CN106992136B - Wet etching equipment and wet etching method - Google Patents
Wet etching equipment and wet etching method Download PDFInfo
- Publication number
- CN106992136B CN106992136B CN201710262995.2A CN201710262995A CN106992136B CN 106992136 B CN106992136 B CN 106992136B CN 201710262995 A CN201710262995 A CN 201710262995A CN 106992136 B CN106992136 B CN 106992136B
- Authority
- CN
- China
- Prior art keywords
- substrate
- pipes
- etching
- spray
- wet etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention provides wet etching equipment and a wet etching method. The wet etching equipment comprises a conveying device for conveying a substrate and a plurality of spraying pipes arranged above the conveying device and used for spraying etching liquid to the surface of the substrate; the carrying surface of the conveying device is divided into a plurality of areas, the plurality of spray pipes are correspondingly divided into a plurality of groups with different heights between the spray pipes and the carrying surface above the plurality of areas of the carrying surface, so that when the substrate is conveyed obliquely, the spray pressure of the substrate on different areas is different, the difference of the replacement rate of etching liquid on the areas at two sides of the substrate is reduced, the difference of etching size deviation on the areas at two sides of the substrate is reduced, and the uniformity of etching sizes is improved.
Description
Technical Field
The invention relates to the field of manufacturing processes of flat panel displays, in particular to wet etching equipment and a wet etching method.
Background
In the field of Display technology, flat panel Display devices such as Liquid Crystal Displays (LCDs) and Active Matrix Organic Light-Emitting Display devices (AMOLEDs) have been widely used because of their advantages such as thin body, high image quality, power saving, and no radiation, for example: a mobile phone, a Personal Digital Assistant (PDA), a digital camera, a computer screen or a notebook screen, etc.
A Thin Film Transistor (TFT) Array (Array) substrate is a main component of a Liquid Crystal Display (LCD) and an active matrix Organic Light-Emitting Display (AMOLED) device, and is directly related to the development direction of a high performance flat panel Display device.
For example, the manufacturing process of LCD generally includes: anterior segment array process, middle section become box (Cell) process and back end module equipment process, anterior segment array process includes again: cleaning and drying the glass substrate, coating a film, coating a photoresist, exposing, developing, etching, removing the photoresist and the like. Etching is further classified into WET (WET) etching and DRY (DRY) etching, wherein the effect of WET etching has a great influence on the fineness of wiring and the quality of a final panel, and thus, the etching size deviation (CD Bias) and the etching size (CD) uniformity are important characteristics after WET etching. For example, if the etching dimension of the second metal layer is not uniform, i.e., the conductive lines in a part of the area are wider, the overlapping area between the second metal layer and the first metal layer between pixels will be different, i.e., different capacitive coupling effect will be generated, and the quality of the panel will deviate from the designed value.
The most common wet etching mode at present is a spray mode (spray mode) in which a substrate is etched mainly by spraying an etching solution over the substrate; in the wet etching process, under the condition of determining the chemical solution, the main factors influencing the CD include temperature, etching time, solution replacement efficiency, and the like.
The existing spraying wet etching equipment mainly comprises a conveying device 100 for conveying a glass substrate 500, and a plurality of spraying pipes 210 arranged above the conveying device 100 and used for spraying etching liquid to the glass substrate 500; the conveying mode adopted by the conveying device 100 includes a horizontal conveying mode and an inclined conveying mode inclined by about 5 degrees relative to the horizontal plane. When horizontally conveyed, as shown in fig. 1, the etching solution is about to flow out from both sides of the glass substrate 500, so that the etching solution replacement rate in the middle area of the glass substrate 500 is different from that in both side areas, thereby causing poor uniformity of the etched CD; in the inclined transportation, as shown in fig. 2, since the etching solution flows out from one side of the glass substrate 500, the replacement rate of the etching solution in the two side regions of the glass substrate 500 is greatly different, which results in poor uniformity of the etched CD.
Disclosure of Invention
The invention aims to provide a wet etching device, which can reduce the difference of the replacement rate of etching liquid on two side areas of a substrate by adjusting the spraying pressure of the substrate on different areas when the substrate is obliquely conveyed, thereby reducing the difference of etching size deviation on the two side areas of the substrate and further improving the uniformity of etching size.
The present invention also provides a wet etching method, which uses the above wet etching apparatus to reduce the difference of the replacement rate of the etching solution in the two side areas of the substrate by adjusting the spraying pressure applied to the substrate in different areas when the substrate is transported in an inclined manner, so as to reduce the difference of the etching size deviation in the two side areas of the substrate, and further improve the uniformity of the etching size.
