CN106992136A - Wet etching equipment and wet etch process - Google Patents
Wet etching equipment and wet etch process Download PDFInfo
- Publication number
- CN106992136A CN106992136A CN201710262995.2A CN201710262995A CN106992136A CN 106992136 A CN106992136 A CN 106992136A CN 201710262995 A CN201710262995 A CN 201710262995A CN 106992136 A CN106992136 A CN 106992136A
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- substrate
- conveyer
- shower
- loading end
- wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention provides a kind of wet etching equipment and wet etch process.The wet etching equipment of the present invention is used for the shower to substrate surface spray etching liquid including the conveyer for being used to transmit substrate and multiple be located above the conveyer；The loading end of the conveyer is divided into multiple regions, top correspondence of the multiple shower in the multiple regions of loading end is divided into multiple groups highly differed between loading end, so that when tilting transmission substrate, substrate spray pressure suffered in different zones is different, so that the replacement rate difference to reduce etching solution in substrate two side areas, and then reduce the difference that dimensional discrepancy is etched in substrate two side areas, improve the homogeneity of etching size.
Description
Technical field
The present invention relates to the processing procedure field of flat-panel screens, more particularly to a kind of wet etching equipment and wet etching side
Method.
Background technology
In display technology field, liquid crystal display (Liquid Crystal Display, LCD) and active matrix drive type
Organic electroluminescence display device and method of manufacturing same (Active Matrix Organic Light-Emitting Diode, abbreviation AMOLED) etc.
Panel display apparatus is widely used, such as because having many merits such as thin fuselage, high image quality, power saving, radiationless：Move
Mobile phone, personal digital assistant (PDA), digital camera, computer screen or notebook screens etc..
Thin film transistor (TFT) (Thin Film Transistor, TFT) array (Array) substrate is current liquid crystal display device
(Liquid Crystal Display, LCD) and active matrix drive type organic electroluminescence display device and method of manufacturing same (Active
Matrix Organic Light-Emitting Diode, abbreviation AMOLED) in main building block, be directly connected to height
The developing direction of performance panel display apparatus.
Such as LCD processing procedure is generally comprised：Leading portion array process, stage casing are into box (Cell) processing procedure and back segment module group assembling
Processing procedure, leading portion array process includes again：The cleaning of glass substrate and drying, plated film, resist coating, exposure, development, etch, go
Except processing procedures such as photoresists.Etching again be divided into wet method (WET) etching and dry method (DRY) etching, wherein the effect of wet etching for
The fine degree of wiring and the quality of final panel have a great impact, therefore etching dimensional discrepancy (CD Bias) and etching
Size (CD) homogeneity is the key character value after wet etching.For example, for second layer metal, if etching size is not
Uniformly, namely subregion wire is wider, second layer metal between pixel can be caused to hand over the difference of capping product with first layer metal,
That is, producing different capacitance coupling effects, make the quality off-design value of panel.
Wet etching pattern the most frequently used at present is fountain (spray mode), and it in surface mainly by spraying
Etch decoction and substrate is etched；And in wet etching processing procedure, in the case where chemical liquid is determined, influence CD master
Factor is wanted to have temperature, etching period, decoction displacement efficiency etc..
The wet etching equipment of existing fountain mainly includes the conveyer 100 for transmitting glass substrate 500 and set
Put is used for multiple showers 210 to the spray etching liquid of glass substrate 500 in the top of conveyer 100；Wherein, the transmission dress
Put the inclination transfer mode that the conveyance pattern of 100 uses has horizontal transmission pattern and relative level to tilt about 5 °.Level is passed
When sending, as shown in figure 1, because etching solution will flow out from the both sides of glass substrate 500, causing the erosion of intermediate region on glass substrate 500
Carve liquid replacement rate and two side areas is variant, so as to cause etching CD homogeneity not good；And when tilting transmission, as shown in Fig. 2
Because etching solution can all flow out from the side of glass substrate 500, thus the etching solution replacement rate of the two side areas of glass substrate 500 have it is larger
Difference, so as to cause the not good of homogeneity for etching CD.
The content of the invention
, can be by adjusting substrate when tilting transmission substrate it is an object of the invention to provide a kind of wet etching equipment
In the spray pressure suffered by different zones, to reduce the replacement rate difference of etching solution in substrate two side areas, so as to reduce base
The difference of dimensional discrepancy is etched in plate two side areas, and then improves the homogeneity of etching size.
