CN101281372A - Coater and method of coating a process solution on a substrate using the same - Google Patents

Coater and method of coating a process solution on a substrate using the same Download PDF

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Publication number
CN101281372A
CN101281372A CNA2007101946612A CN200710194661A CN101281372A CN 101281372 A CN101281372 A CN 101281372A CN A2007101946612 A CNA2007101946612 A CN A2007101946612A CN 200710194661 A CN200710194661 A CN 200710194661A CN 101281372 A CN101281372 A CN 101281372A
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China
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substrate
coating
unit
coating solution
bearing unit
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CNA2007101946612A
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CN101281372B (en
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朴光信
印义植
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Semes Co Ltd
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Semes Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/26Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

In a slit coater and method for coating a substrate using the same, the first coating process is prepared on the first cleaning component, and having the first substrate on a supporting unit. The coating unit with a coating solution is stored from the first cleaning component moving along the first direction, coating the first substrate by the coating solution. The second substrate displaces the first substrate during preparing the second coating process on the second cleaning component. The coating unit moves from the second cleaning component along the second direction being opposite direction of the first direction, and the second substrate being coated by the coating solution. Therefore time and cost can be saved during the coating process, thereby the combined efficiency of the coating process can be improved.

Description

Coating machine and use the method for this coating machine with the coating solution coated substrates
The cross reference of related application
The application requires the right of priority of on April 4th, 2007 to the 2007-33035 korean patent application of Korea S Department of Intellectual Property (KIPO) application according to 35 U.S.C. § 119, is incorporated in this by the content of quoting fully this application.
Technical field
The embodiment of the invention relates to a kind of slit type coater, and with a kind of method of coating solution coated substrates, more specifically, the present invention relates to a kind ofly comprise a pair of cleaning part, between cleaning part, all can carry out the slit type coater of coating process back and forth, and use a kind of method of this coating machine with the coating solution coated substrates.
Background technology
Recently, along with the variation of environment for use and the appearance of multimedia environment, the demand to the display of display message changes flat-panel monitor (FPD) equipment into from cathode ray tube (CRT) equipment.Because people pay attention to the movability of display especially, so display must be done to such an extent that light weight, body are thin, small and exquisite.In addition, the new technology progress and the development trend of digital technology allow display recently can show various numerical data, such as video data and common TV data.Especially, along with FPD equipment becomes increasing in recent years, people efficiently make the technology of FPD to adopting extensive display panel, have carried out extensive studies.
Usually, because widely distributed IC treatment technology, up-to-date FPD equipment comprises various integrated circuit (ICs), thereby often adopts photoetching technique in the manufacture process of FPD equipment.Conventional photoetching technique comprises coating process, and wherein photoresist is coated on the motherboard that comprises thin layer.Motherboard is divided into the cell board that is used for FPD equipment.Along with the size increase of FPD equipment, the size of motherboard also increases.Therefore the uniformity coefficient of photoresist film has very big influence to the manufacturing efficient of FPD equipment on the coating time of photoresist and the motherboard.
Be used for the conventional coating machine of coating photoresist on motherboard, generally include the bearing unit that is used for bearing substrate, for example the coating machine chuck; With being used for photoresist is ejected into nozzle on the substrate; And the cleaning unit that is used for washer jet.
Fig. 1 is the synoptic diagram that is illustrated in the conventional coating machine of coating photoresist on the substrate.
With reference to Fig. 1, conventional coating machine 90 comprises: bearing unit 10 is used to support motherboard G, for example female glass plate on it; With coater unit 20, be used for being coated with photoresist, thereby on substrate G, form photoresist film L by moving on substrate G along substrate surface; And cleaning unit 30, be used on substrate G, cleaning coater unit 20 after the coating photoresist.
Substrate G is carried on the end face of bearing unit 10, coating solution, and for example photoresist solution by the nozzle 26 of coater unit 20, is injected in the surface of substrate G.Nozzle 26 forms slits, and the width of its length and substrate G is basic identical, makes coating solution with a width unit of nozzle 26, along laterally being coated on the substrate G of substrate G.Thereby when coater unit 20 during along the vertically moving of substrate G, photoresist is applied to the whole surface of substrate G by nozzle 26.
