CN205406497U - Etching apparatus - Google Patents
Etching apparatus Download PDFInfo
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- CN205406497U CN205406497U CN201620191637.8U CN201620191637U CN205406497U CN 205406497 U CN205406497 U CN 205406497U CN 201620191637 U CN201620191637 U CN 201620191637U CN 205406497 U CN205406497 U CN 205406497U
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- 238000005530 etching Methods 0.000 title claims abstract description 148
- 230000007246 mechanism Effects 0.000 claims abstract description 194
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 239000007788 liquid Substances 0.000 claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 37
- 239000007921 spray Substances 0.000 claims abstract description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims description 39
- 238000004140 cleaning Methods 0.000 claims description 20
- 238000001035 drying Methods 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 abstract description 4
- 238000005507 spraying Methods 0.000 abstract 1
- 239000010409 thin film Substances 0.000 description 17
- 238000006073 displacement reaction Methods 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 5
- 238000001039 wet etching Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000007602 hot air drying Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Abstract
The utility model provides an etching apparatus relates to display device preparation field, and in spraying etching process, the etching liquid can carry out the sculpture to the thin layer that the photosensitive resist edge covered. This etching apparatus includes the sculpture chamber, and the sculpture intracavity is provided with workstation and etching liquid shower nozzle, and the workstation is used for bearing treats the sculpture base plate, treat the sculpture base plate including the thin layer and the photosensitive resist that cover the substrate base plate in proper order, the etching liquid shower nozzle can to treat to spray on the sculpture base plate etching liquid. The workstation is connected with vibration mechanism, is used for the drive the workstation vibration to feasible the aforesaid treats that the etching liquid on the sculpture base plate contacts with the marginal thin layer that covers of photosensitive resist. This etching apparatus is used for treating the sculpture base plate and carries out the sculpture.
Description
Technical field
This utility model relates to display device preparation field, particularly relates to a kind of etching apparatus.
Background technology
TFT-LCD (ThinFilmTransistorLiquidCrystalDisplay, thin film transistor-liquid crystal display) as a kind of panel display apparatus, have that volume is little, low in energy consumption, radiationless because of it and the feature such as cost of manufacture is relatively low, and be applied to more and more in the middle of high-performance display field.
Above-mentioned TFT-LCD is made up of the array base palte that box is arranged and color membrane substrates.Wherein, array base palte is provided with grid line and data wire that transverse and longitudinal is intersected.The preparation process of grid line or data wire pattern is, first, by depositing thin film layer 20 on underlay substrate 10 as shown in Figure 1a, is coated with photoresist 30, and this photoresist 30 is exposed by mask plate 11, form photoresist and retain region 31 on thin layer 20.Then, pass through etching technics, for instance wet etching formation Thinfilm pattern 21 as shown in Figure 1 b, then photoresist is retained the photoresist lift off in region 31, to form grid line or data wire pattern.Above-mentioned wet etching includes spray process and infusion method.
Wherein, spray process is for infusion method, and etch rate is fast, therefore applies relatively broad.Existing spray process, as shown in Figure 1 b, etching liquid 50 is sprayed on the substrate being formed with thin layer 20 and photoresist reservation region 31 with certain pressure by etching liquid shower nozzle 40, so that metallic film 20 not covered by photoresist to be performed etching.Additionally, in the process of etching, the both sides being photo-etched the thin layer 20 that glue retains region 31 covering also can slightly be etched, so that the both sides forming Thinfilm pattern 21 after etching have angle (Profile) α with underlay substrate 10.But the thin layer 20 that photoresist 30 edge 32 place covers, owing to cannot contact with etching liquid 50 under the blocking of photoresist 30, thus meeting wedge angle (Tip) β, reduce the smoothness of the both sides of Thinfilm pattern 21.On this basis in order to accelerate the outflow of etching liquid, as illustrated in figure 1 c, when underlay substrate 10 tilts γ (about 5 °), above-mentioned wedge angle β becomes apparent from.In the case.It is covered in all the other thin layers of Thinfilm pattern 21 surface under the impact of wedge angle, is easily susceptible to fracture, thus producing the phenomenon that overlap joint is bad.
Utility model content
Embodiment of the present utility model provides a kind of etching apparatus, and in spray etching process, the thin layer that photoresist edge can be covered by etching liquid performs etching.
For reaching above-mentioned purpose, embodiment of the present utility model adopts the following technical scheme that
Embodiment of the present utility model provides a kind of etching apparatus, including etch chamber, workbench and etching liquid shower nozzle it is provided with in described etch chamber, described workbench is used for carrying substrate to be etched, described substrate to be etched includes the thin layer and the photoresist that cover underlay substrate successively, and described etching liquid shower nozzle can spray etching liquid on described substrate to be etched.Described workbench is connected to vibrating mechanism, is used for driving described workbench to vibrate, so that the etching liquid on described substrate to be etched contacts with the thin layer of described photoresist edges cover.
Further, described vibrating mechanism is made up of the sub-vibrating mechanism being arranged at described workbench at least side, for driving described workbench to make to be provided with on described workbench the side run-off the straight of described sub-vibrating mechanism in vibration processes.