The present invention also aims to provide a kind of wet etch process, using above-mentioned wet etching equipment, tilting
When transmitting substrate, it can be etched by adjusting substrate in the spray pressure suffered by different zones to reduce in substrate two side areas
The replacement rate difference of liquid, so as to reduce the difference that dimensional discrepancy is etched in substrate two side areas, and then improves the equal of etching size
One property.
To achieve the above object, the present invention provides a kind of wet etching equipment, including for transmit substrate conveyer,
And multiple be located above the conveyer is used for the shower to substrate surface spray etching liquid；
The conveyer has the loading end for bearing substrate, if the direction that the conveyer is transmitted to substrate is
First direction, direction vertical with the first direction and parallel with the loading end of the conveyer is second direction, described
The loading end of conveyer with respect to the horizontal plane gradually rises and oblique in a second direction, so as to incline to substrate
Inclined is transmitted；
The loading end of the conveyer is divided into arrange in a second direction first to n-quadrant, and wherein N is more than 1
Natural number, the multiple shower first to n-quadrant top correspondence be divided into first to N groups, the multiple spray
Height between shower pipe and the loading end is gradually reduced by first to N groups, so that substrate is in first area to N areas
Suffered spray pressure is different on domain.
Described wet etching equipment, in addition to be connected respectively with described first to N group showers be used for transmit
N number of feed tube of etching solution.
A control valve is equipped with each feed tube, is controlled for the flow to etching solution.
The axial direction of each shower is each parallel to the first direction.
The multiple nozzles arranged along its axial direction are equipped with each shower, each shower is more by thereon
Individual nozzle is to substrate surface spray etching liquid.
During to substrate surface spray etching liquid, each shower carrys out back rotation above substrate.
The loading end of the conveyer is divided into the first to the 3rd region arranged in a second direction, the multiple spray
Top correspondence of the pipe in the first to the 3rd region is divided into first to the 3rd group.
The loading end of the conveyer is inclined relative to horizontal 3-7 °.
The present invention also provides a kind of wet etch process, comprises the following steps：
Step S1, offer wet etching equipment as described above and substrate to be etched, open the wet etching and set
It is standby；
Step S2, the substrate is positioned on the loading end of conveyer, the substrate is under the drive of conveyer
Move forward and with respect to the horizontal plane oblique, the multiple shower sprays in substrate moving process to substrate below
Etching solution is drenched, because the height between the multiple shower and substrate is gradually reduced by first to N groups, substrate is first
Suffered spray pressure is different on region to n-quadrant.
The transmission that is used for that the wet etching equipment also includes with described first to N group showers being connected respectively is etched
N number of feed tube of liquid, wherein, a control valve is equipped with each feed tube, is controlled for the flow to etching solution；
The step S2 also includes, and the first erosion into N group showers is adjusted by the control valve on each feed tube
Carve the flow of liquid.
Beneficial effects of the present invention：The wet etching equipment of the present invention, including for transmitting the conveyer of substrate and many
It is individual to be used for the shower to substrate surface spray etching liquid；The loading end of the conveyer is divided into multiple regions, described many
Top correspondence of the individual shower in the multiple regions of loading end is divided into multiple groups highly differed between loading end, so that
When tilting transmission substrate, substrate spray pressure suffered in different zones is different, so as to reduce in substrate two side areas
The replacement rate difference of etching solution, and then reduce the difference that dimensional discrepancy is etched in substrate two side areas, improve the equal of etching size
One property.The wet etch process of the present invention, using above-mentioned wet etching equipment, by adjusting substrate suffered by different zones
Spray pressure, to reduce the replacement rate difference of etching solution in substrate two side areas, and then reduce and etched in substrate two side areas
The difference of dimensional discrepancy, improves the homogeneity of etching size.
In order to be able to be further understood that the feature and technology contents of the present invention, refer to below in connection with the detailed of the present invention
Illustrate and accompanying drawing, however accompanying drawing only provide with reference to and explanation use, not for being any limitation as to the present invention.
Brief description of the drawings
Below in conjunction with the accompanying drawings, it is described in detail by the embodiment to the present invention, technical scheme will be made
And other beneficial effects are apparent.
