EP3872875A4 - Bus bar assembly and manufacturing method therefor - Google Patents

Bus bar assembly and manufacturing method therefor Download PDF

Info

Publication number
EP3872875A4
EP3872875A4 EP19875983.9A EP19875983A EP3872875A4 EP 3872875 A4 EP3872875 A4 EP 3872875A4 EP 19875983 A EP19875983 A EP 19875983A EP 3872875 A4 EP3872875 A4 EP 3872875A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
bus bar
bar assembly
method therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19875983.9A
Other languages
German (de)
French (fr)
Other versions
EP3872875A1 (en
Inventor
Yuusuke Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suncall Corp
Original Assignee
Suncall Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suncall Corp filed Critical Suncall Corp
Publication of EP3872875A1 publication Critical patent/EP3872875A1/en
Publication of EP3872875A4 publication Critical patent/EP3872875A4/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02—Single bars, rods, wires, or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Connection Or Junction Boxes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Insulated Conductors (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
EP19875983.9A 2018-10-23 2019-10-16 Bus bar assembly and manufacturing method therefor Pending EP3872875A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018199259A JP7271130B2 (en) 2018-10-23 2018-10-23 busbar assembly
PCT/JP2019/040552 WO2020085154A1 (en) 2018-10-23 2019-10-16 Bus bar assembly and manufacturing method therefor

Publications (2)

Publication Number Publication Date
EP3872875A1 EP3872875A1 (en) 2021-09-01
EP3872875A4 true EP3872875A4 (en) 2022-08-03

Family

ID=70331576

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19875983.9A Pending EP3872875A4 (en) 2018-10-23 2019-10-16 Bus bar assembly and manufacturing method therefor

Country Status (4)

Country Link
EP (1) EP3872875A4 (en)
JP (1) JP7271130B2 (en)
CN (1) CN112956040B (en)
WO (1) WO2020085154A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022063465A (en) * 2020-10-12 2022-04-22 サンコール株式会社 Busbar assembly and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159837A (en) * 2010-02-01 2011-08-18 Apic Yamada Corp Lead frame and substrate for led package
JP2012195430A (en) * 2011-03-16 2012-10-11 Sanken Electric Co Ltd Light emitting diode and method for manufacturing the same
US20130049061A1 (en) * 2011-08-24 2013-02-28 Toyoda Gosei Co., Ltd. Light-emitting device and method of manufacturing the same
JP2013062491A (en) * 2011-08-23 2013-04-04 Dainippon Printing Co Ltd Optical semiconductor device lead frame, optical semiconductor device lead frame with resin and optical semiconductor device
US20130187188A1 (en) * 2012-01-20 2013-07-25 Nichia Corporation Molded package and light emitting device
US20140339595A1 (en) * 2013-05-15 2014-11-20 Rohm Co., Ltd. Led module

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4610263B2 (en) * 2004-08-31 2011-01-12 株式会社小糸製作所 Manufacturing method of LED wiring unit
JP2006269079A (en) 2005-03-22 2006-10-05 Hitachi Lighting Ltd Light source module, liquid crystal display device and manufacturing method for light source module
JP4432913B2 (en) 2006-02-10 2010-03-17 株式会社デンソー Laminated bus bar assembly and molding apparatus therefor
KR101367380B1 (en) * 2007-09-28 2014-02-27 서울반도체 주식회사 Led package
US8277093B2 (en) * 2009-03-09 2012-10-02 Yazaki Corporation Connector, LED unit, and method for producing connector
JP2011134961A (en) * 2009-12-25 2011-07-07 Hitachi Chem Co Ltd Semiconductor device, wiring base material for mounting and connecting semiconductor element, wiring board for mounting semiconductor device and method for manufacturing the same
JP6487769B2 (en) 2015-05-18 2019-03-20 サンコール株式会社 Manufacturing method of laminated busbar unit
JP6619317B2 (en) * 2016-10-03 2019-12-11 豊田鉄工株式会社 Manufacturing method of bus bar resin molded product

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011159837A (en) * 2010-02-01 2011-08-18 Apic Yamada Corp Lead frame and substrate for led package
JP2012195430A (en) * 2011-03-16 2012-10-11 Sanken Electric Co Ltd Light emitting diode and method for manufacturing the same
JP2013062491A (en) * 2011-08-23 2013-04-04 Dainippon Printing Co Ltd Optical semiconductor device lead frame, optical semiconductor device lead frame with resin and optical semiconductor device
US20130049061A1 (en) * 2011-08-24 2013-02-28 Toyoda Gosei Co., Ltd. Light-emitting device and method of manufacturing the same
US20130187188A1 (en) * 2012-01-20 2013-07-25 Nichia Corporation Molded package and light emitting device
US20140339595A1 (en) * 2013-05-15 2014-11-20 Rohm Co., Ltd. Led module

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020085154A1 *

Also Published As

Publication number Publication date
WO2020085154A1 (en) 2020-04-30
EP3872875A1 (en) 2021-09-01
JP7271130B2 (en) 2023-05-11
CN112956040A (en) 2021-06-11
JP2020068261A (en) 2020-04-30
CN112956040B (en) 2024-01-09

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A4 Supplementary search report drawn up and despatched

Effective date: 20220701

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 33/48 20100101ALI20220627BHEP

Ipc: H01L 23/28 20060101ALI20220627BHEP

Ipc: H01L 23/08 20060101ALI20220627BHEP

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