Preferably, described vibrating mechanism is made up of the first sub-vibrating mechanism being respectively arranged at described workbench opposite sides and the second sub-vibrating mechanism；Workbench described in described first sub-vibrating mechanism and described second sub-vibrating mechanism driven.
Preferably, described vibrating mechanism is made up of the first sub-vibrating mechanism being arranged at described workbench opposite sides and the second sub-vibrating mechanism；Described first sub-vibrating mechanism and described second sub-vibrating mechanism simultaneously drive described workbench, and the driving direction of described first sub-vibrating mechanism and described second sub-vibrating mechanism is contrary.
It is further preferred that described vibrating mechanism is constituted by being respectively arranged at the first sub-vibrating mechanism of described four sides of workbench, the second sub-vibrating mechanism, the 3rd sub-vibrating mechanism and the 4th sub-vibrating mechanism；Within a vibration period, described first sub-vibrating mechanism, described second sub-vibrating mechanism, described 3rd sub-vibrating mechanism and described 4th sub-vibrating mechanism be vibration alternately.
Further, described vibrating mechanism includes hydraulic electric motor, air pressure motor or electromagnetic motor.
Further, described workbench includes support, and is installed on the first connecting gear on described support, and described connecting gear is used for carrying and transmit described substrate to be etched.
Preferably, described connecting gear includes at least two roll shaft being installed on described support, and described roll shaft rotates along axis direction, and the axis direction of described roll shaft is vertical with described board transport direction to be etched.
It is further preferred that be provided with, between adjacent two roller bearings, the gap flowed out for described etching liquid.
Preferably, described connecting gear includes being installed on described support upper conveyor belt.
It is further preferred that described conveyer belt is provided with the outage flowed out for described etching liquid.
Further preferred, described workbench also includes at least one pair of locating shaft being installed on described support, for the both sides being parallel to described board transport direction to be etched on described substrate to be etched are fixed；Described locating shaft rotates along axis direction, and the axis direction of described locating shaft is vertical with described substrate to be etched.
Further, described etching apparatus also includes being arranged at the accumulator tank below described workbench, reclaims for etching liquid.
Further, described etching apparatus also includes cleaning chamber, described cleaning chamber arranges the second connecting gear, and for accepting the substrate being sent to described cleaning chamber by described first connecting gear, described cleaning chamber also includes being arranged at the cleaning shower nozzle above described second connecting gear.
Further, described etching apparatus also includes drying chamber, described drying chamber arranges the 3rd connecting gear, and for accepting the substrate being sent to described drying chamber by described second connecting gear, described drying chamber also includes being arranged at the air knife above described 3rd connecting gear.
This utility model embodiment provides a kind of etching apparatus, this etching apparatus includes etch chamber, workbench and etching liquid shower nozzle it is provided with in this etch chamber, workbench is used for carrying substrate to be etched, substrate to be etched includes the thin layer and the photoresist that cover underlay substrate successively, and above-mentioned etching liquid shower nozzle can spray etching liquid on substrate to be etched.Above-mentioned workbench is connected to vibrating mechanism, is used for driving above-mentioned workbench to vibrate, so that the etching liquid on substrate to be etched contacts with the thin layer of photoresist edges cover.Owing to vibrating mechanism can drive the workbench vibration carrying substrate to be etched in the process of vibration, the etching liquid of the substrate to be etched being further driven to be sprayed to be positioned on workbench fluctuates up and down along the direction being perpendicular to base, in the process of fluctuation, etching liquid washes away the thin layer of the edges cover to photoresist, and the thin layer of this position is performed etching, it is thus possible to reduce the thin layer of the edges cover of above-mentioned photoresist owing to being photo-etched blocking of glue, and the wedge angle that cannot contact with the etching liquid of etching liquid shower nozzle spray and produce.And then reduce the probability that above-mentioned wedge angle causes the generation of follow-up cover layer to be ruptured, reduce thin layer overlap joint fraction defective, improve product quality.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 a is a kind of structural representation making array base palte in prior art；
Fig. 1 b is the structural representation of a kind of wet etching adopted in prior art；
Fig. 1 c is the structural representation of the another kind of wet etching adopted in prior art；
The structural representation of a kind of wet-method etching equipment that Fig. 2 a provides for this utility model；
Fig. 2 b adopts the structural representation of substrate to be etched in the etching process of the etching apparatus in Fig. 2 a；
The structural representation of the etching apparatus that a kind of vibrating motor is hydraulic electric motor or air pressure motor that Fig. 3 a provides for this utility model；
The structural representation of the etching apparatus that a kind of vibrating motor is electromagnetic motor that Fig. 3 b provides for this utility model；
The structural representation of a kind of etching apparatus including two sub-vibrating mechanisms that Fig. 4 provides for this utility model；
Fig. 5 a is the driven process schematic of the etching apparatus adopting Fig. 4；
Fig. 5 b is the driven another kind process schematic of the etching apparatus adopting Fig. 4；
Fig. 5 c be adopt Fig. 4 etching apparatus while reverse drive process schematic；
Fig. 5 d be adopt Fig. 4 etching apparatus while reverse drive another kind process schematic；
Fig. 6 a is the structural representation of a kind of tortuous Thinfilm pattern；
The structural representation of a kind of etching apparatus including four sub-vibrating mechanisms that Fig. 6 b provides for this utility model；
The structural representation of the another kind of etching apparatus that Fig. 7 provides for this utility model；
The structural representation of the first connecting gear of a kind of etching apparatus that Fig. 8 a provides for this utility model；
The structural representation of another kind first connecting gear of a kind of etching apparatus that Fig. 8 b provides for this utility model；
Fig. 9 includes the structural representation of the workbench of locating shaft for a kind of etching apparatus that this utility model provides；
The structural representation of a kind of etching apparatus including etch chamber, cleaning chamber and drying chamber that Figure 10 provides for this utility model.