In accompanying drawing,
Fig. 1 is that existing wet etching equipment occurs etching the uneven schematic diagram of size under horizontal transmission pattern；
Fig. 2 is that existing wet etching equipment occurs the uneven schematic diagram of etching size in the case where tilting transfer mode；
Fig. 3 is the structural representation of the wet etching equipment of the present invention；
Fig. 4 is the connection diagram of shower and feed tube in wet etching equipment of the invention；
Fig. 5 is the schematic flow sheet of the wet etch process of the present invention.
Embodiment
Further to illustrate the present invention technological means and its effect taken, below in conjunction with embodiments of the invention and
Its accompanying drawing is described in detail.
Referring to Fig. 3, the present invention provides a kind of wet etching equipment, including for transmit substrate 50 conveyer 10,
And multiple be located above the conveyer 10 is used for the shower 21 to the surface spraying etching solution of substrate 50；
The conveyer 10 has the loading end for bearing substrate 50, if the conveyer 10 is transmitted to substrate 50
Direction be first direction X, vertical with the first direction X and parallel with the loading end of the conveyer 10 direction is the
Two direction Y, the loading end of the conveyer 10 with respect to the horizontal plane gradually rises and oblique on Y in a second direction,
So as to carry out tilting transmission to substrate 50；
The loading end of the conveyer 10 is divided into the first of the arrangement of Y in a second direction to n-quadrant, and wherein N is big
In 1 natural number, the multiple shower 21 is divided into first to N groups in first to n-quadrant top correspondence, described many
Height between individual shower 21 and the loading end is gradually reduced by first to N groups, so that substrate 50 is in the firstth area
Suffered spray pressure is different on domain to n-quadrant.
The wet etching equipment of the present invention, by the way that multiple showers 21 of the top of conveyer 10 are divided into and loading end
Between highly differ multiple groups so that when tilting transmission substrate 50, the spray suffered in different zones of substrate 50
Pressure is different, so that the replacement rate difference to reduce etching solution in the two side areas of substrate 50, and then reduce the two side areas of substrate 50
The difference of upper etching dimensional discrepancy, improves the homogeneity of etching size.
Specifically, as shown in figure 4, described wet etching equipment, in addition to respectively with described first to N group showers
The 21 N number of feed tubes 22 for being used to transmit etching solution being connected；Wherein, one is equipped with each feed tube 22 is used for etching
The flow of etching solution can be controlled individually in the control valve 221 that the flow of liquid is controlled, i.e., each group shower 21.
The process of wet etching is so carried out to substrate 50 in the wet etching equipment using the present invention, can also be by adjusting
Whole first to etching solution in the shower 21 of N groups flow, it is poor come the replacement rate that reduces etching solution in the two side areas of substrate 50
It is different, and then reduce the difference that dimensional discrepancy is etched in the two side areas of substrate 50, improve the homogeneity of etching size.
Specifically, each shower 21 is configured according to its axial direction parallel to the first direction X.
Specifically, the multiple nozzles 211 arranged along its axial direction, each shower 21 are equipped with each shower 21
By multiple nozzles 211 thereon to the surface spraying etching solution of substrate 50.
Specifically, during to the surface spraying etching solution of substrate 50, each shower 21 is in the top of substrate 50
Carry out back rotation, that is, multiple nozzles 211 on each shower 21 swung back and forth in the plane perpendicular to first direction X,
So that the region on substrate 50 between two adjacent showers 21 of correspondence also can arrive etching solution by spray.
Specifically, in the present embodiment, the loading end of the conveyer 10 is divided into the first of Y arrangements in a second direction
To the 3rd region, top correspondence of the multiple shower 21 in the first to the 3rd region is divided into first to the 3rd group.
Specifically, the loading end of the conveyer 10 is inclined relative to horizontal 3-7 °.
Referring to Fig. 5, based on above-mentioned wet etching equipment, the present invention also provides a kind of wet etch process, including such as
Lower step：
Step S1, the above-mentioned wet etching equipment of offer and substrate 50 to be etched, open the wet etching equipment.
