JP2011216516A - Apparatus and method of processing substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus of processing substrate capable of a prolonged processing without increasing a footprint of the apparatus or reducing a throughput per unit time, and capable of easily changing the processing time.SOLUTION: A frame F in a second peeling band 2 is provided with lanes L1, L2, L3, which are provided with roller conveyors L11, L21, L31 and upper liquid curtain nozzles L12, L22, L32, respectively. The frame F moves up and down to sequentially carry substrates W1, W2, W3 into the respective lanes L1, L2, L3, and peeling liquid is supplied from the upper liquid curtain nozzles L12, L22, L32 to upper ends of the respective substrates W1, W2, W3. After completion of the process for a predetermined time period, the frame F moves up and down to sequentially carry the processed substrates W1, W2, W3 out.

Description

  The present invention supplies a treatment liquid to the surface of various substrates such as glass substrates, semiconductor wafers, mask substrates for semiconductor manufacturing apparatuses used for manufacturing liquid crystal display panels, plasma display panels, solar cells, magnetic disks, optical disks, etc. The present invention relates to a substrate processing apparatus and a substrate processing method for performing processing.

  Conventionally, as one method for forming a wiring pattern on an object such as a glass substrate used for manufacturing a liquid crystal display panel or the like, a resist film pattern (that is, a resist pattern) corresponding to the wiring pattern is formed on a conductive layer of the substrate. The part exposed from the resist film of the conductive layer is removed by applying an etching solution to the conductive layer through the resist pattern, and then the unnecessary resist film is removed to form a wiring pattern A photolithography method is known. In this type of photolithography process, processing steps using various processing solutions such as development, etching, peeling, and washing of the resist film are required.

  As a substrate processing apparatus for performing this type of processing, an apparatus that supplies a processing liquid to a substrate on a conveyor by a spray nozzle or the like while a substrate is transported in a processing chamber by a roller conveyor is well known. By the way, in this type of general processing apparatus, the conveying speed of the roller conveyor is determined in relation to the apparatus of the process before and after being connected to the roller conveyor, so that the processing time is almost dependent on the conveying speed and the size of the processing chamber. It will be decided. Therefore, for example, in order to increase the processing time, it is necessary to increase the length of the processing chamber or to provide a plurality of processing chambers in series, which increases the area for installing the apparatus and requires a large area in the clean room. However, the operation cost increases and the cost of the device itself increases.

JP 2000-299268 A

  In order to change the processing time without increasing the installation area of the apparatus, for example, Patent Document 1 proposes to increase the processing time by reciprocating one substrate in the processing chamber. However, if this is done, one substrate will occupy one processing chamber for a long time, and the processing capacity per unit time will be reduced.

  The present invention has been made in view of the above problems, and can perform long-time processing without increasing the installation area of the apparatus and without reducing the processing capacity per unit time, and facilitates processing time. An object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can be changed to

  In order to solve this problem, the invention according to claim 1 is directed to a carrying-in mechanism for carrying a substrate into the processing chamber, a carrying-out mechanism for carrying the substrate out of the processing chamber, and supporting and carrying the substrate in the processing chamber. A plurality of transport mechanisms, a processing liquid supply mechanism for supplying a processing liquid to a substrate supported by the plurality of transport mechanisms, and a plurality of transport mechanisms are moved to selectively select one of the transport mechanisms and the carry-in mechanism. A substrate processing apparatus comprising: a moving mechanism connected to the carry-out mechanism.

  According to a second aspect of the present invention, in the substrate processing apparatus of the first aspect, the carry-in mechanism and the carry-out mechanism are positioned at a pass line height, and the transfer mechanism of the processing chamber is located at the pass line height. And the unloading mechanism.

  According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, each of the plurality of transport mechanisms is provided with a magnetic driven member at an input portion for driving force in the transport direction, and the transport mechanism. And a magnetic drive member that is magnetically coupled to the magnetic driven member of the transport mechanism disposed at a connection position to the carry-out mechanism, and a drive source that drives the magnetic drive member is provided. .

  According to a fourth aspect of the present invention, in the substrate processing apparatus according to any one of the first to third aspects, the transport mechanism is provided to be inclined so as to support and transport the substrate in an inclined posture.

  According to a fifth aspect of the present invention, in the substrate processing apparatus according to any one of the first to fourth aspects, the plurality of transport mechanisms are attached to one frame, and the moving mechanism moves the frame. It is characterized by.

  The invention according to claim 6 is the substrate processing apparatus according to any one of claims 1 to 5, wherein the moving mechanism moves the transfer mechanism in a direction perpendicular to a surface of the substrate supported by the transfer mechanism. It is a thing to let it be.