When photoresist solution by vertically being coated on fully on the surface of substrate G, and when being completed into photoresist film on the surface of substrate G, bearing unit 10 moves down, and coater unit 20 moves up, to increase the clearance distance between coater unit 20 and the substrate G.Be formed with the substrate of photoresist film then on it, shift out from bearing unit 10, and on it another substrate transfer to be coated to bearing unit 10.When the substrate that is formed with photoresist film is moved out of, when another substrate was stated from the bearing unit 10, coater unit 20 turned back to cleaning unit 30, and prepared the follow-up coating process carried out on another substrate.
Cleaning unit 30 comprises the humidifier 34 that is used for humidification nozzle 26, prevents nozzle 26 exsiccation, and the priming rollers 32 that evenly spray photoresist solutions by nozzle 26.The nozzle 26 of coater unit 20 is arranged on the circumferential surface around priming roller 32, and driver element (not giving diagram) rolls priming roller 32.The nozzle 26 of coater unit 20 is configured in the circumferential surface around priming roller 32, and photoresist solution keeps flowing, and makes that photoresist solution can be through nozzle 26 ejections.Therefore, though the coating process on the substrate because priming roller 32 is former thereby interrupt, photoresist solution also can evenly spray from nozzle, and humidifier 34 can avoid photoresist solution dry and deadlocked around nozzle 26.When photoresist solution retrogradation and adhesion nozzle 26, the cleaning process on the nozzle 26 may be stopped up by the caking of photoresist solution and interrupt, and the photoresist film that forms on the substrate also may be because the caking of photoresist solution become inhomogeneous.
Yet there is a problem in above-mentioned conventional coating machine 90, and the efficient that is exactly its coating process is low, because after finishing on the substrate G of coating process at bearing unit 10, coater unit 20 must turn back to cleaning unit 30, to prepare follow-up coating process.
Fig. 2 is expression is coated with the process cycle of a plurality of substrates with a conventional coating machine shown in Figure 1 synoptic diagram.
With reference to Fig. 2, coater unit 20 is cleaned fully by cleaning unit 30, and when spraying photoresist solution to substrate G by nozzle 26, when forming photoresist film L on substrate G, coater unit 20 vertically moves along substrate G's.When photoresist film L is completed into after substrate G goes up, coater unit 20 turns back to the cleaning unit 30 near bearing unit 10 ends, and coater unit 20 is prepared the follow-up coating process carried out on another substrate G.After coater unit 20 cleans up on cleaning unit 30, be formed with the substrate G of photoresist film L, shift out from bearing unit 10, and another substrate is stated from the bearing unit 10, be used for follow-up coating process.
Yet, after coating process is finished, coater unit 20 must along with the opposite return path B of path A that on substrate G, carries out coating process, turn back to cleaning unit 30.In other words, when coater unit 20 when return path B turns back to cleaning unit 30, treat that the substrate G that has been formed with photoresist film L on it replaces by the new substrate of coater unit 20 coatings.
Therefore, when coater unit 20 turns back to cleaning unit 30, do not carry out coating process, thereby can increase the time and the cost of coating process.Especially when a plurality of substrates were carried out coating process, the time and the cost of coating process significantly increased, because coater unit 20 turns back to cleaning unit 30 processes, each substrate all must repeat.As a result, because coater unit 20 turns back to cleaning unit 30, the total efficiency of coating process just significantly reduces.
Summary of the invention
Therefore, embodiments of the invention provide a kind of such coating machine, have wherein omitted the process that coater unit returns along return path, thereby have improved the efficient of coater unit.
The embodiment of the invention also provides a kind of employing above-mentioned coating machine, applies the method for coating solution on substrate.
According to an aspect of the present invention, provide a kind of coating machine with the coating solution coated substrates.This coating machine comprises: the bearing unit of bearing substrate; By on substrate, providing coating solution, on substrate, carry out coating process, thereby on substrate, form the coater unit of coating; And before carrying out coating process, the cleaning unit that coater unit is cleaned.Cleaning unit comprises second cleaning part near first cleaning part of bearing unit first end and close bearing unit the second end, and, when coater unit moves to second cleaning part from first cleaning part, and when moving to first cleaning part, carry out coating process from second cleaning part.
In an embodiment, substrate comprises glass plate that is used for display panel and the semiconductor substrate that is used for semiconductor equipment.Coater unit comprises having the main body that stores the inner space that coating solution uses; With discharge portion towards substrate surface; With the supply line that coating solution is provided; With supply with (coating solution) by supply line to main body, and be discharged to the coater unit of substrate by discharge portion.Main body comprises the tapered portion that is positioned at the close substrate surface in its end, so that discharge portion is positioned at the tapered portion of main body.For example, discharge portion forms slit, and its length is basic identical with substrate width.