Step S2, the substrate 50 is positioned on the loading end of conveyer 10, the substrate 50 is in conveyer 10
Drive under move forward and with respect to the horizontal plane obliquely, the multiple shower 21 is in the moving process of substrate 50 to it
The spray etching liquid of substrate 50 of lower section, because the height between the multiple shower 21 and substrate 50 is by first to N groups
Gradually reduce, the spray pressure suffered on first area to n-quadrant of substrate 50 is different, so as to reduce the both sides of substrate 50
The replacement rate difference of etching solution on region, and then the difference that dimensional discrepancy is etched in the two side areas of substrate 50 can be reduced, improve
Etch the homogeneity of size.
Specifically, the wet etching equipment also include respectively with the described first use being connected to N groups shower 21
In N number of feed tube 22 of transmission etching solution, wherein, one is equipped with each feed tube 22 is used for the flow progress to etching solution
The flow of etching solution can be controlled individually in the control valve 221 of control, i.e., each group shower 21.
So described step S2 also includes, and is sprayed by the adjustment of control valve 221 first to the N groups on each feed tube 22
The flow of etching solution in pipe 21., can also be by being etched in the shower 21 of adjustment first to N groups in i.e. described step S2
The flow of liquid, to reduce the replacement rate difference of etching solution in the two side areas of substrate 50, and then reduces erosion in the two side areas of substrate 50
The difference of dimensional discrepancy is carved, improves the homogeneity of etching size.
In summary, wet etching equipment of the invention, including for transmit substrate conveyer and it is multiple be used for
The shower of substrate surface spray etching liquid；The loading end of the conveyer is divided into multiple regions, the multiple shower
Top correspondence in the multiple regions of loading end is divided into multiple groups highly differed between loading end, so as to tilt transmission
During substrate, substrate spray pressure suffered in different zones is different, so as to reduce etching solution in substrate two side areas
Replacement rate difference, and then reduce the difference that dimensional discrepancy is etched in substrate two side areas, improve the homogeneity of etching size.This hair
Bright wet etch process, using above-mentioned wet etching equipment, by adjusting substrate in the spray pressure suffered by different zones
Power, dimensional discrepancy is etched to reduce in the replacement rate difference of etching solution in substrate two side areas, and then reduction substrate two side areas
Difference, improve etching size homogeneity.
It is described above, for the person of ordinary skill of the art, can be with technique according to the invention scheme and technology
Other various corresponding changes and deformation are made in design, and all these changes and deformation should all belong to appended right of the invention
It is required that protection domain.
Claims (10)
1. a kind of wet etching equipment, it is characterised in that including the conveyer (10) for transmitting substrate (50) and multiple set
It is used for the shower (21) to substrate (50) surface spraying etching solution above the conveyer (10)；
The conveyer (10) has the loading end for bearing substrate (50), if the conveyer (10) is to substrate (50)
The direction of transmission is first direction (X), vertical with the first direction (X) and parallel with the loading end of the conveyer (10)
Direction be second direction (Y), the loading end of the conveyer (10) on (Y) in a second direction with respect to the horizontal plane gradually
Rise and it is oblique so as to substrate (50) carry out tilting transmission；
The loading end of the conveyer (10) is divided into the first of (Y) in a second direction arrangement to n-quadrant, and wherein N is big
In 1 natural number, the multiple shower (21) is divided into first to N groups in first to n-quadrant top correspondence, described
Height between multiple showers (21) and the loading end is gradually reduced by first to N groups, so that substrate (50) exists
Suffered spray pressure is different on first area to n-quadrant.
2. wet etching equipment as claimed in claim 1, it is characterised in that also including being sprayed respectively with described first to N groups
N number of feed tube (22) for transmitting etching solution that shower pipe (21) is connected.
3. wet etching equipment as claimed in claim 2 a, it is characterised in that control is equipped with each feed tube (22)
Valve (221), is controlled for the flow to etching solution.
4. wet etching equipment as claimed in claim 1, it is characterised in that the axial direction of each shower (21) is parallel
In the first direction (X).
5. wet etching equipment as claimed in claim 1, it is characterised in that be equipped with each shower (21) along its axial direction
Multiple nozzles (211) of direction arrangement, each shower (21) is by multiple nozzles (211) thereon to substrate (50) surface
Spray etching liquid.
6. wet etching equipment as claimed in claim 1, it is characterised in that in the mistake to substrate (50) surface spraying etching solution
Cheng Zhong, each shower (21) carrys out back rotation above substrate (50).
