BRPI0817554A2 - Processo de fabricação de um dispositivo de identificação por radiofrequência. - Google Patents

Processo de fabricação de um dispositivo de identificação por radiofrequência.

Info

Publication number
BRPI0817554A2
BRPI0817554A2 BRPI0817554A BRPI0817554A2 BR PI0817554 A2 BRPI0817554 A2 BR PI0817554A2 BR PI0817554 A BRPI0817554 A BR PI0817554A BR PI0817554 A2 BRPI0817554 A2 BR PI0817554A2
Authority
BR
Brazil
Prior art keywords
manufacturing
radio frequency
identification device
frequency identification
radio
Prior art date
Application number
Other languages
English (en)
Inventor
Olivier Mazabraud
Christophe Halopé
Original Assignee
Ask Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ask Sa filed Critical Ask Sa
Publication of BRPI0817554A2 publication Critical patent/BRPI0817554A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
    • Y10T156/1039—Surface deformation only of sandwich or lamina [e.g., embossed panels]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
BRPI0817554 2007-10-11 2008-10-13 Processo de fabricação de um dispositivo de identificação por radiofrequência. BRPI0817554A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0707143A FR2922342B1 (fr) 2007-10-11 2007-10-11 Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
PCT/FR2008/001434 WO2009087295A1 (fr) 2007-10-11 2008-10-13 Support de dispositif d'identification radiofréquence renforcé et son procédé de fabrication

Publications (1)

Publication Number Publication Date
BRPI0817554A2 true BRPI0817554A2 (pt) 2015-03-31

Family

ID=39204661

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI0817554 BRPI0817554A2 (pt) 2007-10-11 2008-10-13 Processo de fabricação de um dispositivo de identificação por radiofrequência.
BRPI0818440 BRPI0818440A2 (pt) 2007-10-11 2008-10-13 Processo de fabricação de uma cobertura de documento de identidade munido de um dispositivo de identificação por radiofrência, e, dispositivo.

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRPI0818440 BRPI0818440A2 (pt) 2007-10-11 2008-10-13 Processo de fabricação de uma cobertura de documento de identidade munido de um dispositivo de identificação por radiofrência, e, dispositivo.

Country Status (15)

Country Link
US (2) US8172978B2 (pt)
EP (2) EP2203875B1 (pt)
JP (2) JP5379802B2 (pt)
KR (2) KR101534283B1 (pt)
CN (2) CN101861592B (pt)
BR (2) BRPI0817554A2 (pt)
CA (2) CA2702286C (pt)
ES (1) ES2534863T3 (pt)
FR (2) FR2922342B1 (pt)
HK (2) HK1149352A1 (pt)
IL (2) IL204919A0 (pt)
MX (2) MX2010003823A (pt)
PT (1) PT2203876E (pt)
TW (2) TWI487622B (pt)
WO (2) WO2009087295A1 (pt)

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US20100288436A1 (en) * 2008-02-04 2010-11-18 Solido 3D, Ltd. Depicting interior details in a three-dimensional object
WO2010132117A1 (en) * 2009-05-13 2010-11-18 American Bank Note Company Cover and method of manufacturing the same
EP2429324B1 (en) * 2009-05-15 2021-02-24 FYI Design Dept. Ltd. Methods and apparatus for affixing hardware to garments
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
JP2011108733A (ja) 2009-11-13 2011-06-02 Casio Computer Co Ltd 半導体装置及びその製造方法
JP2012137807A (ja) * 2010-12-24 2012-07-19 Toppan Printing Co Ltd Ｉｃ付冊子及びその製造方法
CN102622641B (zh) * 2011-01-30 2015-07-29 上海祯显电子科技有限公司 一种无源射频传感装置
EP2605188A1 (fr) * 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
CN103158393A (zh) * 2011-12-15 2013-06-19 北京燕京科技有限公司 一种rfid证件及其制作方法
CN115049032A (zh) 2014-04-07 2022-09-13 艾利丹尼森零售信息服务公司 在用于具体活动的具体商业制品上使用的热转印和方法
CN104626719B (zh) * 2015-01-14 2017-12-19 铜陵富仕三佳机器有限公司 一种用于塑封系统中的覆膜机构
EP3259708A1 (fr) * 2015-02-20 2017-12-27 Nid Sa Procédé de fabrication d'un dispositif comportant au moins un élément électronique associé à un substrat et à une antenne
FR3047101B1 (fr) 2016-01-26 2022-04-01 Linxens Holding Procede de fabrication d’un module de carte a puce et d’une carte a puce
CN112956283A (zh) 2018-08-22 2021-06-11 液态电线公司 具有可变形导体的结构
CN110689105B (zh) * 2018-09-26 2024-04-09 深圳市融智兴科技有限公司 超薄rfid智能卡封装方法
EP3696731B1 (en) * 2019-02-18 2022-01-05 Assa Abloy AB Secure rfid device
TWI804158B (zh) * 2022-01-17 2023-06-01 宏通數碼科技股份有限公司 卡片結構