In order to achieve the above object, the present invention provides a wet etching apparatus, comprising a conveying device for conveying a substrate, and a plurality of spray pipes arranged above the conveying device for spraying an etching solution onto the surface of the substrate;
the conveying device is provided with a bearing surface for bearing the substrate, the conveying direction of the conveying device for the substrate is set to be a first direction, the direction which is vertical to the first direction and is parallel to the bearing surface of the conveying device is set to be a second direction, and the bearing surface of the conveying device is gradually raised relative to a horizontal plane along the second direction to be inclined, so that the substrate is obliquely conveyed;
the carrying surface of the conveying device is divided into a first area, a second area, a third area, a fourth area, a fifth area, a sixth area and a seventh area which are arranged along the second direction, wherein N is a natural number larger than 1, the plurality of spray pipes are correspondingly divided into a first group, a second group and a fifth group above the first area, the height between the plurality of spray pipes and the carrying surface is gradually reduced from the first group to the nth group, and therefore the spray pressure of the substrate on the first area to the nth area is different.
The wet etching equipment also comprises N liquid inlet pipes which are respectively connected with the first group of spray pipes, the second group of spray pipes and the Nth group of spray pipes and are used for conveying etching liquid.
Each liquid inlet pipe is provided with a control valve for controlling the flow of the etching liquid.
The axial direction of each shower is parallel to the first direction.
Each spray pipe is provided with a plurality of nozzles arranged along the axial direction of the spray pipe, and each spray pipe sprays etching liquid to the surface of the substrate through the plurality of nozzles on the spray pipe.
In the process of spraying the etching solution on the surface of the substrate, each spraying pipe rotates back and forth above the substrate.
The bearing surface of the conveying device is divided into a first area, a second area, a third area and a third area, wherein the first area, the second area and the third area are arranged along a second direction, and the plurality of spray pipes are correspondingly divided into a first group, a second group and a third group above the first area, the second area and the third area.
The carrying surface of the conveyor is inclined 3-7 deg. to the horizontal.
The invention also provides a wet etching method, which comprises the following steps:
step S1, providing the wet etching apparatus and the substrate to be etched, and turning on the wet etching apparatus;
and step S2, placing the substrate on a bearing surface of a conveyer, wherein the substrate moves forwards under the drive of the conveyer and is inclined relative to the horizontal plane, the plurality of spray pipes spray etching liquid to the substrate below the spray pipes in the moving process of the substrate, and the spray pressure of the substrate on the first area to the Nth area is different as the heights between the plurality of spray pipes and the substrate are gradually reduced from the first group to the Nth group.
The wet etching equipment also comprises N liquid inlet pipes which are respectively connected with the first group of spray pipes, the second group of spray pipes and the Nth group of spray pipes and are used for conveying etching liquid, wherein each liquid inlet pipe is provided with a control valve used for controlling the flow of the etching liquid;
the step S2 further includes adjusting the flow rate of the etching solution in the first to nth groups of shower pipes through a control valve on each liquid inlet pipe.
The invention has the beneficial effects that: the wet etching equipment comprises a conveying device for conveying a substrate and a plurality of spray pipes for spraying etching liquid to the surface of the substrate; the carrying surface of the conveying device is divided into a plurality of areas, the plurality of spray pipes are correspondingly divided into a plurality of groups with different heights between the spray pipes and the carrying surface above the plurality of areas of the carrying surface, so that when the substrate is conveyed obliquely, the spray pressure of the substrate on different areas is different, the difference of the replacement rate of etching liquid on the areas at two sides of the substrate is reduced, the difference of etching size deviation on the areas at two sides of the substrate is reduced, and the uniformity of etching sizes is improved. According to the wet etching method, the wet etching equipment is adopted, and the difference of the replacement rates of the etching liquid on the two side areas of the substrate is reduced by adjusting the spraying pressure of the substrate on the different areas, so that the difference of the etching size deviation on the two side areas of the substrate is reduced, and the uniformity of the etching size is improved.
