JP2011159837A - Lead frame and substrate for led package - Google Patents
Lead frame and substrate for led package Download PDFInfo
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- JP2011159837A JP2011159837A JP2010020777A JP2010020777A JP2011159837A JP 2011159837 A JP2011159837 A JP 2011159837A JP 2010020777 A JP2010020777 A JP 2010020777A JP 2010020777 A JP2010020777 A JP 2010020777A JP 2011159837 A JP2011159837 A JP 2011159837A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Abstract
Description
本発明は、リードフレーム及びＬＥＤパッケージ用基板に関する。 The present invention relates to a lead frame and an LED package substrate.
従来から、所定の波長の光を発するＬＥＤチップを備えたＬＥＤパッケージがある。このようなＬＥＤパッケージは、リードフレームの上に複数のＬＥＤチップを実装してＬＥＤパッケージ用基板を形成し、このＬＥＤパッケージ用基板を切断して個片化することにより製造される。 Conventionally, there is an LED package including an LED chip that emits light of a predetermined wavelength. Such an LED package is manufactured by mounting a plurality of LED chips on a lead frame to form an LED package substrate, and cutting the LED package substrate into individual pieces.
リードフレームの上には、複数のＬＥＤチップの各々を取り囲むように、一次成形樹脂（白樹脂）で一括形成されたリフレクタが設けられている。また、リードフレーム上に実装された複数のＬＥＤチップは、レンズ部としての機能を備えた二次成形樹脂（透明樹脂）により封止される。これらの樹脂を封止すると樹脂バリが生じるため、薬液を用いて樹脂バリを除去する必要がある。 On the lead frame, a reflector formed in a lump with a primary molding resin (white resin) is provided so as to surround each of the plurality of LED chips. Further, the plurality of LED chips mounted on the lead frame are sealed with a secondary molding resin (transparent resin) having a function as a lens portion. When these resins are sealed, resin burrs are generated. Therefore, it is necessary to remove the resin burrs using a chemical solution.
ところで、特許文献１には、凹溝がダイパッドの外周側に沿って矩形リング状に形成されたリードフレームが開示されている。凹溝の上には半導体チップが搭載され、この凹溝は半田付けの際の半田の広がりを防止する。 By the way, Patent Document 1 discloses a lead frame in which concave grooves are formed in a rectangular ring shape along the outer peripheral side of the die pad. A semiconductor chip is mounted on the groove, and this groove prevents the spread of solder during soldering.
ところが、樹脂封止後に生じた樹脂バリを薬液を用いて除去しようとすると、薬液が樹脂とリードフレームとの間の僅かな隙間から浸入するおそれがある。薬液が製品となる境界面の隙間に浸入すると、樹脂とリードフレームとの密着性を低下させ、場合によっては剥離させてしまう。また、リードフレームと樹脂の境界面のリードフレーム側を変色してしまう。 However, if the resin burrs generated after resin sealing are to be removed using a chemical solution, the chemical solution may enter through a slight gap between the resin and the lead frame. When the chemical enters the gap at the boundary surface that becomes the product, the adhesiveness between the resin and the lead frame is lowered, and in some cases, it is peeled off. Further, the lead frame side of the boundary surface between the lead frame and the resin is discolored.
そこで本発明は、薬液処理による樹脂の密着性低下や剥離を防止し、更には密着性を向上させ、薬液による変色を抑制するように構成されたリードフレーム及びＬＥＤパッケージ用基板を提供する。 Therefore, the present invention provides a lead frame and an LED package substrate that are configured to prevent a decrease in the adhesion and peeling of the resin due to the chemical treatment, further improve the adhesion and suppress discoloration due to the chemical.
本発明の一側面としてのリードフレームは、ＬＥＤチップを実装するために用いられるリードフレームであって、前記ＬＥＤチップを第１の面に実装して該ＬＥＤチップの第１の電極に電気的に接続されるように構成された第１のリードフレーム部と、前記ＬＥＤチップの前記第１の電極とは異なる第２の電極に電気的に接続されるように構成された第２のリードフレーム部と、を有し、前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面には、前記ＬＥＤチップの実装領域を取り囲むように第１の凹溝が形成されている。 A lead frame as one aspect of the present invention is a lead frame used for mounting an LED chip, wherein the LED chip is mounted on a first surface and electrically connected to a first electrode of the LED chip. A first lead frame portion configured to be connected and a second lead frame portion configured to be electrically connected to a second electrode different from the first electrode of the LED chip And a first concave groove is formed on the first surface of the first lead frame portion and the second lead frame portion so as to surround the LED chip mounting region. .