  According to a seventh aspect of the present invention, in the substrate processing apparatus according to any one of the first to sixth aspects, the moving mechanism moves the transport mechanism in a horizontal direction.

  According to an eighth aspect of the present invention, in the substrate processing apparatus according to any one of the first to seventh aspects, the transport mechanism is a roller conveyor.

  A ninth aspect of the present invention is the substrate processing apparatus according to the fourth aspect, wherein the processing liquid supply mechanism supplies a processing liquid from an upper side of the inclination of the substrate.

  A tenth aspect of the present invention is the substrate processing apparatus according to any one of the first to ninth aspects, further comprising a sub supply mechanism for supplying a processing liquid to the substrate in the loading mechanism and / or the unloading mechanism. To do.

  According to an eleventh aspect of the present invention, in the substrate processing apparatus according to the tenth aspect, the sub supply mechanism sprays a processing liquid onto the substrate at a high pressure.

  According to a twelfth aspect of the present invention, in the substrate processing apparatus according to any one of the first to eleventh aspects, the processing liquid supplied by the processing liquid supply mechanism is a stripping liquid.

  The invention according to claim 13 is a carrying-in mechanism for carrying a substrate into a processing chamber, a carrying-out mechanism for carrying a substrate out of the processing chamber, a plurality of supporting members for supporting the substrate in the processing chamber, and the plurality of supporting members. A treatment liquid supply mechanism for supplying a treatment liquid to a substrate supported by the substrate, a movement mechanism for moving the plurality of support members and selectively connecting any one of the support members to the carry-in mechanism and the carry-out mechanism; A substrate processing apparatus comprising:

  The invention according to claim 14 is the step of positioning the first conveyor among the plurality of conveyors provided movably in the processing chamber, and the first conveyor positioned on the pass line. A step of loading and supporting the first substrate, and moving the first conveyor supporting the first substrate from the pass line to another position, and then positioning the second conveyor on the pass line. A process, a process of supplying a processing liquid to the first substrate supported by the first conveyor, a process of supplying the processing liquid, and a second substrate carried into the second conveyor located in a pass line A step of supporting, and after moving the second conveyor supporting the second substrate from the pass line to another position, the first conveyor supporting the first substrate is positioned on the pass line. And the second step A step of supplying a processing liquid to the second substrate supported by the bear and processing, and a step of unloading the processed first substrate from the first conveyor located in the pass line. It is the substrate processing method characterized by having provided.

According to the present invention, a substrate processing apparatus and a substrate capable of processing for a long time without changing the processing area per unit time without increasing the installation area of the apparatus and changing the processing time. A processing method can be provided.
According to the third aspect of the present invention, a driving force can be supplied to a required lane with a simple mechanism without providing a complicated driving force switching mechanism, and there is no fear of leakage of the processing liquid.
In the invention of claim 4, since the substrate is supported in an inclined posture, the processing liquid can be supplied to the entire substrate only by providing the processing liquid supply mechanism on the upper end side of the substrate.

It is side surface sectional drawing which shows typically the peeling apparatus which is a substrate processing apparatus of 1st embodiment of this invention. It is typical side surface sectional drawing explaining operation | movement of the peeling apparatus shown in FIG. It is typical side surface sectional drawing explaining operation | movement of the peeling apparatus shown in FIG. It is typical side surface sectional drawing explaining operation | movement of the peeling apparatus shown in FIG. FIG. 5 is a sectional view taken along line 5-5 ′ in FIG. 3. FIG. 6 is a sectional view taken along line 6-6 ′ in FIG. It is sectional drawing which shows an raising / lowering moving mechanism. It is side surface sectional drawing which shows typically the peeling apparatus which is a substrate processing apparatus of 2nd embodiment of this invention. It is side surface sectional drawing which shows typically the peeling apparatus which is a substrate processing apparatus of 3rd embodiment of this invention.

  [Overall configuration of the device]

  FIG. 1 is a side view schematically showing a configuration of a peeling apparatus 100 that is a substrate processing apparatus according to a first embodiment of the present invention. The peeling apparatus 100 supplies a peeling liquid to the upper surface of the substrate while transporting a glass substrate (hereinafter simply referred to as a substrate) used for manufacturing a liquid crystal display panel in a horizontal direction with a slight inclination as described later by a roller conveyor. Then, an unnecessary resist film on the substrate is peeled off. In general, this peeling apparatus 100 is supplied with a substrate on which a resist film is applied, a pattern is exposed and developed to form a resist film pattern, and a portion of the substrate surface where there is no resist film is etched. . Therefore, an etching apparatus or a substrate supply apparatus that supplies the substrate after the etching process from the cassette is connected to the upstream side of the peeling apparatus 100. The substrate that has been peeled off by the peeling device 100 is further subjected to treatments such as washing with water and drying. Accordingly, a washing device or the like is connected downstream of the peeling device 100.