Accompanying drawing labelling:
10-underlay substrate；11-mask plate；20-thin layer；21-Thinfilm pattern；210-longitudinal component；211-lateral part；30-photoresist；31-photoresist retains region；The edge of 32-photoresist；40-etching liquid shower nozzle；50-etching liquid；100-etch chamber；101-workbench；102-substrate to be etched；103-vibrating mechanism；105-vibrating mechanism；The sub-vibrating mechanism of 1051-first；The sub-vibrating mechanism of 1052-second；The sub-vibrating mechanism of 1053-the 3rd；The sub-vibrating mechanism of 1054-the 4th；106-base；107-bolster；108-support；110-roll shaft；111-gap；112-conveyer belt；113-outage；114-locating shaft；115-accumulator tank；116-the second connecting gear；117-cleans shower nozzle；118-the 3rd connecting gear；119-air knife；200-cleans chamber；300-drying chamber.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is clearly and completely described, it is clear that described embodiment is only a part of embodiment of this utility model, rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of this utility model protection.
This utility model provides a kind of etching apparatus, as shown in Figure 2 a, including etch chamber 100, workbench 101 and etching liquid shower nozzle 40 it is provided with in etch chamber 100, wherein, workbench 101 is used for carrying substrate 102 to be etched, and substrate 102 to be etched includes the thin layer 20 and the photoresist 30 that cover underlay substrate 10 successively, and etching liquid shower nozzle 40 can spray etching liquid 50 on this substrate 102 to be etched.Above-mentioned workbench 101 is connected to vibrating mechanism 103, is used for driving described workbench 101 to vibrate, so that the etching liquid 50 on substrate to be etched 102 contacts with the thin layer 20 of photoresist 30 edges cover.
It should be noted that above-mentioned substrate to be etched 102 refers to, the underlay substrate 10 to cover layer successively 20 as shown in Figure 1a and photoresist 30, adopt mask plate 11 to carry out mask exposure, the substrate after development, before etching technics.And for full exposure technology, this substrate has photoresist as shown in Figure 1a and retains region 31 and the removal of the photoresist except this photoresist retains region 31 district (not shown, to be positioned at photoresist and retain both sides, region 31).
Based on this, the thin layer 20 of edge 32 covering that photoresist retains region 31 photoresist 30 as shown in Figure 1 b refers to, adopt when wet-etching technique carries out, it is subject to blocking of photoresist 30 edge 32,, namely easily there is the part of wedge angle (Tip) β as shown in Figure 1 b in the thin layer 20 that cannot contact with the etching liquid 50 sprayed out by etching liquid shower nozzle 40 on thin layer 20.
Additionally, vibrating mechanism 103 is driven the mode that workbench 101 vibrates not limit by this utility model, for instance as shown in Figure 2 a, the workbench 101 upper and lower vibration of vertically Y-axis can be driven, or drive the workbench 101 left and right vibration of X-axis in the horizontal direction etc..In the case, substrate 102 to be etched is identical with the direction of vibration of workbench 101.So, the etching liquid 50 of substrate 102 upper surface to be etched it is sprayed to by etching liquid shower nozzle 40, can be (left with substrate 102 X-direction in the horizontal direction to be etched as shown in Figure 2 b at substrate 102 to be etched, right vibration is example) vibration processes in fluctuate, so that the thin layer 20 that the edge 32 that etching liquid 50 can wash away to photoresist 30 covers, and the thin layer 20 of this position is performed etching, it is thus possible to the thin layer 20 that the edge 32 reducing above-mentioned photoresist 30 covers is owing to being photo-etched blocking of glue 20, and the wedge angle β that cannot contact with the etching liquid 50 of etching liquid shower nozzle 40 spray and produce.
It should be noted that, those skilled in the art, herein, " on ", D score, the directional terminology such as " left side " and " right side " be relative to accompanying drawing, the orientation that such as, workbench 101 signal in Fig. 2 a is placed defines, it should be understood that, these directional terminology are relative concepts, they for relative to description and clarification, it correspondingly can change according to the change in the orientation that workbench 101 is placed.