本発明の他の側面としてのＬＥＤパッケージ用基板は、ＬＥＤパッケージを製造するために用いられるＬＥＤパッケージ用基板であって、ＬＥＤチップと、前記ＬＥＤチップを第１の面に実装して該ＬＥＤチップの第１の電極に電気的に接続されるように構成された第１のリードフレーム部と、前記ＬＥＤチップの前記第１の電極とは異なる第２の電極に電気的に接続されるように構成された第２のリードフレーム部と、前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面の少なくとも一部を覆うように形成された樹脂とを有し、前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面には、前記ＬＥＤチップの実装領域を取り囲むように第１の凹溝が形成されており、前記第１の凹溝には、前記樹脂が充填されている。 An LED package substrate according to another aspect of the present invention is an LED package substrate used for manufacturing an LED package, and the LED chip is mounted on the first surface by mounting the LED chip. A first lead frame portion configured to be electrically connected to the first electrode of the LED chip, and a second electrode different from the first electrode of the LED chip to be electrically connected to the first electrode. A second lead frame portion configured; and a resin formed to cover at least a part of the first lead frame portion and the first surface of the second lead frame portion; A first groove is formed on the first surface of the first lead frame portion and the second lead frame portion so as to surround a mounting region of the LED chip. In Serial resin is filled.
本発明の他の目的及び特徴は、以下の実施例において説明される。 Other objects and features of the present invention are illustrated in the following examples.
本発明によれば、薬液処理による境界面におけるリードフレームと樹脂の密着性を向上させ、樹脂剥離を防止し、更には密着性を向上させることと、境界面におけるリードフレームの変色を抑制するように構成されたリードフレーム及びＬＥＤパッケージ用基板を提供することができる。 According to the present invention, the adhesion between the lead frame and the resin at the boundary surface due to the chemical treatment is improved, the resin is prevented from being peeled off, and the adhesion is further improved, and the discoloration of the lead frame at the boundary surface is suppressed. A lead frame and an LED package substrate configured as described above can be provided.
以下、本発明の実施例について、図面を参照しながら詳細に説明する。各図において、同一の部材については同一の参照番号を付し、重複する説明は省略する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In each figure, the same members are denoted by the same reference numerals, and redundant description is omitted.
まず、図１乃至図３を参照して、本実施例におけるリードフレームについて説明する。本実施例のリードフレームは、ＬＥＤパッケージを製造するために用いられるリードフレームである。図１は、リードフレーム１０の表面（第１の面）の全体構成図である。図２は、リードフレーム１０の裏面（第２の面）の全体構成図である。図３は、リードフレーム１０の拡大図であり、図１中の領域１００を拡大したものである。図３（ａ）はリードフレーム１０の表面拡大図、図３（ｂ）は図３（ａ）中のＢ−Ｂ線で切断した断面図、図３（ｃ）はＣ−Ｃ線で切断した断面図である。 First, the lead frame in this embodiment will be described with reference to FIGS. The lead frame of the present embodiment is a lead frame used for manufacturing an LED package. FIG. 1 is an overall configuration diagram of the surface (first surface) of the lead frame 10. FIG. 2 is an overall configuration diagram of the back surface (second surface) of the lead frame 10. FIG. 3 is an enlarged view of the lead frame 10, and is an enlarged view of the region 100 in FIG. 3A is an enlarged view of the surface of the lead frame 10, FIG. 3B is a cross-sectional view taken along line BB in FIG. 3A, and FIG. 3C is cut along line CC. It is sectional drawing.
リードフレーム１０は、例えば、銅合金又は鉄合金等の材料の表面にメッキ層を形成して構成され、短冊状に形成されている。後述のように、リードフレーム１０の上には複数のＬＥＤチップが実装され、樹脂封止後にリードフレーム１０をダイシング（切断）することにより、複数のＬＥＤパッケージが完成する。 The lead frame 10 is configured by forming a plating layer on the surface of a material such as a copper alloy or an iron alloy, and is formed in a strip shape. As will be described later, a plurality of LED chips are mounted on the lead frame 10, and a plurality of LED packages are completed by dicing (cutting) the lead frame 10 after resin sealing.