  The peeling apparatus 100 includes a first peeling zone 1, a second peeling zone 2, and a third peeling zone 3 from the upstream side of substrate conveyance. The first strip 1 receives a substrate W supplied from an etching apparatus or the like connected to the upstream side, sprays a stripping solution by high-pressure spray, and performs a separate stripping process by the striking force. The second stripping zone 2 receives the substrate W after the processing in the first stripping zone 1 and deposits the stripping solution along the surface from the upstream side of the inclined posture of the substrate W for a predetermined time, and adheres to the substrate W. The resist film is sufficiently swollen. The third stripping zone 3 receives the substrate W after the processing in the second stripping zone 2, sprays a stripping solution by high-pressure spray, and strips and removes the swollen resist film by its striking force.

  [Detailed configuration of first strip]

  The first peeling band 1 is formed inside the first peeling band wall 1a, and the substrate W is carried by the roller conveyor 12 from the left side of FIG. 1 through the carry-in port 11 formed in the first peeling band wall 1a (note that The height position of the roller conveyor 12 is referred to as a pass line height). In the first stripping zone 1, the stripping liquid is supplied over the entire width direction of the substrate W, the inlet liquid curtain nozzle 13 that discharges and supplies the stripping liquid in a uniform curtain shape over the entire width direction of the substrate W to be loaded. The high pressure spray nozzle 14 sprays the liquid in a high pressure spray form, and the discharge liquid is discharged and supplied toward the upstream side in the transport direction in the form of a uniform curtain over the entire width direction of the substrate W. An outlet liquid curtain nozzle 15 that suppresses carry-out is provided. The stripping solution used in the first stripping zone 1 collects in the lower part of the first stripping zone 1 and is collected in the stripping solution tank 16 from the waste liquid port 1b formed at the bottom of the first stripping zone wall 1a. The recovered stripping liquid is supplied again from the pump 17 through the valve group 18 to the inlet liquid curtain nozzle 13, the high pressure spray nozzle 14, and the outlet liquid curtain nozzle 15 to be reused. Each nozzle in the first peeling zone 1 may be replaced with another nozzle as long as it discharges uniformly in the width direction of the substrate W.

[Detailed configuration of the second peeling zone]
A second peeling zone 2 serving as a processing chamber is provided on the downstream side of the first peeling zone 1, that is, on the opposite side of the carry-in port 11, and the substrate W is carried into the second peeling zone 2 from the first peeling zone 1 on the left side in FIG. Is done. The second peeling band 2 is formed inside the second peeling band wall 2a and communicates with the first peeling band 1 at the upper part, but is separated from the first peeling band 1 by the second peeling band wall 2a at the lower part. Thus, the stripping solution used in the first stripping zone 1 is prevented from being mixed into the stripping solution used in the second stripping zone 2.
The second stripping zone 2 is provided with three lanes L1 to L3 for supplying a stripping liquid to the substrate W and performing the stripping process while supporting one substrate W during the processing of the substrate W. . These lanes L1 to L3 will be described in detail. The second peeling band 2 is provided with a frame F that is open at the top and bottom and front and rear (first peeling band 1 side and third peeling band 3 side). The frame F is supported by an elevating / lowering mechanism 21 provided at the four corners of the ceiling of the second peeling band wall 2a so as to be movable up and down (details will be described later). Inside the frame F, a lane L1, a lane L2, and a lane L3 are stacked and assembled in this order from the top. Each lane L1, L2, L3 has a length (transport direction) that can hold one substrate W, supports the substrate W in a slightly inclined posture during the peeling process, Roller conveyors L11, L21, L31 that perform the function of transporting the substrate W in the horizontal direction when the substrate W is loaded into L3, and the upper end side of the substrate W supported by each roller conveyor L11, L21, L31 (details) Are provided with upper liquid curtain nozzles L12, L22, and L32 for supplying a stripping liquid.