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345302A (ja) * 1998-06-02 1999-12-14 Toppan Printing Co Ltd Ｉｃチップの実装方法、ｉｃモジュール、インレットおよびｉｃカード
FR2782821B1 (fr) * 1998-08-27 2001-10-12 Gemplus Card Int Procede de fabrication de carte a puce sans contact
ATE398814T1 (de) * 1998-09-11 2008-07-15 Motorola Inc Rfid-etikettenvorrichtung und verfahren
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
JP2000148949A (ja) * 1998-11-06 2000-05-30 Dainippon Printing Co Ltd 非接触ｉｃカードおよびその製造方法
FR2787609B1 (fr) * 1998-12-21 2001-02-09 Gemplus Card Int Procede de fabrication de carte a puce sans contact
US6248199B1 (en) * 1999-04-26 2001-06-19 Soundcraft, Inc. Method for the continuous fabrication of access control and identification cards with embedded electronics or other elements
JP4176244B2 (ja) * 1999-07-30 2008-11-05 トッパン・フォームズ株式会社 チップカード
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
EP1143378A1 (en) * 2000-04-04 2001-10-10 Smartag (S) Pte. Ltd. Method for manufacturing of RFID inlet
WO2001075772A2 (en) * 2000-04-04 2001-10-11 Smartag (S) Pte Ltd. Method for manufacturing of rfid inlet
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
FR2824018B1 (fr) * 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
FR2826153B1 (fr) * 2001-06-14 2004-05-28 A S K Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact
JP2003016407A (ja) * 2001-06-29 2003-01-17 Matsushita Electric Ind Co Ltd 非接触型ｉｃカードとその製造方法
JP4899277B2 (ja) * 2001-09-11 2012-03-21 大日本印刷株式会社 非接触通信カード
JP2003085510A (ja) * 2001-09-13 2003-03-20 Dainippon Printing Co Ltd 非接触通信機能を有する紙製ｉｃカードと紙製ｉｃカード用基材およびゲーム用紙製ｉｃカード
FR2829857B1 (fr) * 2001-09-14 2004-09-17 A S K Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
JP2004334268A (ja) * 2003-04-30 2004-11-25 Dainippon Printing Co Ltd 紙片ｉｃタグと紙片ｉｃタグ付き書籍・雑誌、紙片ｉｃタグ付き書籍
WO2004100063A1 (fr) * 2003-05-05 2004-11-18 Axalto Sa Procede de fabrication d'un inlet prelamine
US7755484B2 (en) * 2004-02-12 2010-07-13 Avery Dennison Corporation RFID tag and method of manufacturing the same
JP2005284813A (ja) * 2004-03-30 2005-10-13 Toppan Forms Co Ltd Ｒｆ−ｉｄメディアの製造方法
FR2877462B1 (fr) * 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
FR2881251B1 (fr) * 2005-01-24 2007-04-13 Ask Sa Livret d'identite a dispositif d'identification radiofrequence resistant aux milieux humides
FR2881252A1 (fr) * 2005-01-24 2006-07-28 Ask Sa Dispositif d'idenfication radiofrequence resistant aux milieux et son procede de fabrication
JP2007121815A (ja) * 2005-10-31 2007-05-17 Nec Tokin Corp シールタグインレット
FR2900485B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900484B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
US20080179404A1 (en) * 2006-09-26 2008-07-31 Advanced Microelectronic And Automation Technology Ltd. Methods and apparatuses to produce inlays with transponders

Also Published As

Publication number Publication date
CA2702286A1 (fr) 2009-07-16
CN101861592A (zh) 2010-10-13
TWI469875B (zh) 2015-01-21
KR101534283B1 (ko) 2015-07-09
ES2534863T3 (es) 2015-04-29
KR20100080795A (ko) 2010-07-12
TW200918313A (en) 2009-05-01
EP2203875B1 (fr) 2015-02-18
CN101861591B (zh) 2013-11-06
US8038831B2 (en) 2011-10-18
FR2922343A1 (fr) 2009-04-17
US20090095415A1 (en) 2009-04-16
CN101861591A (zh) 2010-10-13
MX2010003823A (es) 2010-05-17
HK1149352A1 (en) 2011-09-30
WO2009087296A3 (fr) 2009-12-10
FR2922343B1 (fr) 2012-08-03
JP5379803B2 (ja) 2013-12-25
KR20100075910A (ko) 2010-07-05
HK1149353A1 (en) 2011-09-30
EP2203875A2 (fr) 2010-07-07
JP2011501255A (ja) 2011-01-06
CA2702286C (fr) 2019-10-01
MX2010003822A (es) 2010-05-17
EP2203876B1 (fr) 2015-01-14
JP2011501256A (ja) 2011-01-06
PT2203876E (pt) 2015-05-13
US20090120564A1 (en) 2009-05-14
CA2702272A1 (fr) 2009-07-16
BRPI0818440A2 (pt) 2015-05-12
EP2203876A1 (fr) 2010-07-07
TW200918312A (en) 2009-05-01
TWI487622B (zh) 2015-06-11
WO2009087295A1 (fr) 2009-07-16
IL204919A0 (en) 2010-11-30
US8172978B2 (en) 2012-05-08
FR2922342B1 (fr) 2010-07-30
WO2009087296A2 (fr) 2009-07-16
IL204920A0 (en) 2010-11-30
JP5379802B2 (ja) 2013-12-25
CN101861592B (zh) 2013-08-28
FR2922342A1 (fr) 2009-04-17
IL204920A (en) 2014-07-31

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.