リードフレーム１０は、後述のＬＥＤチップの第１の電極（アノード電極）に電気的に接続されるように構成されたベース側リードフレーム１０ａ（第１のリードフレーム部）を備える。また、リードフレーム１０は、ＬＥＤチップの第１の電極とは異なる第２の電極（カソード電極）に電気的に接続されるように構成された端子側リードフレーム１０ｂ（第２のリードフレーム部）を備える。後述のように、ＬＥＤチップはベース側リードフレーム１０ａの表面上に実装される。ベース側リードフレーム１０ａと端子側リードフレーム１０ｂの間にはリード形成孔２５ａ（抜き孔）が設けられており、ベース側リードフレーム１０ａと端子側リードフレーム１０ｂは互いに分離されている。ベース側リードフレーム１０ａと端子側リードフレーム１０ｂによりパッド部が構成される。なお、本実施例はこれに限定されるものではなく、上述の構成とは逆に、ＬＥＤチップのカソード電極をベース側リードフレームに接続し、アノード電極を端子側リードフレームに接続するように構成してもよい。 The lead frame 10 includes a base-side lead frame 10a (first lead frame portion) configured to be electrically connected to a first electrode (anode electrode) of an LED chip described later. Further, the lead frame 10 is a terminal-side lead frame 10b (second lead frame portion) configured to be electrically connected to a second electrode (cathode electrode) different from the first electrode of the LED chip. Is provided. As will be described later, the LED chip is mounted on the surface of the base-side lead frame 10a. Between the base side lead frame 10a and the terminal side lead frame 10b, a lead forming hole 25a (extraction hole) is provided, and the base side lead frame 10a and the terminal side lead frame 10b are separated from each other. The base side lead frame 10a and the terminal side lead frame 10b constitute a pad portion. The present embodiment is not limited to this, and conversely to the above configuration, the cathode electrode of the LED chip is connected to the base-side lead frame and the anode electrode is connected to the terminal-side lead frame. May be.
図１及び図２に示されるように、本実施例のリードフレーム１０は、縦５個、横６個の合計３０個のパッド部（単位要素）から構成されており、１つのリードフレーム１０から合計３０個のＬＥＤパッケージが製造される。リードフレーム１０の各パッド部の間は、吊りピン１１を用いて接続されている。このように、隣接するパッド部の間は吊りピン１１で直接繋がっているため、隣接するパッド部の間のスペースをより小さくすることができる。このため、１つのリードフレーム１０に設けられるパッド部の密度（個数）を増加させることができ、その結果、多数のＬＥＤパッケージを効率的に製造することが可能となる。 As shown in FIG. 1 and FIG. 2, the lead frame 10 of this embodiment is composed of a total of 30 pad portions (unit elements) of 5 vertical and 6 horizontal. A total of 30 LED packages are manufactured. The pad portions of the lead frame 10 are connected using suspension pins 11. Thus, since the adjacent pad parts are directly connected by the suspension pin 11, the space between the adjacent pad parts can be further reduced. Therefore, the density (number) of pad portions provided on one lead frame 10 can be increased, and as a result, a large number of LED packages can be efficiently manufactured.
リードフレーム１０のパッド部（ベース側リードフレーム１０ａ、端子側リードフレーム１０ｂ）の表面（ＬＥＤチップ実装面、第１の面）には、凹溝１２（第１の凹溝）が形成されている。凹溝１２は、以後の工程で実装されることになるＬＥＤチップの実装領域を取り囲むように溝が形成される。本実施例のＬＥＤパッケージは、後述のように、樹脂（白樹脂）をリードフレーム１０の表面のみ（片面）に形成するため、ＬＥＤパッケージとして個片化した後に、リードフレーム１０が樹脂から抜け落ちてしまうおそれがある。また、樹脂封止後に生じる樹脂バリを除去するために薬液が使用されるが、この薬液がリードフレーム１０と樹脂との境界面の僅かな隙間から浸入すると、リードフレーム１０が樹脂から剥離し、樹脂が浸食されることによりリードフレームを変色してしまうおそれがある。 A concave groove 12 (first concave groove) is formed on the surface (LED chip mounting surface, first surface) of the pad portion of the lead frame 10 (base-side lead frame 10a, terminal-side lead frame 10b). . The groove 12 is formed so as to surround the mounting area of the LED chip to be mounted in the subsequent process. In the LED package of this embodiment, as will be described later, since the resin (white resin) is formed only on the surface (one side) of the lead frame 10, the lead frame 10 falls out of the resin after being separated into individual LED packages. There is a risk that. In addition, a chemical solution is used to remove the resin burr generated after resin sealing, but when this chemical solution enters from a slight gap at the boundary surface between the lead frame 10 and the resin, the lead frame 10 peels from the resin, If the resin is eroded, the lead frame may be discolored.
そこで、本実施例のようにリードフレーム１０の表面に凹溝１２を形成することにより、上述のようなリードフレーム１０と樹脂の密着性低下や剥離や、樹脂の変色を効果的に抑制することができ、更に密着性を向上させることができる。なお、本実施例において、凹溝１２はエッチング加工により形成されるが、これに限定されるものではなく、機械加工やプレス加工により形成してもよい。また、凹溝１２の断面はＲ形状を有するが、矩形状であってもよい。 Therefore, by forming the concave groove 12 on the surface of the lead frame 10 as in the present embodiment, the above-described decrease in adhesion and peeling between the lead frame 10 and the resin and discoloration of the resin can be effectively suppressed. And the adhesion can be further improved. In this embodiment, the groove 12 is formed by etching, but is not limited to this, and may be formed by machining or pressing. Moreover, although the cross section of the groove 12 has an R shape, it may be rectangular.