  The roller conveyors L11, L21, L31 of the lanes L1, L2, L3 provided in the second peeling band 2 are provided in parallel in the frame F. The frame F is supported in the second peeling band 2 so as to be lifted and lowered by a lifting and lowering moving mechanism 21 using ball screws or belts provided at the four corners of the ceiling wall 2aC of the second peeling band 2a. Moreover, the 2nd peeling strip wall 2a is installed through the base P on the horizontal floor FL. The pedestal P is configured such that the second peeling band wall 2a is slightly inclined. As a result, the roller conveyors L11, L21, and L31 in the lanes L1, L2, and L3 are formed on the substrate W as shown in FIGS. Inclined by an angle θ of about 5 to 15 degrees with respect to the horizontal plane so that the left side (the left side in FIGS. 5 and 6, the front side in FIG. 1 to 4) is lower toward the upstream side in the transport direction. . The sizes of the rollers L15, L25, L35 attached to the roller shafts L14, L24, L34 are all equal. Therefore, these roller conveyors L11, L21, and L31 support the substrate W in a posture inclined by the same angle θ and transport the substrate W in that posture. The left and right side plates FW of the frame F are provided in a plane perpendicular to the roller shafts L14, L24, and L34 and in parallel with the transport direction of the substrate W. The roller shafts L14, L24, and L34 are provided with bearings L16, It is supported by L26 and L36 so as to be rotatable and arranged at equal intervals. The lower edge of each substrate W is supported by side guide rollers L18, L28, and L38 that are rotatably provided.

In addition, the roller conveyor 12 in the 1st peeling belt | band | zone 1 is also provided in the same direction as each roller conveyor L11, L21, L31 of the lanes L1, L2, and L3 provided in the 2nd peeling belt | band | zone 2, and inclined at the same angle. Further, the range of raising and lowering of the frame F is, when using the normal apparatus, the roller conveyor L11 in the uppermost lane L1 is positioned at the pass line height when it is lowered most (FIGS. 1, 4, and 6). The roller conveyor L31 of the lowest lane L3 is positioned at the pass line height when it is raised most (FIGS. 3 and 5), and by moving the frame F up and down, all the lanes L1 to L3 Thus, the substrate W can be smoothly transferred from the roller conveyor 12.
As shown in FIGS. 5 and 6, the right side (the right side in FIGS. 5 and 6 and the back side in FIGS. 1 to 4) toward the upstream side in the transport direction of the substrate W, that is, the roller shafts L14, L24, and L34. On the upper side in the inclination direction, the frame F is provided in parallel with the side wall 2aW of the second peeling band wall 2a. In addition, disk-shaped magnetic driven members L17, L27, and L37 each including a magnet are attached to all end portions of the roller shafts L14, L24, and L34 as input portions for the rotational driving force, close to the side wall 2aW. It has been. Further, it is a position corresponding to all the roller shafts of the roller conveyor positioned at the height of the pass line (that is, the roller shaft L14 of the roller conveyor L11 in FIG. 6 and the roller shaft L34 of the roller conveyor L31 in FIG. 5). A plurality of magnetic drive members 22 are provided on the outer side of the side wall 2aW of the stripping strip wall 2a so as to be magnetically coupled to the magnetic driven members of the respective roller shafts through the side walls 2aW and to rotationally drive all the roller shafts. Is rotatably provided. The side wall 2aW of the second stripping band wall 2a is made of a material that allows magnetism to pass through and has resistance to the stripping solution, for example, stainless steel. The magnetic drive member 22 is supported by a bearing (not shown) and is rotationally driven by a drive source 25 such as a motor.
In the lanes L1, L2, and L3 provided in the second stripping zone 2, the high side of each of the roller conveyors L11, L21, and L31 (shown in FIGS. 5 and 6 on the right side toward the upstream side in the conveyance direction of the substrate W, FIG. To 4), when the respective roller conveyors L11, L21, L31 support the substrate W, the upper liquid curtain nozzles L12, L22, which supply the stripping liquid in the form of a curtain to the upper end side of the substrate W, L32 is provided. The stripping solution supplied and flowed over the substrate W forms a liquid layer on the surface of the substrate W while flowing downward along the inclination of the substrate W, and sufficiently swells the resist film attached to the substrate W. . The upper liquid curtain nozzles L12, L22, and L32 need only be supplied to the upper end of the substrate W, and therefore do not need to be provided in a narrow space between the lanes L1, L2, and L3, but are provided outside the upper liquid curtain nozzles L12, L22, and L32. . That is, the rollers L15, L25, and L35 are provided outside the most upper end side and outside the substrate W to be processed. Each nozzle in the second peeling zone 2 may be replaced with another nozzle as long as it discharges uniformly in the transport direction of the substrate W.
The stripping liquid used in the second stripping zone 2 flows down from the lower end of the substrate W and accumulates in the lower part of the second stripping zone 2 and accumulates from the waste liquid port 2b formed at the bottom of the second stripping zone wall 2a. To be recovered. The recovered stripping liquid is supplied again from the pump 27 through the valve 28 to the upper liquid curtain nozzles L12, L22, L32 and reused.

