JP2011118163A - 光電気モジュール及びその製造方法並びに光電気モジュール基板 - Google Patents

光電気モジュール及びその製造方法並びに光電気モジュール基板 Download PDF

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JP2011118163A
JP2011118163A JP2009275618A JP2009275618A JP2011118163A JP 2011118163 A JP2011118163 A JP 2011118163A JP 2009275618 A JP2009275618 A JP 2009275618A JP 2009275618 A JP2009275618 A JP 2009275618A JP 2011118163 A JP2011118163 A JP 2011118163A
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cladding layer
core
substrate
optical waveguide
forming
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JP2009275618A
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Japanese (ja)
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JP2011118163A5 (https=
Inventor
Kazuki Kobayashi
和貴 小林
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Publication of JP2011118163A5 publication Critical patent/JP2011118163A5/ja
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JP2009275618A 2009-12-03 2009-12-03 光電気モジュール及びその製造方法並びに光電気モジュール基板 Pending JP2011118163A (ja)

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JP2009275618A JP2011118163A (ja) 2009-12-03 2009-12-03 光電気モジュール及びその製造方法並びに光電気モジュール基板

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JP2009275618A JP2011118163A (ja) 2009-12-03 2009-12-03 光電気モジュール及びその製造方法並びに光電気モジュール基板

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JP2011118163A true JP2011118163A (ja) 2011-06-16
JP2011118163A5 JP2011118163A5 (https=) 2012-11-01

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222075A (ja) * 2012-04-17 2013-10-28 Internatl Business Mach Corp <Ibm> 半導体上の発光素子または受光素子と光導波路との間の光の接続損失を低減させることに役立つ、スペーサ樹脂パターンの設計
CN103760635A (zh) * 2014-01-28 2014-04-30 华进半导体封装先导技术研发中心有限公司 玻璃基三维光电同传器件及其制作方法
US9983368B2 (en) 2016-04-06 2018-05-29 Shinko Electric Industries Co., Ltd. Optical waveguide device
US10185082B2 (en) 2017-04-28 2019-01-22 Shinko Electric Industries Co., Ltd. Optical waveguide apparatus
JP2019029389A (ja) * 2017-07-26 2019-02-21 京セラ株式会社 光回路基板
CN116031254A (zh) * 2023-01-29 2023-04-28 深南电路股份有限公司 一种局部凸台式光电共封装结构及其制作方法
WO2024063015A1 (ja) * 2022-09-20 2024-03-28 イビデン株式会社 配線基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08160236A (ja) * 1994-12-07 1996-06-21 Sumitomo Electric Ind Ltd 光導波路の作製方法
JP2005106861A (ja) * 2003-09-26 2005-04-21 Mitsumi Electric Co Ltd 高分子光導波路デバイス及びその製造方法
JP2005300913A (ja) * 2004-04-12 2005-10-27 Sharp Corp 微小ミラーの製造方法
JP2006073653A (ja) * 2004-08-31 2006-03-16 Shinko Electric Ind Co Ltd 積層型基板、積層型基板の製造方法および半導体装置
JP2006119216A (ja) * 2004-10-19 2006-05-11 Shinko Electric Ind Co Ltd 光導波路の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08160236A (ja) * 1994-12-07 1996-06-21 Sumitomo Electric Ind Ltd 光導波路の作製方法
JP2005106861A (ja) * 2003-09-26 2005-04-21 Mitsumi Electric Co Ltd 高分子光導波路デバイス及びその製造方法
JP2005300913A (ja) * 2004-04-12 2005-10-27 Sharp Corp 微小ミラーの製造方法
JP2006073653A (ja) * 2004-08-31 2006-03-16 Shinko Electric Ind Co Ltd 積層型基板、積層型基板の製造方法および半導体装置
JP2006119216A (ja) * 2004-10-19 2006-05-11 Shinko Electric Ind Co Ltd 光導波路の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013222075A (ja) * 2012-04-17 2013-10-28 Internatl Business Mach Corp <Ibm> 半導体上の発光素子または受光素子と光導波路との間の光の接続損失を低減させることに役立つ、スペーサ樹脂パターンの設計
CN103760635A (zh) * 2014-01-28 2014-04-30 华进半导体封装先导技术研发中心有限公司 玻璃基三维光电同传器件及其制作方法
US9983368B2 (en) 2016-04-06 2018-05-29 Shinko Electric Industries Co., Ltd. Optical waveguide device
US10185082B2 (en) 2017-04-28 2019-01-22 Shinko Electric Industries Co., Ltd. Optical waveguide apparatus
JP2019029389A (ja) * 2017-07-26 2019-02-21 京セラ株式会社 光回路基板
WO2024063015A1 (ja) * 2022-09-20 2024-03-28 イビデン株式会社 配線基板
CN116031254A (zh) * 2023-01-29 2023-04-28 深南电路股份有限公司 一种局部凸台式光电共封装结构及其制作方法

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