また、リードフレーム１０の外周には、第１の面（表面）において、パッド部を取り囲むように凹溝１６（第２の凹溝）が形成されている。更に、凹溝１６の少なくとも一部には、第１の面（表面）と第１の面とは反対側の第２の面（裏面）との間を貫通する複数の貫通孔１５が形成されている。リードフレーム１０の外周に貫通孔１５及び凹溝１６を形成することにより、薬液による樹脂の密着性低下や剥離や、リードフレームの変色を効果的に抑制することができ、更に密着性を向上させることができる。 Further, on the outer periphery of the lead frame 10, a concave groove 16 (second concave groove) is formed on the first surface (front surface) so as to surround the pad portion. Furthermore, a plurality of through holes 15 penetrating between the first surface (front surface) and the second surface (back surface) opposite to the first surface are formed in at least a part of the concave groove 16. ing. By forming the through-holes 15 and the concave grooves 16 on the outer periphery of the lead frame 10, it is possible to effectively suppress the deterioration and peeling of the resin due to the chemical solution and the discoloration of the lead frame, and further improve the adhesion. be able to.
図２及び図３に示されるように、リードフレーム１０の裏面には、段差部１７（ハーフエッジ）が形成されている。段差部１７は、後述の白樹脂２０がリードフレーム１０から抜け落ちるのを防止するために、リードフレーム１０の縁部に設けられている。段差部１７を設けることにより、白樹脂２０をリードフレーム１０に確実に密着させ、白樹脂２０とリードフレーム１０との間の接合性を向上させることができる。なお、本実施例では、段差部１７がリードフレーム１０の裏面（ＬＥＤチップの実装面とは反対側の面）に形成されているが、これに限定されるものではなく、段差部１７をリードフレーム１０の表面（ＬＥＤチップの実装面）に形成してもよい。 As shown in FIGS. 2 and 3, a stepped portion 17 (half edge) is formed on the back surface of the lead frame 10. The step portion 17 is provided at the edge of the lead frame 10 in order to prevent a later-described white resin 20 from falling off the lead frame 10. By providing the stepped portion 17, the white resin 20 can be securely adhered to the lead frame 10, and the bondability between the white resin 20 and the lead frame 10 can be improved. In this embodiment, the stepped portion 17 is formed on the back surface of the lead frame 10 (the surface opposite to the LED chip mounting surface). However, the present invention is not limited to this. It may be formed on the surface of the frame 10 (LED chip mounting surface).
また、リードフレーム１０の吊りピン１１の裏面には、凹部１８が形成されている。凹部１８は、ＬＥＤパッケージに個片化する際の切断部位に形成されている。リードフレーム１０の切断部位に凹部１８を形成することにより、ＬＥＤパッケージに個片化する際に、ダイサーブレードの磨耗を少なくし、リードフレーム１０の切断を容易にすることができる。なお、本実施例において、凹部１８はエッチング加工により形成されるが、これに限定されるものではなく、機械加工やプレス加工により形成してもよい。また、凹部１８の断面は矩形状であるが、Ｒ形状であってもよい。 Further, a recess 18 is formed on the back surface of the suspension pin 11 of the lead frame 10. The recess 18 is formed at a cutting site when the LED package is separated. By forming the recess 18 at the cutting portion of the lead frame 10, when dicing into LED packages, the wear of the dicer blade can be reduced and the lead frame 10 can be easily cut. In this embodiment, the recess 18 is formed by etching, but is not limited to this, and may be formed by machining or pressing. Moreover, although the cross section of the recessed part 18 is rectangular shape, R shape may be sufficient.
更にリードフレーム１０のサイドレール上には、複数のアライメントマーク１９が形成されている。本実施例において、アライメントマーク１９の幅は０．５ｍｍであり、リードフレーム１０を切断するために用いられるダイサーブレードの幅（例えば、０．２〜０．３ｍｍ）よりも広い。このため、切断時におけるダイサーブレードの磨耗を少なくすることができる。 Further, a plurality of alignment marks 19 are formed on the side rails of the lead frame 10. In the present embodiment, the width of the alignment mark 19 is 0.5 mm, which is wider than the width of the dicer blade used for cutting the lead frame 10 (for example, 0.2 to 0.3 mm). For this reason, wear of the dicer blade during cutting can be reduced.
