JP2011108782A5 - - Google Patents
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- Publication number
- JP2011108782A5 JP2011108782A5 JP2009261018A JP2009261018A JP2011108782A5 JP 2011108782 A5 JP2011108782 A5 JP 2011108782A5 JP 2009261018 A JP2009261018 A JP 2009261018A JP 2009261018 A JP2009261018 A JP 2009261018A JP 2011108782 A5 JP2011108782 A5 JP 2011108782A5
- Authority
- JP
- Japan
- Prior art keywords
- gas
- substrate
- substrate processing
- chf
- deposition step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 19
- 238000000151 deposition Methods 0.000 claims 11
- 230000008021 deposition Effects 0.000 claims 9
- 238000003672 processing method Methods 0.000 claims 6
- 238000005530 etching Methods 0.000 claims 3
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009261018A JP5357710B2 (ja) | 2009-11-16 | 2009-11-16 | 基板処理方法，基板処理装置，プログラムを記録した記録媒体 |
| US12/943,967 US8524331B2 (en) | 2009-11-16 | 2010-11-11 | Substrate processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009261018A JP5357710B2 (ja) | 2009-11-16 | 2009-11-16 | 基板処理方法，基板処理装置，プログラムを記録した記録媒体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011108782A JP2011108782A (ja) | 2011-06-02 |
| JP2011108782A5 true JP2011108782A5 (cg-RX-API-DMAC7.html) | 2012-12-27 |
| JP5357710B2 JP5357710B2 (ja) | 2013-12-04 |
Family
ID=44011469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009261018A Expired - Fee Related JP5357710B2 (ja) | 2009-11-16 | 2009-11-16 | 基板処理方法，基板処理装置，プログラムを記録した記録媒体 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8524331B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5357710B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2251452B1 (en) | 2009-05-13 | 2018-07-18 | SiO2 Medical Products, Inc. | Pecvd apparatus for vessel coating |
| US9458536B2 (en) | 2009-07-02 | 2016-10-04 | Sio2 Medical Products, Inc. | PECVD coating methods for capped syringes, cartridges and other articles |
| US11624115B2 (en) | 2010-05-12 | 2023-04-11 | Sio2 Medical Products, Inc. | Syringe with PECVD lubrication |
| US9878101B2 (en) | 2010-11-12 | 2018-01-30 | Sio2 Medical Products, Inc. | Cyclic olefin polymer vessels and vessel coating methods |
| US9272095B2 (en) | 2011-04-01 | 2016-03-01 | Sio2 Medical Products, Inc. | Vessels, contact surfaces, and coating and inspection apparatus and methods |
| KR20130004830A (ko) * | 2011-07-04 | 2013-01-14 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| CN103930595A (zh) | 2011-11-11 | 2014-07-16 | Sio2医药产品公司 | 用于药物包装的钝化、pH保护性或润滑性涂层、涂布方法以及设备 |
| US11116695B2 (en) | 2011-11-11 | 2021-09-14 | Sio2 Medical Products, Inc. | Blood sample collection tube |
| EP2846755A1 (en) | 2012-05-09 | 2015-03-18 | SiO2 Medical Products, Inc. | Saccharide protective coating for pharmaceutical package |
| US20150297800A1 (en) | 2012-07-03 | 2015-10-22 | Sio2 Medical Products, Inc. | SiOx BARRIER FOR PHARMACEUTICAL PACKAGE AND COATING PROCESS |
| US9664626B2 (en) | 2012-11-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Coating inspection method |
| WO2014078666A1 (en) | 2012-11-16 | 2014-05-22 | Sio2 Medical Products, Inc. | Method and apparatus for detecting rapid barrier coating integrity characteristics |
| CN103832965B (zh) * | 2012-11-23 | 2017-02-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片刻蚀方法 |
| EP2925903B1 (en) | 2012-11-30 | 2022-04-13 | Si02 Medical Products, Inc. | Controlling the uniformity of pecvd deposition on medical syringes, cartridges, and the like |