  [Detailed configuration of the third peeling zone]

The third peeling band 3 is provided on the downstream side of the second peeling band 2, that is, on the opposite side of the first peeling band 1, and the substrate W is carried into the third peeling band 3 from the second peeling band 2 on the left side in FIG. . The third peeling band 3 is formed inside the third peeling band wall 3a and communicates with the second peeling band 2 at the upper part, but is separated from the second peeling band 2 by the second peeling band wall 2a at the lower part. Thus, the stripping solution used in the second stripping zone 2 is prevented from being mixed into the stripping solution used in the third stripping zone 3.
The substrate W is conveyed from the roller conveyor of the lane placed at the pass line height among the lanes of the second peeling band 2 on the left side of FIG. 1 to the roller conveyor 32 of the third peeling band wall 3a. After the peeling process in the third peeling band 3, it is carried out from a carry-out port 31 formed on the opposite side of the second peeling band 2.

The roller conveyor 32 in the third peeling band 3 is provided at the pass line height, and has the same direction and the same angle as the roller conveyors 12, L11, L21, and L31 provided in the first peeling band 1 and the second peeling band 2. It is provided with an inclination. Therefore, the substrate W can be smoothly conveyed between the second peeling zone 2 and the roller conveyor of the lane located at the pass line height.
In the third stripping zone 3, the inlet liquid curtain nozzle 33 that discharges and supplies the stripping liquid in a uniform curtain shape over the entire width direction of the substrate W to be carried in, and the stripping liquid over the entire width direction of the substrate W. Is provided with a high-pressure spray nozzle 34 for spraying in a high-pressure spray form, and an air knife 35 for spraying and removing the stripping liquid from the surface of the substrate W by blowing air on the upper and lower surfaces over the entire width of the substrate W. Air is supplied to the air knife 35 via a pipe (not shown). The stripping solution used in the third stripping zone 3 is removed from the substrate W by the air blast of the air knife 35, collected at the bottom of the third stripping zone 3, and a waste liquid port formed at the bottom of the third stripping zone wall 3a. 3b is collected in the stripping solution tank 36. The recovered stripping liquid is supplied again to the inlet liquid curtain nozzle 33 and the high-pressure spray nozzle 34 from the pump 37 through the valve group 38 and reused. Each nozzle in the first peeling zone 1 may be replaced with another nozzle as long as it discharges uniformly in the width direction of the substrate W.

[Control of the entire device]
The conveying operation of each roller conveyor 12, L11, L21, L31, 32, the operation of the valve groups 18, 38, the valve 28, the pumps 17, 27, 37, the lifting and lowering moving mechanism 21 and the like govern the operation of the entire peeling apparatus 100. It is controlled by a control device (not shown) comprising a so-called microcomputer. The control device includes substrate position detection information of a substrate sensor (not shown) arranged at appropriate portions of the roller conveyors 12, L11, L21, L31, and 32, and a liquid meter provided in the stripping solution tanks 16, 26, and 36. The entire peeling device 100 is controlled based on information such as a liquid thermometer.

[Operation and processing method of entire apparatus]
Next, control and operation of substrate processing using the peeling apparatus 100 of the present embodiment will be described in order. First, the first substrate W1 after the etching process is carried into the first peeling zone 1 from the carry-in port 11 by the roller conveyor 12 from the upstream device of the peeling device 100. In the first stripping zone 1, the stripping liquid is discharged and supplied in a uniform curtain shape over the entire width direction of the substrate W1 by the inlet liquid curtain nozzle 13, and the stripping process of the resist film is started. Next, a stripping solution is sprayed in a high-pressure spray form with the high-pressure spray nozzle 14, and the resist film is roughly stripped and removed with the impact force of the stripping solution. At this stage, the stripped resist film component is mixed with a large amount of stripped resist film components. The substrate W1 is subsequently transported to the second peeling zone 2 of the next process, but the substrate W1 has an inclined posture as described above, and the peeling liquid smoothly flows laterally along the inclination. There is little removal liquid removal. However, in order to further reduce the carry-out amount, the stripping liquid is discharged in the form of a uniform curtain toward the upstream side in the transport direction by the outlet liquid curtain nozzle 15 in the entire width direction of the substrate W1, and the second stripping strip 2 of the stripping liquid. The amount taken out to the home is reduced.