次に、図４乃至図６を参照して、本実施例における一次成形後のリードフレーム（ＬＥＤパッケージを製造するために用いられるＬＥＤパッケージ用基板）について説明する。図４は、一次成形後のリードフレーム（ＬＥＤパッケージ用基板）の全体構成図である。図４（ａ）はＬＥＤパッケージ用基板の平面図であり、図４（ｂ）及び図４（ｃ）は、図４（ａ）を正面側及び右側のそれぞれから見た場合の側面図である。図４（ａ）中の破線で表される領域１５０は、最終製品であるＬＥＤパッケージの外形である。 Next, with reference to FIG. 4 thru | or FIG. 6, the lead frame (LED package board | substrate used in order to manufacture an LED package) after the primary shaping | molding in a present Example is demonstrated. FIG. 4 is an overall configuration diagram of the lead frame (LED package substrate) after the primary molding. 4A is a plan view of the LED package substrate, and FIGS. 4B and 4C are side views when FIG. 4A is viewed from the front side and the right side, respectively. . A region 150 indicated by a broken line in FIG. 4A is the outer shape of the LED package that is the final product.
２０は、一次成形樹脂としての白樹脂である。白樹脂２０は、例えば、シリカ及び酸化チタン等を含有したエポキシ又はシリコーン樹脂である。白樹脂２０は、不図示の金型を用いてリードフレーム１０を両面からクランプし、トランスファ成形により樹脂を流し込んで硬化させることにより、リードフレーム１０のＬＥＤチップ実装面上に一体的に形成される。このように、本実施例におけるＬＥＤパッケージ用基板は、白樹脂２０で一括して成形されたマップ構造を有する。 Reference numeral 20 denotes a white resin as a primary molding resin. The white resin 20 is, for example, an epoxy or silicone resin containing silica and titanium oxide. The white resin 20 is integrally formed on the LED chip mounting surface of the lead frame 10 by clamping the lead frame 10 from both sides using a mold (not shown), and pouring and curing the resin by transfer molding. . As described above, the LED package substrate in the present embodiment has a map structure that is molded together with the white resin 20.
白樹脂２０は、ＬＥＤチップから発せられた光を上方に反射させるリフレクタとして機能する。また、白樹脂２０は、ＬＥＤパッケージの強度を向上させるという機能も有する。図４（ａ）に示されるように、白樹脂２０は、ＬＥＤチップが搭載されることになるリードフレーム１０上の所定の領域には形成されない。この領域は、ＬＥＤチップを実装するためのＬＥＤチップ実装領域２５であり、一次成形後でもリードフレーム１０の表面が露出した領域である。 The white resin 20 functions as a reflector that reflects light emitted from the LED chip upward. The white resin 20 also has a function of improving the strength of the LED package. As shown in FIG. 4A, the white resin 20 is not formed in a predetermined region on the lead frame 10 where the LED chip is to be mounted. This area is an LED chip mounting area 25 for mounting an LED chip, and is an area where the surface of the lead frame 10 is exposed even after primary molding.
図５は、一次成形後のリードフレーム（ＬＥＤパッケージ用基板）の一個片の構成図である。図５は、図４（ａ）中の領域１５０を拡大し、リードフレーム１０上にＬＥＤチップ４０を実装した後の状態を示している。図５（ａ）は平面図であり、図５（ｂ）及び図５（ｃ）は、図５（ａ）のＢ−Ｂ線及びＣ−Ｃ線のそれぞれの断面図である。 FIG. 5 is a block diagram of a single piece of lead frame (LED package substrate) after primary molding. FIG. 5 shows a state after the area 150 in FIG. 4A is enlarged and the LED chip 40 is mounted on the lead frame 10. 5A is a plan view, and FIGS. 5B and 5C are cross-sectional views taken along lines BB and CC in FIG. 5A, respectively.
ＬＥＤチップ４０は、ＬＥＤチップ実装領域２５内のベース側リードフレーム１０ａの上に実装される。ＬＥＤチップ４０は、アノード電極（正極）及びカソード電極（負極) の一対の電極を備え、これらの電極の間に順バイアスの所定電圧を印加することにより光を放出する素子である。前述のように、リードフレーム１０は、ベース側リードフレーム１０ａ（アノード電極部）と端子側リードフレーム１０ｂ（カソード電極部）とに分離されており、各電極に電気的に接続される。 The LED chip 40 is mounted on the base-side lead frame 10a in the LED chip mounting area 25. The LED chip 40 is an element that includes a pair of electrodes of an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light by applying a predetermined voltage of a forward bias between these electrodes. As described above, the lead frame 10 is separated into the base-side lead frame 10a (anode electrode portion) and the terminal-side lead frame 10b (cathode electrode portion), and is electrically connected to each electrode.
