JP2011243798A5 - - Google Patents

Download PDF

Info

Publication number
JP2011243798A5
JP2011243798A5 JP2010115526A JP2010115526A JP2011243798A5 JP 2011243798 A5 JP2011243798 A5 JP 2011243798A5 JP 2010115526 A JP2010115526 A JP 2010115526A JP 2010115526 A JP2010115526 A JP 2010115526A JP 2011243798 A5 JP2011243798 A5 JP 2011243798A5
Authority
JP
Japan
Prior art keywords
case
lid
base plate
semiconductor element
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010115526A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011243798A (ja
JP5229271B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010115526A priority Critical patent/JP5229271B2/ja
Priority claimed from JP2010115526A external-priority patent/JP5229271B2/ja
Priority to DE102011007228.4A priority patent/DE102011007228B4/de
Priority to CN201110104259.7A priority patent/CN102254878B/zh
Publication of JP2011243798A publication Critical patent/JP2011243798A/ja
Publication of JP2011243798A5 publication Critical patent/JP2011243798A5/ja
Application granted granted Critical
Publication of JP5229271B2 publication Critical patent/JP5229271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010115526A 2010-05-19 2010-05-19 半導体装置 Active JP5229271B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置
DE102011007228.4A DE102011007228B4 (de) 2010-05-19 2011-04-12 Halbleitervorrichtung
CN201110104259.7A CN102254878B (zh) 2010-05-19 2011-04-15 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010115526A JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置

Publications (3)

Publication Number Publication Date
JP2011243798A JP2011243798A (ja) 2011-12-01
JP2011243798A5 true JP2011243798A5 (enExample) 2012-07-19
JP5229271B2 JP5229271B2 (ja) 2013-07-03

Family

ID=44900590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010115526A Active JP5229271B2 (ja) 2010-05-19 2010-05-19 半導体装置

Country Status (3)

Country Link
JP (1) JP5229271B2 (enExample)
CN (1) CN102254878B (enExample)
DE (1) DE102011007228B4 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101309394B1 (ko) 2005-12-23 2013-09-17 쓰리엠 이노베이티브 프로퍼티즈 컴파니 열가소성 실리콘 블록 공중합체를 포함하는 다층 필름
JP6848802B2 (ja) 2017-10-11 2021-03-24 三菱電機株式会社 半導体装置
JP6861622B2 (ja) * 2017-12-19 2021-04-21 三菱電機株式会社 半導体装置及び電力変換装置
EP4270469A1 (en) * 2022-04-29 2023-11-01 Infineon Technologies AG Power semiconductor module

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079511A (en) * 1976-07-30 1978-03-21 Amp Incorporated Method for packaging hermetically sealed integrated circuit chips on lead frames
DE3308720A1 (de) 1983-03-11 1984-09-13 Siemens AG, 1000 Berlin und 8000 München Halbleiterbauelement mit scheibenfoermigem gehaeuse
JPS6329957A (ja) * 1986-07-23 1988-02-08 Seiko Epson Corp 半導体装置の封止形態
JPS63164345A (ja) 1986-12-26 1988-07-07 Nec Corp 半導体集積回路用パツケ−ジ
JPH02307250A (ja) * 1989-05-23 1990-12-20 Mitsubishi Electric Corp 混成集積回路パツケージ
JP3357220B2 (ja) 1995-07-07 2002-12-16 三菱電機株式会社 半導体装置
EP1355351B1 (en) 2001-01-23 2018-05-23 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2004103936A (ja) 2002-09-11 2004-04-02 Mitsubishi Electric Corp 電力半導体装置およびその製造方法
EP1494278A1 (de) 2003-07-04 2005-01-05 Siemens Aktiengesellschaft Elektronisches Leistungsmodul mit Gummidichtung und entsprechendes Herstellungsverfahren
CN100361317C (zh) * 2004-02-27 2008-01-09 矽品精密工业股份有限公司 具有支撑体的感光半导体封装件及其制法
ES2367036T3 (es) 2005-09-27 2011-10-27 SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG Módulo de semiconductor de potencia con medios de protección contra la sobre corriente.
JP4242401B2 (ja) * 2006-06-29 2009-03-25 三菱電機株式会社 半導体装置
CN101101880A (zh) * 2006-07-03 2008-01-09 矽品精密工业股份有限公司 散热型封装结构及其制法
JP4858336B2 (ja) * 2007-07-10 2012-01-18 三菱電機株式会社 電力用半導体装置
DE102008051560A1 (de) 2007-10-18 2009-04-23 Infineon Technologies Ag Leistungshalbleitermodul

Similar Documents

Publication Publication Date Title
USD678516S1 (en) Oral fluid collector
JP2015532461A5 (enExample)
JP2013236091A5 (enExample)
JP2013190802A5 (enExample)
JP2013033753A5 (ja) 発光装置
JP2013137552A5 (enExample)
JP2011008775A5 (enExample)
JP2015502296A5 (enExample)
JP2014063749A5 (enExample)
JP2012256838A5 (enExample)
WO2011106810A8 (de) Schwimmende plattform
JP2010103508A5 (ja) 半導体装置
JP2011100877A5 (enExample)
JP2012125169A5 (enExample)
FR2966970B1 (fr) Condensateur a electrolyte liquide scelle hermetiquement.
JP2014011456A5 (enExample)
JP2012033615A5 (enExample)
JP2011243798A5 (enExample)
JP2019067970A5 (enExample)
CL2014000009A1 (es) Contenedor para un liquido que comprende una cavidad para mantener el liquido, una abertura para llenar la cavidad con el liquido, un cierre, una carcasa inferior, una carcasa superior y una pelicula que se extiende desde la carcasa superior a la carcasa inferior; uso de un contenedor; metodo para llenar un contenedor con liquido; metodo para reducir un peligro de radiacion; uso de una carcasa.
JP2014174417A5 (enExample)
CN202244446U (zh) 可重复使用式容器瓶
USD703045S1 (en) Bowl cap
JP2013140809A5 (ja) 表示装置
JP2015009865A5 (enExample)