In an embodiment, first cleaning part comprises: be arranged near the bearing unit first end, and by discharge portion, make coating solution keep the first even portion of evenly flowing; Be arranged near the first even portion, coater unit is moisturized, add wet end to prevent first of cleaning unit exsiccation.Second cleaning part comprises: be arranged on the second end near bearing unit, and by discharge portion, make coating solution keep the second even portion of evenly flowing; Be arranged near the second even portion, coater unit is moisturized, add wet end to prevent second of cleaning unit exsiccation.The first and second even portions comprise priming roller system, and they have roller that relies on the external power source driving and the frame that supports this roller respectively.The first and second even portions also comprise the cleaning solution that is stored in the frame, supplies the roller in the cleaning machine frame.First and second ends of bearing unit are with respect to the center line of bearing unit, and direction toward each other.
According to a further aspect in the invention, provide the method for the above-mentioned coating machine of a kind of usefulness with the coating solution coated substrates.First substrate transfer by discharging coating solution from coater unit, by the first direction from the first end of bearing unit to the second end of bearing unit, on the surface of first substrate, is carried out first coating process to bearing unit; Simultaneously coater unit comprises coating solution in it, and moves past on first substrate by first direction.Then, by shifting out first substrate from bearing unit, and provide second substrate to bearing unit, replace first substrate with second substrate.By discharging coating solution from coater unit,, on the surface of second substrate, carry out second coating process by second direction from the second end of bearing unit to the first end of bearing unit; Simultaneously coater unit comprises coating solution in it, and moves past on second substrate by second direction.
In an embodiment, provide the step of first and second substrates to comprise that employing vacuum air pump or chuck are with the surface of base plate carrying at bearing unit.
In an embodiment, before carrying out on first substrate,, prepare first coating process again at first coating process near on first cleaning part of bearing unit first end; And at second coating process before carrying out on second substrate, near on second cleaning part of bearing unit the second end, prepare second coating process again.In addition, prepare the step of first and second coating process, comprise with from its separately the coater unit coating solution control of discharging evenly flow.In addition, the step of preparing first and second coating process comprises, before the step that coating solution control is evenly flowed, at one of them parts of first and second cleaning parts or on two parts of first and second cleaning parts, all coating solution is supplied to coater unit.
In an embodiment, the step coating solution control is evenly flowed comprises the discharge portion that is used to discharge coating solution with coater unit, is set near first and second cleaning parts even portion separately, and coating solution is flow in the even portion of cleaning unit; Described even portion with the described cleaning unit that rolls evenly flow on the surface of even portion coating solution, and coating solution keeps evenly flowing on the discharge portion of coater unit thereby make.
In an embodiment, evenly portion comprises the constant speed rotation roller that relies on external power source to drive.First and second ends of bearing unit are with respect to the center of bearing unit, and direction toward each other.
According to the embodiment of the invention, first and second cleaning parts are arranged near substrate two ends respect to one another.Coater unit is carried out first coating process along first path that moves to second cleaning part from first cleaning part on first substrate; And coater unit is carried out second coating process along second path that moves to first cleaning part from second cleaning part on second substrate.Therefore the time and the cost of coating process can significantly reduce.
Description of drawings
In conjunction with the accompanying drawings and referring to detailed description of the present invention, can know above-mentioned and other characteristics of the present invention and advantage, wherein:
Fig. 1 is the synoptic diagram that expression is used for the conventional coating machine of coating photoresist on substrate;
Fig. 2 is an expression conventional coating machine as shown in Figure 1, is coated with the synoptic diagram in the process cycle of a plurality of substrates;
Fig. 3 is the synoptic diagram of expression according to the coating machine structure of the embodiment of the invention;
Fig. 4 is the synoptic diagram that the expression coating solution flows in priming roller system by discharge portion;
Fig. 5 is the process flow diagram with coating solution coated substrates method of expression according to the embodiment of the invention; And
Fig. 6 be represent as shown in Figure 5 prepare the process flow diagram of the step of coating process according to the embodiment of the invention.