Based on this, vibrating mechanism 103 is not limited by this utility model, and this vibrating mechanism 103 can be hydraulic electric motor, air pressure motor or electromagnetic motor.Adopt hydraulic electric motor or the structural representation of air pressure motor for vibrating mechanism 103 in this utility model as shown in Figure 3 a, adopt the structural representation of electromagnetic motor as shown in Figure 3 b for this utility model vibrating mechanism 103.Herein it should be noted that the model of above-mentioned vibrating mechanism 103, specification, power etc. are not limited by this utility model, it is possible to need to select according to concrete etching.
This utility model embodiment provides a kind of etching apparatus, this etching apparatus includes etch chamber, workbench and etching liquid shower nozzle it is provided with in this etch chamber, workbench is used for carrying substrate to be etched, substrate to be etched includes the thin layer and the photoresist that cover underlay substrate successively, and above-mentioned etching liquid shower nozzle can spray etching liquid on substrate to be etched.Above-mentioned workbench is connected to vibrating mechanism, is used for driving above-mentioned workbench to vibrate, so that the etching liquid on substrate to be etched contacts with the thin layer of photoresist edges cover.
Owing to vibrating mechanism can drive the workbench vibration carrying substrate to be etched in the process of vibration, the etching liquid of the substrate to be etched being further driven to be sprayed to be positioned on workbench fluctuates up and down along the direction being perpendicular to base, in the process of fluctuation, etching liquid washes away the thin layer of the edges cover to photoresist, and the thin layer of this position is performed etching, it is thus possible to reduce the thin layer of the edges cover of above-mentioned photoresist owing to being photo-etched blocking of glue, and the wedge angle that cannot contact with the etching liquid of etching liquid shower nozzle spray and produce.And then reduce the probability that above-mentioned wedge angle causes the generation of follow-up cover layer to be ruptured, reduce thin layer overlap joint fraction defective, improve product quality.
Further, above-mentioned vibrating mechanism 103 can also be made up of the sub-vibrating mechanism being arranged at workbench 101 at least side, for driving above-mentioned workbench 101 to make to be provided with on workbench 101 side (right side in the such as Fig. 4) run-off the straight of sub-vibrating mechanism in vibration processes.So, when workbench 101 when the side run-off the straight being provided with sub-vibrating mechanism for whole workbench 101 vertically Y vibration straight up and down, be conducive to the thin layer 20 that the etching liquid 50 being sprayed to substrate 102 surface to be etched covers along the edge 32 that the incline direction of workbench washes away to photoresist 30, and the thin layer 20 of this position is performed etching.
Hereinafter, how antithetical phrase vibrating mechanism constitutes the mode of vibrating mechanism 103 and the corresponding mode of vibration of workbench 101 is described in detail.
Such as, above-mentioned vibrating mechanism 103 can be as shown in Figure 4, it is made up of the be arranged at workbench 101 opposite sides first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052, and the first sub-vibrating mechanism 1051 and the second sub-above-mentioned workbench 101 of vibrating mechanism 1052 driven.
Concrete, the left side below workbench 101 arranges the first sub-vibrating mechanism 1051, and right side arranges the second sub-vibrating mechanism 1052.Wherein, the first sub-vibrating mechanism 1051 and the second sub-above-mentioned workbench 101 of vibrating mechanism 1052 driven refer to, when not starting to drive workbench 101 to vibrate, workbench 101 is in direction parallel to the ground.When vibrating mechanism drives workbench 101 to vibrate, first as shown in Figure 5 a, first sub-vibrating mechanism 1051 vertically Y-direction drives workbench 101, make workbench 101 in the side being provided with the first sub-vibrating mechanism 1051, namely vertically certain displacement occurs Y-direction on the left of this workbench 101.Next as shown in Figure 5 b, second sub-vibrating mechanism 1052 vertically Y-direction drives workbench 101, make workbench 101 in the side being provided with the second sub-vibrating mechanism 1052, namely vertically there is certain displacement in Y-direction on the right side of this workbench 101, meanwhile, when the second sub-vibrating mechanism 1052 drives the right side of workbench 101, first sub-vibrating mechanism 1051 stops drive actions, so that the left side of workbench 101 is fallen after rise naturally to initial position, thus completing a vibration period.In etching process, workbench 101 needs to complete multiple above-mentioned vibration period under the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 driven.
Again such as, above-mentioned vibrating mechanism 105 is as shown in Figure 4, it is also possible to be made up of the be arranged at workbench 101 opposite sides first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052.Wherein, the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 simultaneously drive above-mentioned workbench 101, and the driving direction of the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 is contrary.