ボンディングワイヤ４３は、例えば金ワイヤであり、ＬＥＤチップ４０のアノード電極とベース側リードフレーム１０ａとの間を電気的に接続する。ボンディングワイヤ４５は、例えば金ワイヤであり、ＬＥＤチップ４０のカソード電極と端子側リードフレーム１０ｂとの間を電気的に接続する。なお、図５中にはボンディングワイヤ４３、４５がそれぞれ一本だけ示されているが、本実施例はこれに限定されるものではなく、搭載されるＬＥＤチップにより必要に応じてボンディングワイヤ４３、４５のそれぞれを複数本設けてもよい。また、ＬＥＤチップ４０として、フリップチップタイプのチップを用いてもよい。この場合には、リード形成孔２５ａ（抜き孔）を跨ぐようにＬＥＤチップを配置して、ＬＥＤチップの下面に形成された各電極をベース側リードフレーム１０ａ及び端子側リードフレーム１０ｂのそれぞれにボンディングして実装する。このため、ボンディングワイヤ４３、４５は不要となる。 The bonding wire 43 is, for example, a gold wire, and electrically connects the anode electrode of the LED chip 40 and the base-side lead frame 10a. The bonding wire 45 is, for example, a gold wire, and electrically connects the cathode electrode of the LED chip 40 and the terminal side lead frame 10b. In FIG. 5, only one bonding wire 43, 45 is shown, but this embodiment is not limited to this, and the bonding wire 43, A plurality of each of 45 may be provided. Further, as the LED chip 40, a flip chip type chip may be used. In this case, the LED chip is arranged so as to straddle the lead forming hole 25a (extract hole), and each electrode formed on the lower surface of the LED chip is bonded to each of the base side lead frame 10a and the terminal side lead frame 10b. And implement. For this reason, the bonding wires 43 and 45 are unnecessary.
図５に示されるように、リフレクタとしての白樹脂２０は、ＬＥＤチップ実装領域２５（ＬＥＤチップ４０）を取り囲むように、リードフレーム１０の上に環状に成形されている。また、リフレクタとしての白樹脂２０は、リードフレーム１０から離れるほど（上側に行くほど）ＬＥＤチップ実装領域２５の径が大きくなるすり鉢形状となっている。リフレクタとしての白樹脂２０は、このような形状を有することにより、ＬＥＤチップ４０から発せられた光を上方に効率よく反射させることが可能である。このように、ベース側リードフレーム１０ａ及び端子側リードフレーム１０ｂの表面（第１の面）の少なくとも一部を覆うように白樹脂２０が形成されている。また、パッド部に形成された凹溝１２には白樹脂２０が充填されている。 As shown in FIG. 5, the white resin 20 as a reflector is formed in an annular shape on the lead frame 10 so as to surround the LED chip mounting region 25 (LED chip 40). Further, the white resin 20 as the reflector has a mortar shape in which the diameter of the LED chip mounting region 25 increases as the distance from the lead frame 10 increases. By having such a shape, the white resin 20 as a reflector can efficiently reflect the light emitted from the LED chip 40 upward. As described above, the white resin 20 is formed so as to cover at least a part of the surface (first surface) of the base-side lead frame 10a and the terminal-side lead frame 10b. Moreover, the white resin 20 is filled in the concave groove 12 formed in the pad portion.
図６は、一次成形後のリードフレーム（ＬＥＤパッケージ用基板）の裏面拡大図である。図６に示されるように、リードフレーム１０の裏面に段差部１７を設けることにより、リード形成孔２５ａに充填された白樹脂２０をリードフレーム１０に確実に密着させ、白樹脂２０とリードフレーム１０との間の接合性を向上させることができる。なお、本実施例では、段差部１７がリードフレーム１０の裏面（ＬＥＤチップの実装面とは反対側の面）に形成されているが、これに限定されるものではなく、段差部１７をリードフレーム１０のＬＥＤチップの実装面に形成してもよい。また、リードフレーム１０には、ダイサーブレードによる個片化の際の切断部位（吊りピン１１）において、凹部１８が形成されている。このため、切断時におけるダイサーブレードの磨耗を少なくすることができる。 FIG. 6 is an enlarged view of the back surface of the lead frame (LED package substrate) after the primary molding. As shown in FIG. 6, by providing the stepped portion 17 on the back surface of the lead frame 10, the white resin 20 filled in the lead formation hole 25 a is securely adhered to the lead frame 10, and the white resin 20 and the lead frame 10 are Can be improved. In this embodiment, the stepped portion 17 is formed on the back surface of the lead frame 10 (the surface opposite to the LED chip mounting surface). However, the present invention is not limited to this. You may form in the mounting surface of the LED chip of the flame | frame 10. Further, the lead frame 10 is formed with a concave portion 18 at a cutting site (hanging pin 11) at the time of singulation with a dicer blade. For this reason, wear of the dicer blade during cutting can be reduced.