Embodiment
Now, be described in further detail the present invention referring to the accompanying drawing that the embodiment of the invention is shown.Yet the present invention can realize with many different forms, and should not be construed as the embodiment that only limits in this proposition.More properly, propose these embodiment reach complete disclosing comprehensively, and make those skilled in the art understand scope of the present invention fully to reach.In the diagram, for the purpose of knowing, may amplify the size and the relative size in layer and zone.
Should be understood that when element or layer are called another element or layer " on ", in another element or layer " connection " or " coupling ", it can be direct connection, with other element or layer be connected or be coupled, perhaps existence occupy wherein element or layer.In contrast, when element is called " directly on (another element or layer) time ", with another element or layer " directly being connected " or " the direct coupling ", do not exist the element that occupy wherein or layer.Similar elements is marked with similar Reference numeral all the time.Statement as used herein, " and/or " comprise any or all combinations of one or more relevant Listed Items.
Although should be understood that and use the first, second, third, etc. term to describe various elements, assembly, zone, layer and/or part herein, these elements, assembly, zone, layer and/or part are not subjected to the restriction of these statements.These terms only are used for an element, assembly, zone, layer or part and come with another zone, layer or part difference.Thus, hereinafter be referred to as first element, assembly, zone, layer or part and can be described as second element, assembly, zone, layer or part, and do not break away from instruction of the present invention.
The term that the space is relative, as " ... under (beneath) ", " ... below (below) ", " down (lower) ", " ... top (above) ", " going up (upper) " etc., use these terms with the element as shown in the figure of statement easily or the relation of unit and another element or unit in this article.Should be understood that the relative term in these spaces is intended to contain the different azimuth of this equipment in using or working except that orientation shown in the figure.For example, if this equipment upset among the figure, the element that is described as " under other element or unit ", " below other element or unit " then can be defined as " above other element or unit ".Thus, this exemplary term " in ... below " can contain simultaneously " in ... top " and " in ... below " both.This equipment can be other orientation (revolve and turn 90 degrees or other orientation), and corresponding explanation also done in the relative term in these spaces used herein.
Statement used herein only is used to describe certain embodiments, and and is not intended to limit the present invention.As described herein, " a " of singulative, " an " and " the " are intended to comprise plural form, unless its context has clearly expression in addition.Will also be understood that, in this instructions, use term " to contain " or " comprising " in, offered some clarification on and had described feature, integral body, step, operation, element and/or assembly, but do not got rid of the existence or the interpolation of one or more further feature, integral body, step, operation, element, assembly and/or their cohort.
Embodiments of the invention are to describe with reference to the schematic sectional view of idealized embodiment of the present invention (intermediate structure) herein.Like this, expection for example can produce because of manufacturing process and/or tolerance and cause in shape variation.Thus, embodiments of the invention should not be construed as it is constrained to specific region shown in this article shape, also for example should comprise the form variations that causes because of manufacturing.For example, be shown or be described as passing through the zone mutually and generally may having circle or curvilinear characteristic of rectangle, with and/or its edge pass through concentrated degree of tilt mutually, but not change to non-two dimension of passing through the zone mutually from passing through the zone mutually.Equally, because of passing through the hidden area of formation mutually, may cause the phase coherence in zone between hidden area and the surface that takes place to pass through mutually by its.Thus, the zone shown in the figure is schematically, and its shape and be not intended to illustrate the accurate shape of component area, also is not intended to limit scope of the present invention.
Unless otherwise defined, the technician institute common sense of the implication of employed all terms of this paper (comprising scientific and technical terminology) and the technical field of the invention is consistent.Should also be understood that to be interpreted as consistently such as defined term in the general dictionary, and should not do Utopian or excessively mechanical explanation, unless clearly definition is arranged in the text in addition with implication in the correlative technology field.
Fig. 3 is the synoptic diagram according to the coating machine structure of the embodiment of the invention.
With reference to Fig. 3, the coating machine 900 in the embodiment of the invention comprises the bearing unit 100 of placing substrate G to be coated; With the coater unit 200 that moves and provide coating solution along substrate G on substrate G surface; And after coating process is finished, when coater unit 200 is prepared follow-up coating process on another substrate, be used to clean the cleaning unit 300 of coater unit 200.
Bearing unit 100 comprises flat board and the substrate G that is carried on bearing unit 100 end faces.In an embodiment, vacuum pressure acts on bearing unit by the vacuum hole in the bearing unit 100 (not giving diagram), and adopts vacuum air pump, substrate G is carried on the surface of bearing unit 100.In addition, substrate G also can be carried on the bearing unit by chuck.Bearing unit 100 can move up and down by first driver (not giving diagram), makes bearing unit 100 can move vertically to bearing unit 100.As a result, by mobile bearing unit 100, the clearance distance between bearing unit 100 and the substrate G can be controlled to unanimity.In addition, coater unit 200 can move vertically to substrate G, thus the clearance distance between control basal plate G and the coater unit 200.
In an embodiment, substrate G comprises that being used for flat-panel monitor (FPD) does the display panel female glass used and the wafer that is used for semiconductor equipment.
Coater unit 200 comprises: have the main body 220 that stores the inner space that coating solution uses; With the inner space that is connected to main body 220, and be used for the supply line of coating solution supply subject 220; Be connected to the inner space of main body 220 equally, and be used for the discharge portion 260 of coating solution from main body 220 discharges.
Coating solution can comprise the various materials that meet the subsequent process relevant with substrate G coating.For example, coating solution comprise to be coated to the substrate the photoresist solution in the photoresist film.Photoresist film is become mask pattern by needle drawing, to form integrated circuit (IC) on substrate G.
In an embodiment, main body 220 comprises having the cube shape of preserving the inner space that coating solution uses, when along substrate G when vertically moving, keep at a certain distance away with the end face of substrate G.Especially, the close end of the main body 220 that is bordering on substrate G of connecting, its width is less than relatively away from the distal portion of the main body 220 of substrate G, so that main body 220 is tapered in the direction towards substrate G.In other words, close end is the tapered portion of main body 220, and discharge portion 260 is positioned at the tapered portion of main body 220.As a result, coating solution is pressurizeed, discharge by discharge portion 260 thereby quicken coating solution towards the tapered portion direction of main body 220.
Supply line 240 is connected to the inner space of main body 220, and coating solution supplies to the inner space of main body 220 from liquid reservoir, and this liquid reservoir is located at the outside of coater unit 200 by supply line 240.For example, supply line 240 can comprise line construction, and this line construction has the valve system that a cover control coating solution flows.
Discharge portion 260 is located at the surface of main body 220 tapered portion, near substrate G, and forms slit, and the width w of slit length and substrate G is basic identical.In other words, by discharge portion 260, substrate G is laterally applied at it.Therefore, when discharge portion 260 moves past on substrate G, from first end of substrate G, move in vertical second end with respect to the substrate G of first end, coating solution supplies to substrate G according to the unit of substrate G width w, and the whole surface of substrate G all can applied solution coat.
Coater unit 200 vertically moves past substrate G by second driver (not giving diagram) along substrate G.When coater unit 200 when substrate G moves, coating solution is discharged to substrate G according to the unit of width w.As a result, the whole surface of substrate G all can applied solution coat.
In an embodiment, cleaning unit 300 comprises near first cleaning part 310 of bearing unit 100 first ends 110 and second cleaning part 320 of close bearing unit 100 the second ends 120.
First cleaning part 310 comprises the first even portion 312 that is arranged near bearing unit 100 first ends 110, and this first even portion 312 makes coating solution keep evenly flowing by discharge portion 260; Add wet end 314 with being arranged near first of the first even portion 312, it moisturizes coater unit 200, becomes dry to prevent cleaning unit 200.Second cleaning part 320 comprises the second even portion 322 that is arranged near bearing unit 100 the second ends 120, and this second even portion 322 makes coating solution keep evenly flowing by discharge portion 260; Add wet end 324 with being arranged near second of the second even portion 322, it moisturizes coater unit 200, becomes dry to prevent cleaning unit 200.
First and second add wet end 314 and 324, and the humidity around the discharge portion 260 of control coater unit 200 is to prevent when the coating process that coater unit 200 is prepared to carry out discharge portion 260 exsiccation on substrate G.When discharge portion 260 becomes dry, from the coating solution that discharge portion 260 is discharged, the stiff that around discharge portion 260, becomes, and adhere to thereon, thereby the discharge portion 260 of coater unit 200 just may be owing to the caking of coating solution is closed.Therefore, the exsiccation of discharge portion 260, it is inhomogeneous to cause go up supplying with coating solution toward substrate G, thus the coating L's that substrate G is gone up form is in uneven thickness.As a result, first and second add wet end 314 and 324 can prevent effectively that discharge portion 260 from becoming dry during the coating process carrying out, and goes up the uniformity coefficient that forms coating L thereby improve substrate G.
In an embodiment, first and second ends 110 and 120 of bearing unit 100, with respect to the center of bearing unit 100, direction is toward each other; So that first and second cleaning parts 310 and 320 are also with respect to the center of bearing unit 100, direction toward each other.
In an embodiment, the first and second even portions 312 and 322 comprise priming roller system respectively.Priming roller system comprises the roller A that relies on external power source (not giving diagram) to drive; With the frame B that is used for backing roll A; Be stored among the frame B and cleaning machine frame B in the cleaning solution C of roller.
Known to a person skilled in the art as any, to frame B without any in shape restriction, as long as comprise roller A and cleaning solution C in the frame B.The top of roller A, part is exposed to the top of frame B.
Fig. 4 is the synoptic diagram that the expression coating solution flows in priming roller system by discharge portion.
With reference to Fig. 4, the top of roller A is outstanding from the end face of frame B, and the bottom of roller A then is immersed under the interior cleaning solution C of frame B.When roller A rolls with sense of rotation R in frame B, from the coating solution D that discharge portion 260 is discharged, press the sense of rotation R of roller A, flow out to the circumferential surface of roller A, accumulate in below the discharge portion 260 to avoid coating solution D.As a result, coating solution can evenly to flow, be discharged from discharge portion 260 by the rolling of roller A.In addition, because of roller A is partially immersed under the cleaning solution C, so the circumferential surface of roller A can be cleaned solution and clean up when roller A rotate at every turn.
When first cleaning part, 310 coater units 200 clean up, be full of coating solution in the coater unit 200.Then, coater unit 200 moves to second cleaning part 320 along substrate G, and coating solution is discharged to the surface of substrate G from discharge portion 260.Because the length of the discharge portion 260 of coater unit 200 conforms to the width w of substrate G, so only move from first of first cleaning part, 310 to second cleaning parts 320 on substrate G by coater unit, it is good that the whole surface of substrate G all can applied solution coat.After the coating process on the substrate G is finished, coater unit 200 dislocations above second cleaning part 320, and with another sheet will be in same coating machine 900 applied substrate replace and formed cated substrate G on it.Promptly form cated substrate G and shift out, and another substrate transfer to be coated is to bearing unit 100 from bearing unit 100.During replacing substrate G with another substrate, coating solution is fed in the coater unit 200 on second cleaning part 320.Coater unit 200 is after second cleaning part, 320 places are cleaned totally, and coater unit 200 moves past on another substrate from second cleaning part, 320 to first cleaning parts 310; Then, coating solution is discharged to the surface of another substrate, thereby forms another coating on the surface of another substrate by discharge portion 260.
Therefore, the coating machine 900 of the embodiment of the invention need not that coater unit turns back to that cleaning unit goes and do not carry out the return path of any coating process on substrate, and, just can on substrate, carry out coating process between two opposed ends of substrate as long as coater unit moves.So time and the cost of carrying out coating process on substrate all can significantly reduce, thereby improve the treatment effeciency of coating process greatly.
Below,, describe the process of the execution coating on substrate in detail with reference to Fig. 3 to Fig. 6 with embodiment of the invention coating machine 900.Fig. 5 is that expression uses the coating solution of the embodiment of the invention to carry out the process flow diagram of the method for base plate coating, Fig. 6 be represent as shown in Figure 5 according to the embodiment of the invention, prepare the flow chart of steps of coating process.
With reference to Fig. 3 to Fig. 6, first substrate to be coated, transfer is to the end face (step S100) of bearing unit 100.For example, adopt vacuum air pump or pass through chuck, first base plate carrying is to the end face of bearing unit 100.
Then, coater unit 200 places on first cleaning part 310, and prepares first coating process (step S200) on first substrate.For example, as shown in Figure 6, coating solution D supplies to the inner space (step S210) of main body 220, and prevents that discharge portion 260 from becoming dry at first cleaning part, 310 places by supply line 240.In an embodiment, discharge portion 260 is added wet end 314 humidifications by first of first cleaning part 310.When coating solution D fully supplied to the inner space of main body 220, coater unit moved to the first even portion 312, controlled coating solution by discharge portion 260 evenly flow (step S220) by the rolling of roller A.In other words, coater unit 200 is to prepare first coating process by the method that solution on retentive control first cleaning part 310 evenly flows.
In an embodiment, can evenly flow by priming roller system control coating solution.Be used to discharge the discharge portion 260 of coating solution D, near the roller A of priming roller system.Along with roller A rolls by sense of rotation R, the coating solution D from discharge portion 260 is discharged by sense of rotation R, flows out to the circumferential surface of roller A, thereby prevent that coating solution D from gathering below discharge portion 260.As a result, coating solution can evenly flow from discharge portion 260 and discharge by the rolling of roller A.Roller A is partially immersed under the cleaning solution C, and therefore, the circumferential surface of roller A can each time in the rotary course, clean up by cleaning solution at roller A.
Then, coater unit 200 is along first direction E, on first substrate, move past, then, coating solution is discharged from discharge portion 260, thereby carry out first coating process (step S300) on first substrate by the unit of the first substrate width w, the whole surface that makes the substrate of winning all can applied solution coat, to form first coating on first substrate.For example, the moving of coater unit 200, first driver (not giving diagram) of main body 220 that can be by being connected to coater unit 200 and the control module (not giving diagram) that is connected to first driver are controlled.Because the width w of the length of discharge portion 260 and first substrate is basic identical, so, only by first substrate moving on first direction E, the whole surface of first substrate, just can applied solution fully coated.
Finish after first coating process, coater unit 200 is positioned at second one 120 second cleaning part 320 near bearing unit 100, and prepares second coating process at second cleaning part 320.In second coating process of preparing on second substrate at second cleaning part 320 (step S400), be formed with first substrate of first coating, replace with second substrate to be coated.In other words, finished first substrate of first coating process on it, shifted out from bearing unit 100, and second substrate of pending second coating process on it, transfer is to bearing unit 100.
Except second coating process is that the preparation process of the preparation of second coating process and first coating process is basic identical preparing on second cleaning part 320, thereby, do not do more description for the preparation of second coating process.In addition, in preparing second coating process, also can save main body 220 these steps that coating solution supplied to coater unit 200.In other words, coating solution can be located first and second cleaning parts 310 and 320 liang, or in first and second cleaning parts 310 and 320 any one, supplies in the main body 220 of coater unit 200.
Then, coater unit 200 is along the second direction F opposite with first direction E, on second substrate, move past, then, coating solution is discharged from discharge portion 260, thereby finish second coating process (step S500) on first substrate by the unit of the first substrate width w, make that the whole surface on second substrate all can applied solution coat, and on second substrate, form second coating.Second coating process and first coating process on first substrate on second substrate are basic identical, therefore to second coating process, do not do any more description.
Therefore, the coating machine 900 of the embodiment of the invention can be in two opposite directions, promptly at first direction E and second direction F both direction, all carry out coating process, so, with the coating machine 900 of the embodiment of the invention, no longer need the extra time, consumption turns back to cleaning unit at coater unit, and does not carry out on substrate in the way of any coating process, therefore, compare with conventional coating machine, the efficient that can improve coating process is up to more than 50%.
According to embodiments of the invention, two opposed edges portions at substrate to be coated are provided with a pair of cleaning unit, therefore as long as coater unit moves along the substrate between two cleaning units, just can carry out coating process on substrate.So coater unit no longer needs to turn back to cleaning unit, and can between the normal return period of coater unit, finish coating process.As a result, the required processing time of coating process can shorten greatly, thereby improves the treatment effeciency of coating process.
Although described embodiments of the invention already; should understand; should not limit the invention to these embodiment, those skilled in the art to its multiple change of having done and revise all as hereinafter within the spirit and scope of claims the present invention for required protection.

Claims (17)

1. coating machine with the coating solution coated substrates comprises:
Carry the bearing unit of described substrate;
Coater unit, it carries out coating process by provide described coating solution on described substrate on described substrate, thereby forms coating on described substrate; And
Cleaned the cleaning unit of described coater unit before carrying out described coating process, described cleaning unit comprises: near first cleaning part of described bearing unit first end and second cleaning part of close described bearing unit the second end; And move to described second cleaning part from described first cleaning part when described coater unit, and when described second cleaning part moves to described first cleaning part, carry out described coating process.
2. coating machine as claimed in claim 1, wherein said substrate comprise glass plate that is used for display panel and the semiconductor substrate that is used for semiconductor device.