Concrete, as shown in Figure 5 c, workbench 101 lower left arranges the first sub-vibrating mechanism 1051, and right side arranges the second sub-vibrating mechanism 1052.Wherein, first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 adopt rightabout to simultaneously drive workbench 101, and first the driving direction of sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 refer on the contrary, when not starting to drive workbench 101 to vibrate, workbench 101 is in direction parallel to the ground.When vibrating mechanism drives workbench 101 to vibrate, first as shown in Figure 5 c, first sub-vibrating mechanism 1051 vertically Y-direction drives workbench 101, make workbench 101 in the side being provided with the first sub-vibrating mechanism 1051, namely vertically there is certain displacement in Y-direction on the left of this workbench 101, drive workbench 101 under second sub-vibrating mechanism 1052 vertically Y-direction simultaneously, make workbench 101 in the side being provided with the second sub-vibrating mechanism 1052, namely vertically certain displacement occurs under Y-direction on the right side of this workbench 101.Next as fig 5d, the second sub-vibrating mechanism 1052 vertically Y-direction driving workbench 101, driving workbench 101 under the first sub-vibrating mechanism 1051 vertically Y-direction, thus completing a vibration period simultaneously.In etching process, workbench 101 needs to complete multiple above-mentioned vibration period under the first sub-vibrating mechanism 1051 and the driving simultaneously and in opposite direction of the second sub-vibrating mechanism 1052.
Above-mentioned constituted in the two ways that vibrating mechanism 105 vibrates for driving workbench 101 by the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052, the mode of the first sub-vibrating mechanism 1051 and the driving simultaneously and in opposite direction of the second sub-vibrating mechanism 1052, comparatively speaking, group vibrating mechanism is the hydraulic electric motor shown in Fig. 3 a or air pressure motor, and the model of this motor, when running parameter is identical, the impulse stroke of motor is consistent, namely the displacement occurred on the left of workbench 101 is driven to drive the displacement occurred on the right side of workbench 101 identical in an impulse stroke with the second sub-vibrating mechanism 1052 in an impulse stroke at the first sub-vibrating mechanism 1051.So, the mode of the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 driven, make to increase successively on the left of workbench 101 displacement corresponding with above-mentioned impulse stroke with right side, and the mode of the first sub-vibrating mechanism 1051 and the driving simultaneously and in opposite direction of the second sub-vibrating mechanism 1052, it is possible to make to increase in opposite direction on the left of workbench 101 displacement corresponding with above-mentioned impulse stroke with right side simultaneously.Therefore, for the mode of the first sub-vibrating mechanism 1051 and the driving simultaneously and in opposite direction of the second sub-vibrating mechanism 1052, when the first sub-vibrating mechanism 1051 and the second sub-vibrating mechanism 1052 perform an impulse stroke respectively, the angle of inclination of workbench 101 is bigger, such that it is able to improve the undulate quantity being positioned at substrate 102 surface etch liquid 50 to be detected at vibration processes, the thin layer 20 that the edge 32 to photoresist 30 covers is conducive to perform etching.But, owing to the angle of inclination of workbench 101 is relatively big, therefore that the requirement of equipment occupation space is bigger.In sum, those skilled in the art, it is possible to as required above-mentioned type of drive is selected.
On this basis, the first sub-vibrating mechanism 1051 owing to constituting vibrating mechanism 103 is respectively arranged at, with the second sub-vibrating mechanism 1052, the both sides that workbench 101 is relative, so when needing the Thinfilm pattern 21 (including longitudinal component 210 and lateral part 211) of preparation complications as shown in Figure 6 a, if adopting above-mentioned vibrating mechanism 103 to drive workbench 101, when both sides B1 and the B2 of the longitudinal component 210 of Thinfilm pattern 21 can be washed away by the etching liquid 50 on substrate 102 to be detected, both sides B3 and the B4 of the lateral part 211 of Thinfilm pattern 21 liquid 50 that is difficult to be etched washes away, so that the wedge angle β that the lateral part 211 of Thinfilm pattern 21 has effectively is not reduced, vice versa.
In order to solve above-mentioned technical problem, above-mentioned vibrating mechanism 103 as shown in Figure 6 b, is made up of be respectively arranged at 101 4 sides of workbench first sub-vibrating mechanism the 1051, second sub-vibrating mechanism 1053 of sub-vibrating mechanism the 1052, the 3rd and the 4th sub-vibrating mechanism 1054.Within a vibration period, above-mentioned first sub-vibrating mechanism the 1051, second sub-vibrating mechanism the 1052, the 3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 alternately vibration.
Concrete, as shown in Figure 6 b, four sides below workbench 101 are disposed with first sub-vibrating mechanism the 1051, second sub-vibrating mechanism the 1052, the 3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054.Wherein, the sub-vibrating mechanism of aforementioned four replaces vibration and refers to, when not starting to drive workbench 101 to vibrate, workbench 101 is in direction parallel to the ground.When vibrating mechanism drives workbench 101 to vibrate, first, the first sub-vibrating mechanism 1051 vertically Y-direction drives workbench 101 so that workbench 101, in the side vertically Y-direction being provided with the first sub-vibrating mechanism 1051, certain displacement occurs；Then the second sub-vibrating mechanism 1052 vertically Y-direction drives, make workbench 101, in the side vertically Y-direction being provided with the second sub-vibrating mechanism 1052, certain displacement occur, meanwhile, when the second sub-vibrating mechanism 1052 drives workbench 101, first sub-vibrating mechanism 1051 stops drive actions, so that workbench 101 falls after rise naturally in the side being provided with the first sub-vibrating mechanism 1051.It follows that the 3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 perform driving successively, and type of drive is same as above.So, it is possible to complete a vibration period.In etching process, workbench 101 needs to complete multiple above-mentioned vibration period under first sub-vibrating mechanism the 1051, second sub-vibrating mechanism 1053 of sub-vibrating mechanism the 1052, the 3rd and the 4th sub-vibrating mechanism 1054 driven.