図７は、本実施例における二次成形後のリードフレーム（ＬＥＤパッケージ用基板）の全体構成図である。図７（ａ）はＬＥＤパッケージ用基板の平面図であり、図７（ｂ）及び図７（ｃ）は、図７（ａ）を正面側及び右側のそれぞれから見た場合の側面図である。図７のＬＥＤパッケージ用基板は、図７に示される一次成形後のリードフレームに、さらに、二次成形樹脂としての透明樹脂３０が形成されたものである。 FIG. 7 is an overall configuration diagram of the lead frame (LED package substrate) after the secondary molding in the present embodiment. Fig.7 (a) is a top view of the board | substrate for LED packages, FIG.7 (b) and FIG.7 (c) are side views at the time of seeing Fig.7 (a) from each of the front side and the right side. . The LED package substrate of FIG. 7 is obtained by further forming a transparent resin 30 as a secondary molding resin on the lead frame after the primary molding shown in FIG.
透明樹脂３０としては、透光性を有するシリコーン樹脂が用いられる。シリコーン樹脂は、ＬＥＤチップ４０の発光波長が青色光等の短波長である場合や、ＬＥＤチップが高輝度ＬＥＤであり多量の熱を発生する場合に、その光や熱による変色や劣化に対する耐久性に優れている。ただし、本実施例の透明樹脂３０はシリコーン樹脂に限定されるものではなく、例えばエポキシ樹脂を採用してもよい。 As the transparent resin 30, a translucent silicone resin is used. Silicone resin has durability against discoloration or deterioration due to light or heat when the emission wavelength of LED chip 40 is a short wavelength such as blue light or when the LED chip is a high-brightness LED and generates a large amount of heat. Is excellent. However, the transparent resin 30 of the present embodiment is not limited to the silicone resin, and for example, an epoxy resin may be adopted.
透明樹脂３０は、不図示の金型を用いてリードフレーム１０を両面からクランプし、トランスファ成形により樹脂を流し込んで硬化させることにより、リードフレーム１０のＬＥＤチップ実装領域２５の上に一体的に形成される。図７に示されるように、ＬＥＤチップ実装領域２５の上方には球状（半球状）のレンズ部３０ａが形成されている。レンズ部３０ａは、透明樹脂３０によりその他の部位と一体的に形成されている。図７（ａ）乃至図７（ｃ）に示されるように、透明樹脂３０は、白樹脂２０の上面の全てを覆うように形成され、ＬＥＤチップ４０を封止する。 The transparent resin 30 is integrally formed on the LED chip mounting region 25 of the lead frame 10 by clamping the lead frame 10 from both sides using a mold (not shown), and pouring and curing the resin by transfer molding. Is done. As shown in FIG. 7, a spherical (hemispherical) lens portion 30 a is formed above the LED chip mounting region 25. The lens part 30 a is formed integrally with other parts by the transparent resin 30. As shown in FIGS. 7A to 7C, the transparent resin 30 is formed so as to cover the entire top surface of the white resin 20 and seals the LED chip 40.
図８は、本実施例における二次成形後のリードフレームの一個片（最終成形品であるＬＥＤパッケージ）の構成図である。図８は、図７（ａ）中の領域１５０を拡大した図を示している。図８（ａ）は平面図であり、図８（ｂ）及び図８（ｃ）は、図８（ａ）の下側及び右側から見た場合の側面図である。本実施例のＬＥＤパッケージは、複数のＬＥＤチップ４０を実装したリードフレーム１０を切断することにより形成され、少なくとも一つのＬＥＤチップ４０を有する。図８（ａ）乃至図８（ｃ）に示されるように、ＬＥＤチップ実装領域２５の全ては、透明樹脂３０で充填されている。また、ＬＥＤチップ実装領域２５の上方には、透明樹脂３０により球状のレンズ部３０ａが形成されている。 FIG. 8 is a configuration diagram of a single piece of the lead frame (secondary molded LED package) after the secondary molding in the present embodiment. FIG. 8 shows an enlarged view of the region 150 in FIG. FIG. 8A is a plan view, and FIG. 8B and FIG. 8C are side views when viewed from the lower side and the right side of FIG. 8A. The LED package of this embodiment is formed by cutting the lead frame 10 on which a plurality of LED chips 40 are mounted, and has at least one LED chip 40. As shown in FIGS. 8A to 8C, the entire LED chip mounting area 25 is filled with the transparent resin 30. In addition, a spherical lens portion 30 a is formed of the transparent resin 30 above the LED chip mounting region 25.