| US9764093B2 (en) | 2012-11-30 | 2017-09-19 | Sio2 Medical Products, Inc. | Controlling the uniformity of PECVD deposition |
| US9662450B2 (en) | 2013-03-01 | 2017-05-30 | Sio2 Medical Products, Inc. | Plasma or CVD pre-treatment for lubricated pharmaceutical package, coating process and apparatus |
| US9937099B2 (en) | 2013-03-11 | 2018-04-10 | Sio2 Medical Products, Inc. | Trilayer coated pharmaceutical packaging with low oxygen transmission rate |
| WO2014164928A1 (en) | 2013-03-11 | 2014-10-09 | Sio2 Medical Products, Inc. | Coated packaging |
| WO2014144926A1 (en) | 2013-03-15 | 2014-09-18 | Sio2 Medical Products, Inc. | Coating method |
| EP3122917B1 (en) | 2014-03-28 | 2020-05-06 | SiO2 Medical Products, Inc. | Antistatic coatings for plastic vessels |
| EP4001456A1 (en) | 2015-08-18 | 2022-05-25 | SiO2 Medical Products, Inc. | Pharmaceutical and other packaging with low oxygen transmission rate |
| JP7323409B2 (ja) * | 2019-10-01 | 2023-08-08 | 東京エレクトロン株式会社 | 基板処理方法、及び、プラズマ処理装置 |
| US12480212B2 (en) * | 2022-03-30 | 2025-11-25 | Applied Materials, Inc. | Chemical-dose substrate deposition monitoring |
| US12333700B2 (en) | 2022-03-30 | 2025-06-17 | Applied Materials, Inc. | Chemical-dose substrate deposition monitoring |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5290383A (en) * | 1991-03-24 | 1994-03-01 | Tokyo Electron Limited | Plasma-process system with improved end-point detecting scheme |
| JP2001267310A (ja) * | 2000-03-17 | 2001-09-28 | Tokyo Electron Ltd | プラズマ成膜方法及びその装置 |
| KR100361585B1 (ko) * | 2000-11-11 | 2002-11-22 | 한국과학기술연구원 | 트리플루오로메탄(ｒ２３)과테트라플루오로에틸렌(ｔｆｅ)의 열분해 반응에 의한헥사플루오로프로필렌(ｈｅｆ)의 제조방법 |
| US7169695B2 (en) | 2002-10-11 | 2007-01-30 | Lam Research Corporation | Method for forming a dual damascene structure |
| JP2004152977A (ja) * | 2002-10-30 | 2004-05-27 | Renesas Technology Corp | 半導体記憶装置 |
| JP2004311706A (ja) * | 2003-04-07 | 2004-11-04 | Toshiba Corp | 半導体装置及びその製造方法 |
| JP4422624B2 (ja) * | 2004-03-03 | 2010-02-24 | 日本航空電子工業株式会社 | 微小可動デバイス及びその作製方法 |
| JP2006156591A (ja) * | 2004-11-26 | 2006-06-15 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
| US7271107B2 (en) * | 2005-02-03 | 2007-09-18 | Lam Research Corporation | Reduction of feature critical dimensions using multiple masks |
| JP2007194284A (ja) * | 2006-01-17 | 2007-08-02 | Tokyo Electron Ltd | プラズマ処理方法、プラズマ処理装置、及び記憶媒体 |
| JP4946138B2 (ja) * | 2006-03-31 | 2012-06-06 | 東京エレクトロン株式会社 | エッチング方法 |
| US7309646B1 (en) * | 2006-10-10 | 2007-12-18 | Lam Research Corporation | De-fluoridation process |
| JP5161503B2 (ja) * | 2007-07-09 | 2013-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP5276926B2 (ja) * | 2008-08-25 | 2013-08-28 | ラピスセミコンダクタ株式会社 | コンタクトホール側壁の抵抗値測定方法 |
| JP5128421B2 (ja) * | 2008-09-04 | 2013-01-23 | 東京エレクトロン株式会社 | プラズマ処理方法およびレジストパターンの改質方法 |
| JP5191857B2 (ja) * | 2008-10-08 | 2013-05-08 | 東京エレクトロン株式会社 | 基板処理方法，基板処理装置，記憶媒体 |
| JP5180121B2 (ja) * | 2009-02-20 | 2013-04-10 | 東京エレクトロン株式会社 | 基板処理方法 |
| US8197915B2 (en) * | 2009-04-01 | 2012-06-12 | Asm Japan K.K. | Method of depositing silicon oxide film by plasma enhanced atomic layer deposition at low temperature |
-
2009
- 2009-11-16 JP JP2009261018A patent/JP5357710B2/ja not_active Expired - Fee Related
-
2010
- 2010-11-11 US US12/943,967 patent/US8524331B2/en not_active Expired - Fee Related