nullIt should be noted that herein，Within an above-mentioned vibration period，To the first sub-vibrating mechanism 1051、Second sub-vibrating mechanism 1052、The vibration order of the 3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 does not limit，Can such as above-mentioned first sub-vibrating mechanism 1051、Second sub-vibrating mechanism 1052、3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 be alternately vibration successively，It can also be the first sub-vibrating mechanism 1051、3rd sub-vibrating mechanism 1053、Second sub-vibrating mechanism 1052 and the 4th sub-vibrating mechanism 1054 be alternately vibration successively，As long as ensureing the first sub-vibrating mechanism 1051 within a vibration period、Second sub-vibrating mechanism 1052、3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 carry out alternately vibrating with identical order.
So, workbench 101 can at the first sub-vibrating mechanism 1051, second sub-vibrating mechanism 1052, four sides of the 3rd sub-vibrating mechanism 1053 and the 4th sub-vibrating mechanism 1054 driven workbench 101 replace run-off the straight, so that on tortuous Thinfilm pattern 21 as shown in Figure 6 a, both sides B3 and the B4 of both sides B1 and the B2 of the longitudinal component 210 of Thinfilm pattern 21 and the lateral part 211 of Thinfilm pattern 21 can all be washed away by the etching liquid 50 on substrate 102 to be etched, it is beneficial to so that on Thinfilm pattern 21, the wedge angle β of diverse location all can effectively be reduced.On this basis, it is the hydraulic electric motor shown in Fig. 3 a or air pressure motor when above-mentioned sub-vibrating mechanism, and when the model of this motor, running parameter are identical, the impulse stroke of motor is consistent.So that the four of workbench 101 side amplitudes in vibration processes are identical, to realize uniformly driving the etching liquid 50 on substrate 102 to be etched to carry out the purpose fluctuated, and then the wedge angle β of diverse location on Thinfilm pattern 21 is carried out uniform treatment.
Additionally, as it is shown in fig. 7, above-mentioned etching apparatus also includes being positioned at the base 106 below above-mentioned workbench 101, be provided with bolster 107 between this base 106 and workbench 101.The workbench 101 being connected with vibrating mechanism 103, in vibrating mechanism 103 vibration processes, is had certain cushioning effect, reduces the abrasion of this etching apparatus, improve the service life of this etching apparatus by this bolster 107.
Above-mentioned vibrating mechanism is to illustrate for electromagnetic motor as shown in figure 3b, and vibrating mechanism herein can also be hydraulic electric motor as shown in fig. 3a or air pressure motor.
Herein it should be noted that the concrete structure of above-mentioned bolster 107 is not limited by this utility model, it is possible to be illustrated in figure 7 spring members, it is also possible to for rubber washer or air cushion packing ring.
On this basis, as it is shown in fig. 7, this etching apparatus can also include the accumulator tank 115 being arranged at below workbench 101, reclaiming for etching liquid 50, the etching liquid 50 after recovery can recycle, it is to avoid the waste to resource, it is achieved recycle.
Additionally, in order to make above-mentioned etching apparatus be capable of automatization, above-mentioned workbench 101 can include support 108 as shown in Figure 8 a, and is installed on the first connecting gear on support 108, and this connecting gear is used for carrying and transmit substrate 102 to be etched.
Hereinafter the structure of above-mentioned first connecting gear is described in detail.
Such as, above-mentioned first connecting gear is as shown in Figure 8 a, it is possible to include at least two roll shaft 110 being installed on above-mentioned support 108, and this roll shaft 110 rotates along axis direction O-O ', and the axis direction O-O ' of roll shaft 110 to transmit direction E with substrate 102 to be etched vertical.And between adjacent two roll shafts 110, it being provided with the gap 111 flowed out for etching liquid 50, this gap 111 is beneficial to the discharge of etching liquid 50, and the etching liquid 50 discharged through gap 111 enters the accumulator tank 115 of lower section, carries out recycling.Concrete, when roll shaft 110 turns clockwise along axis direction O-O ', under the drive of this roll shaft 110, substrate 102 to be etched can be transmitted along transmission direction E, and then enters lower one processing technology, it is achieved the Automated condtrol of etching process.
Again such as, above-mentioned first connecting gear is as shown in Figure 8 b, it is possible to includes being installed on above-mentioned support 108 upper conveyor belt 112, and is also provided with the outage 113 flowed out for etching liquid 50 on this conveyer belt 112.Concrete conveyer belt 112 of working as is transmitted along transmission direction E, can drive and be transmitted along transmission direction E with the substrate to be etched 102 contacted above conveyer belt 112, and then enter lower one processing technology, it is achieved the Automated condtrol of etching process.