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description and are not intended to limit the invention.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
In the drawings, there is shown in the drawings,
FIG. 1 is a schematic diagram of a conventional wet etching apparatus showing non-uniform etching dimensions in a horizontal transfer mode;
FIG. 2 is a schematic diagram of a conventional wet etching apparatus showing non-uniform etching dimensions in an inclined conveyance mode;
FIG. 3 is a schematic structural diagram of a wet etching apparatus according to the present invention;
FIG. 4 is a schematic view of the connection between the shower pipe and the liquid inlet pipe in the wet etching apparatus of the present invention;
FIG. 5 is a flow chart illustrating a wet etching method according to the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the embodiments of the present invention and the accompanying drawings.
Referring to fig. 3, the present invention provides a wet etching apparatus, which includes a conveyer 10 for conveying a substrate 50, and a plurality of spraying pipes 21 disposed above the conveyer 10 for spraying an etching solution onto the surface of the substrate 50;
the conveying device 10 has a carrying surface for carrying the substrate 50, the conveying direction of the conveying device 10 to the substrate 50 is a first direction X, the direction perpendicular to the first direction X and parallel to the carrying surface of the conveying device 10 is a second direction Y, and the carrying surface of the conveying device 10 is gradually raised and inclined relative to the horizontal plane along the second direction Y, so as to obliquely convey the substrate 50;
the carrying surface of the conveying device 10 is divided into a first area to an nth area arranged along the second direction Y, wherein N is a natural number greater than 1, the plurality of shower pipes 21 are correspondingly divided into a first group to an nth group above the first area to the nth area, and heights between the plurality of shower pipes 21 and the carrying surface are gradually reduced from the first group to the nth group, so that the substrate 50 is subjected to different spraying pressures on the first area to the nth area.
According to the wet etching equipment, the plurality of spray pipes 21 above the conveying device 10 are divided into a plurality of groups with different heights from the bearing surface, so that when the substrate 50 is conveyed obliquely, the spray pressure of the substrate 50 on different areas is different, the difference of the replacement rate of the etching liquid on the areas on two sides of the substrate 50 is reduced, the difference of etching size deviation on the areas on two sides of the substrate 50 is reduced, and the uniformity of etching size is improved.
Specifically, as shown in fig. 4, the wet etching apparatus further includes N liquid inlet pipes 22 connected to the first to nth groups of shower pipes 21, respectively, for conveying an etching solution; wherein, each liquid inlet pipe 22 is provided with a control valve 221 for controlling the flow of the etching solution, that is, the flow of the etching solution in each group of spray pipes 21 can be controlled independently.
In the process of wet etching the substrate 50 by using the wet etching apparatus of the present invention, the difference of the replacement rate of the etching solution on the two side areas of the substrate 50 can be reduced by adjusting the flow rate of the etching solution in the first to nth groups of shower pipes 21, so as to reduce the difference of the etching size deviation on the two side areas of the substrate 50 and improve the uniformity of the etching size.
Specifically, each shower 21 is arranged with its axial direction parallel to the first direction X.
Specifically, each shower pipe 21 is provided with a plurality of nozzles 211 arranged along the axial direction thereof, and each shower pipe 21 sprays the etching solution to the surface of the substrate 50 through the plurality of nozzles 211 thereon.
Specifically, during the process of spraying the etching solution on the surface of the substrate 50, each shower 21 rotates back and forth above the substrate 50, that is, the plurality of nozzles 211 on each shower 21 swing back and forth in a plane perpendicular to the first direction X, so that the area of the substrate 50 corresponding to the area between two adjacent showers 21 can also be sprayed with the etching solution.
Specifically, in this embodiment, the carrying surface of the conveying device 10 is divided into first to third regions arranged along the second direction Y, and the plurality of shower pipes 21 are correspondingly divided into first to third groups above the first to third regions.
In particular, the carrying surface of the conveyor 10 is inclined with respect to the horizontal by 3-7 °.
Referring to fig. 5, based on the above wet etching apparatus, the present invention further provides a wet etching method, including the following steps:
step S1, providing the wet etching apparatus and the substrate 50 to be etched, and turning on the wet etching apparatus.
Step S2, placing the substrate 50 on the carrying surface of the conveyer 10, wherein the substrate 50 is driven by the conveyer 10 to move forward and is inclined relative to the horizontal plane, the plurality of spraying pipes 21 spray the etching solution onto the substrate 50 below the substrate 50 during the moving process of the substrate 50, and the height between the plurality of spraying pipes 21 and the substrate 50 is gradually reduced from the first group to the nth group, so that the spraying pressure applied to the substrate 50 from the first area to the nth area is different, thereby reducing the difference of the replacement rate of the etching solution on the two side areas of the substrate 50, further reducing the difference of the etching size deviation on the two side areas of the substrate 50, and improving the uniformity of the etching size.
