JP2011096658A - 発光ダイオードランプ - Google Patents

発光ダイオードランプ Download PDF

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Publication number
JP2011096658A
JP2011096658A JP2010235499A JP2010235499A JP2011096658A JP 2011096658 A JP2011096658 A JP 2011096658A JP 2010235499 A JP2010235499 A JP 2010235499A JP 2010235499 A JP2010235499 A JP 2010235499A JP 2011096658 A JP2011096658 A JP 2011096658A
Authority
JP
Japan
Prior art keywords
hole
emitting diode
heat
light emitting
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010235499A
Other languages
English (en)
Japanese (ja)
Inventor
Chih-Ming Lai
志銘 頼
Yu-Pin Liu
育彬 劉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Foxsemicon Integrated Technology Inc
Original Assignee
Foxsemicon Integrated Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxsemicon Integrated Technology Inc filed Critical Foxsemicon Integrated Technology Inc
Publication of JP2011096658A publication Critical patent/JP2011096658A/ja
Pending legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
JP2010235499A 2009-11-02 2010-10-20 発光ダイオードランプ Pending JP2011096658A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009103092150A CN102052590A (zh) 2009-11-02 2009-11-02 发光二极管灯具

Publications (1)

Publication Number Publication Date
JP2011096658A true JP2011096658A (ja) 2011-05-12

Family

ID=43618888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010235499A Pending JP2011096658A (ja) 2009-11-02 2010-10-20 発光ダイオードランプ

Country Status (3)

Country Link
EP (1) EP2325556A2 (zh)
JP (1) JP2011096658A (zh)
CN (1) CN102052590A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018067528A (ja) * 2016-10-21 2018-04-26 廈門普為光電科技有限公司Ｘｉａｍｅｎ ＰＶＴＥＣＨ Ｃｏ．， Ｌｔｄ． 天井用発光ダイオード灯具
US10156330B2 (en) 2016-10-21 2018-12-18 Xiamen Pvtech Co., Ltd. LED ceiling lamp

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024096580A (ja) * 2023-01-04 2024-07-17 浜松ホトニクス株式会社 光照射装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068130A (ja) * 2001-08-28 2003-03-07 Matsushita Electric Works Ltd 照明器具
JP3108651U (ja) * 2004-11-09 2005-04-28 家茂 李 Ｌｅｄランプの構造
JP2005340454A (ja) * 2004-05-26 2005-12-08 Advanex Inc 発光ダイオードの固定装置及び固定構造
JP2006128415A (ja) * 2004-10-29 2006-05-18 Nippon Seiki Co Ltd 光源支持体及び光源装置
WO2009108799A1 (en) * 2008-02-26 2009-09-03 Journee Lighting, Inc. Light fixture assembly and led assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003068130A (ja) * 2001-08-28 2003-03-07 Matsushita Electric Works Ltd 照明器具
JP2005340454A (ja) * 2004-05-26 2005-12-08 Advanex Inc 発光ダイオードの固定装置及び固定構造
JP2006128415A (ja) * 2004-10-29 2006-05-18 Nippon Seiki Co Ltd 光源支持体及び光源装置
JP3108651U (ja) * 2004-11-09 2005-04-28 家茂 李 Ｌｅｄランプの構造
WO2009108799A1 (en) * 2008-02-26 2009-09-03 Journee Lighting, Inc. Light fixture assembly and led assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018067528A (ja) * 2016-10-21 2018-04-26 廈門普為光電科技有限公司Ｘｉａｍｅｎ ＰＶＴＥＣＨ Ｃｏ．， Ｌｔｄ． 天井用発光ダイオード灯具
US10156330B2 (en) 2016-10-21 2018-12-18 Xiamen Pvtech Co., Ltd. LED ceiling lamp

Also Published As

Publication number Publication date
EP2325556A2 (en) 2011-05-25
CN102052590A (zh) 2011-05-11

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