After the processing in the first peeling zone 1, the substrate W <b> 1 is carried into the second peeling zone 2 by the roller conveyor 12. In the illustrated example, since the length of the substrate W1 is longer than the length of the first peeling band 1, the substrate W1 is processed across the processing in the first peeling band 1 and the second peeling band 2. FIG. 1 shows this state, in which the frame F is lowered to the lowest position, and the uppermost lane L1 is positioned at the pass line height, which is the conveying height of the roller conveyor 12. The substrate W1 is conveyed from the roller conveyor 12 to the roller conveyor L11 in the lane L1. At this time, the magnetic driven members L17 of all the roller shafts L14 of the roller conveyor L11 approach and magnetically couple with the magnetic drive member 22 across the side wall 2aW, and are driven by the drive source 25 coupled to the magnetic drive member 22. It is driven to rotate and carry.
And with respect to the board | substrate W1 conveyed to the roller conveyor L11, the upper end liquid curtain nozzle L12 supplies stripping liquid to the upper end side of the board | substrate W1 in the shape of a curtain, and pours it down below along the inclination of the board | substrate W1. As a result, the stripping solution forms a liquid layer on the surface of the substrate W1 and sufficiently swells the resist film attached to the substrate W. When the substrate sensor detects that the entire substrate W1 has entered the second peeling zone 2, the driving of the drive source 25 is stopped, and the substrate W1 is stopped while being supported on the roller conveyor L11 in the lane L1. . And the raising / lowering moving mechanism 21 is driven to raise the frame F, and the roller conveyor L21 in the lane L2 is driven to be positioned at the pass line height. Note that the supply of the stripping liquid by the upper end liquid curtain nozzle L12 is continued after this time.
Next, following the substrate W1, the second substrate W2 is carried into the peeling apparatus 100. Similarly to the first substrate W1, the substrate W2 is also processed in the first peeling zone 1 and the second peeling zone 2, but the substrate W2 is transferred to the lane L2 of the second peeling zone 2 and processed. To be different. This state is shown in FIG. At this time, the magnetic driven members L27 of all the roller shafts L24 of the roller conveyor L21 in the lane L2 approach the magnetic driving member 21 through the side wall 2aW and are magnetically coupled, and the driving coupled to the magnetic driving member 21 is performed. It is rotationally driven by the source 25 to perform a transport operation. When the substrate sensor detects that the entire substrate W2 has entered the second peeling zone 2, the driving of the drive source 25 is stopped, and the substrate W2 is stopped while being supported on the roller conveyor L21 in the lane L2. . And the raising / lowering moving mechanism 21 is driven to raise the frame F, and the roller conveyor L31 in the lane L3 is driven to be positioned at the pass line height. After this time, the supply of the stripping liquid to the substrates W1 and W2 by the upper end liquid curtain nozzles L12 and L22 is continued.
Subsequently, following the substrate W2, the third substrate W3 is carried into the peeling apparatus 100. Similarly to the first substrate W1 and the second substrate W2, the substrate W3 is processed in the first peeling zone 1 and the second peeling zone 2, but the substrate W3 is the second peeling zone 2. The difference is that it is transported to lane L3 and processed. At this time, the magnetic driven members L37 of all the roller shafts L34 of the roller conveyor L31 in the lane L3 approach the magnetic driving member 21 through the side wall 2aW and are magnetically coupled, and the driving coupled to the magnetic driving member 21 is performed. It is rotationally driven by the source 25 to perform a transport operation. When the substrate sensor detects that the entire substrate W3 has entered the second peeling zone 2, the drive of the drive source 25 is stopped, and the substrate W3 is stopped while being supported on the roller conveyor L31 in the lane L3. . This state is shown in FIG. As shown in FIG. 3, in the second stripping zone 2, it is possible to process three substrates W at the same time, and it can be used for process applications that require a long time for stripping without reducing the processing capacity per unit time. Is possible. Next, the lifting / lowering moving mechanism 21 is driven to lower the frame F, and the roller conveyor L11 in the lane L1 is driven to be positioned at the pass line height. After this time, the supply of the stripping liquid to the substrates W1, W2, and W3 by the upper end liquid curtain nozzles L12, L22, and L32 is continued.
Subsequently, when the necessary processing time in the second processing zone 2 has elapsed for the first substrate W1, the roller conveyor L11 in the lane L1 is driven, and the roller conveyor 32 is driven at the same time from the second processing zone 2. The first substrate W1 is carried out and conveyed to the third processing zone 3. In the third stripping zone 3, the stripping liquid is discharged and supplied in a uniform curtain shape over the entire width direction by the inlet liquid curtain nozzle 33 to the substrate W1, and further, the entire width direction of the substrate W1 by the high pressure spray nozzle 34. Spray the stripper with high pressure spray. The resist film sufficiently swollen in the second peeling zone 2 is easily peeled and removed by the impact force of these treatments, particularly by high-pressure spraying. This state is shown in FIG. Thereafter, air is blown onto the upper and lower surfaces of the substrate W1 over the entire width direction by the air knife 35 to remove and remove the stripping solution, which is carried out from the carry-out port 31 and conveyed to the subsequent cleaning device or the like.
At the same time as the first substrate W1 is unloaded from the second processing zone 2, the next fourth substrate W4 can be received in the lane L1. In the actual control of the peeling apparatus 100, it can be controlled so that the next substrate W4 is carried into the second processing zone at almost the same timing as the substrate W1 is carried out of the second processing zone 2. This is desirable in terms of utilization efficiency of the peeling apparatus 100. Subsequently, similarly, the second substrate W2 is unloaded from the second processing zone 2 and the fifth substrate W5 is received, so that a number of substrates W can be processed.
In addition, the conveyance speed of each roller conveyor 12, L11, L21, L31, 32 can be set arbitrarily independently. For example, when the surface of the resist film is hard, it can be easily peeled off by slowing the conveying speed of the roller conveyor 12 so that the high-pressure spray in the first treatment zone 1 acts for a long time. When the adhesiveness between the substrate and the substrate is high, the speed of the roller conveyor 32 can be slowed down so that the high-pressure spray in the third peeling zone 3 acts for a long time to facilitate peeling.