Specifically, the wet etching apparatus further includes N liquid inlet pipes 22 respectively connected to the first to nth groups of spray pipes 21 and used for conveying the etching solution, wherein each liquid inlet pipe 22 is provided with a control valve 221 for controlling the flow rate of the etching solution, that is, the flow rate of the etching solution in each group of spray pipes 21 can be independently controlled.
The step S2 further includes adjusting the flow rate of the etching solution in the first to nth groups of shower pipes 21 through the control valve 221 on each liquid inlet pipe 22. That is, in the step S2, the flow rate of the etching solution in the first to nth groups of shower pipes 21 is adjusted to reduce the difference in the replacement rate of the etching solution in the regions on both sides of the substrate 50, thereby reducing the difference in the etching dimension deviation in the regions on both sides of the substrate 50 and improving the uniformity of the etching dimension.
In summary, the wet etching apparatus of the present invention includes a conveying device for conveying the substrate, and a plurality of spraying pipes for spraying the etching solution onto the surface of the substrate; the carrying surface of the conveying device is divided into a plurality of areas, the plurality of spray pipes are correspondingly divided into a plurality of groups with different heights between the spray pipes and the carrying surface above the plurality of areas of the carrying surface, so that when the substrate is conveyed obliquely, the spray pressure of the substrate on different areas is different, the difference of the replacement rate of etching liquid on the areas at two sides of the substrate is reduced, the difference of etching size deviation on the areas at two sides of the substrate is reduced, and the uniformity of etching sizes is improved. According to the wet etching method, the wet etching equipment is adopted, and the difference of the replacement rates of the etching liquid on the two side areas of the substrate is reduced by adjusting the spraying pressure of the substrate on the different areas, so that the difference of the etching size deviation on the two side areas of the substrate is reduced, and the uniformity of the etching size is improved.
As described above, it will be apparent to those skilled in the art that various other changes and modifications can be made based on the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the appended claims.
Claims (5)
1. The wet etching equipment is characterized by comprising a conveying device (10) for conveying a substrate (50) and a plurality of spray pipes (21) arranged above the conveying device (10) and used for spraying etching liquid to the surface of the substrate (50);
the conveying device (10) is provided with a carrying surface for carrying the substrate (50), the conveying direction of the conveying device (10) for the substrate (50) is set to be a first direction (X), the direction which is perpendicular to the first direction (X) and parallel to the carrying surface of the conveying device (10) is set to be a second direction (Y), and the carrying surface of the conveying device (10) is gradually raised and inclined relative to the horizontal plane along the second direction (Y) so as to obliquely convey the substrate (50);
the carrying surface of the conveying device (10) is divided into a first area to an Nth area which are arranged along a second direction (Y), wherein N is a natural number which is more than 1, the plurality of spray pipes (21) are correspondingly divided into a first group to an Nth group above the first area to the Nth area, and the heights between the plurality of spray pipes (21) and the carrying surface are gradually reduced from the first group to the Nth group, so that the spray pressures of the substrate (50) on the first area to the Nth area are different;
in the process of spraying etching solution on the surface of the substrate (50), each spray pipe (21) rotates back and forth above the substrate (50);
the etching solution spraying device also comprises N liquid inlet pipes (22) which are respectively connected with the first group of spraying pipes to the Nth group of spraying pipes (21) and are used for conveying etching solution;
each liquid inlet pipe (22) is provided with a control valve (221) for controlling the flow of the etching liquid;
the axial direction of each shower (21) is parallel to the first direction (X);
each spray pipe (21) is provided with a plurality of nozzles (211) which are arranged along the axial direction of the spray pipe, and each spray pipe (21) sprays etching liquid to the surface of the substrate (50) through the plurality of nozzles (211) on the spray pipe.
2. The wet etching apparatus according to claim 1, wherein the carrying surface of the conveyor (10) is divided into first to third zones arranged along the second direction (Y), and the plurality of shower pipes (21) are correspondingly divided into first to third groups above the first to third zones.
3. Wet etching apparatus according to claim 1, characterized in that the carrying surface of the conveyor (10) is inclined with respect to the horizontal plane by 3-7 °.