On this basis, in order to prevent at vibrating mechanism 103 in the process of vibration, the substrate to be etched 102 above workbench 101 produces friction and collision with above-mentioned first connecting gear, thus treating etch substrate 102 to cause damage.As it is shown in figure 9, above-mentioned workbench 101 can also include at least one pair of locating shaft 114 being installed on support 108, for being fixed above-mentioned substrate 20 to be etched is parallel to the both sides that this substrate 102 to be etched transmits direction E.This locating shaft 114 rotates along axis direction C-C ', and the axis direction C-C ' of locating shaft 114 is vertical with substrate 102 to be etched.
Concrete, above-mentioned locating shaft 114 can be active rotation, it is also possible to be under the first connecting gear drives, and produces friction passive rotation with substrate 102 to be etched.Wherein, when the first connecting gear is transmitted along transmission direction E, the locating shaft 114 of the D1 side of support 108 turns clockwise along axis direction C-C ', and the locating shaft 114 of the D2 side of support 108 rotates counterclockwise along axis direction C-C ', and vice versa.
It should be noted that herein, above-mentioned locating shaft 114 can be elastomeric material, such as resin material or elastomeric material, make the locating shaft 114 of this elasticity material in treating the process that etch substrate 102 is fixed, produce to damage it can be avoided that treat etch substrate 102 because of extruding, in addition, substrate 102 to be etched is when along transmission direction E transmission, this locating shaft 114 self carries out rotation actively or passively, while being capable for the treatment of the location of etch substrate 102, it is ensured that the normal transmission of substrate 102 to be etched.
In addition, as shown in Figure 10, this etching apparatus can also include cleaning chamber 200, this cleaning chamber 200 arranges the second connecting gear 116, for accepting the substrate being sent to this cleaning chamber 200 by above-mentioned first connecting gear, this cleaning chamber 200 also includes being arranged at the cleaning shower nozzle 117 above above-mentioned second connecting gear 116.
On this basis, as shown in Figure 10, this etching apparatus can also include drying chamber 300, drying chamber 300 arranges the 3rd connecting gear 118, for accepting the substrate being sent to this drying chamber 300 by above-mentioned second connecting gear 116, this drying chamber 300 also includes being arranged at the air knife 119 above above-mentioned 3rd connecting gear 118.
Herein it should be noted that above-mentioned second connecting gear 116 is identical with the structure that first transmits with the 3rd connecting gear 118, it is possible to for being installed on the roll shaft 110 of above-mentioned support 108, it is also possible to for being installed on above-mentioned support 108 upper conveyor belt 112.
Concrete, as shown in Figure 10, when this etching apparatus includes above-mentioned etch chamber 100, cleans chamber 200 and drying chamber 300, the process of above-mentioned etching technics is specially, first after substrate 102 to be etched enters the workbench 101 of etch chamber 100, this substrate 102 to be etched is fixed by the locating shaft 114 in workbench 101, then Vibration on Start-up mechanism 103, open etching liquid shower nozzle 40 simultaneously and spray etching liquid 50 to substrate 102 to be etched, proceeding by etching operation, the gap 111 between roll shaft 110 of the etching liquid 50 in etching process enters the accumulator tank 115 of lower section.After etching operation completes, close etching liquid shower nozzle 40 and vibrating mechanism 103, under the drive of above-mentioned roll shaft 110, the substrate after etching enters cleaning chamber 200, substrate after above-mentioned etching is cleaned by the cleaning shower nozzle 117 cleaned in chamber 200, after having cleaned under the drive of the second connecting gear 116, substrate after cleaning enters drying chamber 300, substrate after above-mentioned cleaning is blowed this substrate of hot air drying by the air knife 119 in drying chamber 300, after completing drying operation, through the 3rd connecting gear 118, dried substrate is sent into lower one technique and process.
The above; it is only detailed description of the invention of the present utility model; but protection domain of the present utility model is not limited thereto; any those familiar with the art is in the technical scope that this utility model discloses; change can be readily occurred in or replace, all should be encompassed within protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with described scope of the claims.
Claims (16)
1. an etching apparatus, it is characterized in that, including etch chamber, workbench and etching liquid shower nozzle it is provided with in described etch chamber, described workbench is used for carrying substrate to be etched, described substrate to be etched includes the thin layer and the photoresist that cover underlay substrate successively, and described etching liquid shower nozzle can spray etching liquid on described substrate to be etched；
Described workbench is connected to vibrating mechanism, is used for driving described workbench to vibrate, so that the etching liquid on described substrate to be etched contacts with the thin layer of described photoresist edges cover.
2. etching apparatus according to claim 1, it is characterized in that, described vibrating mechanism is made up of the sub-vibrating mechanism being arranged at described workbench at least side, for driving described workbench to make to be provided with on described workbench the side run-off the straight of described sub-vibrating mechanism in vibration processes.