[Detailed configuration of lifting mechanism]
FIG. 7 is a schematic diagram showing an example of the lifting / lowering moving mechanism 21 provided at the four corners of the ceiling of the second peeling band wall 2a. Here, the illustration of the upper liquid curtain nozzle and the like is omitted, and two sets of left and right are shown, but the structure is the same, so only the right set is given a reference numeral. Explaining this, a support column 21b is erected and fixed to the ceiling 2aC of the second peeling band wall 2a, and a moving table 21d is provided on the side surface via a linear motion guide mechanism 21c. A motor 21e is attached. A ball screw 21f having a predetermined length is attached to the rotation shaft of the motor 21e, and the ball screw 21f is screwed into a nut 21g attached and fixed to the ceiling of the second peeling band wall 2a to reach the second peeling band 2. On the other hand, a bearing 21i is attached and fixed to the upper surface of the frame F, and a non-screw part 21h at the tip of the ball screw 21f is rotatably supported. The non-threaded portion 21h and the bearing 21i at the tip of the ball screw 21f located in the second stripping band 2 are covered with a stretchable bellows 21j that is resistant to the stripping solution in order to separate the stripping solution atmosphere. With such a configuration, the up-and-down movement mechanism 21 moves the lanes L1, L2, and L3 in the vertical direction with respect to the surface of the substrate W supported by them.
FIG. 7 shows a state in which the frame F is raised most. When the frame F is lowered from this state, the ball screw 21f is rotated by the motor 21e, and the ball screw 21f is moved to the inside of the second peeling band 2. Thereby, the frame F descends as the ball screw 21f descends. At the same time, the motor 21e is also lowered by the guidance of the linear motion guide mechanism 21c.

  [Second Embodiment]

  FIG. 8 shows a second embodiment of the second stripping zone 2. In this example, two of the lane L1 and the lane L2 are provided so as to be rotatable around the left side in the figure, and the lane L2 indicated by the solid line in the figure is the pass line height. Illustration of a moving mechanism for moving the upper liquid curtain nozzle and the lanes L1 and L2 is omitted. When the substrate W is carried into and out of the lane L2, the lanes L1 and L2 are placed at the positions indicated by the solid lines in the drawing. Further, when the substrate W is carried in and out of the lane L1, the lane L2 is rotated to the position of the broken line in the drawing, and the lane L1 is rotated to the position of the lane L2 shown by the solid line in the drawing, respectively. L1 is positioned at the pass line height.

  [Third embodiment]

FIG. 9 shows a third embodiment of the second stripping zone 2. In this example, the inclination angle of the lanes L1 to L3 is larger than that of the first embodiment close to a right angle, and in this case, the linear motion guide member 29 extends in the direction along the bottom of the second strip 2. The frame F is movable in the horizontal direction. Note that the drive source of the frame F and a mechanism such as a magnetic drive member for driving the roller conveyor are not shown. In this case, also in the 1st peeling zone 1 and the 3rd peeling zone 3, a board | substrate is conveyed by the inclination angle similar to each lane L1-L3 of the 2nd peeling zone 2. FIG.
[Modification]
In the first and third embodiments, the number of lanes is 3, and in the second embodiment, the number of lanes is 2. The number of lanes is determined by the required processing time in the second stripping zone 2. That's fine. By providing a large number of lanes, it is possible to perform long-time processing without reducing the processing capacity per unit time, and the installation area of the apparatus is not increased. For example, in the first embodiment, by changing the number of lanes used, such as “use only lanes L1 and L2 and not use lane L3”, the processing time can be easily changed. .
In addition, since the driving force is transmitted by the magnetic driven member and the magnetic driving member, even if the lane positioned at the pass line height is switched, the driving force is applied to the required lane without providing a complicated driving force switching mechanism. Since there is no need to provide a hole for transmitting the driving force in the second peeling band wall 2a, there is no risk of leakage of the processing liquid.
Further, since the substrate is supported in an inclined posture in each lane, if the processing liquid supply mechanism is provided only on the upper end side of the substrate, the entire substrate can be spread by supplying the processing liquid. Therefore, it is possible to narrow the space between lanes as necessary.
Further, since the first stripping zone 1, the second stripping zone 2, and the third stripping zone 3 are provided with separate stripping liquid supply systems, for example, stripping liquids having different concentrations are applied to the stripping solution tanks 16, 26, and 36, for example. Processing such as use is possible.