4. A wet etching method is characterized by comprising the following steps:
step S1, providing the wet etching apparatus as claimed in claim 1 and the substrate (50) to be etched, and turning on the wet etching apparatus;
step S2, the substrate (50) is placed on a bearing surface of a conveying device (10), the substrate (50) moves forward under the driving of the conveying device (10) and is inclined relative to the horizontal plane, the plurality of spray pipes (21) spray etching liquid on the substrate (50) below the spray pipes in the moving process of the substrate (50), and the spray pressure of the substrate (50) on the first area to the Nth area is different as the heights between the plurality of spray pipes (21) and the substrate (50) are gradually reduced from the first group to the Nth group.
5. The wet etching method according to claim 4, wherein the wet etching apparatus further comprises N liquid inlet pipes (22) connected to the first to Nth groups of shower pipes (21), respectively, for conveying the etching solution, wherein each liquid inlet pipe (22) is provided with a control valve (221) for controlling the flow rate of the etching solution;
the step S2 further includes adjusting the flow rate of the etching solution in the first to nth groups of shower pipes (21) through a control valve on each liquid inlet pipe (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710262995.2A CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710262995.2A CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106992136A CN106992136A (en) | 2017-07-28 |
| CN106992136B true CN106992136B (en) | 2020-04-07 |
Family
ID=59415388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710262995.2A Active CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106992136B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236954A (en) * | 2017-08-13 | 2017-10-10 | 安徽星光标识系统有限公司 | Metal tag Etaching device and its operating method |
| CN109407387A (en) * | 2018-10-29 | 2019-03-01 | 武汉华星光电技术有限公司 | Developing apparatus and substrate developing method |
| CN110106504B (en) * | 2019-04-04 | 2021-03-23 | Tcl华星光电技术有限公司 | Etching equipment |
| CN110828356A (en) * | 2019-10-21 | 2020-02-21 | 苏州晶洲装备科技有限公司 | Display panel etching device and display panel etching method |
| CN110993529B (en) * | 2019-11-14 | 2022-07-26 | Tcl华星光电技术有限公司 | Wet etching device and substrate wet etching method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN105140167A (en) * | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | Carrying device, wet etching equipment and application method of wet etching equipment |
| CN105607434A (en) * | 2016-04-05 | 2016-05-25 | 京东方科技集团股份有限公司 | Developing apparatus and developing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4421956B2 (en) * | 2003-07-18 | 2010-02-24 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and processing method |
-
2017
- 2017-04-20 CN CN201710262995.2A patent/CN106992136B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN105140167A (en) * | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | Carrying device, wet etching equipment and application method of wet etching equipment |
| CN105607434A (en) * | 2016-04-05 | 2016-05-25 | 京东方科技集团股份有限公司 | Developing apparatus and developing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106992136A (en) | 2017-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106992136B (en) | Wet etching equipment and wet etching method | |
| CN107316826B (en) | Wet etching equipment | |
| US20050063791A1 (en) | Inline transfer system and method | |
| JP2006199483A (en) | Stage device and coating device | |
| US7637799B2 (en) | Substrate production apparatus for producing a substrate for a display device | |
| CN101562124B (en) | Apparatus for processing substrate and method for processing substrate | |
| JP2017034101A (en) | Etching device | |
| US7225917B2 (en) | Conveyor system having width adjustment unit | |
| CN108807469A (en) | The attaching method and device of a kind of OLED display panel, backboard | |
| JP4485853B2 (en) | Substrate transfer apparatus and transfer method | |
| CN102969259B (en) | The device for the treatment of substrate | |
| CN110106504B (en) | Etching equipment | |
| KR20190057193A (en) | Substrate treating apparatus and method of treating substrate | |
| CN104076622A (en) | Developing unit | |
| KR101298313B1 (en) | Fabricating method of flexible Display | |
| KR200331986Y1 (en) | substrate processing equipment having one process line capable of handling plural substrates simultaneously | |
| TWI479589B (en) | Apparatus and method for treating substrate | |
| JP4330159B2 (en) | Thin film forming apparatus and method, and liquid crystal display device | |
| CN105676492A (en) | Vacuum absorbing platform and glass substrate carrying method | |
| KR101003580B1 (en) | Apparatus for loading substrate | |
| KR100562724B1 (en) | Etching equipment of glass for Liquid Crystal Display and Plasma Display Panel | |
| US6456356B1 (en) | Opposite layout substrate alignment method and device and liquid crystal display | |
| CN202102214U (en) | TFT array substrate, liquid crystal panel and display equipment | |
| JP5469507B2 (en) | Substrate processing apparatus and substrate processing method | |
| US7287919B2 (en) | Developing process and apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |