JP2011205046A - 半導体記憶装置、及びその製造方法 - Google Patents
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- 239000010936 titanium Substances 0.000 claims description 40
- 229910052758 niobium Inorganic materials 0.000 claims description 39
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 31
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- 229910052735 hafnium Inorganic materials 0.000 claims description 17
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- 239000010703 silicon Substances 0.000 claims description 14
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- 229910000673 Indium arsenide Inorganic materials 0.000 description 1
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
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- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】 半導体記憶装置10は、半導体基板11と、半導体基板11内に離間して設けられたソース領域3及びドレイン領域2と、ソース領域3とドレイン領域2との間であって半導体基板11上に設けられたトンネル絶縁膜12と、トンネル絶縁膜12上に設けられ、酸化物クラスターを含む電荷蓄積膜13と、電荷蓄積膜13上に設けられたブロック絶縁膜14と、ブロック絶縁膜14上に設けられたゲート電極15とを備える。
【選択図】 図1
Description
図1は、本発明の第1の実施形態に係る半導体記憶装置10を示す。
ジルコニウム、又はハフニウムを置換した場合を考えている。例えば、HfO2中にWを添加した状態では、WがHfO2のHfを置換している。このとき、HfO2が形成するバンドギャップ中にWのd軌道が出現し、その状態から電子を出し入れできる。それに対し、HfO2とWO3が単に混在している状態では、HfO2のバンドギャップ中にd軌道が出現しないため、電子の出し入れができない。
図17は、第1の実施形態に係る半導体記憶装置10の変形例を示す図である。
図18は、第1の実施形態に係る半導体記憶装置10の変形例を示す図である。第1の実施形態に係る半導体記憶装置10とは、トンネル絶縁膜12、電荷蓄積膜13、及びブロック絶縁膜14が加工されていない点が異なる。この構造は上記した図12〜図14に示す半導体記憶装置20、図15に示す半導体記憶装置30や図16に示す半導体記憶装置40に応用することが出来る。
図19は、第1の実施形態に係る半導体記憶装置10の変形例を示す図である。変形例1、2を合わせた構造である。この構造は上記した図12〜図14に示す半導体記憶装置20、図15に示す半導体記憶装置30や図16に示す半導体記憶装置40に応用することが出来る。
Claims (9)
- 半導体基板と、
前記半導体基板内に離間して設けられたソース領域及びドレイン領域と、
前記ソース領域と前記ドレイン領域との間であって前記半導体基板上に設けられたトンネル絶縁膜と、
酸化物クラスターを含み、前記トンネル絶縁膜上に設けられた電荷蓄積膜と、
前記電荷蓄積膜上に設けられたブロック絶縁膜と、
前記ブロック絶縁膜上に設けられたゲート電極と、
を備え、
前記酸化物クラスターがZr又はHfを含み、更にTi、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、Ta、W、Re、Os、Ir、Pt、Au、及びHgから選択される少なくとも一つの元素を含むことを特徴とする半導体記憶装置。 - 半導体基板と、
前記半導体基板内に離間して設けられたソース領域及びドレイン領域と、
前記ソース領域と前記ドレイン領域との間であって前記半導体基板上に設けられたトンネル絶縁膜と、
酸化物クラスターを含み、前記トンネル絶縁膜上に設けられた電荷蓄積膜と、
前記電荷蓄積膜上に設けられたブロック絶縁膜と、
前記ブロック絶縁膜上に設けられたゲート電極と、
を備え、
前記酸化物クラスターがTiを含み、更にV、Cr、Mn、Fe、Co、Ni、Cu、Zn、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、Ta、W、Re、Os、Ir、Pt、Au、及びHgから選択される少なくとも一つの元素を含むことを特徴とする半導体記憶装置。 - 前記酸化物クラスターが前記電荷蓄積膜内に層状に形成されていることを特徴とする請求項1又は請求項2に記載の半導体記憶装置。
- 前記酸化物クラスター中の前記元素の面密度が、8.6×1012cm―2以上であり、1.25×1015cm−2より小さいことを特徴とする請求項1又は請求項2に記載の半導体記憶装置。
- 前記電荷蓄積膜の積層方向において前記酸化物クラスターの大きさが0.4nm以上2.5nm以下であることを特徴とする請求項3に記載の半導体記憶装置。
- 前記ジルコニウム酸化物がZrO2、SrZrO3、(Ba、Sr、Ca)ZrO3、及びLa2Zr2O7から選択され、前記ハフニウム酸化物がHfO2、SrHfO3、(Ba、Sr、Ca)HfO3、及びLa2Hf2O7から選択され、前記チタン酸化物がTiO2、SrTiO3、(Ba、Sr、Ca)TiO3、及びLa2Ti2O7から選択されることを特徴とする請求項1又は請求項2に記載の半導体記憶装置。