3. etching apparatus according to claim 2, it is characterised in that described vibrating mechanism is made up of the first sub-vibrating mechanism being respectively arranged at described workbench opposite sides and the second sub-vibrating mechanism；Workbench described in described first sub-vibrating mechanism and described second sub-vibrating mechanism driven.
4. etching apparatus according to claim 2, it is characterised in that described vibrating mechanism is made up of the first sub-vibrating mechanism being arranged at described workbench opposite sides and the second sub-vibrating mechanism；Described first sub-vibrating mechanism and described second sub-vibrating mechanism simultaneously drive described workbench, and the driving direction of described first sub-vibrating mechanism and described second sub-vibrating mechanism is contrary.
5. etching apparatus according to claim 2, it is characterised in that described vibrating mechanism is constituted by being respectively arranged at the first sub-vibrating mechanism of described four sides of workbench, the second sub-vibrating mechanism, the 3rd sub-vibrating mechanism and the 4th sub-vibrating mechanism；Within a vibration period, described first sub-vibrating mechanism, described second sub-vibrating mechanism, described 3rd sub-vibrating mechanism and described 4th sub-vibrating mechanism be vibration alternately.
6. the etching apparatus according to any one of claim 1-5, it is characterised in that also include being positioned at the base below described workbench, be provided with bolster between described base and described workbench.
7. etching apparatus according to claim 1, it is characterised in that described vibrating mechanism includes hydraulic electric motor, air pressure motor or electromagnetic motor.
8. etching apparatus according to claim 1, it is characterised in that described workbench includes support, and is installed on the first connecting gear on described support, described connecting gear is used for carrying and transmit described substrate to be etched.
9. etching apparatus according to claim 8, it is characterised in that described connecting gear includes at least two roll shaft being installed on described support, described roll shaft rotates along axis direction, and the axis direction of described roll shaft is vertical with described board transport direction to be etched.
10. etching apparatus according to claim 9, it is characterised in that be provided with, between adjacent two roller bearings, the gap flowed out for described etching liquid.
11. etching apparatus according to claim 8, it is characterised in that described connecting gear includes being installed on described support upper conveyor belt.
12. etching apparatus according to claim 11, it is characterised in that be provided with the outage flowed out for described etching liquid on described conveyer belt.
13. etching apparatus according to claim 8, it is characterised in that described workbench also includes at least one pair of locating shaft being installed on described support, for being fixed the both sides being parallel to described board transport direction to be etched on described substrate to be etched；Described locating shaft rotates along axis direction, and the axis direction of described locating shaft is vertical with described substrate to be etched.
14. etching apparatus according to claim 1, it is characterised in that also include being arranged at the accumulator tank below described workbench, reclaim for etching liquid.
15. etching apparatus according to claim 8, it is characterized in that, also include cleaning chamber, described cleaning chamber arranges the second connecting gear, for accepting the substrate being sent to described cleaning chamber by described first connecting gear, described cleaning chamber also includes being arranged at the cleaning shower nozzle above described second connecting gear.
16. etching apparatus according to claim 15, it is characterized in that, also include drying chamber, described drying chamber arranges the 3rd connecting gear, for accepting the substrate being sent to described drying chamber by described second connecting gear, described drying chamber also includes being arranged at the air knife above described 3rd connecting gear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620191637.8U CN205406497U (en) | 2016-03-11 | 2016-03-11 | Etching apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620191637.8U CN205406497U (en) | 2016-03-11 | 2016-03-11 | Etching apparatus |
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| CN205406497U true CN205406497U (en) | 2016-07-27 |
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| CN201620191637.8U Expired - Fee Related CN205406497U (en) | 2016-03-11 | 2016-03-11 | Etching apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898569A (en) * | 2017-03-21 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of method of wet-method etching equipment and wet etching |
| CN108874226A (en) * | 2018-06-29 | 2018-11-23 | 信利光电股份有限公司 | A kind of lithographic method and touch panel unit of touch screen ito film layer |
| CN110429053A (en) * | 2019-08-19 | 2019-11-08 | 江阴江化微电子材料股份有限公司 | A kind of wet etching equipment and wet etch process with removable cover |
-
2016
- 2016-03-11 CN CN201620191637.8U patent/CN205406497U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106898569A (en) * | 2017-03-21 | 2017-06-27 | 京东方科技集团股份有限公司 | A kind of method of wet-method etching equipment and wet etching |
| CN106898569B (en) * | 2017-03-21 | 2019-04-26 | 京东方科技集团股份有限公司 | A kind of method of wet-method etching equipment and wet etching |
| CN108874226A (en) * | 2018-06-29 | 2018-11-23 | 信利光电股份有限公司 | A kind of lithographic method and touch panel unit of touch screen ito film layer |
| CN108874226B (en) * | 2018-06-29 | 2021-06-11 | 信利光电股份有限公司 | Etching method of ITO film layer of touch screen and touch screen assembly |
| CN110429053A (en) * | 2019-08-19 | 2019-11-08 | 江阴江化微电子材料股份有限公司 | A kind of wet etching equipment and wet etch process with removable cover |
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