本実施例によれば、薬液処理による樹脂の密着性低下や剥離やリードフレームの変色を抑制するようし、更に密着性を向上させることができるように構成されたリードフレーム及びＬＥＤパッケージ用基板を提供することができる。 According to the present embodiment, the lead frame and the LED package substrate configured to suppress the decrease in adhesion and peeling of the resin and the discoloration of the lead frame due to the chemical treatment, and to further improve the adhesion. Can be provided.
以上、本発明の実施例について具体的に説明した。ただし、本発明は上記実施例として記載された事項に限定されるものではなく、本発明の技術思想を逸脱しない範囲内で適宜変更が可能である。 The embodiment of the present invention has been specifically described above. However, the present invention is not limited to the matters described as the above-described embodiments, and can be appropriately changed without departing from the technical idea of the present invention.
１０ リードフレーム
１２ 凹溝
１５ 貫通孔
１６ 凹溝
１７ 段差部
１８ 凹部
２０ 白樹脂
２５ ＬＥＤチップ実装領域
３０ 透明樹脂
３０ａ レンズ部
４０ ＬＥＤチップ
DESCRIPTION OF SYMBOLS 10 Lead frame 12 Concave groove 15 Through hole 16 Concave groove 17 Step part 18 Concave part 20 White resin 25 LED chip mounting area 30 Transparent resin 30a Lens part 40 LED chip
Claims (5)
前記ＬＥＤチップを第１の面に実装して該ＬＥＤチップの第１の電極に電気的に接続されるように構成された第１のリードフレーム部と、
前記ＬＥＤチップの前記第１の電極とは異なる第２の電極に電気的に接続されるように構成された第２のリードフレーム部とを有し、
前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面には、前記ＬＥＤチップの実装領域を取り囲むように第１の凹溝が形成されていることを特徴とするリードフレーム。 A lead frame used for mounting an LED chip,
A first lead frame portion configured to be mounted on the first surface and electrically connected to the first electrode of the LED chip;
A second lead frame portion configured to be electrically connected to a second electrode different from the first electrode of the LED chip;
A lead having a first groove formed on the first surface of the first lead frame portion and the second lead frame portion so as to surround a mounting region of the LED chip. flame.
前記第２の凹溝の少なくとも一部には、前記第１の面と該第１の面とは反対側の第２の面との間を貫通する貫通孔が形成されていることを特徴とする請求項１に記載のリードフレーム。 On the outer periphery of the lead frame, a second concave groove is formed on the first surface so as to surround a pad portion configured to include the first lead frame portion and the second lead frame portion. And
A through-hole penetrating between the first surface and the second surface opposite to the first surface is formed in at least a part of the second concave groove. The lead frame according to claim 1.
前記吊りピンの前記第２の面には凹部が形成されていることを特徴とする請求項２に記載のリードフレーム。 It further has a hanging pin that connects between the adjacent pad parts,
The lead frame according to claim 2, wherein a recess is formed in the second surface of the suspension pin.
ＬＥＤチップと、
前記ＬＥＤチップを第１の面に実装して該ＬＥＤチップの第１の電極に電気的に接続されるように構成された第１のリードフレーム部と、
前記ＬＥＤチップの前記第１の電極とは異なる第２の電極に電気的に接続されるように構成された第２のリードフレーム部と、
前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面の少なくとも一部を覆うように形成された樹脂と、を有し、
前記第１のリードフレーム部及び前記第２のリードフレーム部の前記第１の面には、前記ＬＥＤチップの実装領域を取り囲むように第１の凹溝が形成されており、
前記第１の凹溝には、前記樹脂が充填されていることを特徴とするＬＥＤパッケージ用基板。 An LED package substrate used for manufacturing an LED package,
An LED chip;
A first lead frame portion configured to be mounted on the first surface and electrically connected to the first electrode of the LED chip;
A second lead frame portion configured to be electrically connected to a second electrode different from the first electrode of the LED chip;
A resin formed so as to cover at least part of the first surface of the first lead frame part and the second lead frame part,
A first groove is formed on the first surface of the first lead frame portion and the second lead frame portion so as to surround the LED chip mounting region.
The LED package substrate, wherein the first groove is filled with the resin.
前記第２の凹溝の少なくとも一部には、前記第１の面と該第１の面とは反対側の第２の面との間を貫通する貫通孔が形成されていることを特徴とする請求項４に記載のＬＥＤパッケージ用基板。 On the outer periphery of the lead frame, a second concave groove is formed on the first surface so as to surround a pad portion configured to include the first lead frame portion and the second lead frame portion. And
A through-hole penetrating between the first surface and the second surface opposite to the first surface is formed in at least a part of the second concave groove. The LED package substrate according to claim 4.
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