- 前記トンネル絶縁膜、前記電荷蓄積膜、又は前記ブロック絶縁膜がシリコン酸化物、シリコン酸窒化物、シリコン窒化物、アルミニウム酸化物、アルミニウム酸窒化物、及びアルミニウム窒化物から選択される少なくとも一つの化合物であることを特徴とする請求項1又は請求項2に記載の半導体記憶装置。
- 半導体基板上にトンネル絶縁膜を形成する工程と、
前記トンネル絶縁膜上に、Zr、又はHf、並びにTi、V、Cr、Mn、Fe、Co、Ni、Cu、Zn、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、Ta、W、Re、Os、Ir、Pt、Au、及びHgから選択される少なくとも一つの元素を堆積して島状の金属粒子を形成する工程と、
前記トンネル絶縁膜上に形成された前記金属粒子を酸化して酸化物クラスターを形成する工程と、
前記トンネル絶縁膜上に形成された前記酸化物クラスターを覆うようにシリコン酸化物、シリコン酸窒化物、シリコン窒化物、アルミニウム酸化物、アルミニウム酸窒化物、及びアルミニウム窒化物から選択される少なくとも一つの化合物を堆積させて電荷蓄積膜を形成する工程と、
前記電荷蓄積膜上にブロック絶縁膜を形成する工程と、
前記ブロック絶縁膜上にゲート電極を形成する工程とを備えることを特徴とする半導体記憶装置の製造方法。 - 半導体基板上にトンネル絶縁膜を形成する工程と、
前記トンネル絶縁膜上に、TiとV、Cr、Mn、Fe、Co、Ni、Cu、Zn、Nb、Mo、Tc、Ru、Rh、Pd、Ag、Cd、Ta、W、Re、Os、Ir、Pt、Au、及びHgから選択される少なくとも一つの元素を堆積して島状の金属粒子を形成する工程と、
前記トンネル絶縁膜上に形成された前記金属粒子を酸化して酸化物クラスターを形成する工程と、
前記トンネル絶縁膜上に形成された前記酸化物クラスターを覆うようにシリコン酸化物、シリコン酸窒化物、シリコン窒化物、アルミニウム酸化物、アルミニウム酸窒化物、及びアルミニウム窒化物から選択される少なくとも一つの化合物を堆積させて電荷蓄積膜を形成する工程と、
前記電荷蓄積膜上にブロック絶縁膜を形成する工程と、
前記ブロック絶縁膜上にゲート電極を形成する工程とを備えることを特徴とする半導体記憶装置の製造方法。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013191666A (ja) * | 2012-03-13 | 2013-09-26 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
KR101338360B1 (ko) * | 2012-04-04 | 2013-12-06 | 광주과학기술원 | 선택 소자, 이를 포함하는 비휘발성 메모리 셀 및 이의 제조방법 |
JP2015073093A (ja) * | 2013-09-04 | 2015-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
JP2016058731A (ja) * | 2014-09-04 | 2016-04-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9768265B1 (en) | 2016-03-17 | 2017-09-19 | Toshiba Memory Corporation | Semiconductor memory device |
US9935122B2 (en) | 2015-09-10 | 2018-04-03 | Toshiba Memory Corporation | Nonvolatile semiconductor memory device having electron scattering and electron accumulation capacities in charge accumulation layer |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8884358B2 (en) * | 2013-01-24 | 2014-11-11 | Freescale Semiconductor, Inc. | Method of making a non-volatile memory (NVM) cell structure |
DE102014109924B3 (de) * | 2014-07-15 | 2015-11-12 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit Feldelektrode und Felddielektrikum und Verfahren zur Herstellung und elektronische Anordnung |
US9368510B1 (en) * | 2015-05-26 | 2016-06-14 | Sandisk Technologies Inc. | Method of forming memory cell with high-k charge trapping layer |
US9607952B1 (en) * | 2015-10-30 | 2017-03-28 | International Business Machines Corporation | High-z oxide nanoparticles embedded in semiconductor package |
US10840259B2 (en) | 2018-08-13 | 2020-11-17 | Sandisk Technologies Llc | Three-dimensional memory device including liner free molybdenum word lines and methods of making the same |