DESCRIPTION OF SYMBOLS 100 Peeling device 1 1st peeling zone 2 2nd peeling zone 3 3rd peeling zone 12, L11, L21, L31, 32 Roller conveyor 13 Inlet liquid curtain nozzle 14 High pressure spray nozzle 15 Outlet liquid curtain nozzle 21 Elevating movement mechanism L12, L22 , L32 Upper liquid curtain nozzle 33 Inlet liquid curtain nozzle 34 High pressure spray nozzle

Claims (14)

A loading mechanism for loading the substrate into the processing chamber;
An unloading mechanism for unloading the substrate from the processing chamber;
A plurality of transport mechanisms for supporting and transporting the substrate in the processing chamber;
A processing liquid supply mechanism for supplying a processing liquid to a substrate supported by the plurality of transport mechanisms;
A movement mechanism that moves the plurality of conveyance mechanisms and selectively connects any of the conveyance mechanisms to the carry-in mechanism and the carry-out mechanism;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 1,
The carry-in mechanism and the carry-out mechanism are located at a pass line height,
A substrate processing apparatus, wherein a transfer mechanism of the processing chamber is connected to the carry-in mechanism and the carry-out mechanism at the height of the pass line. The substrate processing apparatus according to claim 1 or 2,
Each of the plurality of transport mechanisms is provided with a magnetic driven member at the input portion of the driving force in the transport direction,
In addition, a magnetic drive member that is magnetically coupled to the magnetic driven member of the transport mechanism disposed at a connection position to the carry-in mechanism and the carry-out mechanism is provided,
A substrate processing apparatus comprising a drive source for driving the magnetic drive member. In the substrate processing apparatus in any one of Claims 1 thru | or 3,
The substrate processing apparatus, wherein the transport mechanism is provided to be inclined so as to support and transport the substrate in an inclined posture. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the plurality of transport mechanisms are attached to a single frame, and the moving mechanism moves the frame. The substrate processing apparatus according to any one of claims 1 to 5,
The substrate processing apparatus, wherein the moving mechanism moves the transport mechanism in a direction perpendicular to the surface of the substrate supported by the transport mechanism. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the moving mechanism moves the transport mechanism in a horizontal direction. The substrate processing apparatus according to claim 1,
The substrate processing apparatus, wherein the transport mechanism is a roller conveyor. The substrate processing apparatus according to claim 4,
The substrate processing apparatus, wherein the processing liquid supply mechanism supplies a processing liquid from an upper side of the inclination of the substrate. The substrate processing apparatus according to any one of claims 1 to 9,
A substrate processing apparatus comprising a sub supply mechanism for supplying a processing liquid to a substrate in the carry-in mechanism and / or the carry-out mechanism. The substrate processing apparatus according to claim 10, wherein
The substrate processing apparatus is characterized in that the sub supply mechanism sprays a processing liquid onto the substrate at a high pressure. The substrate processing apparatus according to claim 1,
A substrate processing apparatus, wherein the processing liquid supplied by the processing liquid supply mechanism is a stripping liquid. A loading mechanism for loading the substrate into the processing chamber;
An unloading mechanism for unloading the substrate from the processing chamber;
A plurality of support members for supporting a substrate in the processing chamber; a treatment liquid supply mechanism for supplying a treatment liquid to the substrate supported by the plurality of support members;
A moving mechanism that moves the plurality of support members and selectively connects any of the support members to the carry-in mechanism and the carry-out mechanism;
A substrate processing apparatus comprising: Of the plurality of conveyors provided movably in the processing chamber, the step of positioning the first conveyor in the pass line of the processing device;
Carrying and supporting the first substrate on the first conveyor located in the pass line;
Moving the first conveyor supporting the first substrate from the pass line to another position, and then positioning the second conveyor on the pass line;
Supplying and processing a processing liquid to the first substrate supported by the first conveyor;
Carrying and supporting the second substrate on the second conveyor located in the pass line;
Moving the second conveyor supporting the second substrate from the pass line to another position, and then positioning the first conveyor supporting the first substrate on the pass line;
Supplying a processing liquid to the second substrate supported by the second conveyor and processing the second substrate;
Unloading the processed first substrate from the first conveyor located on the pass line;
A substrate processing method comprising:

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