3. coating machine as claimed in claim 1, wherein said coater unit comprises: the main body with inner space of using of the described coating solution of storage; With discharge portion towards described substrate surface; With the supply line that is used to provide described coating solution; And described coater unit is supplied with described main body by described supply line, and is discharged to described substrate by described discharge portion.
4. coating machine as claimed in claim 3, wherein said main body comprises: be positioned at the tapered portion on the described surface of described body end, close described substrate, make described discharge portion be arranged on the described tapered portion of described main body.
5. coating machine as claimed in claim 4, wherein said discharge portion forms slit, and the length of described slit and the width of described substrate are basic identical.
6. coating machine as claimed in claim 3, wherein said first cleaning part comprises: be arranged on the first even portion near the described first end of described bearing unit, the described first even portion makes the described coating solution by described discharge portion keep evenly flowing; Add wet end with being arranged near first of the described first even portion, described first adds wet end moisturizes to prevent that described cleaning part from becoming dry described coater unit; Wherein said second cleaning part comprises: be arranged on the second even portion near the described the second end of described bearing unit, the described second even portion makes the described coating solution by described discharge portion keep evenly flowing; Add wet end with being arranged near second of the described second even portion, described second adds wet end moisturizes to prevent that described cleaning part from becoming dry described coater unit.
7. coating machine as claimed in claim 6, the wherein said first and second even portions comprise priming roller system separately, described priming roller system has the roller that driven by external power source and the frame of the described roller of supporting.
8. coating machine as claimed in claim 7, the wherein said first and second even portions also comprise the cleaning solution that is stored in the frame, is used to clean the described roller in the described frame.
9. coating machine as claimed in claim 1, described first and second ends of wherein said bearing unit are with respect to the center line of described bearing unit, and direction is toward each other.
10. the method for a coated substrates comprises:
First substrate is provided on described bearing unit;
By discharging coating solution from coater unit,,, carry out first coating process on the surface of described first substrate by first direction from the first end of described bearing unit to the second end of described bearing unit; Described coater unit comprises described coating solution in it, and moves past on described first substrate by described first direction;
By shifting out described first substrate from described bearing unit, and provide described second substrate to described bearing unit, replace described first substrate with second substrate; And
By discharging described coating solution,, on the surface of described second substrate, carry out second coating process by second direction from the described the second end of described bearing unit to the described first end of described bearing unit from described coater unit; Described coater unit comprises described coating solution in it, and moves past on described second substrate by described second direction.
11. method as claimed in claim 10 wherein provides described first and second substrates, comprises adopting vacuum air pump or chuck, with the surface of described base plate carrying to described bearing unit.
12. method as claimed in claim 10 also comprises:
Before carrying out described first coating process on described first substrate, on first cleaning part, prepare described first coating process near the described first end of described bearing unit; And
Before carrying out described second coating process on described second substrate, on second cleaning part, prepare described second coating process near the described the second end of described bearing unit.
13. method as claimed in claim 12 is wherein prepared described first and second coating process and is comprised and will be controlled to be even flowing from the described coating solution that its described coater unit is separately discharged.
14. method as claimed in claim 13, wherein prepare described first and second coating process, also comprise: before described coating solution being controlled to be even flowing, on two of in described first and second cleaning parts one of them or described first and second cleaning parts, supply with described coating solution in described coater unit.
15. method as claimed in claim 13 wherein is controlled to be described coating solution evenly and flows, and comprising:
With the discharge portion that is used to discharge described coating solution of described coater unit, be configured to make described coating solution flow out in the described even portion of described cleaning part near described first and second cleaning parts even portion separately; And
The roll described even portion of described cleaning part makes described coating solution evenly flow on the surface of described even portion, thereby makes the above coating solution of described discharge portion of described coater unit keep evenly flowing.
16. method as claimed in claim 15, wherein said even portion comprises the roller of the constant speed rotation that relies on the external power source driving.
17. method as claimed in claim 10, described first and second ends of wherein said bearing unit, with respect to the described center of described bearing unit, direction is toward each other.
CN2007101946612A 2007-04-04 2007-11-28 Coater and method of coating a process solution on a substrate using the same Active CN101281372B (en)

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TWI326618B (en) 2010-07-01
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CN101281372B (en) 2012-11-28
TW200840652A (en) 2008-10-16

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