US11489061B2 (en) * | 2018-09-24 | 2022-11-01 | Intel Corporation | Integrated programmable gate radio frequency (RF) switch |
JP2021048239A (ja) * | 2019-09-18 | 2021-03-25 | キオクシア株式会社 | 半導体装置およびその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006066804A (ja) * | 2004-08-30 | 2006-03-09 | Sharp Corp | 微粒子含有体及び微粒子含有体の製造方法並びに記憶素子、半導体装置及び電子機器 |
WO2006059368A1 (ja) * | 2004-11-30 | 2006-06-08 | Fujitsu Limited | 半導体記憶装置及びその製造方法 |
JP2008091421A (ja) * | 2006-09-29 | 2008-04-17 | Toshiba Corp | 不揮発性半導体メモリ |
JP2008218482A (ja) * | 2007-02-28 | 2008-09-18 | Fujitsu Ltd | 半導体記憶装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006000020A1 (en) | 2004-06-29 | 2006-01-05 | European Nickel Plc | Improved leaching of base metals |
WO2006095890A1 (ja) | 2005-03-07 | 2006-09-14 | Nec Corporation | 半導体装置およびその製造方法 |
US7612403B2 (en) * | 2005-05-17 | 2009-11-03 | Micron Technology, Inc. | Low power non-volatile memory and gate stack |
JP4374037B2 (ja) * | 2007-03-28 | 2009-12-02 | 株式会社東芝 | 不揮発性半導体メモリ及びその製造方法 |
-
2010
- 2010-03-26 JP JP2010073699A patent/JP5235930B2/ja not_active Expired - Fee Related
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006066804A (ja) * | 2004-08-30 | 2006-03-09 | Sharp Corp | 微粒子含有体及び微粒子含有体の製造方法並びに記憶素子、半導体装置及び電子機器 |
WO2006059368A1 (ja) * | 2004-11-30 | 2006-06-08 | Fujitsu Limited | 半導体記憶装置及びその製造方法 |
JP2008091421A (ja) * | 2006-09-29 | 2008-04-17 | Toshiba Corp | 不揮発性半導体メモリ |
JP2008218482A (ja) * | 2007-02-28 | 2008-09-18 | Fujitsu Ltd | 半導体記憶装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013191666A (ja) * | 2012-03-13 | 2013-09-26 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
US9105739B2 (en) | 2012-03-13 | 2015-08-11 | Renesas Electronics Corporation | Semiconductor device and manufacturing method thereof |
US9455264B2 (en) | 2012-03-13 | 2016-09-27 | Renesas Electronics Corporation | Semiconductor device and manufacturing method thereof |
KR101338360B1 (ko) * | 2012-04-04 | 2013-12-06 | 광주과학기술원 | 선택 소자, 이를 포함하는 비휘발성 메모리 셀 및 이의 제조방법 |
JP2015073093A (ja) * | 2013-09-04 | 2015-04-16 | 株式会社半導体エネルギー研究所 | 半導体装置および半導体装置の作製方法 |
JP2016058731A (ja) * | 2014-09-04 | 2016-04-21 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US9935122B2 (en) | 2015-09-10 | 2018-04-03 | Toshiba Memory Corporation | Nonvolatile semiconductor memory device having electron scattering and electron accumulation capacities in charge accumulation layer |
US9768265B1 (en) | 2016-03-17 | 2017-09-19 | Toshiba Memory Corporation | Semiconductor memory device |
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