JP2011100792A5 - - Google Patents

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Publication number
JP2011100792A5
JP2011100792A5 JP2009253433A JP2009253433A JP2011100792A5 JP 2011100792 A5 JP2011100792 A5 JP 2011100792A5 JP 2009253433 A JP2009253433 A JP 2009253433A JP 2009253433 A JP2009253433 A JP 2009253433A JP 2011100792 A5 JP2011100792 A5 JP 2011100792A5
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JP
Japan
Prior art keywords
metal layer
layer
wiring board
manufacturing
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009253433A
Other languages
English (en)
Japanese (ja)
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JP2011100792A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009253433A priority Critical patent/JP2011100792A/ja
Priority claimed from JP2009253433A external-priority patent/JP2011100792A/ja
Publication of JP2011100792A publication Critical patent/JP2011100792A/ja
Publication of JP2011100792A5 publication Critical patent/JP2011100792A5/ja
Pending legal-status Critical Current

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JP2009253433A 2009-11-04 2009-11-04 配線基板の製造方法 Pending JP2011100792A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009253433A JP2011100792A (ja) 2009-11-04 2009-11-04 配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009253433A JP2011100792A (ja) 2009-11-04 2009-11-04 配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2011100792A JP2011100792A (ja) 2011-05-19
JP2011100792A5 true JP2011100792A5 (enExample) 2012-10-25

Family

ID=44191764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009253433A Pending JP2011100792A (ja) 2009-11-04 2009-11-04 配線基板の製造方法

Country Status (1)

Country Link
JP (1) JP2011100792A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5523972B2 (ja) 2010-07-29 2014-06-18 三菱重工業株式会社 ターボ冷凍機の性能評価装置
JP2017191845A (ja) * 2016-04-13 2017-10-19 株式会社ジェイデバイス 半導体装置及び半導体装置の製造方法
JP7448309B2 (ja) * 2018-11-27 2024-03-12 日東電工株式会社 配線回路基板およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3704651B2 (ja) * 1994-10-18 2005-10-12 イビデン株式会社 プリント配線板及びその製造方法
JP2002111205A (ja) * 2000-07-27 2002-04-12 Sumitomo Bakelite Co Ltd 多層配線板の製造方法および多層配線板
JP2002353597A (ja) * 2001-05-29 2002-12-06 Nitto Denko Corp 金属転写シート、その製造方法および配線回路基板
JP4170266B2 (ja) * 2004-07-02 2008-10-22 日本特殊陶業株式会社 配線基板の製造方法

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