7. wet etching equipment as claimed in claim 1, it is characterised in that the loading end of the conveyer (10) is divided into
The first to the 3rd region that (Y) is arranged in a second direction, the multiple shower (21) is right in the top in the first to the 3rd region
First to the 3rd group should be divided into.
8. wet etching equipment as claimed in claim 1, it is characterised in that the loading end of the conveyer (10) relative to
3-7 ° of horizontal plane.
9. a kind of wet etch process, it is characterised in that comprise the following steps：
Step S1, offer wet etching equipment as claimed in claim 1 and substrate (50) to be etched, open the wet method
Etching machines；
Step S2, the substrate (50) is positioned on the loading end of conveyer (10), the substrate (50) is in conveyer
(10) moved forward under drive and with respect to the horizontal plane oblique, the multiple shower (21) is moved through in substrate (50)
To substrate (50) spray etching liquid below in journey, because the height between the multiple shower (21) and substrate (50) exists
Gradually reduced by first to N groups, substrate (50) spray pressure suffered on first area to n-quadrant is different.
10. wet etch process as claimed in claim 9, it is characterised in that the wet etching equipment also include respectively with
The described first N number of feed tube (22) for being used to transmit etching solution being connected to N groups shower (21), wherein, each feed liquor
A control valve (221) is equipped with pipe (22), is controlled for the flow to etching solution；
The step S2 also includes, by the control valve adjustment first on each feed tube (22) into N groups shower (21)
Etching solution flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710262995.2A CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710262995.2A CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106992136A true CN106992136A (en) | 2017-07-28 |
| CN106992136B CN106992136B (en) | 2020-04-07 |
Family
ID=59415388
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710262995.2A Active CN106992136B (en) | 2017-04-20 | 2017-04-20 | Wet etching equipment and wet etching method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236954A (en) * | 2017-08-13 | 2017-10-10 | 安徽星光标识系统有限公司 | Metal tag Etaching device and its operating method |
| CN110106504A (en) * | 2019-04-04 | 2019-08-09 | 深圳市华星光电技术有限公司 | A kind of etching machines |
| CN110828356A (en) * | 2019-10-21 | 2020-02-21 | 苏州晶洲装备科技有限公司 | Display panel etching device and display panel etching method |
| CN110993529A (en) * | 2019-11-14 | 2020-04-10 | Tcl华星光电技术有限公司 | Wet etching device and substrate wet etching method |
| WO2020087650A1 (en) * | 2018-10-29 | 2020-05-07 | 武汉华星光电技术有限公司 | Developing device and substrate developing method |
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| JP2005052825A (en) * | 2003-07-18 | 2005-03-03 | Shibaura Mechatronics Corp | Apparatus and method for treating substrate |
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN105140167A (en) * | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | Carrying device, wet etching equipment and application method of wet etching equipment |
| CN105607434A (en) * | 2016-04-05 | 2016-05-25 | 京东方科技集团股份有限公司 | Developing apparatus and developing method |
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| JP2005052825A (en) * | 2003-07-18 | 2005-03-03 | Shibaura Mechatronics Corp | Apparatus and method for treating substrate |
| CN104992914A (en) * | 2015-07-13 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Etching device and etching method |
| CN105140167A (en) * | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | Carrying device, wet etching equipment and application method of wet etching equipment |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107236954A (en) * | 2017-08-13 | 2017-10-10 | 安徽星光标识系统有限公司 | Metal tag Etaching device and its operating method |
| WO2020087650A1 (en) * | 2018-10-29 | 2020-05-07 | 武汉华星光电技术有限公司 | Developing device and substrate developing method |
| CN110106504A (en) * | 2019-04-04 | 2019-08-09 | 深圳市华星光电技术有限公司 | A kind of etching machines |
| CN110106504B (en) * | 2019-04-04 | 2021-03-23 | Tcl华星光电技术有限公司 | Etching equipment |
| CN110828356A (en) * | 2019-10-21 | 2020-02-21 | 苏州晶洲装备科技有限公司 | Display panel etching device and display panel etching method |
| CN110993529A (en) * | 2019-11-14 | 2020-04-10 | Tcl华星光电技术有限公司 | Wet etching device and substrate wet etching method |
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|---|---|
| CN106992136B (en) | 2020-04-07 |
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