 | Support de dispositif d'identification radiofréquence renforcé et son procédé de fabrication |
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